Ku-band miniaturized high-power TR assembly

Abstract

The utility model relates to a Ku wave band miniaturized high-power TR assembly, which is applied to a Ku wave band and comprises a radio frequency connector, a radio frequency cover plate, a heat dissipation water pipe, a power supply control board, a micro-channel cavity, a packaging chip, a microwave multilayer board and a unit antenna, a plurality of micro-flow water channels are arranged in the micro-flow channel cavity; the micro-channel cavity is of an H-shaped structure, and the power supply control panel is arranged in a groove in the upper half part of the H-shaped structure; the radio frequency cover plate seals the upper half part of the H-shaped structure; the radiating water pipe comprises a water inlet pipe and a water outlet pipe; the heat dissipation water pipe is connected with the micro-channel cavity; a plurality of packaging chips are provided; the plurality of packaging chips are arranged in the groove of the lower half part of the H-shaped structure; the microwave multilayer board seals the lower half part of the H-shaped structure and is connected with the packaging chip; the unit antenna is arranged on the outer side of the microwave multilayer board and is connected with an output pin of the packaging chip through the microwave multilayer board; and the radio frequency connector penetrates through the radio frequency cover plate, the power supply control panel and the micro-channel cavity and is connected with the microwave multilayer board.

Description

Technical Field

[0001] This application relates to the field of phased array antenna technology, and in particular to a Ku-band miniaturized high-power TR (transmit / receive) component. Background Technology

[0002] Ku-band phased array antennas currently have advantages such as high speed, high capacity and high reliability, and are being used more and more widely in the field of communication radar.

[0003] Currently, traditional Ku-band TR modules are generally divided into two categories. One is a brick-type high-power TR module, which can output 1W of power per channel. However, it is large in size and uses multiple monolithic microwave chips inside the module. This not only increases the cost but also makes it larger and less reliable, making it difficult to meet the current phased array requirements for low cost and miniaturization.

[0004] Another type is the tile-type TR module, with a single-channel output power generally not exceeding 200mW. It has the advantages of miniaturization and low cost, but the single-channel power is relatively low. TR modules cannot be made airtight, making it difficult to meet the system requirements of various complex environments. Utility Model Content

[0005] To at least partially overcome the problems of Ku-band TR modules in related technologies failing to meet the requirements of low cost and miniaturization, and being unable to implement airtight measures, this application provides a miniaturized high-power Ku-band TR module.

[0006] The proposed solution is as follows:

[0007] A miniaturized high-power TR module for Ku-band applications includes:

[0008] RF connectors, RF cover plates, cooling water pipes, power control boards, microfluidic cavities, packaged chips, microwave multilayer boards, and unit antennas;

[0009] The microchannel cavity is equipped with multiple microchannels;

[0010] The microchannel cavity has an H-shaped structure, and the power supply control board is located in the groove of the upper half of the H-shaped structure;

[0011] The radio frequency cover plate seals the upper part of the H-shaped structure;

[0012] The cooling water pipe includes an inlet pipe and an outlet pipe; the cooling water pipe is connected to the microchannel cavity;

[0013] The packaged chips are multiple; all the packaged chips are disposed in the groove of the lower half of the H-shaped structure;

[0014] The microwave multilayer board seals the lower half of the H-shaped structure and connects to the packaged chip;

[0015] The unit antenna is disposed on the outside of the microwave multilayer board and is connected to the output pin of the packaged chip through the microwave multilayer board.

[0016] The RF connector passes through the RF cover plate, the power supply control board, and the microfluidic cavity, and connects to the microwave multilayer board.

[0017] Preferably, the packaged chips are spaced apart in the grooves of the lower half of the H-shaped structure.

[0018] Preferably, the packaged chip is disposed in the groove of the lower half of the H-shaped structure using a flexible heat dissipation material.

[0019] Preferably, the groove in the lower half of the H-shaped structure has multiple protrusions;

[0020] The packaged chip is disposed on a protrusion in the groove of the lower half of the H-shaped structure.

