Auxiliary matching device for semiconductor chip packaging

Abstract

The utility model belongs to the technical field of semiconductor chip packaging, and particularly relates to an auxiliary matching device for semiconductor chip packaging, which comprises a supporting block. A first threaded rod and an auxiliary rod are symmetrically arranged on the inner side of the supporting block; the auxiliary rod is slidably connected with the supporting block. The lower ends of the auxiliary rod and the first threaded rod are rotationally connected with moving blocks; limiting rods are symmetrically and fixedly connected to the lower end of the supporting block; the limiting rod is slidably connected with the moving block; through the change of the relative positions of the contact surfaces of the clamping blocks and the separator, the two clamping blocks are far away from each other in the downward sliding process by utilizing the structural design at the beginning, and then when the clamping blocks slide to the lower end of the separator, the elastic characteristic of the spring is effectively activated to promote the two clamping blocks to be close to each other quickly and stably, so that the clamping of the chip is realized; the process not only simplifies the operation steps and improves the automation degree, but also ensures the stability and accuracy of chip clamping, and effectively improves the working efficiency and the product quality.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor chip packaging technology, specifically an auxiliary fitting device for semiconductor chip packaging. Background Technology

[0002] Semiconductor chips are highly integrated circuit blocks made of semiconductor materials (such as silicon). Through the precise combination of millions or even billions of electronic components such as transistors, they realize complex computing and processing functions. They are widely used in many fields such as mobile phones, computers, automotive electronics, and renewable energy, and are an indispensable core component of modern electronic devices.

[0003] Semiconductor chips have a wide range of applications, covering almost all electronic devices. In the renewable energy sector, semiconductor chips play a crucial role in connecting wind and solar power to the grid and reducing transmission losses. They also demonstrate strong application potential in emerging fields such as automotive electronics and green electronic lighting. Furthermore, semiconductor chips are a vital support for cutting-edge technologies such as artificial intelligence and virtual reality.

[0004] In semiconductor chip packaging processes, precise and stable chip clamping is a key step in ensuring packaging quality and efficiency; therefore, an auxiliary mating device for semiconductor chip packaging is proposed to address the above issues. Utility Model Content

[0005] In order to overcome the shortcomings of the prior art and solve at least one of the technical problems mentioned in the background art, this utility model proposes an auxiliary mating device for semiconductor chip packaging.

[0006] The technical solution adopted by this utility model to solve its technical problem is as follows: An auxiliary fitting device for semiconductor chip packaging, comprising a support block; a first threaded rod and an auxiliary rod symmetrically arranged on the inner side of the support block; the auxiliary rod is slidably connected to the support block; a moving block is rotatably connected to the lower end of both the auxiliary rod and the first threaded rod; a sleeve is fixedly connected to one end of each of the two moving blocks that are close to each other; a sliding rod is slidably connected to the inner side of the sleeve; a clamping block is fixedly connected to the end of the sliding rod away from the moving block; a spring is fixedly connected between the moving block and the clamping block, and outside the sleeve and the sliding rod; a conveying device is arranged on the outer side of the support block; a separator is fixedly connected to the upper end of the conveying device; limit rods are symmetrically fixedly connected to the lower end of the support block; the limit rods are slidably connected to the moving blocks.

[0007] Preferably, a threaded cylinder is symmetrically rotatably connected to the inner side of the support block; a second threaded rod is threadedly connected to the inner side of the threaded cylinder.

[0008] Preferably, a first servo motor is fixedly connected to the inner side of the support block; a first rotating rod is fixedly connected to the output end of the first servo motor; a first sprocket is fixedly connected to the outer side of the first rotating rod; a second sprocket is fixedly connected to the outer side of the threaded cylinder; and a chain is drivingly connected between the outer side of the second sprocket and the outer side of the first sprocket.

[0009] Preferably, a gear threaded post is threadedly connected to the outer side of the first threaded rod and the inner side of the support block; a rotating cylinder is fixedly connected to the outer side of the gear threaded post; a rotating plate is fixedly connected to the middle part of the outer side of the rotating cylinder; and the rotating plate is rotatably connected to the support block.

[0010] Preferably, a second servo motor is fixedly connected to the inner side of the support block; a second rotating rod is fixedly connected to the output end of the second servo motor; an output gear is fixedly connected to the outer side of the second rotating rod; and the output gear is meshed with a gear thread column.

[0011] Preferably, the upper end of the first threaded rod is rotatably connected to a connecting plate; the lower end of the connecting plate is rotatably connected to an auxiliary rod.

[0012] Preferably, a silicone pad is fixedly connected to the end of the clamping block.

