Single-row packaging type surface-mounted device convenient for glue filling

Abstract

The utility model relates to a single-row packaging type surface-mounted device, in particular to a single-row packaging type surface-mounted device convenient for glue pouring. The single-row packaging type surface-mounted device convenient for glue pouring comprises a lower die, an upper die, a die strip, single-row inner PINs and terminals, the upper portion of the lower die is in butt joint with the upper die, the upper portion of the lower die is provided with a plurality of discharging grooves, the terminals are placed in the discharging grooves, the upper portion of the lower die is provided with placing grooves which are distributed in a front-back mode, and the placing grooves are arranged in the lower die. A mold strip is placed in the containing groove and frames all the discharging grooves, and the front side and the rear side of the mold strip are connected with a plurality of single-row inner PINs. According to the utility model, the accurate placement of terminals is ensured by arranging the material placing grooves, and the mold strips are accurately positioned by arranging the placing grooves, so that the terminals are ensured to be positioned between the PINs in every two longitudinally aligned single rows, and the problems that the positions of the PINs and the terminals are easy to deviate, the packaging quality is influenced, and the packaging quality is influenced are effectively solved. And the rejection rate is increased.

Description

Technical Field

[0001] This utility model relates to a single-row encapsulated surface mount device, and more particularly to a single-row encapsulated surface mount device that is easy to pot. Background Technology

[0002] Conventional SMD (Surface Mount Device) single-row packaged components are a type of electronic component packaging using SMT (Surface Mount Technology) technology. They are small, lightweight, low-cost, and highly reliable, and are widely used in various electronic products. This packaging method helps improve the miniaturization and integration of electronic products, while also promoting automation in the electronics manufacturing industry.

[0003] Traditionally, when encapsulating single-row surface mount devices (SMD) components, the terminals are first placed on the lower mold, then the mold strip is placed on the lower mold, aligning the pins of the mold strip with the terminals. Finally, the upper mold is placed on the lower mold for potting and encapsulation. However, this process can be challenging due to difficulties in terminal placement, and inaccurate pin placement can occur during mold strip placement, leading to misalignment between the pins and terminals. This negatively impacts encapsulation quality and increases the scrap rate.

[0004] Therefore, there is a particular need for a single-row encapsulated surface mount device that is easy to pot, in order to solve the problems existing in the prior art. Utility Model Content

[0005] To overcome the shortcomings of traditional molds that easily lead to deviations in the position of pins and terminals, thereby affecting the quality of packaging and increasing the scrap rate, this utility model provides a single-row encapsulation surface mount device that is easy to pot.

[0006] This utility model is achieved through the following technical means: a single-row encapsulated surface mount device that is easy to pot, including a lower mold, an upper mold, a mold strip, a single row of inner pins and terminals. The upper mold is connected to the upper part of the lower mold, and multiple material feeding slots are opened on the upper part. Terminals are placed inside the material feeding slots. The upper part of the lower mold has placement slots distributed front and back. The mold strip is placed inside the placement slots. The mold strip frames all the material feeding slots. Multiple single rows of inner pins are connected to both the front and back sides of the mold strip. Each terminal is located between every two single rows of inner pins that are aligned vertically. An injection port is opened on the lower mold, and the injection port completely penetrates the lower mold.

[0007] As a preferred technical solution of this utility model, it also includes a pressure block and a protrusion. The upper mold has four sets of through holes, each through hole is aligned with each single row of inner pins, and a pressure block is slidably placed inside the through hole. The bottom surface of the pressure block contacts both the single row of inner pins and the terminal. A protrusion is connected to the upper end of the pressure block, and the top surface of the protrusion is on the same horizontal line as the top surface of the upper mold.

[0008] As a preferred technical solution of this utility model, it also includes a plurality of rectangular grooves opened on the upper part of the upper mold, and the bottom surface of the protrusion contacts the bottom surface of the rectangular groove.

[0009] As a preferred technical solution of this utility model, the bottom of the pressure block is provided with a locking block that mates with the single row of inner pins.

