Capacitor assembling structure

Abstract

The utility model relates to a capacitor assembly structure. The capacitor assembly structure comprises a PCB, a convex plate and a bonding pad, wherein the PCB is provided with a clearance hole; the convex plate is arranged in the receding hole, a hollow area is formed in the convex plate, and the hollow area is communicated with the receding hole; according to the scheme provided by the invention, the resonance between the capacitor and the PCB can be effectively reduced, so that the squeal phenomenon is reduced or eliminated.

Description

Technical Field

[0001] This utility model relates to the field of circuit design technology, and in particular to a capacitor assembly structure. Background Technology

[0002] In related technologies, ceramic capacitors are often used in peripheral circuits for filtering and coupling. However, ceramic capacitors may produce a whistling sound when operating at high frequencies. This is usually caused by mechanical resonance between the capacitor and the PCB board, which can lead to abnormal operation of the display screen. Utility Model Content

[0003] The purpose of this invention is to overcome the shortcomings of the existing technology and provide a capacitor assembly structure that can effectively reduce the resonance between the capacitor and the PCB board, thereby reducing or eliminating the howling phenomenon.

[0004] The objective of this utility model is achieved through the following technical solution:

[0005] The first aspect of this application provides a capacitor assembly structure, comprising: a PCB board having a clearance hole; a raised plate disposed within the clearance hole, the raised plate having a cutout area communicating with the clearance hole; and a solder pad disposed on the raised plate for placing a capacitor.

[0006] The convex plate has an "S" shaped cross-sectional structure.

[0007] The thickness of the convex plate is half the thickness of the PCB board.

[0008] The thickness of the convex plate is 0.8 mm.

[0009] The thickness of the PCB board is 1.6mm.

[0010] It also includes circuit traces, which are disposed on the protruding plate and electrically connected to the pads.

[0011] It also includes a connecting plate, which is connected to the protruding plate and the PCB board respectively.

[0012] The vent hole has a rectangular cross-sectional structure.

[0013] The convex plate has multiple hollow areas, and each hollow area is connected to the clearance hole.

[0014] The width of each of the described hollowed-out areas is the same.

[0015] Compared with the prior art, the present invention has at least the following advantages:

[0016] By setting up clearance holes, the convex plate can extend within the clearance holes and remain suspended. At the same time, setting a hollow area on the convex plate can reduce the contact area between the capacitor and the PCB board, thereby reducing the resonance between the capacitor and the PCB board and reducing or eliminating the howling phenomenon. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the embodiments will be briefly described below.

[0018] Figure 1 This is a schematic diagram of the capacitor assembly structure in one embodiment of the present invention;

[0019] Figure 2 This is a schematic diagram of another embodiment of the capacitor assembly structure in one embodiment of the present invention. Detailed Implementation

[0020] Embodiments of this application will now be described in more detail with reference to the accompanying drawings. While embodiments of this application are shown in the drawings, it should be understood that this application may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided to make this application more thorough and complete, and to fully convey the scope of this application to those skilled in the art.

[0021] It should be understood that although the terms "first," "second," "third," etc., may be used in this application to describe various information, this information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another. For example, without departing from the scope of this application, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0022] Unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0023] Peripheral circuits often require ceramic capacitors for filtering and coupling. However, ceramic capacitors may produce a whistling sound when operating at high frequencies. This is usually caused by mechanical resonance between the capacitor and the PCB board, leading to abnormal operation of the display screen.

[0024] To address the aforementioned issues, this application provides a capacitor assembly structure that effectively reduces resonance between the capacitor and the PCB board, thereby reducing or eliminating the whistling phenomenon.

[0025] The technical solutions of the embodiments of this application are described in detail below with reference to the accompanying drawings.

[0026] Please see Figure 1 and Figure 2 A capacitor assembly structure includes: a PCB board 100, a raised plate 200, and solder pads 300. The PCB board 100 has a clearance hole 110; the raised plate 200 is disposed within the clearance hole 110, and a cutout area 210 is formed on the raised plate 200, communicating with the clearance hole 110; the solder pads 300 are disposed on the raised plate 200 and are used to place the capacitor. Preferably, the clearance hole 110 has a rectangular cross-sectional structure.

