BCU module structure

Abstract

The utility model relates to the technical field of high-voltage box body structures, in particular to a BCU module structure. The BCU module body comprises a module box body and a golden finger group, a main control BCU mainboard is mounted in the module box body, and a plurality of terminals are inserted into the front end of the main control BCU mainboard and are used for directly leading out external interface signals or user interface signals; a plurality of second openings are formed in the panel surface of a rear panel of the main control BCU main board, and the golden finger group penetrates through the second openings to be connected with the rear end of the main control BCU main board in an inserted mode, so that signal butt joint of the BCU module body and an internal interface of the high-voltage box body is achieved; internal interface signals and external interface signals of the BCU module body and the high-voltage box are processed in a distinguishing manner, and a hot plug maintenance function of the BCU module body on the high-voltage box is also realized; according to the utility model, the problems of difficulty in maintenance and complicated signal lines caused by the adoption of high-density wire harness terminals on the front panel in the prior art are effectively solved, and meanwhile, drawing is realized in a limited space by adopting a captive screw assembly.

Description

Technical Field

[0001] This utility model relates to the technical field of high-voltage enclosure BCU module structure, and in particular to a BCU module structure. Background Technology

[0002] Currently, high-voltage BMS generally adopts a distributed three-level architecture: a central control (or stack control) BAU (Battery Array Unit), a master control (or cluster control) BCU (Battery Cluster Unit), and slave control BMU (Battery Management Unit). The master control BCU is usually integrated inside the high-voltage enclosure as a component. The principle block diagram is shown below. Figure 1 As shown.

[0003] The main control unit (BCU) typically has multiple power or signal lines that need to interconnect with other components inside the high-voltage box, generally 40 to 60 or even more signal lines. Simultaneously, the main control BCU also has numerous user interface signals that directly connect to other devices outside the high-voltage box, also generally 40 to 60 or even more interface signals or power lines. The existing technology has the following problems and drawbacks:

[0004] 1. Due to the close interconnection between the main control BCU and the high-voltage box, the mainstream practice in the market is to directly integrate the BCU into the inside of the high-voltage box. The internal interface signals of the high-voltage box and the user interface signals are concentrated on a few high-density wire harness terminals on the main control BCU. The wire harnesses are numerous and complicated, and it is not easy to distinguish between power lines and signal lines, communication lines and other lines, high-voltage signal lines and low-voltage signal lines. This causes trouble and inefficiency in assembly and assembly.

[0005] 2. Due to the limited space of the high-density wiring harness terminals and the front panel interface of the main control BCU, it is also difficult to meet the required safety distance between the internal high-voltage signal lines and low-voltage signal lines.

[0006] 3. Moreover, the user interface signal needs to be transferred to the front panel port of the high-voltage box through the adapter cable inside the high-voltage box before it can be used by the user. This makes the already complicated internal wiring harness even more messy and also brings extremely low efficiency in assembly and assembly.

[0007] 4. For ease of wiring, it is difficult to distinguish between high-voltage signal lines and low-voltage signal lines inside the high-voltage box; during maintenance, it is necessary to first remove the complicated wire harness and sort out the signal lines, which can easily lead to incorrect connections or even safety hazards, making maintenance particularly difficult or even impossible to begin with.

[0008] 5. Traditional handle structures are bulky and costly, making them unsuitable for modules with high space requirements. Some structures are also relatively complex. Some non-detachable designs require springs and sleeve screws, which are complex and costly to manufacture. If all screws are used, either they protrude excessively, requiring more space, or they don't lock properly. Summary of the Invention

[0009] The technical problem to be solved by this utility model is: in order to solve the problems existing in the prior art mentioned above, a method is provided that uses a gold finger group to not only distinguish and process the high voltage signal and low voltage signal of the main control BCU motherboard, but also to distinguish and process the internal interface signal and external interface signal of the BCU module body and the high voltage box, and also to realize the hot-swap maintenance function of the BCU module body on its high voltage box; effectively solving the problems of maintenance difficulties and complicated signal lines caused by the use of high-density wire harness terminals on the front panel in the past.

[0010] The technical solution adopted by this utility model to solve its technical problem is: a BCU module structure, installed in the high-voltage box, including a BCU module body, the BCU module body including a module box and a gold finger group, the module box is equipped with a main control BCU motherboard, and the front end of the main control BCU motherboard is connected to several terminals for directly leading out external interface signals or user interface signals.

