Thermal vacuum test device

Abstract

The utility model relates to the technical field of spaceflight, in particular to a thermal vacuum test device. The thermal vacuum test device comprises a base, a temperature adjusting mechanism and an objective table, the temperature adjusting mechanism is arranged on the base, the objective table is arranged on the temperature adjusting mechanism and used for bearing a tested spacecraft, and the temperature adjusting mechanism can heat or refrigerate the objective table so as to heat or refrigerate the tested spacecraft. The objective table and the spacecraft on the objective table are heated or refrigerated through the temperature adjusting mechanism, so that the capacity of the tested spacecraft for resisting high temperature, low temperature and temperature alternation under the vacuum condition is tested, the problems that in the prior art, a heating structure and a refrigeration structure need to be independently arranged, and the size is large are solved, and the test cost is reduced; the objective table is in direct contact with the temperature adjusting mechanism, the tested spacecraft is in direct contact with the objective table, heat of the temperature adjusting mechanism is transferred in a heat conduction mode, and the heat transfer efficiency is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to space technology field especially relates to a hot vacuum test device. BACKGROUND

[0002] The spacecraft, for example, is a satellite, is under high vacuum, solar and earth heat radiation, cold black background, plus the instrument and equipment of each starboard work to give out heat, make the satellite's heat receiving, heat dissipation and heat transfer state very complex, therefore, vacuum and hot environment are the most basic and also the most important environment that the satellite encounters during orbit operation, in order to ensure the long life, high reliability, high precision of satellite orbit operation, need to carry out multiple environmental tests for detecting product performance before launching, including hot vacuum test, the main purpose of hot vacuum test is to verify the rationality of thermal control sub-system thermal design and examine the ability of instrument and equipment of each starboard under vacuum condition to resist high, low temperature and temperature alternation, expose the defects of starboard single machine, material, component and technology in advance, to ensure the high reliability of satellite and its components.

[0003] Due to the advantages of high functional density, strong flexibility and low cost, the demand for launching microsatellites is increasing in China.

[0004] The existing hot vacuum test device generally designs heating and refrigeration structure in the vacuum tank, heating is generally completed by electric heating through heating pipes or rods attached to the side of the coil or heat exchange mechanism, refrigeration methods generally include compressor refrigeration, heat transfer medium circulation refrigeration, liquid nitrogen refrigeration and other methods, according to the required temperature range, select one or combined refrigeration, through the coil or heat exchange mechanism attached to the inner surface of the vacuum tank, to achieve the purpose of cooling. The above heating and refrigeration structure is bulky, therefore, the existing hot vacuum test device is large in size and high in cost, and there is a great waste in testing microsatellites or starboard instruments carried by satellites, which does not meet the low cost requirement of microsatellites.

[0005] In addition, the above heating and refrigeration method exchanges heat with the tested spacecraft by thermal radiation, and the heat transfer efficiency is low.

[0006] Therefore, there is an urgent need for a hot vacuum test device to solve the above problems. UTILITY MODEL CONTENT

[0007] The utility model aims at providing a kind of hot vacuum test device, reduce hot vacuum test volume, reduce test cost, improve heat conduction efficiency.

[0008] To achieve the above object, the following technical scheme is provided:

[0009] Hot vacuum test device, comprising:

[0010] Base;

[0011] The temperature adjusting mechanism is arranged on the base, and the object table is arranged on the temperature adjusting mechanism and used for carrying the test spacecraft. The temperature adjusting mechanism can heat or cool the object table to heat or cool the test spacecraft.

[0012] Optionally, the thermal vacuum test device further comprises:

[0013] The cover and the base jointly form a vacuum chamber, and the temperature adjusting mechanism and the object table are located in the vacuum chamber.

[0014] Optionally, the cover comprises:

[0015] The main body part is detachably connected with the base.

[0016] The transparent part is arranged on the main body part.

[0017] Optionally, the cover further comprises:

[0018] The mirror film layer is arranged on the outer periphery of the main body part.

[0019] Optionally, the thermal vacuum test device further comprises a pressing member, and the cover further comprises:

[0020] The flange is formed by extending radially outward from one end of the main body part away from the transparent part, and the pressing member abuts against the flange and is detachably connected with the base.

