Laser cutting device capable of collecting sweeps

By using a metal placement bar and collection groove structure in the laser cutting device to collect the chips, the problem of cutting powder and chips sticking together is solved, achieving efficient chip handling and cleaning, and improving cutting quality and efficiency.

CN223557533UActive Publication Date: 2025-11-18SUQIAN YANTUO LASER TECH CO LTD
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Patent Information

Application Number
CN202423053697.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-10
Publication Date
2025-11-18
Estimated Expiration
2034-12-10

AI Technical Summary

Technical Problem

The cutting powder and debris generated during laser cutting will remain on the cutting table, causing them to stick together and affecting the quality of subsequent cutting.

Method used

Design a laser cutting device that can collect waste chips. It uses metal placement bars as supports, combined with a collection trough and a vibration motor. The chip collection is guided by an inclined plate to avoid powder adhesion. The cutting head is moved using an XY moving module.

Benefits of technology

It effectively prevents debris and powder from adhering to the cutting table, ensuring the quality of subsequent cutting, simplifying the cleaning process, and improving cutting efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The laser cutting device comprises a cutting machine body, a cutting table is arranged on the cutting machine body, supporting side plates are arranged on the two sides of the cutting table, clamping grooves are formed in the supporting side plates, placing strips are arranged in the supporting side plates, clamping teeth are arranged on the placing strips, and clamping grooves are formed in the clamping teeth. A collecting tank is arranged below the placing strip, an inclined plate is arranged in the collecting tank, a discharging port is formed in one end of the inclined plate, and a vibration motor is arranged at the bottom of the collecting tank; the laser cutting machine has the advantages that different from a traditional laser cutting machine, the metal containing strips are adopted as the platen for supporting, chippings generated during cutting can fall down through the containing strips and are placed through the supporting side plates, compared with a traditional platen with hollow holes, the laser cutting machine can be cleaned and replaced at any time, and the working efficiency is improved. And the situation that molten metal powder adheres to block the hollowed-out holes to affect passing of chippings is avoided.
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Description

Technical Field

[0001] This utility model relates to the field of laser cutting machines, specifically a laser cutting device that can collect waste chips. Background Technology

[0002] A laser cutting machine is a device that uses a laser beam for cutting. It achieves this by focusing the laser beam onto a very small point, causing the material to melt, vaporize, or burn under the laser beam's irradiation. Laser cutting machines offer advantages such as high precision, high speed, high efficiency, and flexibility. They can cut various materials, including metals, plastics, wood, and textiles. Laser cutting machines are widely used in manufacturing, automotive, aerospace, and electronics industries.

[0003] Laser cutting machines produce fewer chips during the cutting process because, unlike the physical cutting of traditional cutting machines, laser cutting generates heat during the cutting process. As a result, some chips melt under the heat. However, laser cutting machines still produce cutting powder, such as metal powder and some debris, during the cutting process. These chips and powder remain on the cutting table and will adhere to the surface of the new workpiece during the next cut. In the next round of cutting, they will be affected by heat and fuse with the new workpiece, causing cutting problems. Summary of the Invention

[0004] (a) Technical problems to be solved

[0005] The technical problem to be solved by this utility model is that laser cutting machines still produce cutting powder, such as metal powder and some debris, during cutting. These debris and powder will remain on the cutting table and will stick to the surface of the new cutting part during the next cutting. When the new round of cutting is affected by heat, they will fuse and stick to the new cutting part, causing cutting problems.

[0006] (II) Technical Solution

[0007] To solve the above problems, this utility model provides the following technical solution:

[0008] A laser cutting device for collecting waste chips includes a cutting machine body, a cutting table on the cutting machine body, supporting side plates on both sides of the cutting table, a slot in the supporting side plate, a placement strip in the supporting side plate, a tooth on the placement strip, a collection groove below the placement strip, an inclined plate in the collection groove, a discharge port at one end of the inclined plate, and a vibration motor at the bottom of the collection groove.

[0009] Furthermore, the bottom of the cutting table is provided with a bracket and legs, and the collection trough is placed on the bracket.

[0010] Furthermore, the two ends of the placement strip are located in the slot, and the placement strip is made of metal and is strip-shaped.

[0011] Furthermore, the collection trough is rectangular, the inclined plate is sloping, and a retention area is provided at the end of the inclined plate near the discharge port.

[0012] Furthermore, the cutting machine body is equipped with a cutting head and an XY movement module.

