High-voltage-resistant aluminum substrate

Abstract

The utility model relates to the technical field of aluminum substrates, in particular to a high-voltage-resistant aluminum substrate, which comprises a bonding pad layer, a copper foil layer, an insulating layer and an aluminum base layer, the aluminum base layer comprises an upper aluminum material layer and a lower aluminum material layer, the strength and the rigidity are ensured, the insulating layer is arranged between the two aluminum material layers, and metal plating layers are arranged on the outer surfaces of the two aluminum material layers. The insulating layer is a composite insulating layer, comprises a polytetrafluoroethylene layer, a polyimide layer and an epoxy resin layer, can bear high voltage without breakdown or electric leakage and has good heat resistance, and a concave embedding structure is arranged on the first aluminum material layer. And the composite insulating layer is arranged, so that the insulating property, the heat resistance and the corrosion resistance can be ensured.

Description

Technical Field

[0001] This utility model relates to the field of aluminum substrate technology, specifically a high-voltage resistant aluminum substrate. Background Technology

[0002] Aluminum-based circuit boards generate heat during operation. When the heat accumulates due to failure to be transferred in time, the temperature of the circuit board and its surrounding circuit board segments will continue to rise. If the temperature exceeds the temperature limit that the circuit board material can withstand, it will easily lead to damage or burnout of the circuit board. In addition, traditional aluminum substrates are relatively poor in terms of pressure resistance.

[0003] Therefore, it is necessary to design an aluminum substrate that is resistant to high pressure and has good heat dissipation. Utility Model Content

[0004] To address the aforementioned problems, this invention provides a high-pressure resistant aluminum substrate that possesses good strength and rigidity, as well as excellent heat dissipation performance.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A high-voltage resistant aluminum substrate includes a pad layer, a copper foil layer, an insulating layer, and an aluminum base layer. The aluminum base layer includes an upper aluminum layer and a lower aluminum layer to ensure strength and rigidity. An insulating layer is provided between the upper aluminum layer and the lower aluminum layer. A metal plating layer is provided on the outward-facing surface of the aluminum base layer. The insulating layer is a composite insulating layer, which consists of a polytetrafluoroethylene layer, a polyimide layer, and an epoxy resin layer from top to bottom. Heat dissipation holes are provided on the aluminum base layer.

[0007] Optionally, in one embodiment of this utility model, the heat dissipation hole is connected to the lower aluminum material layer via a polyimide layer.

[0008] Optionally, in one embodiment of this utility model, the insulating layer is an epoxy resin layer.

[0009] Optionally, in one embodiment of this utility model, the upper aluminum layer is provided with a reinforcing rib structure.

[0010] Optionally, in one embodiment of this utility model, the thickness of the polytetrafluoroethylene layer is 0.2mm-0.5mm.

[0011] Optionally, in one embodiment of this utility model, the thickness of the polyimide layer is 20μm-50μm.

[0012] Optionally, in one embodiment of this utility model, the thickness of the epoxy resin layer is 50μm-200μm.

[0013] Optionally, in one embodiment of this utility model, the thickness of the insulating layer is 100 μm.

[0014] Beneficial effects of this utility model

[0015] This utility model discloses a high-voltage resistant aluminum substrate, which has two aluminum layers to ensure the strength and rigidity of the substrate. A metal plating layer is applied to the surface of each aluminum layer to ensure corrosion resistance. A reinforcing rib structure is provided on the upper aluminum layer to further improve the strength of the substrate. An epoxy resin layer is provided between the two aluminum layers to enhance the interlayer bonding force, improve peel resistance, and provide high insulation resistance and breakdown voltage, enabling it to withstand higher voltages. This improves the voltage resistance of the aluminum substrate and ensures stability and safety under high-voltage environments. Heat dissipation holes are provided between the polyimide layer and the lower aluminum layer to dissipate heat and make the circuit operation more stable. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below.

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0018] Figure labeling: 1. Pad, 2. Copper foil layer, 3. Polytetrafluoroethylene layer, 4. Polyimide layer, 5. Epoxy resin layer, 6. Upper aluminum layer, 7. Insulating layer, 8. Lower aluminum layer, 9. Heat dissipation hole. Detailed Implementation

[0019] To further illustrate the technical means and effects adopted by this utility model in order to achieve the intended utility model purpose, the following detailed description of the specific implementation methods, structure, features and effects of this utility model is provided in conjunction with the accompanying drawings and preferred embodiments. Example

[0020] To improve the reliability of aluminum substrates, a high-voltage resistant aluminum substrate was designed, and the specific solution is as follows:

[0021] like Figure 1 As shown, a high-voltage resistant aluminum substrate includes a pad layer 1, a copper foil layer 2, an insulating layer, and an aluminum base layer. The aluminum base layer includes an upper aluminum layer 6 and a lower aluminum layer 8 to ensure strength and rigidity. An insulating layer 7 is provided between the upper aluminum layer 6 and the lower aluminum layer 8. A metal plating layer is provided on the outward-facing surface of the aluminum base layer. The insulating layer is a composite insulating layer, which consists of a polytetrafluoroethylene layer 3, a polyimide layer 4, and an epoxy resin layer 5 from top to bottom. Heat dissipation holes 9 are provided on the aluminum base layer.