[0021] Optionally, the cover is made of double-layer glass.

[0022] Optionally, the thermal vacuum test device further comprises:

[0023] The sealing member is arranged between the cover and the base.

[0024] Optionally, the thermal vacuum test device further comprises:

[0025] The carrying support is arranged on the base, and the temperature adjusting mechanism is arranged on the carrying support.

[0026] Optionally, the thermal vacuum test device further comprises:

[0027] The detection member is arranged on the object table and is configured to detect the temperature of the table surface of the object table.

[0028] Optionally, one side of the object table and the temperature adjusting mechanism facing each other is provided with heat-conducting silicone grease.

[0029] Compared with the prior art, the hot vacuum test device has the advantages that:

[0030] The hot vacuum test device provided by the utility model, through the temperature adjusting mechanism, the heating or refrigeration is carried out to the object table and the test spacecraft thereon, the ability of the test spacecraft to withstand high and low temperature and temperature alternation under vacuum condition is tested, the problem of the huge volume of the heating structure and the refrigeration structure which need to be separately arranged in the prior art is solved, and the test cost is reduced; the object table is directly contacted with the temperature adjusting mechanism, the test spacecraft is directly contacted with the object table, the heat of the temperature adjusting mechanism is transmitted through the heat conduction mode, and the heat transmission efficiency is improved. BRIEF DESCRIPTION OF DRAWINGS

[0031] In order to more clearly illustrate the technical scheme in the utility model embodiment, the following will briefly introduce the drawings needed to be used in the description of the utility model embodiment, and obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can also be obtained according to the contents of the utility model embodiment and the drawings without paying creative labor.

[0032] Figure 1 The structure diagram of the hot vacuum test device provided by the utility model embodiment is shown in the figure.

[0033] Figure 2 The sectional view of the hot vacuum test part structure provided by the utility model embodiment is shown in the figure.

[0034] Reference signs:

[0035] 100, hot vacuum test device;

[0036] 1, base; 11, groove; 2, cover body; 21, main body part; 22, transparent part; 23, flange; 3, temperature adjusting mechanism; 4, object table; 5, bearing support; 51, bearing platform; 52, support leg; 6, sealing element; 7, pressing element; 8, vacuum extraction system; 9, heat dissipation system; 10, temperature control box. DETAILED DESCRIPTION

[0037] In order to make the above purpose, features and advantages of the application more obvious and easy to understand, the specific embodiments of the application will be described in detail below with reference to the drawings. In the following description, a lot of specific details are set forth in order to fully understand the application. However, the application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the application, therefore the application is not limited by the following disclosed specific embodiments.

[0038] In the description of the application, it should be understood that, if there are these terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the application.

[0039] In addition, if there are these terms "first", "second", these terms are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first", "second" can explicitly or implicitly include at least one of the features. In the description of the application, if the term "multiple" appears, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise explicitly specified and limited.

[0040] In this application, unless otherwise explicitly specified and limited, if there are terms such as "mounting", "connecting", "connecting", "fixing" and the like, these terms should be broadly understood. For example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0041] In this application, unless otherwise explicitly specified and limited, if there are similar descriptions such as "first feature on or under second feature", the meaning can be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature "above", "above" and "above" of the second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" of the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0042] It is to be noted that if an element is referred to as being "fixed" or "set" on another element, it can be directly on the other element or there can be an intervening element. If an element is referred to as being "connected" to another element, it can be directly connected to the other element or there can be an intervening element. The terms "vertical", "horizontal", "upper", "lower", "left", "right", and similar terms as used herein are for the purpose of illustration only and do not indicate the only possible orientation of the embodiment.

[0043] As shown in FIGS. Figure 1 and Figure 2 The embodiment provides a thermal vacuum test device 100 for thermal vacuum test of a spacecraft. Specifically, the thermal vacuum test device 100 includes a base 1 and a cover 2, the base 1 and the cover 2 together define a vacuum chamber, and the thermal vacuum test device 100 further includes a vacuum pumping system 8 connected to the vacuum chamber to pump the vacuum chamber to simulate the vacuum condition in space. The vacuum pumping system 8 can be a vacuum pump.

