Chip carrier

Abstract

The utility model relates to the field of carriers, and discloses a patch carrier which comprises a carrier plate, a plurality of pad grooves are formed in the positions, corresponding to pads on a flexible board, of the carrier plate, a heat release hole is formed in the position, corresponding to each pad on the flexible board, in each pad groove, and heat dissipation channels are formed in the two sides of the interior of each pad groove in the width direction of the pad groove. The heat dissipation device has the effect of increasing the heat dissipation speed of the soft board after welding.

Description

Technical Field

[0001] This application relates to the field of vehicles, and more particularly to a patch vehicle. Background Technology

[0002] FPC, also known as flexible printed circuit board, is referred to as flex PCB. The SMT assembly and soldering process of flex PCB is very different from that of rigid printed circuit board because flex PCB is not rigid enough and is relatively flexible. Without the use of special carriers, it is impossible to complete the fixing and transportation, and thus impossible to complete basic SMT processes such as printing, placement, and soldering.

[0003] A high-precision flexible printed circuit board (FPCB) mounting carrier includes a dedicated carrier board. This carrier board, along with a positioning template, is used for positioning. The carrier board is manufactured based on the PCB's CAD file, reading the hole positioning data from the FPCB. A successfully manufactured mounting carrier ensures that the diameter of the positioning pins on the positioning template matches the diameter of the positioning holes on the carrier board and the FPCB. Many FPCBs, due to the need to protect certain circuits or design considerations, are not perfectly flat when laid flat. Therefore, the junction between the carrier board and the FPCB needs to be machined, ground, and grooved according to the actual situation to ensure the FPCB is flat during printing and mounting processes.

[0004] Reference Figure 1 and Figure 2 The flexible circuit board 1 has positioning marks 11 for SMD components to be mounted on its front side. Mark points 12 are also fixedly provided on the front side of the flexible circuit board 1 near the edge, and several through holes 13 are also provided on the flexible circuit board 1 near the edge to facilitate positioning. On the back side of the flexible circuit board 1, a pad 14 is fixedly provided for each position of the SMD component to be mounted.

[0005] When the SMT carrier is used to manufacture the above flexible circuit board products, the carrier board that usually carries the flexible circuit board is often soldered by the reflow soldering equipment. Due to the failure of the flexible circuit board to dissipate heat in time, the molten solder paste may not solidify in time. This can lead to misalignment between the SMD components and the flexible circuit board when the flexible circuit board product is removed, or even the SMD components falling off the flexible circuit board, ultimately reducing the SMT soldering pass rate. Utility Model Content

[0006] To accelerate the heat dissipation of the flexible circuit board after soldering, this application provides a patch carrier.

[0007] The patch carrier provided in this application adopts the following technical solution:

[0008] A patch carrier includes a carrier plate, on which a plurality of pad slots are formed at positions corresponding to pads on a flexible circuit board. Each pad slot has a heat dissipation hole at a position corresponding to each pad on the flexible circuit board, and each pad slot has a heat dissipation channel on both sides along its width.

[0009] By adopting the above technical solution, when the carrier board carrying the flexible circuit board leaves the reflow soldering equipment, the cooler ambient air flows directly into contact with the solder pads through the heat dissipation holes, thereby removing the heat from the solder pads. The heat dissipation channel setting can accelerate the reduction of the solder pad temperature.

[0010] Optionally, each of the heat dissipation channels is a heat dissipation groove, and the heat dissipation groove is connected to the heat dissipation hole.

[0011] By adopting the above technical solution, when the heat dissipation channel is two heat dissipation grooves opened on the inner wall of the bottom of the pad groove on the carrier board, since the heat dissipation grooves are connected to the heat dissipation holes, when the carrier board carrying the flexible board leaves the reflow soldering equipment, the pads abut against the inner wall of the bottom of the pad groove. At this time, the cooler ambient air can flow into the heat dissipation groove, which helps to remove the heat from the pads that are not at the heat dissipation holes and accelerates the heat dissipation of the pads.

[0012] Optionally, the inner wall at the bottom of each pad groove is arc-shaped, with the center of the arc located below the pad groove, and the arc-shaped inner wall of the pad groove forms a heat dissipation channel between its two sides and its sidewalls along its width.

[0013] By adopting the above technical solution, when the inner wall of the bottom of the solder pad tank is arc-shaped, the solder pad can only contact the highest point in the middle of the inner wall of the bottom of the solder pad tank. At this time, a heat dissipation channel is formed between the two sides of the highest point on the inner wall of the bottom and the two opposite side walls of the solder pad tank. When the carrier board carrying the flexible circuit board leaves the reflow soldering equipment, the cooler ambient air can flow into the heat dissipation channel, thereby carrying away the heat from the solder pad area that is not at the heat dissipation hole.

