Fixing clamp for packaging semiconductor structure
By using a fixing clip instead of traditional clamping blocks and screws, and utilizing elastic elements to provide constant clamping force, the problem of uneven solder during gold-tin sealing is solved, simplifying fixture requirements, reducing costs, and improving packaging efficiency.
Patent Information
- Application Number
- CN202422874859.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-25
- Publication Date
- 2025-11-18
- Estimated Expiration
- 2034-11-25
AI Technical Summary
In the existing gold-solder sealing process, loose screws fixing the cover plate can cause uneven solder flow, resulting in voids or solder overflow. Furthermore, different chip sizes require specialized fixtures, which is costly.
The clamping device employs a first clamping arm, a second clamping arm, and an elastic element. The elastic element provides a constant clamping force, replacing traditional pressure blocks and screws. The clamping head can be adjusted according to the chip size, and the elastic element is removable and replaceable.
It achieves constant clamping force, reduces fixture costs, simplifies the operation process, improves packaging efficiency, and allows for the replacement of elastic components to adapt to different chip types as needed.
Smart Images
Figure CN223558248U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to semiconductor packaging technology, mainly applied to the back end packaging link of semiconductor packaging process, especially in the sealing or cap process of semiconductor packaging process uses the fixing tool. BACKGROUND
[0002] Gold tin sealing or gold tin cap process is usually applied to the back end packaging link of semiconductor packaging process, especially in the sealing or cap process, mainly used to ensure the airtightness and stability of the chip after packaging, prevent moisture or other pollutants from the outside into the package, protect the function and performance of the chip.
[0003] In the general gold tin sealing process, the gravity block is pressed according to the chip shape design, the cover plate is locked around, and enough pressure needs to be applied above the cover plate to avoid defects such as solder cavity or solder overflow at the welding interface, but with the melting of the solder piece, the screw of the fixed cover plate will loosen, causing uneven stress, thereby affecting the flow of solder, resulting in problems such as cavity formation or solder overflow at the welding surface. In addition, the gravity block and the jig for placing the chip need to be made according to the size of the chip, and different size chips need corresponding jigs and gravity blocks, which costs high.
[0004] Therefore, in order to solve the above problems, a simple and convenient technical scheme is needed. UTILITY MODEL CONTENTS
[0005] In order to solve the above problems, the utility model provides a kind of semiconductor structure packaging fixing clamp, including first clamping arm, second clamping arm and elastic piece, its characterized in that, elastic piece is arranged between first clamping arm and second clamping arm, and the clamping force of the mutual clamping of the end of first clamping arm and second clamping arm is provided;
[0006] The end of the first clamping arm is provided with a clamping fixed head, and the clamping fixed head and the end of the second clamping arm jointly clamp the semiconductor to be packaged.
[0007] Further, the clamping fixed head is U-shaped structure or V-shaped structure.
[0008] Further, the clamping fixed head is inwardly bent U-shaped structure or V-shaped structure.
[0009] Further, the clamping fixed head is circular arc or spherical fixed head.
[0010] Further, the surface of the clamping fixed head in contact with the semiconductor to be packaged is provided with a flexible pad.
[0011] Further, the other end of the first clamping arm and the second clamping arm is provided with a force applying part, and the clamping part of the first clamping arm is separated from the second clamping arm after force is applied to the force applying part.
[0012] Further, the elastic member is a torsion spring.
[0013] Further, the elastic member is detachably connected with the first clamping arm or the second clamping arm.
[0014] Further, a fixing lug is arranged at the position where the elastic member is arranged on the first clamping arm and the second clamping arm, and the fixing lug is used for fixing the elastic member.
[0015] The beneficial effects of the utility model lie in that:
[0016] 1. The fixed clamps are used to replace the pressing block and the screw, and the complex jig and clamp according to the size of the chip are not needed, and the fixed clamps can provide constant clamping force for the chip cover plate.
[0017] 2. The first clamping arm and the second clamping arm are used to quickly fix the semiconductor to be packaged.
