Electronic component heat dissipation device

By designing a heat dissipation device that includes a temperature sensor and mechanical transmission, the heat dissipation problem of electronic components in high-temperature environments is solved, ensuring that the components operate at a suitable temperature, preventing dust accumulation, extending service life, and improving equipment stability.

CN223553650UActive Publication Date: 2025-11-14SHANGHAI CIWEI AVIATION TECH CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202422977550.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-04
Publication Date
2025-11-14
Estimated Expiration
2034-12-04

AI Technical Summary

Technical Problem

Existing electronic components lack effective temperature sensing and automatic heat dissipation mechanisms, resulting in prolonged operation in high-temperature environments, which reduces performance and lifespan.

Method used

A heat dissipation device was designed, which includes components such as a temperature sensor, a small motor, a fan, a housing, and a spring. The temperature sensor controls the small motor to start the fan, which rotates. The mechanical transmission enables the automatic opening and closing of the ventilation openings to ensure that the heat dissipation needs are met. When the temperature drops, the ventilation openings are automatically closed to prevent dust from entering.

Benefits of technology

This ensures that electronic components operate normally at suitable temperatures, preventing performance degradation and damage, extending service life, and improving equipment stability and reliability.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN223553650U_ABST
    Figure CN223553650U_ABST
Patent Text Reader

Abstract

The utility model belongs to the technical field of electronic component heat dissipation, and particularly relates to an electronic component heat dissipation device which comprises a circuit board, the circuit board is detachably connected with a shell, a fan cover penetrates through the shell and is fixedly connected with the shell, the inner wall of the fan cover is fixedly connected with a dustproof net, and a heat dissipation mechanism is arranged in the shell. According to the electronic component heat dissipation device, when the temperature in the shell rises to a certain degree, the temperature sensor controls the small motor to start, the rotating shaft drives the fan to rotate to generate airflow, meanwhile, the ventilation openings in the ventilation plates are opened through a series of mechanical transmission, and the airflow passes through the circuit board through the air guide plate and the ventilation openings; according to the circuit board, heat of electronic components on the circuit board can be effectively taken away, it can be ensured that the electronic components work in a proper temperature environment, the problems of performance reduction, damage and the like caused by overheating are avoided, normal operation of the electronic components is guaranteed, and the stability of a whole circuit system is improved.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology for electronic components, specifically a heat dissipation device for electronic components. Background Technology

[0002] Electronic components are the components of electronic parts and small machines and instruments. They are a general term for electronic devices such as capacitors, transistors, hairsprings, and clockwork, with diodes being a common example.

[0003] Currently, some existing electronic components may lack effective temperature sensing and automatic heat dissipation mechanisms. When the electronic components generate heat and the internal temperature of the device rises, the heat dissipation process cannot be activated in time. This may cause the electronic components to operate in a high-temperature environment for a long time, accelerating component aging and reducing its performance and lifespan. In view of this, we propose a heat dissipation device for electronic components. Utility Model Content

[0004] The main objective of this invention is to provide a heat dissipation device for electronic components, which can solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model proposes a heat dissipation device for electronic components, including a circuit board, a housing detachably connected to the circuit board, a fan shroud penetrating the housing and fixedly connected to the fan shroud, a dustproof mesh fixedly connected to the inner wall of the fan shroud to prevent dust from entering the housing with the airflow during heat dissipation, and a heat dissipation mechanism provided inside the housing, the heat dissipation mechanism including;

[0006] A temperature sensor, which is fixedly connected to the inner wall of the housing;

[0007] A small motor, the output end of which is fixedly connected to a rotating shaft, and the end of the rotating shaft is fixedly connected to a fan;

[0008] Sleeve 1, the outer wall of sleeve 1 is fixedly connected with bushing and rod, the end of rod is set as ball to reduce the friction between rod and inclined groove, sleeve 1 and bushing are rotated and fixedly connected to the rotating shaft, sleeve 1 passes through crossbar sleeve and is rotatably connected to crossbar sleeve;

[0009] The second sleeve is penetrated by and sleeved with the bushing. The second sleeve has an oblique groove. A spring is provided between the first sleeve and the second sleeve. Washers are fixedly connected to both ends of the spring and sleeved with the bushing.

[0010] Preferably, a bearing is fixedly connected to the outer wall of the sleeve, and a fixing rod is fixedly connected to the outer wall of the bearing.

[0011] Preferably, the fixed rod is slidably connected to a limiting frame to limit the fixed rod and prevent the bearing from rotating. The limiting frame is fixedly connected to the outer wall of the crossbar sleeve.

[0012] Preferably, a frame is fixedly connected to the inner wall of the housing, a ventilation plate is fixedly connected to the inner wall of the frame, and a sliding plate is provided on the frame.

[0013] Preferably, a guide rod is fixedly connected to the outer wall of the sliding plate, the guide rod passes through the frame and is slidably connected to the frame, and the sliding plate is elastically connected to the frame by a spring.

[0014] Preferably, an L-shaped rod is fixedly connected to the outer wall of the sliding plate, the L-shaped rod penetrates the housing and the wind hood and is slidably connected to the housing and the wind hood, and a wind guide plate is fixedly connected to the inner wall of the housing.