[0013] (III) Beneficial Effects

[0014] The beneficial effects of this utility model are:

[0015] Unlike traditional laser cutting machines, this machine uses metal support strips as the table for support. During cutting, the chips generated can fall through the support strips and be placed on the supporting side plates. Compared with traditional tables with perforated holes, this design allows for easy cleaning and replacement at any time. It also prevents molten metal powder from sticking together and clogging the perforated holes, thus avoiding chip residue that could affect subsequent workpiece cutting. In addition, a collection groove is set at the bottom to guide and collect the chips for centralized chip processing. Attached Figure Description

[0016] Figure 1 This is a perspective view of the present invention;

[0017] Figure 2 This is a magnified view of part A;

[0018] Figure 3 This is another perspective view of the present invention;

[0019] Figure 4 This is a schematic diagram of the collection tank structure;

[0020] The markings in the diagram are: 1-Cut machine body, 2-Cut table, 3-Support side plate, 4-Placement strip, 5-Collection trough, 6-Discharge port, 7-Vibration motor, 3a-Slot, 4a-Slot tooth, 5a-Inclined plate, 5b-Retention area. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] In the description of this utility model, it should be understood that the terms "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0023] Please see Figure 1-4 The laser cutting device shown includes a cutting machine body 1, a cutting table 2 on the cutting machine body 1, support side plates 3 on both sides of the cutting table 2, a slot 3a in the support side plate 3, a placement strip 4 in the support side plate 3, a tooth 4a on the placement strip 4, a collection groove 5 below the placement strip 4, an inclined plate 5a in the collection groove 5, a discharge port 6 at one end of the inclined plate 5a, and a vibration motor 7 at the bottom of the collection groove 5.

[0024] The bottom of the cutting table 2 is equipped with a support and legs. The collection trough 5 is placed on the support. While supporting the cutting machine body 1, the support and legs also support the collection trough 5. At the same time, the two ends of the support and the two sides of the legs limit the collection trough 5 to prevent the collection trough 5 from shifting significantly under the vibration of the vibration motor 7.

[0025] The two ends of the placement strip 4 are located in the slot 3a. The placement strip 4 is made of metal and is strip-shaped. Please refer to [link / reference]. Figure 2 The two ends of the placement strip 4 are engaged in the slot 3a. During cutting, several placement strips 4 form a receiving platform to receive the workpiece. The teeth 4a on the placement strip 4 are serrated and wavy, so that when the high-temperature metal powder falls during laser cutting, it can enter the collection groove 5 through the placement strip 4. Even if it sticks to the placement strip 4, the wavy shape of the teeth 4a ensures that less residual debris remains at the top of the teeth 4a and is retained at the root of the wavy shape. This prevents a lot of debris or powder from remaining on the surface of the workpiece during subsequent cutting.

[0026] The collection tank 5 is rectangular and box-shaped. The inclined plate 5a is sloping. The end of the inclined plate 5a near the discharge port 6 is provided with a retention area 5b. Powder or debris enters the collection tank 5 after passing through the placement strip 4, and enters the discharge port 6 through the guide of the vibration motor 7 and the inclined plate 5a. The retention area 5b is an empty, flat area to facilitate on-site staff to check the debris situation and facilitate manual cleaning.

[0027] The main body 1 of the cutting machine is equipped with a cutting head and an XY moving module. The XY module is an existing component of the laser cutting machine, used to drive the laser cutting head to move and cut.

[0028] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0029] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A laser cutting apparatus capable of collecting swarf, characterised in that: The utility model relates to a cutting machine, including cutting machine body (1), be equipped with cutting table (2) on cutting machine body (1), cutting table (2) both sides are equipped with support side plate (3), the support side plate (3) is opened in the clamping groove (3a), the support side plate (3) is equipped with the placement strip (4), the placement strip (4) is equipped with the clamping tooth (4a), the collection groove (5) is equipped with the inclined plate (5a) under the placement strip (4), the inclined plate (5a) one end is equipped with the discharge gate (6), the collection groove (5) bottom is equipped with the vibration motor (7).

2. A laser cutting device capable of collecting swarf according to claim 1, wherein: The cutting table (2) bottom is equipped with a support and a supporting leg, and the collection groove (5) is placed on the support.

3. The laser cutting device of claim 1, wherein: The both ends of the placement strip (4) are arranged in the clamping groove (3a), and the placement strip (4) is a strip-shaped sheet made of metal.

4. The waste collecting laser cutting device according to claim 1, wherein: The collection groove (5) is in a rectangular box shape, the inclined plate (5a) is in a slope shape, and the inclined plate (5a) is provided with a retention area (5b) near one end of the discharge gate (6).

5. The waste collecting laser cutting device according to claim 1, wherein: The cutting machine body (1) is provided with a cutting head and an XY movement module.