[0018] 3. The elastic member is detachably connected, and different elastic members with different elastic forces can be replaced according to the clamping force, and the elastic member that is aged or has elastic fatigue can also be conveniently replaced. DRAWINGS
[0019] In order to more clearly illustrate the technical scheme in the embodiments of the utility model, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only some embodiments of the utility model, and those skilled in the art can also obtain other drawings according to these drawings without paying creative labor.
[0020] Figure 1 It is a structure schematic view of the fixed clamp for semiconductor packaging of the first embodiment of the utility model.
[0021] Figure 2 It is a structure schematic view of the fixed clamp for semiconductor packaging of the second embodiment of the utility model.
[0022] Figure 3 It is a structure schematic view of the fixed clamp for semiconductor packaging of the third embodiment of the utility model.
[0023] REFERENCE NUMERALS
[0024] 1 first clamping arm
[0025] 10 force applying part
[0026] 11 clamping fixing head
[0027] 12 fixing lug
[0028] 2 second clamping arm
[0029] 20 force applying portion
[0030] 22 fixing lug
[0031] 3 elastic member DETAILED DESCRIPTION
[0032] The present application will become more fully understood from the detailed description given herein below and the accompanying drawings which are given by way of illustration only and thus are not to be considered as limiting the present application. Other advantages of the present application will be realized from the detailed description and drawings and from the claims.
[0033] In the following description, reference is made to the accompanying drawings which form a part hereof, and which are shown by way of illustration of several embodiments of the present application. It is understood that other embodiments can be used and structural, electrical, as well as other changes can be made without departing from the spirit and scope of the present disclosure. The following detailed description is not to be taken in a limiting sense, and the scope of embodiments of the present application are defined only by the claims. The summary of the present application is not intended to limit the scope of the application. Spatially relative terms, such as "upper", "lower", "left", "right", "below", "below", "bottom", "top", and the like, can be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientations depicted in the figures. For example, if the device described herein is turned over in use, a relative prefiix term such as "upper" can be turned "lower", and vice versa. Therefore, the
[0034] While the terms first, second, etc. can be used herein to describe various elements or parameters, these elements or parameters should not be limited by these terms. These terms are only used to distinguish one element or parameter from another element or parameter. For example, a first end can be termed a second end, and similarly, a second end can be termed a first end, without departing from the scope of the various described embodiments. Both the first and the second ends are ends, but they are not the same end unless the context clearly indicates otherwise.
[0035] Furthermore, as used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context indicates otherwise. It will be further understood that the terms "comprises", "comprising", "includes" and / or "including" when used herein, specify the presence of stated features, steps, operations, elements, components, items, and / or groups but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, items, and / or groups thereof. As used herein, the terms "or" and "and / or" are to be interpreted as inclusive, i.e., as meaning one or any combination of the items. Thus, "A, B or C" or "A, B and / or C" means "any of the following: A; B; C; A and B; A and C; B and C; A, B and C". Exceptions to this definition apply only when the combination of elements, functions, steps or acts are mutually exclusive by their nature, as such exceptions are expressly stated herein.
[0036] Reference is made to Figure 1 The utility model discloses a fixed clamp for semiconductor structure package, including first clamping arm 1, second clamping arm 2 and elastic piece 3, elastic piece 3 is arranged between first clamping arm 1 and second clamping arm 2, provides the clamping force of mutual clamping of the end of first clamping arm 1 and second clamping arm 2, the end of first clamping arm 1 is provided with clamping fixed head 11, and clamping fixed head 11 and the end of second clamping arm 2 jointly clamping the semiconductor to be packaged. Figure 1 In the middle, clamping fixed head 11 is U-shaped structure, in the lowest point of U-shaped structure or is called inflection point, for the position of being used for contacting and clamping the semiconductor to be packaged, can be provided with flexible pad 12, in addition, it can be understood that in this embodiment, the U-shaped structure of clamping fixed head 11 can also be slightly deformed into V-shaped structure (not shown in the drawing), and similarly, the lowest point of V-shaped structure can increase flexible pad, it needs to be specially pointed out that because of material and the scene when actual application, the low point of V-shaped structure still has arc structure instead of completely sharp shape.