[0011] The rear panel of the main control BCU motherboard has several second openings. The gold finger assembly passes through the second openings and is plugged into the rear end of the main control BCU motherboard to realize the interface signal docking between the BCU module body and the internal interface of the high voltage enclosure.

[0012] Furthermore, the assembly method between the BCU module body and the high-voltage box is hot-swappable.

[0013] Furthermore, the gold finger group is divided into a low-voltage gold finger group and a high-voltage gold finger group. Both the low-voltage gold finger group and the high-voltage gold finger group include a gold finger socket and a gold finger. The gold finger socket and the gold finger are matched together. The gold finger socket is installed on the high-voltage box, and the gold finger is on the BCU motherboard.

[0014] Furthermore, the number of gold fingers in the high-voltage gold finger group is set to correspond to the interface of the high-voltage signal in the main control BCU motherboard, forming a gold finger with open pins.

[0015] Furthermore, the module housing has several first lugs on both sides, each first lug having a first mounting hole. The main control BCU motherboard has second lugs on both sides, each second lug having a second mounting hole. A captive screw assembly is installed between the first lugs and the second lugs on the same side. The captive screw assembly includes a screw and a captive nut. The captive nut is installed in the first mounting hole of each first lug, and the screw and the captive nut are connected by threads.

[0016] Furthermore, the screw includes a nut and a screw rod. The screw rod is provided with a nut, the middle position of the screw rod is a smooth part, the lower end of the screw rod is provided with a front thread part, and the upper end of the screw rod is provided with a root thread part. The diameter of the front thread part and the diameter of the root thread part are both larger than the diameter of the smooth part.

[0017] Furthermore, there are two captive nuts, each with an internal thread that mates with the front thread and the root thread.

[0018] Furthermore, the diameter of the smooth rod is smaller than the diameter of the internal thread, and the diameter of the front thread is equal to the diameter of the root thread.

[0019] Furthermore, the root thread is located on the screw at the connection between the screw and the nut.

[0020] Furthermore, the front panel of the module housing has several first openings, through which terminals are inserted to the front end of the main control BCU motherboard.

[0021] The beneficial effects of this utility model are:

[0022] 1. A gold finger assembly is used at the second opening at the rear of the main control BCU motherboard to connect with the internal interface signals of the high-voltage box. This connection method allows for hot-swapping, and subsequent maintenance only requires pulling the BCU module body out of the front panel of the high-voltage box for replacement and maintenance, which greatly improves the efficiency of maintenance work.

[0023] 2. At the same time, multiple second openings are used to distinguish between high-voltage and low-voltage signals; at the second opening at the rear of the main control BCU motherboard, high-voltage and low-voltage signals use different gold finger groups; sufficient safety distance is also reserved between high-voltage signals, and the safety distance is increased by making jump treatment on the pins of the gold finger group on the PCB package.

[0024] 3. By connecting the terminal at the first opening on the front of the main control BCU motherboard, the user interface signal can be directly led out, eliminating the need for complicated internal wiring in the high-voltage box; this also distinguishes the internal interface signal of the high-voltage box from the external user-side interface signal.

[0025] Meanwhile, the hot-swappable assembly method using gold finger assembly makes maintenance simple and convenient. Replacing the main control BCU motherboard does not require reconnecting the internal interface signal lines of the high-voltage box or sorting out the wiring sequence, which greatly reduces maintenance costs and maximizes maintenance efficiency.

[0026] 4. The pull-out mechanism uses a non-detachable screw assembly to achieve pull-out in a limited space. It is simple to manufacture, low in cost, occupies little space, is easy to operate, practical, reliable, and the installation tools are simple and easy to operate. Attached Figure Description

[0027] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0028] Figure 1 This is a block diagram of the three-level architecture of a high-voltage BMS;

[0029] Figure 2 This is a schematic diagram of the structure of this utility model;

[0030] Figure 3 yes Figure 2 A structural diagram from another direction;

[0031] Figure 4 This is an exploded view of this utility model;

[0032] Figure 5 This is a schematic diagram of the gold fingers on the back of the main control BCU motherboard of this utility model;

[0033] Figure 6 This is a structural schematic diagram of the screw of this utility model;

[0034] In the diagram: 1. Module housing, 2. Terminal, 3. First opening, 4. Gold finger assembly, 5. Main control BCU motherboard, 6. Second opening, 7. First lug, 8. First mounting hole, 9. Locking nut, 10. Nut, 11. Screw, 12. Smooth rod, 13. Front thread, 14. Root thread, 15. Second lug, 16. Second mounting hole. Detailed Implementation

[0035] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, illustrating only the basic structure of the present invention, and therefore only show the components relevant to the present invention.

