Tablet computer heat dissipation rear cover
By integrating components such as heat sinks, heat-conducting protrusions, and heat-conducting pads into the back cover of the tablet computer, an efficient heat conduction path is formed, solving the problem of poor heat dissipation, achieving efficient heat dissipation and stable operation of the device, and extending its service life.
Patent Information
- Application Number
- CN202423137985.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-19
- Publication Date
- 2025-11-14
- Estimated Expiration
- 2034-12-19
AI Technical Summary
Existing tablet PC heat dissipation covers have slow and ineffective heat dissipation, leading to prolonged high temperatures, easy hardware damage, and a short lifespan.
It adopts a combination design of heat sink, thermally conductive protrusions and thermally conductive pads to form an efficient heat conduction path, and is equipped with a cooling fan and dust cover to enhance the heat dissipation effect.
It effectively reduces equipment temperature, prevents overheating, extends equipment lifespan, and improves overall performance and stability.
Smart Images

Figure CN223552055U_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of heat dissipation back cover technology, specifically a heat dissipation back cover for a tablet computer. Background Technology
[0002] Heat sink covers are typically made of metal, such as aluminum alloy or copper. These materials have excellent thermal conductivity, which can quickly conduct the heat generated by the chip to the cover and dissipate it. In addition, some heat sink covers are designed with heat dissipation holes or use thermal pads and other auxiliary heat dissipation materials to further enhance the heat dissipation effect. Excessive temperature can lead to a decrease in chip performance, a shortened battery life, and may even damage the hardware. By using a heat sink cover, the device temperature can be effectively reduced, reducing hardware damage caused by high temperature, thereby extending the life of the device.
[0003] However, existing tablet cooling back covers only treat the inside of the back cover to achieve the effect of cooling the tablet. The cooling effect is slow and not obvious. When the user is using it, the tablet is still hot. With long-term use, the tablet's hardware will be damaged and its lifespan will be short. Now, we provide a tablet cooling back cover that can dissipate heat from both inside and outside, thus enhancing the heat dissipation function. Utility Model Content
[0004] The purpose of this application is to provide a tablet computer heat dissipation back cover that addresses the problem that existing tablet computer heat dissipation back covers only treat the inside of the back cover to achieve heat dissipation, resulting in slow and insignificant heat dissipation, and that the tablet computer remains hot during use, leading to hardware damage and a short lifespan with prolonged use.
[0005] The technical solution adopted in this application is as follows: a heat dissipation back cover for a tablet computer, wherein a fixing block is fixedly installed on one side of the surface of the tablet computer back cover, a magnetic plate is adhered to the surface of the fixing block, a slot is provided on the surface of the fixing block, a heat sink shell is welded to the side of the slot away from the tablet computer back cover, and a heat dissipation fan is provided on the surface of the slot.
[0006] By employing the above technical solutions, the heat sink can effectively reduce the temperature of the tablet computer and prevent overheating. Overheating not only affects the performance of the device but can also lead to damage. Using a heat sink ensures that the device operates within a safe temperature range, extending its lifespan. The heat sink helps the tablet computer dissipate heat more effectively, thereby improving the overall performance of the device.
[0007] In a preferred embodiment, a dust cover is fixedly installed on one side surface of the radiator housing, and a radiator charging port is provided on one side surface of the radiator housing.
[0008] By adopting the above technical solution, the dust cover can effectively prevent dust, fine particulate matter and other impurities from entering the radiator, prevent dust accumulation from causing poor heat dissipation of the equipment, thereby protecting the normal operation of the equipment and extending its service life.
[0009] In a preferred embodiment, a heat-conducting protrusion is fixedly installed on the side of the tablet computer's back cover away from the heat sink housing.
[0010] By adopting the above technical solution, a more direct and efficient heat conduction path can be formed through the heat-conducting protrusions, allowing heat to be transferred from the heat source to the heat dissipation surface more quickly. The heat-conducting protrusions can more effectively conduct the heat generated inside the tablet to the back cover, and then dissipate it into the air, reducing the device temperature.
[0011] In a preferred embodiment, a thermally conductive pad is bonded to the adjacent portion of the thermally conductive protrusion.
[0012] By adopting the above technical solutions, thermal pads can reduce the temperature of the equipment during operation, reduce damage to electronic components caused by high temperatures, and extend the service life of the equipment by improving heat dissipation.
