Tactile sensor

Abstract

The utility model relates to the technical field of tactile sensing, and discloses a tactile sensor, which comprises a flexible circuit board, a pressure sensing unit is arranged on the flexible circuit board, and a microprocessor is arranged on one side of the flexible circuit board; the pressure sensing unit is connected with the microprocessor through the flexible circuit board, and the microprocessor processes the pressure change value of the pressure sensing unit in real time; the pressure sensing unit is composed of m * n pressure sensing points to form a pressure sensor array; according to the utility model, through cooperative use of the flexible circuit board, the pressure sensing unit and the microprocessor, pressure distribution point coordinates in the X-axis direction and the Y-axis direction of a plane can be sensed, the pressure can be judged, and the absolute value of a stress point in a time domain can be accurately judged, so that the numerical values are effectively collected and reasonably analyzed; and meanwhile, through cooperative use of the outer frame, the blocking cover and the packaging silica gel layer, the MEMS sensor can be protected, and the reliability of the MEMS sensor can be improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of tactile sensing technology, especially relates to a tactile sensor. BACKGROUND

[0002] The high automation of modern industry and the rapid development of electronic industry make the application of robots in various fields more extensive and in-depth. The key to realizing the intelligence of robots is the research and design of sensors that simulate the sensory functions of human organs. Tactile sensing technology, as one of the key factors in realizing intelligent robot technology, is not only a supplement to vision, but also, like vision, simulates human senses and is a medium for robots to interact with the environment.

[0003] Touch is an important sensory function when a person directly contacts the external environment. Developing a tactile sensor that meets the requirements is one of the key technologies in the development of robots. With the development of microelectronics technology and the emergence of various organic materials, various tactile sensor development schemes have been proposed.

[0004] However, most of them are currently in the laboratory stage, and few have reached productization. Domestic and foreign university laboratories have made significant breakthroughs in the sensitivity, resolution, and flexibility of single array tactile sensor units. However, challenges such as cost, splicing, and crosstalk need to be further addressed. High-end tactile sensors are expensive, resulting in relatively high costs for large-scale deployment. In addition, a large number of wirings are required after the expansion of the tactile sensor, which not only increases the complexity of deployment but also may affect the measurement environment and circuit, posing a challenge to the consistency of measurement results. The splicing of base materials and tactile materials and the connection of electronic circuits also introduce more unknown interference into the measurement process, which may cause distortion of measurement data.

[0005] Therefore, a tactile sensor is proposed. UTILITY MODEL CONTENT

[0006] The utility model aims at providing a tactile sensor, which can solve the problems in the background art.

[0007] To solve the above technical problems, an embodiment of the utility model provides a tactile sensor, which comprises:

[0008] A flexible circuit board, on which a pressure sensing unit is arranged, and a microprocessor on one side of the flexible circuit board;

[0009] The pressure sensing unit is connected to the microprocessor through the flexible circuit board, and the microprocessor processes the pressure change value of the pressure sensing unit in real time.

[0010] The pressure sensing unit is composed of m x n pressure sensing points, forming a pressure sensor array.

[0011] As a preferred technical solution, each of the pressure sensing points contains a MEMS sensor, which is assembled on a flexible circuit board.

[0012] As a preferred technical solution, the MEMS sensor is electrically connected with the flexible circuit board, and the flexible circuit board is electrically connected with the microprocessor.

[0013] As a preferred technical solution, the flexible circuit board is provided with a protective piece for sealing the MEMS sensor.

[0014] As a preferred technical solution, the protective piece includes a through hole opened at the top of the flexible circuit board, the through hole is located at the bottom of the MEMS sensor, the top of the flexible circuit board is fixedly connected with an outer frame, the MEMS sensor is located in the inner cavity of the outer frame, the top and the bottom of the outer frame are in an open structure, the inner cavity of the outer frame is filled with a packaging silica gel layer, the packaging silica gel layer covers the surface of the MEMS sensor, and the top of the outer frame is fixedly connected with a cover.

[0015] As a preferred technical solution, the number of the through hole and the outer frame is the same as that of the pressure sensing point, the through hole and the pressure sensing unit are one-to-one corresponding, and the outer frame and the pressure sensing unit are one-to-one corresponding.