[0036] like Figures 2-6 The BCU module structure shown is installed inside a high-voltage box and includes a BCU module body. The BCU module body includes a block box 1 and a gold finger group 4. The main control BCU motherboard 5 is installed inside the module box 1. Several terminals 2 are plugged into the front end of the main control BCU motherboard 5 for directly leading out external interface signals or user interface signals, without the need for signal conversion inside the module box 1.

[0037] Several second openings 6 are provided on the rear panel of the main control BCU motherboard 5. The gold finger group 4 passes through the second openings 6 and is inserted into the rear end of the main control BCU motherboard 5 to realize the interface signal docking between the BCU module body and the high voltage box.

[0038] The main control BCU motherboard 5 typically has multiple power or signal lines that need to be connected to other components inside the module enclosure 5. These include, but are not limited to, multiple power supplies, control and detection signals for the main positive charging contactor (or charging MOSFET, etc.), control and detection signals for the main positive discharging contactor (or discharging MOSFET, etc.), control and detection signals for the main negative charging contactor (or charging MOSFET, etc.), control and detection signals for the main negative discharging contactor (or discharging MOSFET, etc.), control signals for the pre-charge contactor (or MOSFET, etc.), feedback and tripping control (or on / off control) for the main circuit breaker (or contactor, or MOSFET, etc.), status feedback and tripping control (or on / off control) for the DC circuit breaker (or contactor, or MOSFET, etc.), multiple temperature acquisition signals, shunt detection signals, Hall sensor signals and power supply, power supply and control signals for other equipment requiring power supply in the high-voltage box (such as fans or heaters, etc.), insulation detection control signals and protective grounding, voltage detection signals at the high-voltage box input terminal (or battery terminal), voltage detection signals at the high-voltage box output terminal (or UPS terminal), indicator light control, etc.

[0039] High-voltage signals include voltage detection signals at the input (or battery) end of the high-voltage box, voltage detection signals at the output (or UPS) end of the high-voltage box, insulation detection control signals, and detection signals for protective ground and shunt. High-voltage signal lines are collected using high-voltage gold finger groups. Low-voltage signals are other signals besides the high-voltage signals mentioned above. Low-voltage signal lines are collected using low-voltage gold finger groups.

[0040] The main control BCU (Block CU) 5 also has numerous user interface signals that directly connect to devices outside the module enclosure 1. These include, but are not limited to, multiple external power supply and control signals, various external communication interface resources (multiple CAN, multiple RS485, daisy-chain communication, LAN ports, etc.), multiple DO (Distribution), multiple DI (Distribution), multiple high-side / low-side control signals, multiple temperature acquisition signals, multiple relay control output signals, analog signal acquisition, address assignment signals for slave control BMUs, address assignment signals for receiving master control BAUs, one-key wake-up signals, etc. The user interface signals use standard terminals; in this case, Phoenix Contact DD31H series 3.81mm pitch sockets are used. The matching cable terminals can be crimped terminals or screwless terminal blocks.

[0041] The assembly method between the BCU module body and the high-voltage box is hot-swappable, which enables flexible hot-swappable maintenance of the BCU module body on the high-voltage box of the high-voltage BMS.

[0042] In addition, the matching gold finger socket has screw holes on both sides, which can be fixed into the slot inside the module housing 1. The gold finger socket used in this application is C0304-050FG15SB (connector assembly, including SJ0284 (plastic housing) and HP1163 (cable crimp spring) from Wuhan Greepu Electronics Co., Ltd.