[0015] This utility model provides a heat dissipation device for electronic components. It has the following beneficial effects:

[0016] (1) When the internal temperature of the electronic component heat dissipation device rises to a certain level, the temperature sensor controls the small motor to start, the shaft drives the fan to rotate and generate airflow. At the same time, through a series of mechanical transmissions, the vents on the ventilation plate are opened. The airflow passes through the air guide plate and the vents and passes through the circuit board, which can effectively remove the heat of the electronic components on the circuit board. This ensures that the electronic components work in a suitable temperature environment, avoids performance degradation and damage due to overheating, ensures the normal operation of the electronic components, and improves the stability of the entire circuit system.

[0017] (2) The heat dissipation device for electronic components achieves automatic opening and closing of the ventilation opening through the coordinated action of components such as sliding plate, ventilation plate, L-shaped rod and spring. When the heat dissipation demand is met and the internal temperature of the housing drops to a suitable level, the temperature sensor shuts off the small motor. At this time, sleeve one and sleeve two stop rotating, and the spring pushes sleeve two back to its original position, thereby driving the sliding plate to close the ventilation opening. This automatic dust prevention mechanism effectively prevents dust from entering the housing and avoids the accumulation of dust on electronic components, thereby extending the service life of electronic components and improving the stability and reliability of the equipment. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0019] Figure 1This is a schematic diagram of the overall three-dimensional structure of the present invention;

[0020] Figure 2 This is a schematic diagram of the internal three-dimensional structure of the present invention;

[0021] Figure 3 This is a schematic diagram of the three-dimensional cross-sectional structure of the sliding plate of this utility model;

[0022] Figure 4 This is a partial three-dimensional structural diagram of the present invention;

[0023] Figure 5 This is a schematic diagram of the three-dimensional structure of sleeve one and sleeve two of this utility model. Figure 1 ;

[0024] Figure 6 This is a schematic diagram of the three-dimensional structure of sleeve one and sleeve two of this utility model. Figure 2 ;

[0025] Figure 7 This is a schematic diagram of the overall three-dimensional cross-sectional structure of this utility model;

[0026] Figure 8 This utility model Figure 7 Schematic diagram of structure A in the middle.

[0027] Explanation of icon numbers:

[0028] 1. Circuit board; 2. Housing; 20. Frame; 21. Ventilation plate; 22. Sliding plate; 23. L-shaped rod; 24. Guide rod; 25. Air guide plate; 3. Fan cover; 31. Crossbar sleeve; 32. Limiting frame; 4. Dustproof net; 51. Temperature sensor; 52. Small motor; 53. Rotating shaft; 54. Fan; 55. Sleeve body one; 551. Rod body; 552. Bushing; 56. Sleeve body two; 561. Inclined groove; 57. Bearing; 58. Fixing rod.

[0029] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0030] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0031] Please see Figures 1-8This utility model proposes a heat dissipation device for electronic components, including a circuit board 1, a housing 2 detachably connected to the circuit board 1, a fan shroud 3 penetrating the housing 2 and fixedly connected to the fan shroud 3, a dustproof mesh 4 fixedly connected to the inner wall of the fan shroud 3, and a heat dissipation mechanism inside the housing 2.

[0032] In an embodiment of this utility model, in order to dissipate heat from the electronic components on the circuit board 1, the heat dissipation mechanism specifically includes a temperature sensor 51, which is fixedly connected to the inner wall of the housing 2. A rotating shaft 53 is fixedly connected to the output end of a small motor 52, and a fan 54 is fixedly connected to the end of the rotating shaft 53. A bushing 552 and a rod 551 are fixedly connected to the outer wall of a sleeve 1 55. The sleeve 1 55 and the bushing 552 are connected to the rotating shaft 53 and are fixedly connected to the rotating shaft 53. The sleeve 1 55 passes through the crossbar sleeve 31 and is rotatably connected to the crossbar sleeve 31. The sleeve 2 56 is passed through the bushing 552 and is sleeved with the bushing 552. The sleeve 2 56 has an inclined groove 561, and a spring is provided between the bushing 552 and the sleeve 2 56.

[0033] Furthermore, a bearing 57 is fixedly connected to the outer wall of the sleeve 56, a fixing rod 58 is fixedly connected to the outer wall of the bearing 57, the fixing rod 58 is slidably connected to the limit frame 32, and the limit frame 32 is fixedly connected to the outer wall of the crossbar sleeve 31.

[0034] Furthermore, a frame 20 is fixedly connected to the inner wall of the housing 2, a ventilation plate 21 is fixedly connected to the inner wall of the frame 20, a sliding plate 22 is provided on the frame 20, a guide rod 24 is fixedly connected to the outer wall of the sliding plate 22, the guide rod 24 passes through the frame 20 and is slidably connected to the frame 20, the sliding plate 22 is elastically connected to the frame 20 by a spring, an L-shaped rod 23 is fixedly connected to the outer wall of the sliding plate 22, the L-shaped rod 23 passes through the housing 2 and the hood 3 and is slidably connected to the housing 2 and the hood 3, and an air guide plate 25 is fixedly connected to the inner wall of the housing 2.

