Pressure and temperature sensor

Abstract

A pressure and temperature sensor belongs to the technical field of multifunctional sensors and comprises a shell, a connector is connected to the rear end of the shell, a detection assembly is arranged at the front end of the shell, and the detection assembly comprises a detection head and a circuit board. Wherein the circuit board comprises a pressure detection module, two copper sheet pins extend forwards from the pressure detection module, and each copper sheet pin comprises a bent section close to the pressure detection module and a vertical section located at the front part of the bent section; the detection head comprises a temperature detection head and two wires connected with the temperature detection head, the wires are respectively fixed with the vertical sections to form fixed sections, and the fixed sections account for 4 / 5 of the length of the wires; the temperature detection head is electrically connected with the pressure detection module, and a temperature signal is transmitted into the circuit board through the pressure detection module. Aiming at the problems of inaccurate data acquisition and complex overall structure in the prior art, the utility model provides the pressure and temperature sensor which is simple in overall structure and can acquire accurate data.

Description

Technical Field

[0001] This application belongs to the field of multifunctional sensor technology, and specifically relates to a pressure and temperature sensor. Background Technology

[0002] A sensor is a device that can detect measured information and transform that information into electrical signals or other required signals according to certain rules to meet the requirements of information transmission, processing, storage, display, recording, and control. Among these, the temperature and pressure sensor for an air conditioning electronic expansion valve is a device that integrates temperature and pressure detection. Its purpose is to monitor the real-time state of the refrigerant during air conditioning operation to help the processor determine the compressor's operating state, thereby improving efficiency and reducing power consumption.

[0003] In existing technologies, temperature and pressure sensors house the pressure chip and temperature chip within the same base cavity, which is filled with oil to protect the chips. The oil then transmits pressure and temperature signals to the respective chips. This requires wires to pass through the base and connect to an external circuit board. This technology suffers from problems such as a large overall footprint and difficulties in sealing.

[0004] In a temperature-pressure composite sensor and its manufacturing method disclosed in CN118687625A, to solve the above-mentioned problems, the following technical solution is provided: A mounting plate and a housing are included. The mounting plate is disposed within the housing, dividing the housing into a first space and a second space. A PCB board is disposed on the mounting plate and located within the first space. The PCB board, the supporting housing, and the diaphragm are arranged to form a third space, which is filled with a pressure-conducting medium. A pressure chip is disposed on the PCB board and located within the third space. One end of the temperature sensing component is connected to the PCB board. A portion of the temperature sensing component and a portion of the pressure sensing component can pass through the mounting plate and be located within the second space. The pressure received by the diaphragm can be transmitted to the pressure chip through the pressure-conducting medium. The pressure chip is directly disposed on the PCB board, eliminating the need for leads and enabling miniaturization of the entire sensor.

[0005] However, the applicant's technical personnel believe that multiple independent spaces would affect data acquisition, and that the sensor housing would be difficult to manufacture. Utility Model Content

[0006] The purpose of this invention is to address the problems of inaccurate data acquisition and complex overall structure in existing technologies by providing a pressure and temperature sensor with a simple overall structure that can acquire accurate data.

[0007] To achieve the above technical objectives, the following technical solution is provided: a pressure and temperature sensor, including a housing, a connector connected to the rear end of the housing, and a detection component disposed at the front end.

[0008] The detection assembly includes a probe and a circuit board; wherein, the circuit board includes a pressure detection module, the pressure detection module having two copper pins extending forward, the copper pins including a bent section near the pressure detection module and a vertical section located in front of the bent section;

[0009] The probe includes a temperature detection head and two wires connected to the temperature detection head. The wires are fixed to the vertical section to form a fixed section, and the fixed section occupies 4 / 5 of the wire length.

[0010] The temperature sensor head is electrically connected to the pressure detection module, and the temperature signal is transmitted to the circuit board through the pressure detection module.

[0011] In one feasible embodiment, a platform parallel to the cross-section is provided inside the housing, and a mounting cavity is opened in the middle rear part of the platform, and a circuit board is filled in the mounting cavity.

[0012] The platform has through slots at both ends, one of which contains a grounding conductor that connects the circuit board and the housing. The grounding conductor is also connected to the connector.

[0013] In an feasible embodiment, the probe also includes a protective tube, the front end of which has a claw portion that surrounds the temperature detection head;

[0014] The middle part is a protective section that connects to and covers the fixed section, and the protective section also has a cavity that exposes the fixed section.

