Power amplifier circuit system

Abstract

The utility model belongs to the field of electronic information, and discloses a power amplifier circuit system, which comprises a mainboard, a power amplifier circuit board and two groups of power amplifier circuits, the first MOSFET, the second MOSFET, the MOSFET driving chip, the signal input end and the signal output end are arranged on the power amplifier circuit board; the power amplifier circuit board is suspended above the mainboard; and the power amplifier circuit board is positioned right above the PWM modulation circuit and the feedback processing module. According to the system, the main body thought designed in advance by the applicant is continued, and the power amplifier circuit board is moved to the position above the PWM modulation circuit and the feedback processing module of the mainboard, so that the area of the power amplifier circuit board can be increased, a larger heat dissipation device can be carried, and the influence of waste heat on electronic devices on the mainboard is avoided in a faster heat dissipation mode.

Description

Technical Field

[0001] This utility model relates to the field of electronic information, specifically to a power amplifier circuit system. Background Technology

[0002] The applicant has previously filed three patent applications:

[0003] CN115276627A discloses a gallium nitride MOSFET conduction loss power limiting circuit, including a signal input terminal, a first MOSFET and a second MOSFET, a first sampling circuit connected to the first MOSFET for real-time sampling of its operating voltage, a second sampling circuit connected to the second MOSFET for real-time sampling of its operating voltage, a feedback processing module connected to both the first and second sampling circuits for processing the sampled signals into a production limit feedback signal according to a set setting, and a driving module for driving the first and second MOSFETs to switch on and off according to the signals. The feedback processing module and the signal input terminal are respectively connected to a control signal processing module for generating control signals that are input to the driving module to control the on and off states of the first and second MOSFETs, thereby forming an automatic power loss limiting structure. This solution can effectively protect the MOSFETs and improve their operational stability and efficiency.

[0004] 2. CN220673924U A power amplifier system;

[0005] 3. CN220359428U A single-board gallium nitride power amplifier circuit board and power amplifier circuit system.

[0006] The above three solutions constitute the applicant's old power amplifier equipment.

[0007] As the power of amplifiers increases, the size of most electronic components also increases. If the layout described in CN220673924U is to be followed, the motherboard must be enlarged, which we believe is unacceptable.

[0008] The technical problem addressed in this case is: how to optimize the existing power amplifier system so that the motherboard area does not increase significantly despite the increase in the size of electronic components. Utility Model Content

[0009] The purpose of this utility model is to provide a power amplifier circuit system that continues the main idea of ​​the applicant's prior design, moving the power amplifier circuit board above the PWM modulation circuit and feedback processing module of the motherboard. This increases the area of ​​the power amplifier circuit board, allowing for the installation of larger heat dissipation devices and avoiding the impact of residual heat on the electronic components on the motherboard through faster heat dissipation.

[0010] To achieve the above objectives, this utility model provides the following technical solution: a power amplifier circuit system, comprising a motherboard and a power amplifier circuit board, characterized in that it further comprises two sets of power amplifier circuits; the power amplifier circuit includes an analog signal input terminal, an analog signal amplification circuit, a PWM modulation circuit, a digital signal output terminal, a sampling circuit, a feedback processing module, a first MOSFET, a second MOSFET, a MOSFET driver chip, a signal input terminal, a signal output terminal, an inductor, and an analog signal output terminal;

[0011] The analog signal input terminal, analog signal amplification circuit, PWM modulation circuit, digital signal output terminal, feedback processing module, analog signal output terminal, and inductor are mounted on the motherboard; the first MOSFET, second MOSFET, MOSFET driver chip, signal input terminal, and signal output terminal are mounted on the power amplifier circuit board.

[0012] The power amplifier circuit board is suspended above the motherboard; the power amplifier circuit board is located directly above the PWM modulation circuit and the feedback processing module.

[0013] The aforementioned power amplifier circuit system also includes a power supply; the power supply is used to power the power amplifier circuit; the power supply is located on one side of the motherboard and is arranged opposite to the power amplifier circuit.

[0014] In the aforementioned power amplifier circuit system, the sampling circuit is mounted on the power amplifier circuit board.

[0015] The sampling circuit is set on the power amplifier circuit board, which allows for more space to be reserved on the main board for the power amplifier circuit.