[0035] In this invention, when the internal temperature of the housing 2 rises to a certain level, the temperature sensor 51 controls and starts the small motor 52. When the small motor 52 starts, the shaft 53, which is fixedly connected to the output end of the small motor 52, drives the fan 54 to rotate. Simultaneously, the sleeve 55, which is fixedly connected to the shaft 53, rotates synchronously. When the sleeve 55 rotates, the rod 551, which is fixedly connected to the outer wall of the sleeve 55, rotates synchronously. During the rotation of the rod 551, the rod 551 applies a force to the inclined groove 561, causing the sleeve 56 to move. Simultaneously, the spring between sleeve 1 55 and sleeve 2 56 undergoes elastic deformation. When rod 551 rotates 30 degrees, inclined groove 561 limits rod 551, causing sleeve 2 56 to rotate synchronously with sleeve 1 55. When sleeve 2 56 moves, the fixed rod 58 fixedly connected to the outer wall of bearing 57 presses against L-shaped rod 23, causing L-shaped rod 23 to drive sliding plate 22 to slide. At the same time, the spring fixedly connected to the outer wall of frame 20 undergoes elastic deformation. When sliding plate 22 moves, the ventilation opening on sliding plate 22 will interact with the ventilation opening on ventilation plate 21. It should be noted that there are two sets of sliding plate 22, frame 20, L-shaped rod 23 and ventilation plate 21, and the two sets of L-shaped rod 23 are connected by a connecting rod. When the sliding plate 22 moves, the ventilation openings on the two sets of ventilation plates 21 are opened through the transmission of the connecting rod. At this time, the airflow generated by the fan 54 will pass through the air guide plate 25 and then through the ventilation openings to pass through the circuit board 1, thereby carrying away the heat from the electronic components on the circuit board 1, thus achieving the purpose of heat dissipation. When the temperature inside the housing 2 drops to a suitable level, the temperature sensor 51 will control and shut down the small motor 52. When 52 is closed, sleeve 1 55 and sleeve 2 56 stop rotating. During this process, the spring between sleeve 1 55 and sleeve 2 56 will exert a force on sleeve 2 56, causing sleeve 2 56 to return to its original position. When sleeve 2 56 returns to its original position, the force of the fixing rod 58 and L-shaped rod 23 disappears. At this time, the sliding plate 22 will return to its original position under the elastic force of the spring, thereby closing the ventilation port on the ventilation plate 21. By closing the ventilation port, the electronic components on the circuit board 1 can be protected, preventing dust from accumulating on the outer wall of the electronic components, thus affecting the service life of the components.

[0036] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the inventive concept of the present utility model using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A heat dissipation device for electronic components, comprising a circuit board (1), characterized in that: The circuit board (1) is detachably connected to a housing (2), the housing (2) is penetrated by a fan shroud (3) and fixedly connected to the fan shroud (3), a dustproof net (4) is fixedly connected to the inner wall of the fan shroud (3), and a heat dissipation mechanism is provided inside the housing (2), the heat dissipation mechanism includes; Temperature sensor (51), the temperature sensor (51) is fixedly connected to the inner wall of the housing (2); A small motor (52) is fixedly connected to a rotating shaft (53) at its output end, and a fan (54) is fixedly connected to the end of the rotating shaft (53). Sleeve 1 (55), the outer wall of sleeve 1 (55) is fixedly connected with bushing (552) and rod (551), sleeve 1 (55) and bushing (552) are fixedly connected to rotating shaft (53), sleeve 1 (55) passes through crossbar sleeve (31) and is rotatably connected to crossbar sleeve (31); The second sleeve (56) is penetrated by and sleeved with the bushing (552). The second sleeve (56) has a groove (561). A spring is provided between the bushing (552) and the second sleeve (56).

2. The heat dissipation device for electronic components according to claim 1, characterized in that: A bearing (57) is fixedly connected to the outer wall of the second sleeve (56), and a fixing rod (58) is fixedly connected to the outer wall of the bearing (57).

3. The heat dissipation device for electronic components according to claim 2, characterized in that: The fixed rod (58) is slidably connected to the limiting frame (32), and the limiting frame (32) is fixedly connected to the outer wall of the crossbar sleeve (31).

4. The heat dissipation device for electronic components according to claim 1, characterized in that: A frame (20) is fixedly connected to the inner wall of the housing (2), a ventilation plate (21) is fixedly connected to the inner wall of the frame (20), and a sliding plate (22) is provided on the frame (20).

5. The heat dissipation device for electronic components according to claim 4, characterized in that: The sliding plate (22) is fixedly connected to the outer wall of the guide rod (24), the guide rod (24) passes through the frame (20) and is slidably connected to the frame (20), and the sliding plate (22) is elastically connected to the frame (20) by a spring.

6. The heat dissipation device for electronic components according to claim 5, characterized in that: An L-shaped rod (23) is fixedly connected to the outer wall of the sliding plate (22). The L-shaped rod (23) is slidably connected to the shell (2) and the wind hood (3). A wind guide plate (25) is fixedly connected to the inner wall of the shell (2).