[0037] The other end of first clamping arm 1 and second clamping arm 2 is provided with force applying part 10, 20, and the clamping fixed head 11 of first clamping arm 1 is separated from second clamping arm 2 after applying force to force applying part 10, 20. Fixed lug 12, 22 is arranged at the position of first clamping arm 1 and second clamping arm 2 installing elastic piece 3, and fixed lug 12, 22 is used for fixing elastic piece 3, and elastic piece 3 is detachably connected with first clamping arm 1 or second clamping arm 2, and in the utility model, elastic piece adopts torsion spring, and spring can be replaced according to different clamping force demand, to adapt to different semiconductor types to be packaged.
[0038] Reference is made to Figure 2For the second embodiment of the utility model, the clamping fixing head 11 is a U-shaped structure that is bent inward in the embodiment, other structures are the same as the first embodiment, and will not be described here, in addition, it can be understood that the U-shaped structure of the clamping fixing head in the embodiment can also be slightly deformed into a V-shaped structure (not shown in the figure) as the first embodiment.
[0039] Please refer to Figure 3 For the third embodiment of the utility model, the clamping fixing head 11 is a circular arc or spherical fixing head in the embodiment, other structures are the same as the first embodiment, and will not be described here.
[0040] The utility model discloses a fixed clamp instead of traditional pressing block and screw pressure, and does not need to order complicated fixture and clamp according to chip size, and the fixed clamp can make the chip cover plate have constant clamping force, can reduce the cost of making fixture, and is convenient for operating personnel to operate, and can greatly shorten the time of fixing chip. Meanwhile, the elastic member is detachably connected, and different elastic members can be replaced according to the size of clamping force, and the elastic member that is aging or elastic fatigue can also be conveniently replaced.
[0041] In the utility model, unless another definite provision and limitation, for example, can be fixed connection, also can be detachable connection, or be integrated, can be mechanical connection, also can be electric connection, can be directly connected, also can be indirectly connected through intermediate medium, can be the communication or mutual action relation of two elements inside, unless another definite limitation, for the ordinary skilled in the art, can understand the specific meaning of the above-mentioned term in the utility model according to specific circumstances.
[0042] The above is the preferred embodiment of the utility model, and it should be pointed out that for ordinary skilled in the art, under the premise of not departing from the principle of the utility model, can make a number of improvements and refinements, and these improvements and refinements should also be regarded as the protection scope of the utility model.
Claims
1. A fixing clamp for semiconductor structure packaging, comprising a first clamping arm, a second clamping arm and a resilient member, characterized in that, The elastic member is arranged between the first clamping arm and the second clamping arm to provide a clamping force for clamping the end portions of the first clamping arm and the second clamping arm to each other. An end portion of the first clamping arm is provided with a clamping fixing head which cooperates with an end portion of the second clamping arm to clamp the semiconductor to be packaged.
2. The fixing clamp for semiconductor structure packaging according to claim 1, wherein The clamping fixing head is in a U-shaped structure or a V-shaped structure.
3. The fixing clamp for semiconductor structure packaging according to claim 1, wherein The clamping fixing head is in an inwardly bent U-shaped structure or a V-shaped structure.
4. The fixing clamp for semiconductor structure packaging according to claim 1, wherein The clamping fixing head is in a circular arc shape or a spherical shape.
5. The fixing clamp for semiconductor structure packaging according to any one of claims 2-4, characterized in that, A flexible pad is arranged on a surface of the clamping fixing head which is in contact with the semiconductor to be packaged.
6. The fixing clamp for semiconductor structure packaging according to claim 1, wherein The other end portions of the first clamping arm and the second clamping arm are provided with force applying portions, and the clamping portion of the first clamping arm is separated from the second clamping arm after a force is applied to the force applying portions.
7. The fixing clamp for semiconductor structure packaging according to claim 1, wherein The elastic member is a torsion spring.
8. The fixing clamp for semiconductor structure packaging according to claim 1, wherein The elastic member is detachably connected to the first clamping arm or the second clamping arm.
9. The fixing clamp for semiconductor structure packaging according to claim 1, wherein A fixing lug is arranged at a position where the elastic member is mounted on the first clamping arm or the second clamping arm, and the fixing lug is used to fix the elastic member.