[0016] In the aforementioned power amplifier circuit system, a heat dissipation device is arranged on the upper surface of the power amplifier circuit board, and the first MOSFET and the second MOSFET are arranged on the lower surface of the power amplifier circuit board; the heat dissipation device is used to absorb, store, and dissipate the heat generated by the first MOSFET and the second MOSFET.

[0017] In the aforementioned power amplifier circuit system, the sampling circuit and MOSFET driver chip are arranged on the lower surface of the power amplifier circuit board.

[0018] In the aforementioned power amplifier circuit system, the PWM modulation circuit, digital signal output terminal, feedback processing module, and inductor of the two power amplifier circuits are symmetrically arranged on the motherboard.

[0019] In the aforementioned power amplifier circuit system, the sampling circuit, the first MOSFET, the second MOSFET, and the MOSFET driver chip in the two power amplifier circuits are symmetrically arranged on the power amplifier circuit board.

[0020] In the aforementioned power amplifier circuit system, there is one heat dissipation device, which covers the areas where the first MOSFET and the second MOSFET are located.

[0021] In the aforementioned power amplifier circuit system, the heat dissipation device is a finned heat sink.

[0022] Compared with the prior art, the beneficial effects of this utility model are:

[0023] This solution moves the power amplifier circuit board above the PWM modulation circuit and feedback processing module on the motherboard, which increases the area of ​​the power amplifier circuit board and allows for the installation of larger heat dissipation devices. This faster heat dissipation method avoids the impact of residual heat on the electronic components on the motherboard. At the same time, moving the power amplifier circuit board can free up more space for other electronic components on the motherboard, such as the power supply.

[0024] Through the above design, the goal of making the motherboard area smaller or even larger is achieved despite the general increase in the size of electronic components, making the whole system more compact. Attached Figure Description

[0025] Figure 1 This is a top view of the motherboard in Embodiment 1;

[0026] Figure 2 This is a bottom view of the power amplifier circuit board of Embodiment 1;

[0027] Figure 3 This is a schematic diagram of the power amplifier circuit board and the main board in Embodiment 1. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0029] Example 1

[0030] refer to Figure 1-3 A power amplifier circuit system includes a motherboard 1 and a power amplifier circuit board 2, and further includes two sets of power amplifier circuits; the power amplifier circuit includes an analog signal input terminal 3, an analog signal amplification circuit 4, a PWM modulation circuit 5, a digital signal output terminal 6, a sampling circuit 7, a feedback processing module 8, a first MOSFET 9, a second MOSFET 10, a MOSFET driver chip 11, a signal input terminal 12, a signal output terminal 13, an inductor 14, and an analog signal output terminal 15;

[0031] The analog signal input terminal 3, analog signal amplifier circuit 4, PWM modulation circuit 5, digital signal output terminal 6, signal input terminal 12, and MOSFET driver chip 11 are connected in sequence.

[0032] The first MOSFET 9 and the second MOSFET 10 are both used to receive and amplify the signal input from the MOSFET driver chip 11, and send the amplified signal to the signal output terminal 13. The signal output terminal 13, the inductor 14, and the analog signal output terminal 15 are connected in sequence.

[0033] The sampling circuit 7 is used to sample the working voltage of the first MOSFET 9 and the second MOSFET 10 in real time to obtain the sampling signal. The feedback processing module 8 is used to process the sampling signal into a production limit feedback signal according to the setting. The feedback signal is sent to the MOSFET driver chip 11, which controls the on / off state of the first MOSFET 9 and the second MOSFET 10.

[0034] The analog signal input terminal 3, analog signal amplification circuit 4, PWM modulation circuit 5, digital signal output terminal 6, feedback processing module 8, analog signal output terminal 15, and inductor 14 are mounted on the motherboard 1.

[0035] The first MOSFET 9, the second MOSFET 10, the MOSFET driver chip 11, the signal input terminal 12, and the signal output terminal 13 are disposed on the power amplifier circuit board 2. Preferably, the sampling circuit 7 is also disposed on the power amplifier circuit board 2, which allows more space to be reserved on the motherboard for arranging electronic components. At the same time, the power amplifier circuit board 2 is moved directly above the PWM modulation circuit 5 and the feedback processing module 8, which means that the area of ​​the power amplifier circuit board 2 is larger. Therefore, electronic components that can be moved to the power amplifier circuit board 2 should be moved there as much as possible. Of course, in some implementations, the sampling circuit 7 can also be disposed on the motherboard 1.