[0016] As a preferred technical solution, it further includes a heat dissipation assembly for dissipating heat for the microprocessor, the heat dissipation assembly includes an aluminum alloy heat conduction box body, one side of the aluminum alloy heat conduction box body is designed as an opening, and a silica gel heat conduction layer is fixedly installed inside the aluminum alloy heat conduction box body, the outer side of the silica gel heat conduction layer is flush with the opening of the aluminum alloy heat conduction box body, and the microprocessor is fixedly and tightly installed on the outer side of the silica gel heat conduction layer, wherein:

[0017] Both ends of the aluminum alloy heat conduction box body are fixedly installed with fixing ears, and mounting holes are formed in the fixing ears;

[0018] A plurality of U-shaped aluminum alloy heat dissipation pipes filled with cooling liquid are fixedly installed on the side of the aluminum alloy heat conduction box body opposite to the opening, and a connecting frame is fixedly installed, and a heat dissipation fan is fixedly installed at the center of the connecting frame.

[0019] As a preferred technical solution, the microprocessor is electrically connected with an external display through wired connection.

[0020] The utility model discloses relative to prior art, the utility model discloses, through the cooperation of flexible circuit board, pressure sensing unit and microprocessor, the pressure distribution point coordinate of plane XY axle direction can be perceived, and the size of pressure is judged, and the absolute value of force point in time domain is judged accurately, thereby these numerical value is effectively gathered and the reasonable analysis, simultaneously through the cooperation of outer frame, baffle and encapsulation silica gel layer, can play the protection function to MEMS sensor, help to improve the reliability of MEMS sensor. BRIEF DESCRIPTION OF DRAWINGS

[0021] One or more embodiments are illustrated by way of example in the figures that form a part of this patent document, these example illustrations do not constitute a limitation on the embodiments, elements having the same reference numbers in the figures represent similar elements, unless there is a particular indication otherwise, the figures in the drawings do not constitute a proportionality limit.

[0022] Fig. 1 It is the structure schematic diagram of tactile sensor of the utility model;

[0023] Fig. 2 It is the local structure side view schematic diagram of tactile sensor of the utility model;

[0024] Fig. 3 It is the assembly schematic diagram of microprocessor and heat dissipation component in tactile sensor of the utility model;

[0025] Fig. 4 It is the assembly schematic diagram of microprocessor and heat dissipation component in tactile sensor of the utility model from another view;

[0026] Fig. 5 It is the method flow chart of two-dimensional force detection of tactile sensor of the utility model;

[0027] Fig. 6 It is the pressure point curve change graph of two-dimensional force detection of tactile sensor of the utility model.

[0028] Fig. 1 is a flexible circuit board;11, through hole;12, outer frame;13, baffle;2, pressure sensing unit;3, microprocessor;4, encapsulation silica gel layer;5, heat dissipation component;501, aluminum alloy heat conduction box body;502, silica gel heat conduction layer;503, fixed lug;504, U-shaped aluminum alloy heat dissipation pipe;505, connecting frame;506, heat dissipation fan. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical scheme and advantages of the utility model clearer, the various embodiments of the utility model will be described in detail below in combination with the drawings. However, those skilled in the art can understand that, in the various embodiments of the utility model, many technical details are proposed in order to enable the reader to better understand the present application. However, even without these technical details and various changes and modifications based on the following embodiments, the technical scheme claimed by the various claims of the present application can be implemented.

[0030] The first embodiment of the utility model relates to a kind of tactile sensors, as shown in Figs. 1-2 Pressure sensing unit 2 is connected with microprocessor 3 by flexible circuit board 1, and microprocessor 3 processes the pressure change value of pressure sensing unit 2 in real time;Pressure sensing unit 2 is composed of m×n pressure sensing points, and forms pressure sensor array.

[0031] Wherein, each pressure sensing point contains a MEMS sensor, and the MEMS sensor is assembled on flexible circuit board 1.

[0032] Wherein, MEMS sensor and flexible circuit board 1 are electrically connected, and flexible circuit board 1 and microprocessor 3 are electrically connected.

[0033] Wherein, flexible circuit board 1 is provided with a protective piece for sealing treatment of MEMS sensor.

[0034] Wherein, the protective piece includes a through hole 11 opened in the top of flexible circuit board 1, the through hole 11 is located at the bottom of MEMS sensor, the top of flexible circuit board 1 is fixedly connected with an outer frame 12, the MEMS sensor is located in the inner cavity of outer frame 12, the top and bottom of outer frame 12 are both in open structure, the inner cavity of outer frame 12 is filled with encapsulation silica gel layer 4, the encapsulation silica gel layer 4 covers the surface of MEMS sensor, and the top of outer frame 12 is fixedly connected with a cover 13.