[0021] Preferably, the radio frequency cover is disposed on the inner side of the upper half of the H-shaped structure to seal the upper half of the H-shaped structure;

[0022] The microwave multilayer board is disposed on the outside of the lower half of the H-shaped structure to seal the lower half of the H-shaped structure;

[0023] The cooling water pipe is located at the top of the upper half of the H-shaped structure.

[0024] Preferably, the cooling water pipe is connected to the microchannel cavity by screws and sealing rings.

[0025] The technical solution provided in this application may include the following beneficial effects:

[0026] The Ku-band miniaturized high-power TR component of this application, applied in the Ku-band, includes: an RF connector, an RF cover plate, a heat dissipation pipe, a power supply control board, a microfluidic cavity, a packaged chip, a microwave multilayer board, and a unit antenna; the microfluidic cavity has multiple microfluidic channels inside; the microfluidic cavity has an H-shaped structure, and the power supply control board is located in the groove of the upper half of the H-shaped structure; the RF cover plate seals the upper half of the H-shaped structure; the heat dissipation pipe includes an inlet pipe and an outlet pipe; the heat dissipation pipe is connected to the microfluidic cavity; there are multiple packaged chips; the multiple packaged chips are all located in the groove of the lower half of the H-shaped structure; the microwave multilayer board seals the lower half of the H-shaped structure and connects to the packaged chips; the unit antenna is located on the outside of the microwave multilayer board and connects to the output pin of the packaged chip through the microwave multilayer board; the RF connector passes through the RF cover plate, the power supply control board, and the microfluidic cavity, and connects to the microwave multilayer board.

[0027] In this technical solution, the microfluidic cavity has an H-shaped structure. The upper half of the H-shaped structure is sealed by an RF cover plate, and the lower half is sealed by a microwave multilayer board. This is equivalent to placing the power supply control board and the packaged chip inside the microfluidic cavity, while ensuring the hermeticity requirements of the environment in which the power supply control board and the packaged chip are located. The TR module uses a packaged chip, which improves product reliability and enables high-power output. High-power output generates greater heat dissipation. The microfluidic cavity uses a water circulation system through cooling pipes to dissipate heat from the TR module, achieving good thermal conductivity and keeping the TR module's operating temperature relatively stable. The core of the entire TR module consists of two printed circuit boards: the power supply control board and the microwave multilayer board. This allows the TR module to be made relatively small, achieving miniaturization. Integrating the TR module body and the unit antenna directly through the microwave multilayer board further improves the product's integration.

[0028] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description

[0029] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0030] Figure 1 This is a schematic diagram of the structure of a Ku-band miniaturized high-power TR component provided in one embodiment of this application.

[0031] Reference numerals: RF connector-1; RF cover plate-2; cooling water pipe-3; power supply control board-4; microfluidic cavity-5; packaged chip-6; microwave multilayer board-7; unit antenna-8; flexible heat dissipation material-9. Detailed Implementation

[0032] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0033] Figure 1 This is a schematic diagram of the structure of a Ku-band miniaturized high-power TR module according to an embodiment of this application, with reference to... Figure 1 A miniaturized high-power TR module for Ku-band applications includes:

[0034] 1. RF connector; 2. RF cover plate; 3. Heat dissipation pipe; 4. Power supply control board; 5. Microfluidic cavity; 6. Packaged chip; 7. Microwave multilayer board; 8. Unit antenna.

[0035] Multiple microfluidic channels are arranged inside the microfluidic cavity 5;

[0036] The microchannel cavity 5 has an H-shaped structure, and the power supply control board 4 is set in the groove of the upper half of the H-shaped structure;

[0037] The radio frequency cover 2 seals the upper part of the H-shaped structure;

[0038] The cooling water pipe 3 includes an inlet pipe and an outlet pipe; the cooling water pipe 3 is connected to the microchannel cavity 5;

[0039] There are multiple packaged chips 6; all multiple packaged chips 6 are disposed in the groove of the lower half of the H-shaped structure;

[0040] The microwave multilayer board 7 seals the lower half of the H-shaped structure and connects the packaged chip 6;

[0041] The unit antenna 8 is located on the outside of the microwave multilayer board 7 and is connected to the output pin of the packaged chip 6 through the microwave multilayer board 7.