[0010] As a preferred technical solution of this utility model, the bottom surface of the pressing block is provided with an anti-stick coating.

[0011] As a preferred technical solution of this utility model, the bump is made of a soft material.

[0012] As can be seen from the above description of the structure of this utility model, the design starting point, concept and advantages of this utility model are: by setting a material feeding groove, this utility model ensures the accurate placement of terminals, and by setting a placement groove to accurately position the mold strip, it ensures that the terminals are located between every two single rows of PINs in the longitudinal alignment, effectively solving the problem that existing molds are prone to causing deviations in the position of PINs and terminals, thereby affecting the quality of packaging and increasing the scrap rate.

[0013] This invention incorporates through holes, pressure blocks, and protrusions. The pressure blocks are sequentially placed into the through holes, allowing the bottom surface of the pressure blocks to contact the single row of inner pins and terminals, thus pressing the single row of inner pins firmly onto the terminals and ensuring that the single row of inner pins fits the terminals, thereby improving the packaging quality. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the first three-dimensional structure of this utility model.

[0015] Figure 2 This is a partial sectional view of the present invention.

[0016] Figure 3 This is a schematic diagram of the exploded structure of this utility model.

[0017] Figure 4 This is a three-dimensional structural schematic diagram showing the present invention from a top-down perspective.

[0018] Figure 5 This is a three-dimensional structural diagram of the pressure block and protrusion components of this utility model.

[0019] Figure 6 This is a schematic diagram of the second three-dimensional structure of the present invention.

[0020] Among them: 1. Lower mold, 101. Placement groove, 2. Upper mold, 3. Material discharge groove, 4. Mold strip, 41. Single row of inner pins, 5. Terminal, 6. Through hole, 61. Pressure block, 7. Protrusion, 8. Rectangular groove, 9. Injection port. Detailed Implementation

[0021] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments, but this is not intended to limit the present invention.

[0022] Example: A single-row encapsulated surface mount device that is easy to pot, see [reference]. Figures 1-4 and Figure 6 As shown, it includes a lower mold 1, an upper mold 2, a mold strip 4, a single row of inner pins 41, and terminals 5. The upper mold 2 is connected to the upper part of the lower mold 1, and multiple material feeding slots 3 are arranged in an array on the upper part. Terminals 5 are placed inside the material feeding slots 3. The upper part of the lower mold 1 has a placement slot 101 arranged in a front-to-back pattern. The mold strip 4 is placed inside the placement slot 101. The mold strip 4 frames all the material feeding slots 3. Multiple single rows of inner pins 41 are connected to the front and rear sides of the mold strip 4 at equal intervals. Each terminal 5 is located between every two single rows of inner pins 41 that are aligned vertically. An injection port 9 is opened in the middle of the lower mold 1, and the injection port 9 completely penetrates the lower mold 1.

[0023] See Figures 1-5 As shown, it also includes a pressure block 61 and a protrusion 7. The upper mold 2 has four sets of through holes 6 arranged in a straight line inside. Each through hole 6 is aligned with each single row of inner pins 41. The pressure block 61 is slidably placed inside the through hole 6. The outer surface of the pressure block 61 is in close contact with the inner wall of the through hole 6, and there is a certain amount of friction to ensure that the pressure block 61 will not easily come out of the through hole 6. The bottom surface of the pressure block 61 simultaneously contacts the single row of inner pins 41 and the terminal 5 to press the single row of inner pins 41 onto the terminal 5. The bottom of the pressure block 61 is provided with a contact point with the single row of inner pins 41. The mating blocks allow the pressure block 61 to precisely press the single row of inner pins 41. The bottom surface of the pressure block 61 is coated with an anti-stick coating. The upper end of the pressure block 61 is connected to a protrusion 7. The top surface of the protrusion 7 is on the same horizontal line as the top surface of the upper mold 2. The protrusion 7 is made of a soft material, such as silicone, to facilitate manual operation. The upper part of the upper mold 2 has multiple rectangular grooves 8 arranged longitudinally. The bottom surface of the protrusion 7 contacts the bottom surface of the rectangular groove 8. The rectangular groove 8 provides a point of leverage for the operator's hand to easily pinch the protrusion 7 and remove the pressure block 61.