[0014] Optionally, limit holes are provided at each of the four corners of the carrier plate. The limit holes are used to engage with the positioning pins on the positioning template.

[0015] By adopting the above technical solution, since the surface of the carrier plate is not suitable for any protrusions, a positioning template is necessary to accurately position the flexible circuit board on the carrier plate. The carrier plate and the positioning template are positioned by interlocking the positioning pins and limiting holes. Similarly, the through holes on the flexible circuit board corresponding to the positioning pins are also interlocked with the positioning pins after alignment, thus achieving precise positioning of the flexible circuit board on the carrier plate.

[0016] Optionally, the carrier plate is provided with a plurality of positioning holes.

[0017] By adopting the above technical solution, after the carrier board carrying the flexible circuit board enters the machine for the SMT process, the machine determines the position of the carrier board through positioning holes.

[0018] Optionally, the carrier plate is a high-temperature resistant magnetized steel plate.

[0019] By adopting the above technical solution, when the carrier plate is a high-temperature resistant magnetized steel plate, the carrier plate is not easily deformed and can fix the flexible board well. When the carrier plate carrying the flexible board passes through the reflow oven, the flexible board on the carrier plate is not easy to fall off the carrier plate. Moreover, the high-temperature resistant magnetized steel plate has a long service life due to its high strength and oxidation resistance and does not require special maintenance. In the process of printing solder paste, a clamping sheet is required. After the FPC is positioned on the carrier plate, the clamping sheet containing iron can generate a magnetic attraction with the magnet in the carrier plate, firmly clamping the FPC between the carrier plate and the clamping sheet.

[0020] Optionally, the edge of the carrier plate is also provided with arrows indicating the direction.

[0021] By adopting the above technical solution, prompts are given before the flexible circuit board is positioned on the carrier plate, reducing the possibility of errors during installation and improving docking efficiency.

[0022] In summary, this application includes at least one of the following beneficial technical effects:

[0023] 1. When the carrier board carrying the flexible circuit board leaves the reflow soldering equipment, the cooler ambient air flows directly into contact with the pads through the heat dissipation holes, thereby carrying away the heat from the pads. The heat dissipation channel can accelerate the reduction of the pad temperature.

[0024] 2. When the heat dissipation channel is two heat dissipation grooves opened on the inner wall of the bottom of the pad groove on the carrier board, since the heat dissipation grooves are connected to the heat dissipation holes, when the carrier board carrying the flexible board leaves the reflow soldering equipment, the pads abut against the inner wall of the bottom of the pad groove. At this time, the cooler ambient air can flow into the heat dissipation groove, which helps to remove the heat from the pads that are not at the heat dissipation holes and speeds up the heat dissipation of the pads.

[0025] 3. When the inner wall of the bottom of the solder pad groove is arc-shaped, the solder pads can only contact the highest point in the middle of the inner wall at the bottom of the solder pad groove. At this time, a heat dissipation channel is formed between the two sides of the highest point on the inner wall at the bottom and the two opposite side walls of the solder pad groove. When the carrier board carrying the flexible circuit board leaves the reflow soldering equipment, the cooler ambient air can flow into the heat dissipation channel, thereby carrying away the heat from the solder pad area that is not at the heat dissipation hole. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the front structure of the flexible board to be fixed in the embodiment of this application.

[0027] Figure 2 This is a schematic diagram of the back structure of the flexible board to be fixed in the embodiments of this application.

[0028] Figure 3 This is a schematic diagram of the overall structure of the carrier plate in Example 1.

[0029] Figure 4 This is a schematic diagram of the overall structure of the connection between the flexible board, the carrier board, and the positioning template in Example 1.

[0030] Figure 5 yes Figure 3 Enlarged view of point A in the middle.

[0031] Figure 6 This is a schematic diagram of the overall structure of the carrier plate in Example 2.

[0032] Figure 7 yes Figure 6 Enlarged view of point B in the middle.

[0033] Explanation of reference numerals in the attached figures:

[0034] 01. Positioning template; 1. Flexible board; 11. Positioning mark; 12. Mark point; 13. Through hole; 14. Solder pad; 2. Carrier board; 21. Solder pad groove; 22. Heat dissipation hole; 23. Arrow; 24. Positioning hole; 3. Limiting hole; 4. Heat dissipation channel; 41. Heat dissipation groove. Detailed Implementation

[0035] The following is in conjunction with the appendix Figure 3-7 This application will be described in further detail.