[0042] The RF connector 1 passes through the RF cover plate 2, the power supply control board 4 and the microfluidic cavity 5, and connects to the microwave multilayer board 7.

[0043] It should be noted that the electromagnetic wave signal is transmitted from the outside to the microwave multilayer board 7 through the radio frequency connector 1, and the radio frequency connector 1 and the microwave multilayer board 7 are connected by soldering.

[0044] The connection between the RF cover plate 2 and the microfluidic cavity 5 is laser sealing, which can prevent foreign objects from falling into the TR component and achieve the requirements of an airtight environment.

[0045] The heat dissipation water pipe 3 is connected to the microchannel cavity 5 by screws and sealing rings. It can remove the heat loss of the TR component through liquid cooling circulation, so that the component temperature is kept in a safe and constant environment. The heat dissipation water pipe 3 has two water pipes, namely the inlet pipe and the outlet pipe, to realize the water flow system.

[0046] The power supply control board 4 communicates directly and at high speed with the microwave multilayer board 7 and provides the operating voltage for the devices. The power supply control board 4 contains functional circuits such as power supply module and control module.

[0047] The microchannel cavity 5 has multiple microchannels inside, which allows the water-cooled liquid to flow inside the cavity, achieving excellent heat dissipation.

[0048] The packaged chip 6 is generally a four-channel multi-functional chip and a compound chip packaged chip. Its characteristics are that the single channel power is relatively high, usually the single channel output power is greater than 2W. The package form is generally ceramic package or package of materials with higher thermal conductivity, which is intended to enable good transmission of radio frequency signals, while having good heat transfer characteristics at the top and bottom of the chip.

[0049] The microwave multilayer board 7 is formed by multiple pressing of multilayer dielectric boards and multiple adhesive sheets through a special processing technology. It can realize the transmission of radio frequency, digital and analog signals on the same printed circuit board, and has good transmission characteristics and high integration. It is well suited to the current miniaturization requirements.

[0050] The unit antenna 8 can be connected to the output pin of the packaged chip 6 through the microwave multilayer board 7, realizing the idea of ​​high integration between the packaged chip 6 and the unit antenna 8. At the same time, the antenna is determined to be a microstrip antenna, which has high array antenna gain when multiple units are combined, and can better realize the function of transmitting and receiving radio frequency signals.

[0051] It should be noted that the packaged chips 6 are spaced apart in the grooves of the lower half of the H-shaped structure to achieve device avoidance between multiple packaged chips 6.

[0052] It should be noted that the packaged chip 6 is disposed in the groove of the lower half of the H-shaped structure by means of flexible heat dissipation material 9.

[0053] Since the bottom of the packaged chip 6 is connected to the microwave multilayer board 7 and the top is connected to the microfluidic cavity 5, and the flexible heat dissipation material 9 is placed between the packaged chip 6 and the microfluidic cavity 5, it can provide a buffer between the packaged chip 6 and the microfluidic cavity 5, ensuring that the packaged chip 6 will not be damaged by strong stress.

[0054] It should be noted that the groove in the lower half of the H-shaped structure has multiple protrusions; the packaged chip 6 is disposed on the protrusions in the groove of the lower half of the H-shaped structure. Since the packaged chip 6 itself is relatively thin, it needs to be mounted on the protrusions in the groove of the lower half of the H-shaped structure so that the packaged chip 6 can contact the microfluidic cavity 5 at the top and contact the microwave multilayer board 7 at the bottom.

[0055] It should be noted that the radio frequency cover 2 is set on the inside of the upper half of the H-shaped structure to seal the upper half of the H-shaped structure;

[0056] The microwave multilayer board 7 is placed on the outside of the lower half of the H-shaped structure to seal the lower half of the H-shaped structure;

[0057] The cooling water pipe 3 is located at the top of the upper half of the H-shaped structure.