[0013] The advantages of this utility model are:

[0014] 1. The auxiliary mating device for semiconductor chip packaging described in this utility model changes the relative position of the clamping blocks and the contact surface of the separator. Initially, the structural design causes the two clamping blocks to move away from each other during the downward movement. Subsequently, when the clamping blocks slide down to the lower end of the separator, the elastic properties of the spring are effectively activated, causing the two clamping blocks to quickly and stably move closer to each other, thereby clamping the chip. This process not only simplifies the operation steps but also improves the degree of automation.

[0015] 2. The auxiliary mating device for semiconductor chip packaging described in this utility model starts a first servo motor, and drives a first rotating rod to rotate through the output end of the first servo motor, thereby causing the threaded cylinder to rotate, which in turn causes the support block to move laterally, thereby allowing the device to move the clamped chip to the top of the packaging box, increasing the speed of chip to packaging box, and thus improving production efficiency. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0018] Figure 2 This is a schematic diagram of the clamping block and separator structure in this utility model;

[0019] Figure 3 This is a schematic diagram of the threaded cylinder and the second threaded rod in this utility model;

[0020] Figure 4 This is a schematic diagram of the rotating cylinder and rotating plate structure in this utility model.

[0021] In the diagram: 101, support block; 102, auxiliary rod; 103, first threaded rod; 104, moving block; 105, sleeve; 106, slide bar; 107, spring; 108, clamping block; 109, conveying device; 110, separator; 111, limit rod; 201, threaded cylinder; 202, second threaded rod; 301, first servo motor; 302, first rotating rod; 303, first sprocket; 304, chain; 305, second sprocket; 401, gear threaded column; 402, rotating cylinder; 403, rotating plate; 501, second servo motor; 502, second rotating rod; 503, output gear; 601, connecting plate; 701, silicone pad. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] like Figure 1-4As shown, an auxiliary mating device for semiconductor chip packaging includes a support block 101; a first threaded rod 103 and an auxiliary rod 102 are symmetrically arranged on the inner side of the support block 101; the auxiliary rod 102 is slidably connected to the support block 101; the lower ends of the auxiliary rod 102 and the first threaded rod 103 are rotatably connected to moving blocks 104; sleeves 105 are fixedly connected to the ends of the two moving blocks 104 that are close to each other; a sliding rod 106 is slidably connected to the inner side of the sleeve 105. A clamping block 108 is fixedly connected to one end of the slide rod 106 away from the moving block 104; a spring 107 is fixedly connected between the moving block 104 and the clamping block 108, and located outside the sleeve 105 and the slide rod 106; a conveying device 109 is provided on the outside of the support block 101; a separator 110 is fixedly connected to the upper end of the conveying device 109; limit rods 111 are symmetrically fixedly connected to the lower end of the support block 101; the limit rods 111 are slidably connected to the moving block 104. During operation, when the conveying device 109 conveys the chip to the lower end of the separator 110, the longitudinally moving auxiliary rod 102 and the first threaded rod 103 drive the moving block 104. Simultaneously, through the structural design of the contact area between the clamping block 108 and the separator 110, the two clamping blocks 108 are kept away from each other. When the clamping block 108 slides down to the lower end of the separator 110, the elastic characteristics of the spring 107 cause the two clamping blocks 108 to move closer together, thereby clamping the chip. In this step, through the change in the relative position of the contact surface between the clamping block 108 and the separator 110, initially, the structural design causes the two clamping blocks 108 to move away from each other during the descent. Subsequently, when the clamping block 108 slides down to the lower end of the separator 110, the elastic characteristics of the spring 107 are effectively activated, causing the two clamping blocks 108 to quickly and stably move closer together, thus clamping the chip. This process not only simplifies the operation steps and improves the degree of automation, but also effectively improves work efficiency and product quality.

[0024] like Figure 1-3 As shown, a threaded cylinder 201 is symmetrically rotatably connected to the inner side of the support block 101; a second threaded rod 202 is threadedly connected to the inner side of the threaded cylinder 201; during operation, rotating the threaded cylinder 201 causes it to move laterally outside the second threaded rod 202 through the threaded connection between the threaded cylinder 201 and the second threaded rod 202. At the same time, the threaded cylinder 201 is rotatably connected to the support block 101, thereby driving the support block 101 to move laterally. In this step, the device moves the clamped chip to the top of the packaging box by moving the support block 101 laterally.