[0043] The gold finger assembly can route signals in both directions. The gold finger assembly is divided into a low-voltage gold finger assembly and a high-voltage gold finger assembly. The low-voltage gold finger assembly connects to low-voltage signals, and the high-voltage gold finger assembly connects to high-voltage signals. Both low-voltage and high-voltage gold finger assemblies include gold finger sockets and gold fingers. The gold finger sockets mate with the gold fingers. The gold finger sockets are mounted on the high-voltage box, and the gold fingers are mounted on the BCU motherboard 5. Figure 5 As shown, the lower part is the low-voltage signal gold finger, and the upper part is the high-voltage signal gold finger. The gold finger socket includes a cable crimping spring. The gold fingers are matched with the gold finger socket. The crimping spring of the gold finger socket in gold finger group 4 can directly lead out the signal line from each pin of the gold finger socket without the need for a backplane connector adapter. The gold finger socket has a fixing hole that can be used to fix it to the structural component.

[0044] The gold fingers of the low-voltage signals on the main control BCU motherboard 5 can be adapted to the gold finger sockets at the cable end, eliminating the need for a backplate adapter.

[0045] The number of gold fingers in the high-voltage gold finger group corresponds to the interface of the high-voltage signal in the main control BCU motherboard 5. According to the safety distance of the high-voltage signal, some pins are hollowed out to form hollowed-out pin gold fingers. In addition to being compatible with the gold finger socket at the end of the cable, the gold fingers of the high-voltage signal of the main control BCU motherboard 5 do not require a backplane adapter; they can also hollow out extra pins according to the safety distance to meet the safety distance requirements.

[0046] like Figure 4 As shown, the module housing 1 has several first lugs 7 on both sides, and each first lug 7 has a first mounting hole 8. The main control BCU motherboard 5 has second lugs 15 on both sides, and each second lug 15 has a second mounting hole 16. A non-removable screw assembly is installed between the first lug 7 and the second lug 15 on the same side. The diameter of the first mounting hole 8 and the second mounting hole 16 is larger than the diameter of the smooth rod portion 12 in the screw 11.

[0047] The captive screw assembly includes a screw and a captive nut 9. The captive nut 9 is installed in the first mounting hole 8 of each first lug 7, and the screw and the captive nut 9 are connected by threads.

[0048] like Figure 4 and Figure 6As shown, the screw includes a nut 10 and a screw 11. The nut 10 is provided on the screw 11. The middle part of the screw 11 is a smooth part 12. The purpose of the smooth part 12 is to facilitate quick insertion and removal and improve the user experience. The lower end of the screw 11 is provided with a front thread 13. The purpose of the front thread 13 is to act as a reverse buckle when the module is pulled out, preventing the screw from being pulled out and failing. The upper end of the screw 11 is provided with a root thread 14. The purpose of the root thread 14 is to fix the nut 10 after the module is inserted, preventing the screw from loosening and shaking, which would affect the appearance. The diameter of the front thread 13 and the diameter of the root thread 14 are both larger than the diameter of the smooth part 12.

[0049] There are two captive nuts 9, and each captive nut 9 has an internal thread that mates with the front thread 13 and the root thread 14.

[0050] The diameter of the smooth part 12 is smaller than the diameter of the internal thread part, and the diameter of the front thread part 13 is equal to the diameter of the root thread part 14.

[0051] The root thread 14 is located on the screw 11 at the connection between the screw 11 and the nut 10.

[0052] The front panel of the module housing 1 has several first openings 3. The terminals 2 pass through the first openings 3 and are plugged into the front end of the main control BCU motherboard 5 for connecting other external devices or user interfaces.

[0053] Work process:

[0054] First, the internal interface signals of module enclosure 1 are separated from the external user-side interface signals. The internal interface signals of module enclosure 1 primarily utilize a gold finger assembly (composed of gold fingers and gold finger sockets) to interface with the internal interface signals of module enclosure 1. Using gold fingers on the PCB allows signal lines to be routed on both the upper and lower surfaces of the board, placed at the rear port of the main control BCU motherboard 5, as follows: Figure 3 As shown; while the external user-side interface or external interface signal uses terminal 2 (a conventional terminal), which is placed in the first opening 3 at the front of the main control BCU motherboard 5.

[0055] Secondly, among the interface signals on the main control BCU motherboard 5 that connect to the inside of the module enclosure 1, the high-voltage signals and low-voltage signals are separated using low-voltage gold finger groups and high-voltage gold finger groups respectively, as follows: Figure 5 As shown.