[0022] The double-layer aluminum material can increase the electrical insulation performance and voltage resistance of the aluminum substrate, ensuring the safety and stability of the circuit. The outer surface of both aluminum layers is provided with a metal plating layer. In this embodiment, the metal plating layer is a tin-cobalt alloy plating layer, which is electroplated by electrodeposition, ensuring the uniformity of electroplating and the ability of barrel plating, and is suitable for complex workpieces.

[0023] The insulation layer is a composite insulation layer, which utilizes the properties of different materials to give the board good chemical resistance, dielectric properties, high and low temperature resistance, and insulation properties.

[0024] The heat dissipation hole 9 connects the polyimide layer 4 to the lower aluminum layer 8. The heat dissipation hole 9 is circular in shape, forming an effective heat dissipation channel. The design and optimization of the heat dissipation hole 9 can significantly improve the heat dissipation efficiency of the aluminum substrate, reduce the operating temperature of the circuit, and improve the stability and reliability of the circuit. In this embodiment, the inner wall of the heat dissipation hole 9 is galvanized, which not only improves heat dissipation efficiency but also enhances corrosion resistance.

[0025] The insulating layer 7 is an epoxy resin layer 5, which improves the interlayer bonding between the two aluminum material layers and enhances the pressure resistance and puncture resistance of the sheet material.

[0026] The upper aluminum layer 6 is provided with a reinforcing rib structure to improve the overall load-bearing capacity and fatigue resistance. In this embodiment, the reinforcing rib structure is designed in a grid pattern to ensure the strength and load-bearing capacity of the aluminum substrate.

[0027] The thickness of the polytetrafluoroethylene layer 3 is 0.2mm-0.5mm. In this embodiment, the thickness of the polytetrafluoroethylene layer 3 is 0.2mm.

[0028] The thickness of the polyimide layer 4 is 20μm-50μm. In this embodiment, the thickness of the polyimide layer 4 is 50μm.

[0029] The thickness of the epoxy resin layer 5 is 50μm-200μm. In this embodiment, the thickness of the epoxy resin layer 5 is 100μm.

[0030] The thickness of the insulating layer 7 is 100 μm.

[0031] The aluminum substrate of this solution has upper and lower double aluminum material layers, which improves the strength and rigidity of the board. An epoxy resin layer 5 is provided between the two aluminum material layers, which can improve the interlayer bonding force and improve the pressure resistance and breakdown resistance of the board. Heat dissipation holes 9 are provided from the insulating layer to the lower aluminum material layer for heat dissipation of the board and to maintain stable circuit operation. Example

[0032] In this embodiment, the structure of the aluminum substrate is basically the same as that in Embodiment 1. The difference is that the pad 1 has recessed positions for mounting electronic components, so that the electronic components are mounted more stably.

[0033] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0034] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to preferred embodiments, it is not intended to limit the present utility model. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present utility model. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present utility model without departing from the scope of the present utility model shall still fall within the scope of the present utility model.

Claims

1. A high-voltage resistant aluminum substrate, characterized in that, It includes a solder pad layer, a copper foil layer, an insulating layer, and an aluminum base layer. The aluminum base layer includes an upper aluminum layer and a lower aluminum layer to ensure strength and rigidity. An insulating layer is provided between the upper aluminum layer and the lower aluminum layer. A metal plating layer is provided on the outward-facing surface of the aluminum base layer. The insulating layer is a composite insulating layer, which consists of a polytetrafluoroethylene layer, a polyimide layer, and an epoxy resin layer from top to bottom. Heat dissipation holes are provided on the aluminum base layer.

2. The high-voltage resistant aluminum substrate according to claim 1, characterized in that: The heat dissipation holes are connected to the lower aluminum material layer by a polyimide layer.

3. The high-voltage resistant aluminum substrate according to claim 1, characterized in that: The insulating layer is an epoxy resin layer.

4. The high-voltage resistant aluminum substrate according to claim 1, characterized in that: The upper aluminum layer is provided with a reinforcing rib structure.

5. A high-voltage resistant aluminum substrate according to claim 1, characterized in that: The thickness of the polytetrafluoroethylene layer is 0.2mm-0.5mm.

6. The high-voltage resistant aluminum substrate according to claim 1, characterized in that: The thickness of the polyimide layer is 20μm-50μm.

7. The high-voltage resistant aluminum substrate according to claim 1, characterized in that: The thickness of the epoxy resin layer is 50μm-200μm.

8. A high-voltage resistant aluminum substrate according to claim 1, characterized in that: The thickness of the insulating layer is 100 μm.

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