[0015] The rear end is the bottom edge that engages with the housing, and a support base is provided in the middle of the bottom edge that contacts the circuit board.

[0016] In one feasible embodiment, a buffer cavity communicating with the mounting cavity is also provided in the middle front part of the platform. The buffer cavity includes a support seat, a bent section, and a first O-ring that is tightly attached to the side wall of the buffer cavity.

[0017] In one feasible embodiment, the connector includes a limiting shell with a connecting portion at its front end. The connecting portion fits tightly with the stage, and a second O-ring is provided on the outside of the connection point between the two. The shell encloses the connecting portion.

[0018] In one feasible embodiment, a connecting cavity is provided within the connecting part, and the connecting cavity communicates with the mounting cavity.

[0019] In one feasible embodiment, the connector also includes pins fixed by a retaining housing, which are connected to the circuit board via bent copper sheets located within the connection cavity.

[0020] In one feasible embodiment, a third O-ring is provided on the housing to facilitate sealing with external components.

[0021] Compared with the prior art, the present invention has the following advantages:

[0022] The temperature sensor's wires are led directly from the pressure module, eliminating the need for multiple wires and allowing for a compact sensor structure; moreover, it has only one cavity, simplifying the overall sensor design.

[0023] Furthermore, the pressure detection module directly contacts the outside through the temperature detection head. The external pressure is not only directly collected by the pressure detection module, but can also be applied to the bending section through the protective tube. The deformation of the bending section is used to correct the collected pressure value.

[0024] The internal grounding system of the sensor protects the circuit board and the operator. Attached Figure Description

[0025] 1. Housing; 2. Connector; 3. Detection assembly; 4. Probe head; 5. Circuit board; 11. Platform; 12. Mounting cavity; 13. Through slot; 14. Grounding conductor; 15. Buffer cavity; 21. Limiting shell; 22. Pin; 23. Connecting cavity; 24. Bent copper sheet; 41. Temperature detection head; 42. Wire; 43. Protective tube.

[0026] Figure 1 This is a schematic diagram of the overall external appearance of this embodiment;

[0027] Figure 2 This is a schematic diagram of the connector structure in this embodiment;

[0028] Figure 3 This is a schematic diagram of the connection of the detection components in this embodiment;

[0029] Figure 4 This is a schematic diagram of the probe head in this embodiment;

[0030] Figure 5 This is a schematic diagram of the structure within the accommodating space in this embodiment;

[0031] Figure 6 This is a schematic diagram of the structure of the stage before and after this embodiment; Detailed Implementation

[0032] like Figures 1 to 6 The embodiment shown includes a pressure and temperature sensor, comprising a housing 1, a connector 2 connected to the rear end of the housing 1, and a detection component 3 disposed at the front end, the detection component 3 including a probe 4 and a circuit board 5.

[0033] The circuit board 5 includes a pressure detection module with two copper pins extending forward. The copper pins include a bent section near the pressure detection module and a vertical section in front of the bent section.

[0034] Furthermore, in this embodiment, the probe 4 includes a temperature detection head 41 and two wires 42 connected to the temperature detection head 41. The wires 42 are fixed to the vertical section to form a fixed section, and the fixed section occupies 4 / 5 of the length of the wires 42. The wires 42 are fixed to the vertical section by welding.

[0035] The above structure enables the temperature detection head 41 to be electrically connected to the pressure detection module, and the temperature signal is transmitted to the circuit board 5 through the pressure detection module.

[0036] In this embodiment, the housing 1 includes a detection tube at the front end and a receiving space behind the detection tube. The detection tube contains a probe 4, which also includes a protective tube 43. The front end of the protective tube 43 has a claw portion that surrounds the temperature detection head 41; the claw portion extends out of the detection tube for better sampling. The middle part is a protective section that connects to and covers the fixed section. The protective section also has a cavity that exposes the fixed section; this cavity is covered by the detection tube, providing a buffering effect during thermal expansion and directly exchanging heat with the outside through the detection tube. The rear end is the outer edge bottom that engages with the housing 1. A support base is provided at the middle of the outer edge bottom, contacting the circuit board 5. The support base is provided to prevent the bent section from contacting other lines on the circuit board 5 and causing a short circuit.