[0056] Finally, the entire BCU module body can be hot-swapped. There is a slot area reserved for the BCU module body on the front panel of the high-voltage box. The BCU module body is fixed to the front panel of the high-voltage box by the non-removable screw assembly on its front panel. After the BCU module body is inserted, it forms a whole with the front panel of the high-voltage box (the front panel of the BCU module body is flush with the front panel of the high-voltage box).

[0057] In summary, this solves the problem of complicated wiring from the BCU module body to the internal interface signals of the high-voltage box, thereby improving the efficiency of maintenance work.

[0058] Address the safety distance requirements from the BCU module body to the internal interface signals of the high-voltage box, including the distance between high-voltage and low-voltage signals, and between high-voltage signals, to ensure sufficient safety distances.

[0059] This solves the separation between the internal interface signal from the BCU module body to the high-voltage box and the external user interface signal, making it easier for users to use.

[0060] Based on the above-described preferred embodiments of this utility model, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the technical concept of this utility model. The technical scope of this utility model is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A BCU module structure, installed inside a high-voltage box, characterized in that: Includes a BCU module body, which includes a module housing (1) and a gold finger group (4). The module housing (1) is equipped with a main control BCU motherboard (5). Several terminals (2) are plugged into the front end of the main control BCU motherboard (5) for directly leading out external interface signals or user interface signals. The rear panel of the main control BCU motherboard (5) has several second openings (6). The gold finger group (4) passes through the second openings (6) and is inserted into the rear end of the main control BCU motherboard (5) to realize the interface signal docking between the BCU module body and the high voltage box.

2. The BCU module structure according to claim 1, characterized in that: The assembly method between the BCU module body and the high-voltage box is hot-swappable.

3. The BCU module structure according to claim 1, characterized in that: The gold finger group (4) is divided into a low-voltage gold finger group and a high-voltage gold finger group. Both the low-voltage gold finger group and the high-voltage gold finger group include a gold finger socket and a gold finger. The gold finger socket and the gold finger are matched. The gold finger socket is installed on the high-voltage box, and the gold finger is on the BCU main board (5).

4. A BCU module structure according to claim 3, characterized in that: The number of gold fingers in the high-voltage gold finger group is set to correspond to the interface of the high-voltage signal in the main control BCU motherboard (5), forming a gold finger with a hollow pin.

5. A BCU module structure according to claim 1, characterized in that: The module housing (1) has several first lugs (7) on both sides, and each first lug (7) has a first mounting hole (8). The main control BCU motherboard (5) has second lugs (15) on both sides, and each second lug (15) has a second mounting hole (16). A non-detachable screw assembly is installed between the first lug (7) and the second lug (15) on the same side. The non-detachable screw assembly includes a screw and a non-detachable nut (9), the non-detachable nut (9) is installed in the first mounting hole (8) of each first lug (7), and the screw and the non-detachable nut (9) are threaded together.

6. A BCU module structure according to claim 5, characterized in that: The screw includes a nut (10) and a screw rod (11). The nut (10) is provided on the screw rod (11). The middle position of the screw rod (11) is a smooth part (12). The lower end of the screw rod (11) is provided with a front thread part (13). The upper end of the screw rod (11) is provided with a root thread part (14). The diameter of the front thread part (13) and the diameter of the root thread part (14) are both larger than the diameter of the smooth part (12).

7. A BCU module structure according to claim 6, characterized in that: The number of the captive nuts (9) is two, and the captive nuts (9) are provided with internal threads that cooperate with the front thread (13) and the root thread (14).

8. A BCU module structure according to claim 6, characterized in that: The diameter of the smooth rod portion (12) is smaller than the diameter of the internal thread portion, and the diameter of the front thread portion (13) is equal to the diameter of the root thread portion (14).

9. A BCU module structure according to claim 6, characterized in that: The root thread (14) is located on the screw (11) at the connection between the screw (11) and the nut (10).

10. A BCU module structure according to claim 1, characterized in that: The front panel of the module housing (1) has several first openings (3), and the terminals (2) pass through the first openings (3) and are plugged into the front end of the main control BCU motherboard (5).

Images