[0036] The power amplifier circuit has two sets;

[0037] The power amplifier circuit board 2 is suspended above the motherboard 1; the power amplifier circuit board 2 is located directly above the PWM modulation circuit 5 and the feedback processing module 8.

[0038] The working principle of the power amplifier circuit can be found in CN220673924U, a power amplifier system, and CN220359428U, a single-board gallium nitride power amplifier circuit board 2, which are power amplifier circuit systems, and there are no changes to them.

[0039] The following is a brief description of the power amplifier circuit's operation, based on the components mentioned above:

[0040] Analog signal input terminal 3 inputs an analog signal to analog signal amplifier circuit 4. Analog signal amplifier circuit 4 amplifies the analog signal. The amplified analog signal is then pulse-width modulated and converted from analog to digital by PWM modulation circuit 5 to obtain a digital signal. The digital signal is sent to digital signal output terminal 6. Digital signal output terminal 6 is connected to signal input terminal 12 via a pin header. The digital signal is then sent to MOSFET driver chip 11. MOSFET driver chip 11 sends the digital signal to first MOSFET 911 and second MOSFET 10 for amplification. Sampling circuit 7 samples the first MOSFET 911... The second MOSFET 10 samples the operating voltage in real time to obtain a sampling signal. The feedback processing module 8 processes the sampling signal according to the settings to obtain a production limit feedback signal. The feedback signal is sent to the MOSFET driver chip 11, which controls the on / off state of the first MOSFET 9 and the second MOSFET 10. The first MOSFET 9 and the second MOSFET 10 amplify the digital signal and output it to the inductor 14 through the signal output terminal 13. The inductor 14 performs DA conversion on the signal output terminal 13 to obtain an analog signal. The analog signal output terminal 15 outputs the analog signal.

[0041] CN115276627A discloses the control process between the sampling circuit 7, the feedback processing module 8, and the driving module (i.e., the MOSFET driving chip 11 of this application), which will not be described in detail here.

[0042] The core innovation of this embodiment is not directly related to the working process and processing mode of the power amplifier circuit mentioned above. The main innovation of this embodiment is concentrated on the design of the position of the power amplifier circuit board 2 and the position of the sampling circuit 7.

[0043] In this embodiment, the sampling circuit 7, which was originally designed on the motherboard 1, is moved to the power amplifier circuit board 2. This allows the use of the spare area of ​​the sampling circuit 7 while leaving space for larger electronic components on the motherboard 1. Figure 1 In the diagram, box A marks the mounting location of the power amplifier circuit board, which is suspended and fixed above the main board 1 by a fixing post.

[0044] In this embodiment, the power amplifier circuit board 2 is moved above the PWM modulation circuit 5 and feedback processing module 8 of the motherboard 1. This increases the area of ​​the power amplifier circuit board 2, allowing for the installation of a larger heat dissipation device 16. This faster heat dissipation method avoids the impact of residual heat on the electronic components on the motherboard 1. At the same time, moving the power amplifier circuit board 2 allows for more space for other electronic components on the motherboard 1, such as the power supply 17.

[0045] Preferably, a heat dissipation device 16 is arranged on the upper surface of the power amplifier circuit board 2, and the first MOSFET 9 and the second MOSFET 10 are arranged on the lower surface of the power amplifier circuit board 2; the heat dissipation device 16 is used to absorb, store and dissipate the heat generated by the first MOSFET 9 and the second MOSFET 10.

[0046] In some implementation cases, the heat dissipation device 16 may be a first heat dissipation device 16 and a second heat dissipation device 16 in a power amplifier system (CN220673924U).

[0047] In practical applications, we found that designing the heat dissipation device 16 as a single finned heatsink is more effective because the change in the position of the power amplifier circuit board 2 necessitates faster heat dissipation. An integrated finned heatsink not only facilitates installation but also allows for the mounting of more fins for even faster heat dissipation. Furthermore, the change in the position of the power amplifier circuit board 2 results in a larger area; combined with the integrated finned heatsink, its heat dissipation performance is superior, reducing the impact on the electronic components below the power amplifier circuit board 2.