[0027] It should be noted that there are two convex plates 200 and two pads 300, and the capacitor is soldered onto the two pads 300. Furthermore, by providing a clearance hole 110, the convex plate 200 can extend within the clearance hole 110 and be in a suspended state. At the same time, by providing a cutout area 210 on the convex plate 200, the contact area between the capacitor and the PCB board 100 can be reduced, thereby reducing the resonance between the capacitor and the PCB board 100, and thus reducing or eliminating the howling phenomenon.

[0028] Please see Figure 1 In one embodiment, the convex plate 200 has an "S" shaped cross-sectional structure.

[0029] It should be noted that the convex plate 200 of this application has an "S"-shaped cross-sectional structure, which is similar to a spring, giving the convex plate 200 a certain degree of elasticity and allowing it to deform, thereby reducing resonance. At the same time, the length of the convex plate 200 can be increased or decreased according to the size of the capacitor.

[0030] Please see Figure 1 In one embodiment, the thickness of the protrusion 200 is half the thickness of the PCB board 100. Specifically, the thickness of the protrusion 200 is 0.8 mm. Specifically, the thickness of the PCB board 100 is 1.6 mm.

[0031] It should be noted that the above settings allow the convex plate 200 to be suspended in the air, providing sufficient elasticity.

[0032] Please see Figure 1 In one embodiment, a capacitor assembly structure further includes a circuit trace 400, which is disposed on the protrusion 200 and electrically connected to the solder pad 300.

[0033] It should be noted that the circuit trace 400 is also "S" shaped, used to connect with the capacitor on the pad 300.

[0034] Please see Figure 1 In one embodiment, a capacitor assembly structure further includes a connecting plate 500, which is connected to the protruding plate 200 and the PCB board 100 respectively.

[0035] It should be noted that the connecting plate 500 is the part that connects the protruding plate 200 and the PCB board 100, so that the protruding plate 200 can be stably installed on the PCB board 100.

[0036] Please see Figure 1 In one embodiment, the protruding plate 200 has multiple hollow areas 210, each of which is connected to the clearance hole 110. Specifically, the width of each hollow area 210 is the same.

[0037] It should be noted that the number of hollow areas 210 is determined by the length of the convex plate 200.

[0038] The solution of this application has been described in detail above with reference to the accompanying drawings. In the above embodiments, the descriptions of each embodiment have different focuses; for parts not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments. Those skilled in the art should also understand that the actions and modules involved in the specification are not necessarily essential to this application. Furthermore, it is understood that the steps in the method of this application embodiment can be adjusted, combined, and deleted according to actual needs, and the modules in the device of this application embodiment can be combined, divided, and deleted according to actual needs.

[0039] The various embodiments of this application have been described above. These descriptions are exemplary and not exhaustive, nor are they limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen to best explain the principles, practical application, or improvement of the technology in the market, or to enable others skilled in the art to understand the embodiments disclosed herein.

Claims

1. A capacitor assembly structure, characterized in that, include: PCB board, wherein the PCB board has clearance holes; A convex plate is disposed within the clearance hole, and a hollow area is formed on the convex plate, the hollow area communicating with the clearance hole; The pads are disposed on the protrusion plate and are used to place capacitors.

2. The capacitor assembly structure according to claim 1, characterized in that, The convex plate has an "S" shaped cross-sectional structure.

3. The capacitor assembly structure according to claim 1, characterized in that, The thickness of the convex plate is half the thickness of the PCB board.

4. The capacitor assembly structure according to claim 3, characterized in that, The thickness of the convex plate is 0.8 mm.

5. The capacitor assembly structure according to claim 3, characterized in that, The thickness of the PCB board is 1.6mm.

6. The capacitor assembly structure according to claim 1, characterized in that, It also includes circuit traces, which are disposed on the protruding plate and electrically connected to the pads.

7. The capacitor assembly structure according to claim 1, characterized in that, It also includes a connecting plate, which is connected to the protruding plate and the PCB board respectively.

8. The capacitor assembly structure according to claim 1, characterized in that, The vent hole has a rectangular cross-sectional structure.

9. The capacitor assembly structure according to claim 1, characterized in that, The convex plate has multiple hollow areas, and each hollow area is connected to the clearance hole.

10. The capacitor assembly structure according to claim 9, characterized in that, The width of each of the described hollowed-out areas is the same.

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