[0058] This configuration ensures that the cooling water pipe 3 does not affect the overall structure, and the TR components have a higher degree of integration.

[0059] In this technical solution, the microfluidic cavity 5 has an H-shaped structure. The upper half of the H-shaped structure is sealed by the RF cover plate 2, and the lower half is sealed by the microwave multilayer board. This is equivalent to placing the power supply control board 4 and the packaged chip 6 inside the microfluidic cavity 5, while ensuring the airtightness of the environment where the power supply control board 4 and the packaged chip 6 are located. The TR module uses the packaged chip 6, which improves product reliability and enables high-power output. High-power output generates greater heat dissipation. The microfluidic cavity 5 uses a water circulation system formed by the cooling water pipe 3 to dissipate heat from the TR module, achieving good thermal conductivity and keeping the TR module's operating temperature relatively stable. The core of the entire TR module consists of two printed circuit boards: the power supply control board 4 and the microwave multilayer board 7. This allows the TR module to be made relatively small, achieving miniaturization. The TR module body and the unit antenna 8 are directly integrated through the microwave multilayer board 7, further improving the product's integration.

[0060] It is understood that the same or similar parts in the above embodiments can be referred to each other, and the contents not described in detail in some embodiments can be referred to the same or similar contents in other embodiments.

[0061] It should be noted that in the description of this application, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Furthermore, in the description of this application, unless otherwise stated, "a plurality of" means at least two.

[0062] Furthermore, the functional units in the various embodiments of this application can be integrated into a processing module, or each unit can exist physically separately, or two or more units can be integrated into a module. The integrated module can be implemented in hardware or as a software functional module.

[0063] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0064] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. A miniaturized high-power TR module for the Ku-band, characterized in that, include: RF connectors, RF cover plates, cooling water pipes, power control boards, microfluidic cavities, packaged chips, microwave multilayer boards, and unit antennas; The microchannel cavity is equipped with multiple microchannels; The microchannel cavity has an H-shaped structure, and the power supply control board is located in the groove of the upper half of the H-shaped structure; The radio frequency cover plate seals the upper part of the H-shaped structure; The cooling water pipe includes an inlet pipe and an outlet pipe; the cooling water pipe is connected to the microchannel cavity; The packaged chips are multiple; all the packaged chips are disposed in the groove of the lower half of the H-shaped structure; The microwave multilayer board seals the lower half of the H-shaped structure and connects to the packaged chip; The unit antenna is disposed on the outside of the microwave multilayer board and is connected to the output pin of the packaged chip through the microwave multilayer board. The RF connector passes through the RF cover plate, the power supply control board, and the microfluidic cavity, and connects to the microwave multilayer board.

2. The Ku-band miniaturized high-power TR module according to claim 1, characterized in that, The packaged chips are spaced apart in the grooves of the lower half of the H-shaped structure.

3. The Ku-band miniaturized high-power TR module according to claim 1, characterized in that, The packaged chip is disposed in the groove of the lower half of the H-shaped structure using a flexible heat dissipation material.

4. The Ku-band miniaturized high-power TR module according to claim 1, characterized in that, The groove in the lower half of the H-shaped structure has multiple protrusions; The packaged chip is disposed on a protrusion in the groove of the lower half of the H-shaped structure.

5. The Ku-band miniaturized high-power TR module according to claim 1, characterized in that, The radio frequency cover is disposed on the inner side of the upper half of the H-shaped structure to seal the upper half of the H-shaped structure; The microwave multilayer board is disposed on the outside of the lower half of the H-shaped structure to seal the lower half of the H-shaped structure; The cooling water pipe is located at the top of the upper half of the H-shaped structure.

6. The Ku-band miniaturized high-power TR module according to claim 1, characterized in that, The cooling water pipe is connected to the microchannel cavity by screws and sealing rings.

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