Flexible circuit board cover film laminating jig

Abstract

The utility model discloses a flexible circuit board cover film laminating jig, and relates to the field of flexible circuit boards. The flexible circuit board cover film laminating jig comprises a jig main body, the jig main body is fixedly installed on a film laminating machine, a pet adsorption film is pasted on the outer side of the jig main body, a first adsorption hole is formed in the outer side of the jig main body, a through second adsorption hole is formed in the pet adsorption film, and the first adsorption hole is matched with the second adsorption hole. According to the flexible circuit board covering film attaching jig, the PET adsorption film is arranged, the thickness of the PET adsorption film is set to be 0.125 mm, and compared with an existing glass fiber board jig, the PET adsorption film is thinner and not prone to being contaminated by dust, so that dust and chippings generated in the machining process are effectively eliminated, foreign matter generated by attaching of the covering film is reduced, and the service life of the flexible circuit board covering film attaching jig is prolonged. The diameter of the first adsorption hole and the diameter of the second adsorption hole are set to be 0.05 mm. Compared with an existing glass fiber board jig, the glass fiber board jig is smaller in diameter and higher in precision.

Description

Technical Field

[0001] This utility model relates to the field of flexible circuit board technology, specifically to a flexible circuit board cover film bonding fixture. Background Technology

[0002] With the development of electronic products, industry competition is becoming increasingly fierce. Products that are both high-quality and inexpensive are becoming more competitive, making low cost a crucial factor in competitiveness. Therefore, it is imperative to reduce the cost of each component. For flexible circuit boards (PCBs), overall cost reduction can be achieved by lowering the cost of production tooling and fixtures. There is an intention to develop a simplified tool for cover film lamination processes to replace traditional fixtures, thereby achieving cost reduction and efficiency improvement.

[0003] In the process of covering flexible circuit boards, existing glass fiber board fixtures generate dust during processing, have low precision, are heavy, and are not conducive to operation, which can easily increase processing costs. Therefore, this application proposes a flexible circuit board cover film bonding fixture. Utility Model Content

[0004] To address the shortcomings of existing technologies, this utility model provides a flexible circuit board cover film bonding fixture, which solves the problems of existing fiberglass board fixtures generating dust during processing, having low precision, being heavy, and being inconvenient to operate, thus easily increasing processing costs.

[0005] To achieve the above objectives, this utility model is implemented through the following technical solution: a flexible circuit board cover film bonding fixture, including a fixture body, the fixture body being fixedly installed on a laminating machine, a PET adsorption film being pasted on the outer side of the fixture body, a first adsorption hole being opened on the outer side of the fixture body, and a through second adsorption hole being opened on the PET adsorption film, wherein the first adsorption hole and the second adsorption hole are adapted to each other.

[0006] A connecting block is fixedly installed at the bottom of the fixture body. The inside of the connecting block is connected to the first adsorption hole, and a connecting pipe is fixedly connected to the outside of the connecting block. The connecting pipe is connected to the coating machine.

[0007] Preferably, the bottom end of the connecting pipe has a pipe joint.

[0008] Preferably, a plurality of limiting blocks are fixedly installed on the outer side of the main body of the fixture.

[0009] Preferably, the PET adsorption membrane has multiple through-holes, and multiple limiting blocks are respectively inserted into the multiple limiting holes.

[0010] Preferably, the PET adsorption membrane has a through positioning hole.

[0011] Preferably, a fixing frame is fixedly installed on the back of the fixture body.

[0012] Preferably, a mounting block is fixed to the top of the fixing frame.

[0013] Preferably, the top of the mounting block has a mounting hole, and the mounting block can be connected to the laminating machine through the mounting hole and bolts.

[0014] This utility model discloses a flexible circuit board cover film bonding fixture, which has the following beneficial effects:

[0015] This flexible circuit board cover film bonding fixture works by placing the cut cover film onto the PET adsorption film of the laminating machine, ensuring accurate positioning, then placing the circuit board onto the cover film, and adjusting the fixture to align the circuit board perfectly with the cover film. The vacuum pump is then activated, and the PET adsorption film adheres to both the cover film and the circuit board under vacuum. This creates a tight bond between the cover film and the circuit board. The PET adsorption film, with a thickness of 0.125mm, is thinner than existing fiberglass board fixtures and less prone to dust accumulation, effectively eliminating dust and debris generated during processing and reducing foreign matter during cover film bonding.

[0016] The diameters of the first and second adsorption holes are set to 0.05 mm, which is smaller and more precise than the diameter of existing fiberglass board fixtures, thus enabling a more effective adsorption effect on circuit boards and cover films. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of this utility model;

[0019] Figure 2 This is a schematic diagram of the bottom structure of this utility model;

[0020] Figure 3 This is a schematic diagram of the main body of the fixture of this utility model;

[0021] Figure 4 This is a schematic diagram of the structure of the PET adsorption membrane of this utility model.