[0024] First, the worker places the lower mold 1 on the workbench. Then, the upper mold 2 is removed from the lower mold 1, and the terminals 5 are placed into the feeding slot 3 in sequence, ensuring accurate placement of the terminals 5. After placement, the mold strip 4 is placed on the lower mold 1, and the placement slot 101 precisely positions the mold strip 4, ensuring that the terminals 5 are located between every two vertically aligned single-row inner pins 41. After ensuring accurate placement of the terminals 5 and the single-row inner pins 41, the upper mold 2 is placed back on the lower mold 1 to form a packaging space. Then, the pressure block 61 is placed into the through hole 6 in sequence, so that the bottom surface of the pressure block 61 contacts the single-row inner pins 41 and the terminals 4, pressing the single-row inner pins 41 firmly onto the terminals 5, ensuring the single-row inner pins 41 are securely positioned. N pin 41 is attached to terminal 5. Then, the lower mold 1 and the upper mold 2 are flipped so that the upper mold 2 faces downward and contacts the worktable, and the lower mold 1 faces upward. The protrusion 7 simultaneously contacts the worktable limiting pressure block 61, so that the pressure block 61 continuously presses the single row of inner pins 41. Then, the encapsulating glue is poured into the lower mold 1 and the upper mold 2 from the injection port 9 to encapsulate the mold strip 4, the single row of inner pins 41 and terminal 5. After waiting for a period of time for the encapsulating glue to solidify, a single row of encapsulated surface mount device is obtained. Then, the lower mold 1 and the upper mold 2 are flipped again so that the lower mold 1 faces downward and contacts the worktable, and the upper mold 2 faces upward. Then, the upper mold 2 is removed, and the single row of inner pins 41 is cut off with a cutting tool. Finally, the single row of encapsulated surface mount device is taken out.

[0025] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.

Claims

1. A single-row encapsulated surface mount device that is easy to pot, characterized in that, It includes a lower mold (1), an upper mold (2), a mold strip (4), a single row of inner pins (41) and a terminal (5). The upper mold (2) is connected to the upper part of the lower mold (1), and multiple material feeding slots (3) are opened on the upper part. The terminal (5) is placed inside the material feeding slots (3). The upper part of the lower mold (1) has a placement slot (101) distributed in front and back. The mold strip (4) is placed inside the placement slots (101). The mold strip (4) frames all the material feeding slots (3). Multiple single rows of inner pins (41) are connected to the front and back sides of the mold strip (4). Each terminal (5) is located between every two single rows of inner pins (41) aligned in the longitudinal direction. An injection port (9) is opened on the lower mold (1), and the injection port (9) completely penetrates the lower mold (1).

2. The single-row encapsulated surface mount device for easy potting as described in claim 1, characterized in that, It also includes a pressure block (61) and a protrusion (7). The upper mold (2) has four sets of through holes (6) inside. Each through hole (6) is aligned with each single row of inner pins (41). The pressure block (61) is slidably placed inside the through hole (6). The bottom surface of the pressure block (61) simultaneously contacts the single row of inner pins (41) and the terminal (5). The upper end of the pressure block (61) is connected to the protrusion (7), and the top surface of the protrusion (7) is on the same horizontal line as the top surface of the upper mold (2).

3. The single-row encapsulated surface mount device for easy potting as described in claim 2, characterized in that, It also includes an upper mold (2) with multiple rectangular grooves (8) on the upper part, and the bottom surface of the protrusion (7) contacts the bottom surface of the rectangular groove (8).

4. A single-row encapsulated surface mount device for easy potting according to claim 3, characterized in that, The bottom of the pressure block (61) is provided with a locking block that mates with the single row of inner pins (41).

5. A single-row encapsulated surface mount device for easy potting according to claim 4, characterized in that, The bottom surface of the pressing block (61) is provided with an anti-stick coating.

6. A single-row encapsulated surface mount device for easy potting according to claim 5, characterized in that, The bump (7) is made of soft material.

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