[0036] This application discloses a patch carrier.

[0037] Example 1

[0038] Reference Figure 3 This embodiment is a customized patch carrier, including a carrier plate 2. The carrier plate 2 is a square plate with rounded chamfers at its four corners. A limiting hole 3 is provided at each of the four corners of the carrier plate 2. Several parallel solder pad slots 21 are provided on the carrier plate 2, and several heat dissipation holes 22 are provided inside each solder pad slot 21.

[0039] Reference Figure 3 and Figure 4 Since the surface of the carrier board 2 is not suitable for having any protrusions, the flexible board 1 needs to be precisely positioned on the carrier board 2, which must be achieved using the positioning template 01. After the limiting hole 3 on the carrier board 2 is engaged with the positioning pin on the positioning template 01, the flexible board 1 is then laid on the carrier board 2. Several pads 14 on the back of the flexible board 1 are inserted into the inside of the pad groove 21, and each heat dissipation hole 22 corresponds to a single pad 14.

[0040] Reference Figure 3The carrier plate 2 is a high-temperature resistant magnetized steel plate, and an arrow 23 indicating the direction is engraved on the side of the carrier plate 2 where the solder pad groove 21 is opened. In addition, a number of positioning holes 24 are provided on the side of the carrier plate 2 where the solder pad groove 21 is opened. In this embodiment, there are four positioning holes 24, and each positioning hole 24 is close to a limiting hole 3.

[0041] Reference Figure 3 and Figure 5 Each pad groove 21 has a heat dissipation channel 4 on both sides along its width direction. In this embodiment, the heat dissipation channel 4 is a heat dissipation groove 41. Each heat dissipation groove 41 is opened on the bottom inner wall of the corresponding pad groove 21, and each heat dissipation groove 41 is connected to the heat dissipation hole 22 at the bottom of the pad groove 21.

[0042] The implementation principle of a patch carrier in this application embodiment is as follows: when the carrier board 2 carrying the flexible board 1 leaves the reflow soldering equipment, the heat dissipation hole 22 in the pad groove 21 is penetrated by the external air with a lower temperature, so that the air directly contacts the pad 14 locally and takes away the heat of the pad 14. The heat dissipation groove 41 is connected to the heat dissipation hole 22, so that the external air with a lower temperature also flows in the heat dissipation groove 41.

[0043] Example 2

[0044] Reference Figure 6 and Figure 7 The difference between this embodiment and embodiment 1 is that the inner wall of the bottom of each pad groove 21 is arc-shaped, and the center of the arc of the inner wall is located below the pad groove 21. The arc-shaped bottom of the pad groove 21 forms a heat dissipation channel 4 between its width sides and its side wall.

[0045] The implementation principle of Example 2 is as follows: When the flexible board 1 is inserted into the carrier board 2, the arc-shaped setting of the bottom inner wall of the pad groove 21 makes the pad 14 only contact the highest point in the middle of the bottom inner wall of the pad groove 21. At this time, a heat dissipation channel 4 is formed between the side of the highest point on the bottom inner wall of the pad groove 21 and the inner wall of the adjacent pad groove 21.

[0046] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A patch carrier, characterized in that: The carrier board (2) is provided with a plurality of pad slots (21) at the positions corresponding to the pads (14) on the flexible board (1). A heat dissipation hole (22) is provided in each pad slot (21) at the position corresponding to each pad (14) on the flexible board (1). A heat dissipation channel (4) is provided on both sides of the width of each pad slot (21).

2. The patch carrier according to claim 1, characterized in that: Each of the heat dissipation channels (4) is a heat dissipation groove (41), and the heat dissipation groove (41) is connected to the heat dissipation hole (22).

3. A patch carrier according to claim 1, characterized in that: The inner wall of the bottom of each pad groove (21) is arc-shaped, and the center of the arc is located below the pad groove (21). The arc-shaped inner wall of the pad groove (21) forms a heat dissipation channel (4) between its two sides and its sidewalls along its width.

4. A patch carrier according to claim 1, characterized in that: The carrier plate (2) has limit holes (3) on its four corners. The limit holes (3) are used to engage with the positioning pins on the positioning template.

5. A patch carrier according to claim 1, characterized in that: The carrier plate (2) is provided with a plurality of positioning holes (24).

6. A patch carrier according to claim 1, characterized in that: The carrier plate (2) is a high-temperature resistant magnetized steel plate.

7. A patch carrier according to claim 1, characterized in that: The edge of the carrier plate (2) is also provided with an arrow (23) indicating the direction.

Images