[0022] In the figure: 1. Fixture body; 11. First adsorption hole; 12. Connecting pipe; 121. Pipe joint; 13. Limiting block; 14. Connecting block; 15. Fixing frame; 16. Mounting block; 2. PET adsorption film; 21. Second adsorption hole; 22. Positioning hole; 23. Limiting hole. Detailed Implementation

[0023] To better understand the above technical solutions, the following will provide a detailed explanation of the technical solutions in conjunction with the accompanying drawings and specific implementation methods.

[0024] This utility model discloses a flexible circuit board cover film bonding fixture.

[0025] According to the appendix Figure 1 As shown in Figure 4, the fixture includes a fixture body 1, which is fixedly installed on a laminating machine. A PET adsorption film 2 is attached to the outside of the fixture body 1. A first adsorption hole 11 is opened on the outside of the fixture body 1, and a through second adsorption hole 21 is opened on the PET adsorption film 2. The first adsorption hole 11 and the second adsorption hole 21 are adapted to each other.

[0026] During use, the cut cover film is placed on the PET adsorption film 2 of the laminating machine, ensuring accurate positioning. Then, the circuit board is placed on the cover film, and the fixture position is adjusted to ensure complete alignment between the circuit board and the cover film. The vacuum pump is started, and the PET adsorption film 2 performs vacuum adsorption on the cover film and circuit board. Under vacuum, a tight bond is formed between the cover film and the circuit board. The PET adsorption film 2, with a thickness of 0.125mm, is thinner and less prone to dust accumulation compared to existing fiberglass board fixtures, effectively eliminating dust and debris generated during processing and reducing foreign matter during cover film lamination. The diameters of the first adsorption hole 11 and the second adsorption hole 21 are set to 0.05mm, smaller and more precise than existing fiberglass board fixtures, resulting in a more effective adsorption effect on the circuit board and cover film.

[0027] Furthermore, a connecting block 14 is fixedly installed at the bottom of the fixture body 1. The interior of the connecting block 14 is connected to the first adsorption hole 11, and a connecting pipe 12 is fixedly connected to the outside of the connecting block 14. The connecting pipe 12 is connected to the film coating machine, and the bottom end of the connecting pipe 12 has a pipe joint 121.

[0028] The air pump in the laminating machine is connected to the connecting pipe 12, which enables the laminating film to be adsorbed through the connecting block 14, the first adsorption hole 11 and the second adsorption hole 21.

[0029] Furthermore, multiple limiting blocks 13 are fixedly installed on the outer side of the fixture body 1.

[0030] Furthermore, the PET adsorption membrane 2 has multiple through-holes 23, and multiple limiting blocks 13 are respectively inserted into the multiple limiting holes 23.

[0031] Furthermore, a through positioning hole 22 is provided on the PET adsorption membrane 2.

[0032] The multiple limit blocks 13, multiple limit holes 23 and positioning holes 22 are set to achieve the positioning function.

[0033] Furthermore, a fixing frame 15 is fixedly installed on the back of the fixture body 1.

[0034] Furthermore, a mounting block 16 is fixed to the top of the fixed frame 15.

[0035] Furthermore, the top of the mounting block 16 is provided with a mounting hole, and the mounting block 16 can be connected to the laminating machine through the mounting hole and the bolt.

[0036] It should be emphasized that the thickness of the PET adsorption membrane 2 is set to 0.125 mm.

[0037] It should be emphasized that the diameter of the first adsorption pore 11 and the second adsorption pore 21 is set to 0.05 mm.

[0038] During use, the cut cover film is placed on the PET adsorption film 2 of the laminating machine, ensuring accurate positioning. Then, the circuit board is placed on the cover film, and the fixture position is adjusted to ensure complete alignment between the circuit board and the cover film. The vacuum pump is started, and the PET adsorption film 2 performs vacuum adsorption on the cover film and circuit board. Under vacuum, a tight bond is formed between the cover film and the circuit board. The PET adsorption film 2, with a thickness of 0.125mm, is thinner and less prone to dust accumulation compared to existing fiberglass board fixtures, effectively eliminating dust and debris generated during processing and reducing foreign matter during cover film lamination. The diameters of the first adsorption hole 11 and the second adsorption hole 21 are set to 0.05mm, smaller and more precise than existing fiberglass board fixtures, resulting in a more effective adsorption effect on the circuit board and cover film.

[0039] This flexible circuit board cover film bonding fixture is mainly used in the manufacturing process of electronic products, especially in the assembly and packaging stages of flexible circuit boards. It uses a precise and efficient bonding method to tightly bond the cover film to the circuit board, ensuring the stability and reliability of electronic products.

[0040] Specific application scenarios:

[0041] Smartphones and tablets:

[0042] Flexible circuit boards are widely used in the manufacturing process of smartphones and tablets to connect various components such as displays, cameras, and batteries. This fixture ensures a precise fit between the cover film and the circuit board, preventing dust and moisture intrusion and improving the durability and lifespan of the device.