[0044] In the embodiment, the thermal vacuum test device 100 includes a temperature adjusting mechanism 3 and a carrier 4, the temperature adjusting mechanism 3 is arranged on the base 1 and located in the vacuum chamber, and the carrier 4 is arranged on the temperature adjusting mechanism 3 and used to carry the spacecraft under test. The temperature adjusting mechanism 3 can heat or cool the carrier 4 to heat or cool the spacecraft under test. By heating or cooling the carrier 4 and the spacecraft under test thereon through the temperature adjusting mechanism 3, the ability of the spacecraft under test to withstand high and low temperatures and temperature alternation under the vacuum condition is tested. The problem of large volume of the heating structure and the cooling structure in the prior art is solved, and the test cost is reduced. The carrier 4 is in direct contact with the temperature adjusting mechanism 3, and the spacecraft under test is in direct contact with the carrier 4. The heat of the temperature adjusting mechanism 3 is transferred by heat conduction, and the heat transfer efficiency is improved.

[0045] It is to be noted that the temperature adjusting mechanism 3 is a semiconductor cooling sheet. The semiconductor cooling sheet has two functions. The semiconductor cooling sheet utilizes the Peltier effect of semiconductor materials. When a direct current passes through an electric couple formed by two different semiconductor materials in series, heat can be absorbed and released at the two ends of the electric couple, respectively, so that the purpose of cooling and heating can be achieved. The semiconductor cooling sheet can both cool and heat. One semiconductor cooling sheet can replace separate heating and cooling structures, has small volume, is suitable for thermal vacuum test of microsatellites, has advantages of small volume, convenient use, no refrigerant pollution, high temperature control precision, safety, etc., and is conducive to cost reduction. The specific structure and working principle of the semiconductor cooling sheet are prior art, and will not be described herein.

[0046] Optionally, the thermal vacuum test device 100 further comprises a detection member arranged on the stage 4 and configured to detect the temperature of the stage 4, so as to monitor the temperature of the stage in real time. The detection member can be a temperature sensor. The thermal vacuum test device 100 further comprises a temperature control box 10, which can read the temperature of the temperature sensor, control the current and direction of the semiconductor refrigeration piece, close-loop control the temperature of the stage 4, and perform cold and hot cycle work to improve the working efficiency and safety. It should be noted that the temperature control box 10 is a prior art, and any temperature control box 10 capable of achieving the above functions can be used in the present embodiment.

[0047] Optionally, the thermal vacuum test device 100 further comprises a heat dissipation system 9 arranged below the base 1. When the temperature adjusting mechanism 3 cools the test spacecraft, the lower part of the temperature adjusting mechanism 3 is heated. In order to avoid overheating of the base 1, the heat dissipation system 9 is used to dissipate heat from the base 1. The heat dissipation system 9 can be one or a combination of heat dissipation fins, fans, or liquid cooling plates.

[0048] Optionally, the thermal vacuum test device 100 further comprises a sealing member 6 arranged in a groove 11 on the base 1 and located between the cover 2 and the base 1, so as to improve the sealing performance of the cover 2 and the base 1. The groove 11 is used to position and install the sealing member 6, and the stability of the installation of the sealing member 6 is ensured.

[0049] Optionally, the cover 2 comprises a main body part 21 and a transparent part 22. The main body part 21 is detachably connected to the base 1, and the transparent part 22 is arranged on the main body part 21, so as to facilitate observation of the test spacecraft.

[0050] Optionally, the thermal vacuum test device 100 further comprises a pressing member 7. The cover 2 further comprises a flange 23 formed by extending an end of the main body part 21 away from the transparent part 22 in a radial direction. The pressing member 7 abuts against the flange 23 and is detachably connected to the base 1. The pressing member 7 abuts against the flange 23, thereby achieving stable connection of the cover 2 and the base 1. The pressing member 7 is detachably connected to the base 1, thereby facilitating quick disassembly and assembly of the cover 2 and the base 1.

[0051] Optionally, the cover 2 further comprises a mirror film layer arranged on the outer periphery of the main body part 21, so as to reduce the loss of radiant heat.

[0052] Optionally, the cover 2 is made of double-layer glass, and the hollow layer between the two layers of glass is evacuated or filled with inert gas, thereby achieving heat insulation and further reducing heat loss.

[0053] Optionally, the cover 2 is integrally formed. The integrally formed cover 2 saves connection structures, has a simple structure, and has high overall strength.