[0035] Wherein, the number of through hole 11 and outer frame 12 is same with pressure sensing point, and the through hole 11 and pressure sensing unit 2 are one-to-one corresponding, and the outer frame 12 and pressure sensing unit 2 are one-to-one corresponding.

[0036] Wherein, microprocessor 3 is electrically connected with external display through wired connection, and can output real-time pressure distribution data.

[0037] Wherein, in order to more specifically understand the structure of tactile sensor in the embodiment, the following are some specific size and data examples of flexible circuit board (size L×W×H) and pressure sensing unit (composed of m×n pressure sensing points).

[0038] Flexible Circuit Board Size Examples

[0039] Flexible Circuit Board 1:

[0040] Size (L x W x H): 100mm x 50mm x 0.2mm

[0041] Note: This is a relatively small flexible circuit board suitable for small or medium-sized devices or robots.

[0042] Flexible Circuit Board 2:

[0043] Size (L x W x H): 200mm x 100mm x 0.5mm

[0044] Note: This size of flexible circuit board is suitable for larger area tactile sensors, suitable for larger size devices or robots.

[0045] Flexible Circuit Board 3:

[0046] Size (L x W x H): 300mm x 150mm x 1.0mm

[0047] Note: Larger flexible circuit boards can be used for industrial applications, such as tactile feedback systems for robotic arms or pressure monitoring on large equipment surfaces.

[0048] Pressure Sensing Point Quantity Examples

[0049] Pressure Sensing Unit A:

[0050] Number of sensing points (m x n): 10 x 10

[0051] Note: This is an array of 100 pressure sensing points.

[0052] Pressure Sensing Unit B:

[0053] Number of sensing points (m x n): 20 x 15

[0054] Note: 300 pressure sensing points provide a larger coverage area.

[0055] Pressure Sensing Unit C:

[0056] Number of sensing points (m x n): 30 x 20

[0057] Note: 600 pressure sensing points provide a high-density sensing array, ideal for applications requiring extremely high precision and complex pressure distribution analysis, such as pressure point monitoring in medical mattresses or high-precision robotic hands.

[0058] These example data demonstrate how flexible circuit boards of different sizes and resolutions can be combined with pressure sensing units to meet the needs of various application scenarios.

[0059] The MEMS sensor can be a Bosch low-power, three-axis high-performance acceleration sensor of model BMA456, and the microprocessor 3 can be an STC89C51 single-chip microcomputer.

[0060] The second embodiment of the utility model relates to a kind of tactile sensors, as shown in Figs. 3-4 Different from embodiment 1, it further includes heat dissipation component 5 for heat dissipation of microprocessor 3, and heat dissipation component 5 includes aluminum alloy heat conduction box body 501, one side of aluminum alloy heat conduction box body 501 is open design, and silicon rubber heat conduction layer 502 is fixedly installed in aluminum alloy heat conduction box body 501, the outer side of silicon rubber heat conduction layer 502 is flush with the opening of aluminum alloy heat conduction box body 501, and microprocessor 3 is fixedly attached and installed on the outer side of silicon rubber heat conduction layer 502, wherein:

[0061] Aluminum alloy heat conduction box body 501 is fixedly installed with fixed lug 503 at both ends, and mounting hole is formed in fixed lug 503;

[0062] Aluminum alloy heat conduction box body 501 is fixedly installed with a plurality of U-shaped aluminum alloy heat dissipation pipes 504 filled with coolant on the side away from the opening thereof, and fixedly installed with connecting frame 505, and the center of connecting frame 505 is fixedly installed with heat dissipation fan 506.

[0063] The heat dissipation component 5 set by the above technical scheme is mainly composed of aluminum alloy heat conduction box body 501, silicon rubber heat conduction layer 502, fixed lug 503, a plurality of U-shaped aluminum alloy heat dissipation pipes 504 filled with coolant, connecting frame 505 and heat dissipation fan 506, and the entire heat dissipation component 5 is fixed in the equipment or robot by fixed lug 503 during use, and a heat dissipation port is reserved on the equipment or robot for cooperation with heat dissipation fan 506, especially under the cooperation of a plurality of U-shaped aluminum alloy heat dissipation pipes 504 filled with coolant and heat dissipation fan 506, the microprocessor 3 can be effectively cooled, the operating temperature of MCU microprocessor can be effectively reduced, the performance stability and service life thereof can be improved, and the microprocessor 3 can work stably for a long time, so that the stability of the tactile sensor is improved.