[0025] As shown in Figure 31, a first servo motor 301 is fixedly connected to the inner side of the support block 101; a first rotating rod 302 is fixedly connected to the output end of the first servo motor 301; a first sprocket 303 is fixedly connected to the outer side of the first rotating rod 302; a second sprocket 305 is fixedly connected to the outer side of the threaded cylinder 201; a chain 304 is drivingly connected between the second sprocket 305 and the outer side of the first sprocket 303; during operation, the first servo motor 301 is started, and the first rotating rod 302 is driven to rotate through the output end of the first servo motor 301. When the first rotating rod 302 rotates... The first sprocket 303 is driven to rotate, which in turn drives the chain 304 to rotate, thereby causing the second sprocket 305 to drive. The second sprocket 305 then drives the two threaded cylinders 201 to rotate, which in turn causes the support block 101 to move laterally. In this step, the first servo motor 301 is started, and its output drives the first rotating rod 302 to rotate, which in turn causes the threaded cylinders 201 to rotate, thereby causing the support block 101 to move laterally. This allows the device to move the clamped chip to the top of the packaging box, increasing the speed at which the chip is moved to the packaging box and thus improving production efficiency.

[0026] like Figure 1 , Figure 4 As shown, a gear threaded post 401 is threadedly connected to the outer side of the first threaded rod 103 and the inner side of the support block 101; a rotating cylinder 402 is fixedly connected to the outer side of the gear threaded post 401; a rotating plate 403 is fixedly connected to the middle of the outer side of the rotating cylinder 402; the rotating plate 403 is rotatably connected to the support block 101; during operation, rotating the rotating plate 403 drives the rotating cylinder 402 to rotate, thereby causing the gear threaded post 401 to rotate, and at the same time, the gear threaded post 401 is threadedly connected to the first threaded rod 103, thereby causing the first threaded rod 103 to move longitudinally.

[0027] like Figure 1 , Figure 4 As shown, a second servo motor 501 is fixedly connected to the inner side of the support block 101; a second rotating rod 502 is fixedly connected to the output end of the second servo motor 501; an output gear 503 is fixedly connected to the outer side of the second rotating rod 502; the output gear 503 meshes with the gear thread post 401; during operation, the second servo motor 501 is started, and the output end of the second servo motor 501 drives the second rotating rod 502 to rotate. When the second rotating rod 502 rotates, it drives the output gear 503 to rotate. At the same time, the output gear 503 meshes with the gear thread post 401, thereby causing the first thread rod 103 to move longitudinally.

[0028] like Figure 1 , Figure 4As shown, the upper end of the first threaded rod 103 is rotatably connected to a connecting plate 601; the lower end of the connecting plate 601 is rotatably connected to an auxiliary rod 102. During operation, when the first threaded rod 103 moves longitudinally, it drives the connecting plate 601 to move longitudinally synchronously. At the same time, the connecting plate 601 drives the first threaded rod 103 to move synchronously, thereby causing the two moving blocks 104 to move longitudinally synchronously. In this step, the longitudinal movement of the first threaded rod 103 drives the connecting plate 601 to move longitudinally, and at the same time, the connecting plate 601 drives the auxiliary rod 102, thereby causing the two moving blocks 104 to move longitudinally synchronously, thus making the device more stable when clamping the chip.

[0029] like Figure 1-2 As shown, a silicone pad 701 is fixedly connected to the end of the clamping block 108; during operation, the silicone pad 701 reduces wear during clamping.

[0030] Working principle: During operation, when the conveying device 109 conveys the chip to the lower end of the separator 110, the longitudinally moving auxiliary rod 102 and the first threaded rod 103 drive the moving block 104. Simultaneously, through the structural design of the contact area between the clamping block 108 and the separator 110, the two clamping blocks 108 are moved away from each other. When the clamping block 108 slides down to the lower end of the separator 110, the elasticity of the spring 107 causes the two clamping blocks 108 to move closer together, thereby clamping the chip. This step involves the change in the relative position of the contact surfaces between the clamping block 108 and the separator 110. Initially, the structural design causes the two clamping blocks 108 to move away from each other during the descent. Subsequently, when the clamping block 108 slides down to the lower end of the separator 110... At the lower end, the elastic properties of spring 107 are effectively activated, causing the two clamping blocks 108 to quickly and stably approach each other, thus clamping the chip. This process not only simplifies the operation steps and improves the degree of automation, but also ensures the stability and accuracy of chip clamping, effectively improving work efficiency and product quality. Rotating the threaded cylinder 201, through the threaded connection between the threaded cylinder 201 and the second threaded rod 202, causes the threaded cylinder 201 to move laterally outside the second threaded rod 202. At the same time, through the rotatable connection between the threaded cylinder 201 and the support block 101, the support block 101 is driven to move laterally. In this step, through the lateral movement of the support block 101, the device moves the clamped chip to the top of the packaging box, activating the first servo motor. Machine 301, through the output end of the first servo motor 301, drives the first rotating rod 302 to rotate. When the first rotating rod 302 rotates, it drives the first sprocket 303 to rotate, which in turn drives the chain 304 to rotate, thereby causing the second sprocket 305 to drive, which in turn drives the two threaded cylinders 201 to rotate, thus causing the support block 101 to move laterally. In this step, the first servo motor 301 is started, and through the output end of the first servo motor 301, it drives the first rotating rod 302 to rotate, which in turn drives the threaded cylinders 201 to rotate, thereby causing the support block 101 to move laterally. This allows the device to move the clamped chip to the top of the packaging box, increasing the speed at which the chip is moved to the packaging box, thereby improving production efficiency. The rotating plate 403 drives the rotating cylinder 402 to rotate, which in turn causes the gear threaded column 401 to rotate. Simultaneously, the gear threaded column 401 is threadedly connected to the first threaded rod 103, causing the first threaded rod 103 to move longitudinally. This activates the second servo motor 501, whose output terminal drives the second rotating rod 502 to rotate. When the second rotating rod 502 rotates, it drives the output gear 503 to rotate. Simultaneously, the output gear 503 meshes with the gear threaded column 401, causing the first threaded rod 103 to move longitudinally. This longitudinal movement of the first threaded rod 103 causes the connecting plate 601 to move synchronously longitudinally, and the connecting plate 601 also drives the first threaded rod 103 to move synchronously.This causes the two moving blocks 104 to move longitudinally synchronously. In this step, the longitudinal movement of the first threaded rod 103 drives the connecting plate 601 to move longitudinally, and simultaneously, the connecting plate 601 drives the auxiliary rod 102, thus causing the two moving blocks 104 to move longitudinally synchronously. This makes the device more stable when clamping the chip, and the silicone pad 701 reduces wear during clamping.