[0048] The thermal connection method of heat dissipation device 16 and first MOSFET 9 and second MOSFET 10 refers to CN220673924U A power amplifier system, CN220359428U A single-board gallium nitride power amplifier circuit board 2, and power amplifier circuit system.

[0049] Preferably, the sampling circuit 7 and the MOSFET driver chip 11 are arranged on the lower surface of the power amplifier circuit board 2.

[0050] Preferably, the PWM modulation circuit 5, digital signal output terminal 6, feedback processing module 8, and inductor 14 in the two power amplifier circuits are symmetrically arranged on the main board 1; the sampling circuit 7, first MOSFET 9, second MOSFET 10, and MOSFET driver chip 11 in the two power amplifier circuits are symmetrically arranged on the power amplifier circuit board 2.

Claims

1. A power amplifier circuit system, comprising a main board and a power amplifier circuit board, characterized in that, It also includes two sets of power amplifier circuits; the power amplifier circuit includes an analog signal input terminal, an analog signal amplification circuit, a PWM modulation circuit, a digital signal output terminal, a sampling circuit, a feedback processing module, a first MOSFET, a second MOSFET, a MOSFET driver chip, a signal input terminal, a signal output terminal, an inductor, and an analog signal output terminal; The analog signal input terminal, analog signal amplification circuit, PWM modulation circuit, digital signal output terminal, feedback processing module, analog signal output terminal, and inductor are mounted on the motherboard; the first MOSFET, second MOSFET, MOSFET driver chip, signal input terminal, and signal output terminal are mounted on the power amplifier circuit board. The power amplifier circuit board is suspended above the motherboard; the power amplifier circuit board is located directly above the PWM modulation circuit and the feedback processing module.

2. The power amplifier circuit system according to claim 1, characterized in that, It also includes a power supply; the power supply is used to power the power amplifier circuit; the power supply is located on one side of the motherboard and is arranged opposite to the power amplifier circuit.

3. The power amplifier circuit system according to claim 1, characterized in that, The sampling circuit is mounted on the power amplifier circuit board.

4. The power amplifier circuit system according to claim 1, characterized in that, The analog signal input terminal, analog signal amplification circuit, PWM modulation circuit, digital signal output terminal, signal input terminal, and MOSFET driver chip are connected in sequence. Both the first MOSFET and the second MOSFET are used to receive and amplify the signals input from the MOSFET driver chip, and send the amplified signals to the signal output terminal. The signal output terminal, the inductor, and the analog signal output terminal are connected in sequence. The sampling circuit is used to sample the operating voltage of the first MOSFET and the second MOSFET in real time to obtain the sampling signal. The feedback processing module is used to process the sampling signal into a production limit feedback signal according to the settings. The feedback signal is sent to the MOSFET driver chip, which controls the on / off state of the first MOSFET and the second MOSFET.

5. The power amplifier circuit system according to claim 1, characterized in that, The upper surface of the power amplifier circuit board is provided with a heat dissipation device, and the first MOSFET and the second MOSFET are arranged on the lower surface of the power amplifier circuit board; the heat dissipation device is used to absorb, store and dissipate the heat generated by the first MOSFET and the second MOSFET.

6. The power amplifier circuit system according to claim 5, characterized in that, The sampling circuit and MOSFET driver chip are arranged on the lower surface of the power amplifier circuit board.

7. The power amplifier circuit system according to claim 1, characterized in that, The PWM modulation circuit, digital signal output terminal, feedback processing module, and inductor in the two power amplifier circuits are symmetrically arranged on the motherboard.

8. The power amplifier circuit system according to claim 1, characterized in that, The sampling circuit, the first MOSFET, the second MOSFET, and the MOSFET driver chip in the two power amplifier circuits are symmetrically arranged on the power amplifier circuit board.

9. The power amplifier circuit system according to claim 5, characterized in that, The heat dissipation device is a single device, which covers the areas where the first MOSFET and the second MOSFET are located.

10. The power amplifier circuit system according to claim 9, characterized in that, The heat dissipation device is a finned heat sink.

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