[0064] The third embodiment of the utility model relates to a kind of methods for detecting two-dimensional force by tactile sensor, and the main difference is that Figs. 5-6 As shown in the figure, the method comprises the following steps:

[0065] S1, arranging pressure sensing unit 2 on flexible circuit board 1;

[0066] S2, sealing treatment is carried out on pressure sensing unit 2;

[0067] S3, the pressure sensing unit 2 is connected to the microprocessor 3 through the flexible circuit board 1;

[0068] S4, the microprocessor 3 processes the pressure change value of the pressure sensing unit 2 in real time;

[0069] S5, judging the stress point coordinate and the stress size;

[0070] S6, depicting the pressure point curve change value, as shown in Fig. 6 .

[0071] In summary, through the cooperation of the flexible circuit board 1, the pressure sensing unit 2 and the microprocessor 3, the pressure distribution point coordinate in the XY axis direction can be perceived, the size of the pressure can be judged, the absolute value of the stress point in the time domain can be accurately judged, and thus the values can be effectively collected and reasonably analyzed.

[0072] Those skilled in the art can understand that the above-mentioned embodiments are specific embodiments for implementing the present application, and in actual application, various changes can be made in form and details without departing from the spirit and scope of the present application.

Claims

1. A tactile sensor characterized by, Include: Flexible circuit board (1) is arranged with pressure sensing unit (2), one side of the flexible circuit board (1) is provided with microprocessor (3), wherein: The pressure sensing unit (2) is connected with the microprocessor (3) through the flexible circuit board (1), and the microprocessor (3) processes the pressure change value of the pressure sensing unit (2) in real time; The pressure sensing unit (2) is composed of m*n pressure sensing points, forming a pressure sensor array.

2. The tactile sensor according to claim 1, characterized by: Each of the pressure sensing points contains a MEMS sensor, which is assembled on the flexible circuit board (1).

3. The tactile sensor according to claim 2, characterized by: The MEMS sensor is electrically connected with the flexible circuit board (1), and the flexible circuit board (1) is electrically connected with the microprocessor (3).

4. The tactile sensor according to claim 3, characterized by: The flexible circuit board (1) is provided with a protective member for sealing the MEMS sensor.

5. The tactile sensor according to claim 4, characterized by: The protective member includes a through hole (11) opened at the top of the flexible circuit board (1), the through hole (11) is located at the bottom of the MEMS sensor, the top of the flexible circuit board (1) is fixedly connected with an outer frame (12), the MEMS sensor is located in the inner cavity of the outer frame (12), the top and bottom of the outer frame (12) are in open structure, the inner cavity of the outer frame (12) is filled with a packaging silica gel layer (4), the packaging silica gel layer (4) covers the surface of the MEMS sensor, and the top of the outer frame (12) is fixedly connected with a cover (13).

6. The tactile sensor of claim 5, wherein: The through hole (11) and the outer frame (12) are the same as the number of pressure sensing points, the through hole (11) and the pressure sensing unit (2) are one-to-one corresponding, and the outer frame (12) and the pressure sensing unit (2) are one-to-one corresponding.

7. The tactile sensor of claim 6, wherein: The microprocessor (3) is electrically connected with the external display through wired connection.

8. The tactile sensor of claim 7, wherein: Further comprising a heat dissipation assembly (5) for dissipating heat for the microprocessor (3), the heat dissipation assembly (5) comprises an aluminum alloy heat conduction box body (501), one side of the aluminum alloy heat conduction box body (501) is designed as an opening, and a silica gel heat conduction layer (502) is fixedly installed in the aluminum alloy heat conduction box body (501), the outer side of the silica gel heat conduction layer (502) is flush with the opening of the aluminum alloy heat conduction box body (501), and the microprocessor (3) is fixedly attached and installed on the outer side of the silica gel heat conduction layer (502), wherein: The both ends of the aluminum alloy heat conduction box body (501) are fixedly installed with fixing ears (503), and mounting holes are formed in the fixing ears (503); A plurality of U-shaped aluminum alloy heat dissipation pipes (504) filled with cooling liquid are fixedly installed on the side of the aluminum alloy heat conduction box body (501) opposite to the opening, and a connecting frame (505) is fixedly installed, and a heat dissipation fan (506) is fixedly installed in the center of the connecting frame (505).

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