[0013] In a preferred embodiment, a support plate is provided on one side surface of the back cover of the tablet computer, and a connecting shaft is provided on the surface of the support plate.
[0014] By adopting the above technical solution, the design of the support plate allows the tablet computer to stand stably on the table, helping the tablet computer to dissipate heat.
[0015] In a preferred embodiment, a power control key is fixedly installed at the surface edge of the tablet computer's back cover, and a camera recess is formed on the surface of the tablet computer's back cover.
[0016] By adopting the above technical solution, a power control button and a camera slot are installed on the back cover of the tablet, making it more convenient to control the power and camera.
[0017] In a preferred embodiment, an inner buckle is fixedly connected to the surface edge of the tablet computer's back cover.
[0018] By adopting the above technical solution, the inward-clipping design ensures a secure connection between the back cover and the body. This design not only guarantees a stable connection between the back cover and the body but also allows for easy opening of the back cover using simple techniques. This design effectively prevents accidental detachment, ensuring the stability and safety of the equipment during use.
[0019] In summary, due to the adoption of the above technical solution, the beneficial effects of this application are:
[0020] In this application, the heat sink effectively reduces the temperature of the tablet computer, preventing overheating. Overheating not only affects the performance of the device but can also lead to damage. Using a heat sink ensures that the device operates within a safe temperature range, extending its lifespan. The heat sink helps the tablet computer dissipate heat more effectively, thereby improving the overall performance of the device.
[0021] The thermally conductive protrusions can form a more direct and efficient heat conduction path, allowing heat to be transferred from the heat source to the heat dissipation surface more quickly. The thermally conductive protrusions can more effectively conduct the heat generated inside the tablet to the back cover, and then dissipate it into the air, reducing the device temperature.
[0022] The thermally conductive protrusions can form a more direct and efficient heat conduction path, allowing heat to be transferred from the heat source to the heat dissipation surface more quickly. The thermally conductive protrusions can more effectively conduct the heat generated inside the tablet to the back cover, and then dissipate it into the air, reducing the device temperature. Attached Figure Description
[0023] Figure 1 This is a front view structural diagram of the heat dissipation back cover for a tablet computer according to this application;
[0024] Figure 2 This is a schematic diagram of the rear view structure of the heat dissipation back cover of the tablet computer in this application;
[0025] Figure 3 This is a schematic diagram of the installation structure of the heat dissipation device on the back cover of the tablet computer in this application.
[0026] The markings in the diagram are: 1. Tablet back cover; 2. Support plate; 3. Dust cover; 4. Connecting shaft; 5. Power control button; 6. Cooling fan; 7. Thermal pad; 8. Inner clip; 9. Camera inner slot; 10. Thermal protrusion; 11. Slot; 12. Magnetic plate; 13. Fixing block; 14. Heatsink charging port; 15. Heatsink outer shell. Detailed Implementation
[0027] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the embodiments of this application. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0028] Reference Figure 1-3 ,
[0029] Example:
[0030] A heat dissipation back cover for a tablet computer includes a fixing block 13 fixedly mounted on one side of the back cover 1. A magnetic plate 12 is adhered to the surface of the fixing block 13. A slot 11 is provided on the surface of the fixing block 13. A heat sink shell 15 is welded to the side of the slot 11 away from the back cover 1. A cooling fan 6 is provided on the surface of the slot 11. The heat sink effectively reduces the temperature of the tablet computer, preventing overheating. Overheating not only affects the performance of the device but may also cause damage. Using a heat sink ensures that the device operates within a safe temperature range, extending its lifespan. The heat sink helps the tablet computer dissipate heat better, thereby improving the overall performance of the device.
[0031] A dust cover 3 is fixedly installed on one side surface of the radiator housing 15, and a radiator charging port 14 is provided on one side surface of the radiator housing 15. The dust cover 3 can effectively prevent dust, fine particles and other impurities from entering the radiator, prevent dust accumulation from causing poor heat dissipation of the equipment, thereby protecting the normal operation of the equipment and extending its service life.