[0043] Wearable devices:

[0044] Wearable devices such as smartwatches and smart bracelets also extensively use flexible circuit boards. These devices are typically small and compact, requiring extremely high bonding precision. This fixture meets these requirements, ensuring a perfect fit between the cover film and the circuit board.

[0045] Automotive electronics:

[0046] In the automotive electronics field, flexible circuit boards are used to connect various sensors, controllers, and actuators. This fixture ensures a stable fit of the cover film onto automotive electronic components, improving the reliability and safety of automotive electronic systems.

[0047] Medical equipment:

[0048] Electronic components in medical devices also require high-precision bonding. This fixture ensures a stable bond between the cover film and the circuit board within the medical device, preventing damage from dust and moisture, and ensuring the normal operation of the medical device and patient safety.

[0049] Aerospace:

[0050] In the aerospace field, the reliability and precision requirements for electronic components are extremely high. This fixture ensures a stable fit between the cover film and the circuit board in aerospace equipment, improving the reliability and durability of the equipment.

[0051] Specifically, it has the following advantages:

[0052] Precise fit process:

[0053] Positioning accuracy: During operation, first ensure that the cut cover film is accurately placed on the PET adsorption film 2 of the laminating machine. This step is crucial for the subsequent lamination process, laying the foundation for the entire lamination operation.

[0054] Alignment Adjustment: Next, place the circuit board on the cover film and adjust the position of the fixture to ensure that the circuit board is perfectly aligned with the cover film. This precise alignment is crucial to ensuring bonding quality.

[0055] Highly efficient vacuum adsorption:

[0056] Vacuum pump startup: Once the circuit board and cover film are aligned, the vacuum pump is started, and the two are vacuum-adheded through the PET adsorption film 2. This adsorption method not only ensures a tight fit but also greatly simplifies the operation process.

[0057] Advantages of PET Adsorption Film 2: PET Adsorption Film 2 is only 0.125mm thick, which is thinner and less prone to dust accumulation compared to traditional fiberglass board fixtures. This feature effectively eliminates dust and debris that may be generated during processing, thereby reducing the generation of foreign objects during the bonding process.

[0058] Intricate adsorption pore design:

[0059] Adsorption hole diameter: The diameter of the first adsorption hole 11 and the second adsorption hole 21 is both set to 0.05mm. This size is smaller than the diameter of existing glass fiber board fixtures, thus providing higher precision.

[0060] Effective Adsorption: Smaller adsorption pore diameters mean more effective adsorption of circuit boards and cover films. This sophisticated design ensures the stability and reliability of the bonding process.

[0061] Overall advantages:

[0062] Improved bonding quality: Through a precise bonding process, efficient vacuum adsorption, and a finely designed adsorption hole, this fixture significantly improves the bonding quality of flexible circuit board cover films.

[0063] Reduced foreign matter generation: The thinness and dust-resistant properties of the PET adsorption film 2, along with the smaller adsorption pore diameter, reduce the generation of foreign matter during the bonding process, thereby improving the overall quality of the product.

[0064] Simplified operation process: The design of this fixture makes the operation process simpler and clearer, reducing the difficulty and complexity of operation.

[0065] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A flexible circuit board cover film laminating fixture, comprising a fixture body (1), wherein the fixture body (1) is fixedly mounted on a laminating machine, characterized in that, The outer side of the fixture body (1) is covered with a PET adsorption film (2) that is compatible with the fixture body (1); The fixture body (1) has a first adsorption hole (11) on its outer side, and the PET adsorption membrane (2) has a through second adsorption hole (21), and the first adsorption hole (11) and the second adsorption hole (21) are adapted to each other. A connecting block (14) is fixedly installed at the bottom of the fixture body (1). The interior of the connecting block (14) is connected to the first adsorption hole (11), and a connecting pipe (12) is fixedly connected to the outside of the connecting block (14). The connecting pipe (12) is connected to the film coating machine.

2. The flexible circuit board cover film bonding fixture according to claim 1, characterized in that, The bottom end of the connecting pipe (12) has a pipe joint (121).

3. The flexible circuit board cover film bonding fixture according to claim 1, characterized in that, Multiple limiting blocks (13) are fixedly installed on the outer side of the main body (1) of the fixture.

4. The flexible circuit board cover film bonding fixture according to claim 3, characterized in that, The PET adsorption membrane (2) has multiple through-holes (23), and multiple limiting blocks (13) are respectively inserted into the multiple limiting holes (23).

5. The flexible circuit board cover film bonding fixture according to claim 1, characterized in that, The PET adsorption membrane (2) has a through positioning hole (22).

6. The flexible circuit board cover film bonding fixture according to claim 1, characterized in that, A fixing frame (15) is fixedly installed on the back of the fixture body (1).

7. The flexible circuit board cover film bonding fixture according to claim 6, characterized in that, The top of the fixed frame (15) is fixed with a mounting block (16).

8. The flexible circuit board cover film bonding fixture according to claim 7, characterized in that, The top of the mounting block (16) is provided with a mounting hole, and the mounting block (16) can be connected to the film covering machine through the mounting hole and the bolt.

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