[0037] In this embodiment, a platform 11 parallel to the cross-section is provided inside the housing 1. A mounting cavity 12 is opened in the middle rear part of the platform 11, and a circuit board 5 is filled in the mounting cavity 12. Through slots 13 are opened at both ends of the platform 11. A grounding conductor 14 connecting the circuit board 5 and the housing 1 is provided in one of the through slots 13. The grounding conductor 14 is also connected to the connector 2.

[0038] Among them, the middle front part of the platform 11 is provided with a buffer cavity 15 that communicates with the mounting cavity 12. The buffer cavity 15 includes a support seat, a bent section and a first O-ring that is in close contact with the side wall of the buffer cavity 15.

[0039] In this embodiment, connector 2 includes a limiting shell 21. The front end of the limiting shell 21 has a connecting portion, which is tightly fitted with the platform 11. A second O-ring is provided on the outer side of the connection between the two. The shell 1 encloses the connecting portion. A connecting cavity 23 is formed inside the connecting portion, and the connecting cavity 23 communicates with the placement cavity 12. Connector 2 also includes a pin 22 fixed by the limiting shell 21. The pin 22 is connected to the circuit board 5 through a bent copper sheet 24, which is located inside the connecting cavity 23.

[0040] In this embodiment, a third O-ring is provided on the housing 1 to facilitate sealing with external components.

[0041] In this embodiment, the bent copper sheet 24 and the pin 22 are connected by a dispensing process, the housing 1 and the limiting shell 21 are connected by a riveting process, and the other components are connected by conventional assembly processes.

[0042] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

[0043] In the description of this specification, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing the technical solution of this patent and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this patent application.

[0044] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this patent application, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0045] In this specification, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this specification according to the specific circumstances.

[0046] In this specification, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0047] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0048] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A pressure and temperature sensor, comprising a housing (1), wherein a connector (2) is connected to the rear end of the housing (1), and a detection component (3) is provided at the front end. Its features are, The detection component (3) includes a probe (4) and a circuit board (5); wherein, the circuit board (5) includes a pressure detection module, the pressure detection module having two copper pins extending forward, the copper pins including a bent section near the pressure detection module and a vertical section located in front of the bent section; The probe (4) includes a temperature detection head (41) and two wires (42) connected to the temperature detection head (41). The wires (42) are fixed to the vertical section to form a fixed section, and the fixed section occupies 4 / 5 of the length of the wires (42). The temperature detection head (41) is electrically connected to the pressure detection module, and the temperature signal is transmitted to the circuit board (5) through the pressure detection module.

2. The pressure and temperature sensor according to claim 1, characterized in that, The housing (1) is provided with a platform (11) parallel to the cross-section. The platform (11) has a mounting cavity (12) in the middle rear part. The mounting cavity (12) is filled with the circuit board (5). The platform (11) has through slots (13) at both ends. One of the through slots (13) is provided with a grounding conductor (14) that connects the circuit board (5) and the housing (1). The grounding conductor (14) is also connected to the connector (2).

3. The pressure and temperature sensor according to claim 2, characterized in that, The probe (4) also includes a protective tube (43), the front end of which has a claw portion surrounding the temperature detection head (41); The middle part is a protective part that is combined with and covers the fixed section, and the protective part is also provided with a cavity that exposes the fixed section. The rear end is the bottom edge of the outer edge that engages with the housing (1), and a support base is provided at the middle of the bottom edge that contacts the circuit board (5).

4. The pressure and temperature sensor according to claim 3, characterized in that, The platform (11) is also provided with a buffer cavity (15) in the middle front part, which communicates with the placement cavity (12). The buffer cavity (15) includes the support seat, the bent section and the first O-ring that is in close contact with the side wall of the buffer cavity (15).

5. The pressure and temperature sensor according to claim 2, characterized in that, The connector (2) includes a limiting shell (21), the front end of the limiting shell (21) has a connecting part, the connecting part is tightly fitted with the platform (11) and a second O-ring is provided on the outside of the connection between the two, and the housing (1) wraps the connecting part.

6. The pressure and temperature sensor according to claim 5, characterized in that, The connecting part has a connecting cavity (23) which is connected to the mounting cavity (12).

7. The pressure and temperature sensor according to claim 6, characterized in that, The connector (2) also includes pins (22) fixed by the limiting shell (21), the pins (22) being connected to the circuit board (5) via bent copper sheets (24), the bent copper sheets (24) being located within the connecting cavity (23).

8. The pressure-temperature sensor according to claim 1, 4, or 7, characterized in that, The housing (1) is provided with a third O-ring to facilitate sealing with external components.

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