[0032] A heat-conducting protrusion 10 is fixedly installed on the side of the tablet computer's back cover 1 away from the heat sink housing 15. The heat-conducting protrusion 10 can form a more direct and efficient heat conduction path, allowing heat to be transferred from the heat source to the heat dissipation surface more quickly. The heat-conducting protrusion 10 can more effectively conduct the heat generated inside the tablet computer to the back cover, and then dissipate it into the air, reducing the device temperature.
[0033] Thermally conductive pads 7 are bonded to the adjacent locations of the thermally conductive protrusions 10. The thermally conductive pads 7 can reduce the operating temperature of the equipment, reduce damage to electronic components caused by high temperatures, and extend the service life of the equipment by improving heat dissipation.
[0034] A support plate 2 is provided on one side of the back cover 1 of the tablet computer, and a connecting shaft 4 is provided on the surface of the support plate 2. The design of the support plate allows the tablet computer to stand stably on the table and helps the tablet computer dissipate heat.
[0035] A power control button 5 is fixedly installed on the edge of the back cover 1 of the tablet computer, and a camera recess 9 is formed on the surface of the back cover 1. The installation of the power control button 5 and the camera recess 9 on the back cover of the tablet computer makes it convenient to control the power and camera.
[0036] An inner clip 8 is fixedly connected to the surface edge of the tablet's back cover 1. The design of the inner clip 8 ensures a secure connection between the back cover and the device body. This design not only guarantees a secure connection between the back cover and the device body, but also allows the back cover to be easily opened with simple techniques. This design effectively prevents accidental detachment and ensures the stability and safety of the device during use.
[0037] The implementation principle of a tablet computer heat dissipation back cover embodiment of this application is as follows:
[0038] A heatsink effectively lowers the temperature of a tablet, preventing overheating. Overheating not only affects device performance but can also cause damage. Using a heatsink ensures the device operates within a safe temperature range, extending its lifespan. Heatsinks help tablets dissipate heat more effectively, thereby improving overall device performance.
[0039] The thermally conductive protrusions 10 create a more direct and efficient heat conduction path, allowing heat to be transferred more quickly from the heat source to the heat dissipation surface. The protrusions 10 effectively conduct heat generated inside the tablet to the back cover, which is then dissipated into the air, reducing the device's temperature. The thermally conductive pads 7 lower the device's operating temperature, reducing damage to electronic components caused by high temperatures and extending the device's lifespan by improving heat dissipation.
[0040] The inward snap design ensures a secure connection between the back cover and the body. This design not only guarantees a secure connection between the back cover and the body, but also allows for easy opening of the back cover with simple techniques. This design effectively prevents accidental detachment and ensures the stability and safety of the device during use.
[0041] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.
Claims
1. A heat dissipation back cover for a tablet computer, comprising a tablet computer back cover (1), characterized in that: A fixing block (13) is fixedly installed on one side of the surface of the back cover (1) of the tablet computer. A magnetic plate (12) is bonded to the surface of the fixing block (13). A slot (11) is provided on the surface of the fixing block (13). A heat sink shell (15) is welded to the side of the slot (11) away from the back cover (1) of the tablet computer. A cooling fan (6) is provided on the surface of the slot (11).
2. The tablet computer heat dissipation back cover as described in claim 1, characterized in that: A dust cover (3) is fixedly installed on one side surface of the radiator housing (15), and a radiator charging port (14) is opened on one side surface of the radiator housing (15).
3. The tablet computer heat dissipation back cover as described in claim 1, characterized in that: A heat-conducting protrusion (10) is fixedly installed on the side surface of the back cover (1) of the tablet computer away from the heat sink housing (15).
4. A tablet computer heat dissipation back cover as described in claim 3, characterized in that: A thermally conductive pad (7) is bonded to the adjacent part of the thermally conductive protrusion (10).
5. A tablet computer heat dissipation back cover as described in claim 1, characterized in that: A support plate (2) is provided on one side surface of the back cover (1) of the tablet computer, and a connecting shaft (4) is provided on the surface of the support plate (2).
6. A tablet computer heat dissipation back cover as described in claim 1, characterized in that: A power control key (5) is fixedly installed on the edge of the back cover (1) of the tablet computer, and a camera groove (9) is opened on the surface of the back cover (1).
7. A tablet computer heat dissipation back cover as described in claim 1, characterized in that... An inner buckle (8) is fixedly connected to the surface edge of the back cover (1) of the tablet computer.