[0054] Optionally, the thermal vacuum test device 100 further comprises a bearing support 5, the bearing support 5 is arranged on the base 1, and the temperature adjusting mechanism 3 is arranged on the bearing support 5, so that the bearing support 5 is arranged to bear the temperature adjusting mechanism 3, thereby avoiding the temperature adjusting mechanism 3 directly contacting the base 1, and further reducing heat loss.

[0055] Optionally, the bearing support 5 comprises a bearing platform 51 and a supporting leg 52, the supporting leg 52 is arranged below the bearing platform 51, and the temperature adjusting mechanism 3 is arranged on the bearing platform 51, so that the supporting leg 52 is arranged to further reduce the contact area between the temperature adjusting mechanism 3 and the base 1, thereby further reducing heat loss of the temperature adjusting mechanism 3.

[0056] In order to improve the heat conduction efficiency between the object table 4 and the temperature adjusting mechanism 3, the object table 4 and the temperature adjusting mechanism 3 are arranged with heat-conducting silicone grease on the side facing each other.

[0057] The bearing support 5, the object table 4 and the base 1 are all made of heat-conducting and low outgassing rate materials, which can reduce the influence of gas release on the performance of the thermal vacuum test device 100, and ensure stable operation and long-term reliability of the thermal vacuum test device 100.

[0058] Note that in the description of the present specification, the description referring to the terms "some embodiments", "other embodiments", and the like means that the specific features, structures, materials or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0059] The above is only the preferred embodiment of the present application and the technical principle applied. Those skilled in the art will understand that the present application is not limited to the specific embodiments described herein, and various obvious changes, re-adjustments and substitutions can be made by those skilled in the art without departing from the scope of the present application. Therefore, although the present application has been described in more detail through the above embodiments, the present application is not limited to the above embodiments, and can include more other equivalent embodiments without departing from the concept of the present application, and the scope of the present application is determined by the scope of the appended claims.

Claims

1. A thermal vacuum testing apparatus, characterized in that, include: Base (1); Temperature control mechanism (3) and stage (4) are provided. The temperature control mechanism (3) is disposed on the base (1). The stage (4) is disposed on the temperature control mechanism (3) and is used to carry the test spacecraft. The temperature control mechanism (3) can heat or cool the stage (4) to heat or cool the test spacecraft.

2. The thermal vacuum testing apparatus according to claim 1, characterized in that, The thermal vacuum testing apparatus also includes: The cover (2), the base (1) and the cover (2) together form a vacuum chamber, and the temperature control mechanism (3) and the stage (4) are located in the vacuum chamber.

3. The thermal vacuum testing apparatus according to claim 2, characterized in that, The cover (2) includes: The main body (21) is detachably connected to the base (1); A transparent portion (22) is provided on the main body portion (21).

4. The thermal vacuum testing apparatus according to claim 3, characterized in that, The cover (2) also includes: A mirror film layer is disposed on the outer periphery of the main body (21).

5. The thermal vacuum testing apparatus according to claim 3, characterized in that, The thermal vacuum testing device also includes a pressure-retaining component (7), and the cover (2) further includes: The flange (23) is formed by extending radially outward from one end of the main body (21) away from the transparent part (22). The pressing member (7) abuts against the flange (23) and is detachably connected to the base (1).

6. The thermal vacuum testing apparatus according to claim 2, characterized in that, The cover (2) is made of double-layered glass.

7. The thermal vacuum testing apparatus according to claim 2, characterized in that, The thermal vacuum testing apparatus also includes: A sealing element (6) is disposed between the cover (2) and the base (1).

8. The thermal vacuum testing apparatus according to claim 1, characterized in that, The thermal vacuum testing apparatus also includes: The support bracket (5) is mounted on the base (1), and the temperature control mechanism (3) is mounted on the support bracket (5).

9. The thermal vacuum testing apparatus according to claim 1, characterized in that, The thermal vacuum testing apparatus also includes: The detection element is disposed on the stage (4) and configured to detect the surface temperature of the stage (4).

10. The thermal vacuum testing apparatus according to any one of claims 1-9, characterized in that, The stage (4) and the temperature control mechanism (3) are provided with thermal grease on the side facing each other.

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