[0031] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model.

Claims

1. An auxiliary mating device for semiconductor chip packaging, comprising a support block (101); characterized in that: The inner side of the support block (101) is symmetrically provided with a first threaded rod (103) and an auxiliary rod (102); the auxiliary rod (102) is slidably connected to the support block (101); the lower ends of the auxiliary rod (102) and the first threaded rod (103) are rotatably connected to moving blocks (104); the ends of the two moving blocks (104) that are close to each other are fixedly connected to sleeves (105); the inner side of the sleeves (105) is slidably connected to a sliding rod (106); the sliding rod (106) is away from the moving blocks (104). One end of the moving block (104) is fixedly connected to a clamping block (108); a spring (107) is fixedly connected between the moving block (104) and the clamping block (108) and outside the sleeve (105) and the slide rod (106); a conveying device (109) is provided on the outside of the support block (101); a separator (110) is fixedly connected to the upper end of the conveying device (109); a limit rod (111) is symmetrically fixedly connected to the lower end of the support block (101); the limit rod (111) is slidably connected to the moving block (104).

2. The auxiliary mating device for semiconductor chip packaging according to claim 1, characterized in that: The inner side of the support block (101) is symmetrically rotatably connected to a threaded cylinder (201); the inner side of the threaded cylinder (201) is threadedly connected to a second threaded rod (202).

3. The auxiliary mating device for semiconductor chip packaging according to claim 2, characterized in that: A first servo motor (301) is fixedly connected to the inner side of the support block (101); a first rotating rod (302) is fixedly connected to the output end of the first servo motor (301); a first sprocket (303) is fixedly connected to the outer side of the first rotating rod (302); a second sprocket (305) is fixedly connected to the outer side of the threaded cylinder (201); and a chain (304) is drivingly connected between the second sprocket (305) and the outer side of the first sprocket (303).

4. The auxiliary mating device for semiconductor chip packaging according to claim 1, characterized in that: A gear threaded column (401) is threadedly connected to the outer side of the first threaded rod (103) and the inner side of the support block (101); a rotating cylinder (402) is fixedly connected to the outer side of the gear threaded column (401); a rotating plate (403) is fixedly connected to the middle part of the outer side of the rotating cylinder (402); the rotating plate (403) is rotatably connected to the support block (101).

5. The auxiliary mating device for semiconductor chip packaging according to claim 4, characterized in that: The inner side of the support block (101) is fixedly connected to a second servo motor (501); the output end of the second servo motor (501) is fixedly connected to a second rotating rod (502); the outer side of the second rotating rod (502) is fixedly connected to an output gear (503); the output gear (503) is meshed with a gear thread column (401).

6. The auxiliary mating device for semiconductor chip packaging according to claim 1, characterized in that: The upper end of the first threaded rod (103) is rotatably connected to a connecting plate (601); the lower end of the connecting plate (601) is rotatably connected to an auxiliary rod (102).

7. The auxiliary mating device for semiconductor chip packaging according to claim 1, characterized in that: A silicone pad (701) is fixedly connected to the end of the clamping block (108).

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