Chip four-side detection device

Abstract

The utility model relates to a chip four-side detection device. Relates to the technical field of chip detection. The chip detection device specifically comprises an annular conveying assembly, a feeding assembly, a discharging assembly and a chip detection assembly, the feeding assembly is used for placing chips on the annular conveying assembly, the annular conveying assembly is used for conveying the chips, and the chip detection assembly is used for conducting four-side detection on the chips on the annular conveying assembly; the discharging assembly is used for discharging the chips on the annular conveying assembly. According to the chip detection device, the annular transportation assembly can carry out annular transportation on a plurality of chips to be detected at the same time, and then the chip detection assembly grabs the images of the four side faces of the chips to be detected above the chips to be detected so as to carry out detection, so that the space occupation of equipment can be reduced, and the detection efficiency is improved. And the appearance detection efficiency of a single chip can be improved, so that the production efficiency is improved, and the production cost is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip detection technical field, in particular to a chip four -sided detection device. BACKGROUND

[0002] With the rapid development of semiconductor chips, the industry and equipment related to semiconductor chips also enter the mature stage, in the manufacturing link of chip, after cutting, the appearance of chip needs to be detected, and chip appearance detection is one kind of chip whole tray product appearance detection, another kind is single chip appearance detection. Single chip appearance detection includes appearance detection of four sides of chip.

[0003] In the prior art, the appearance detection of single chip usually needs to set four stations, each station is configured with a camera, and the appearance of four sides of the chip is detected respectively. The appearance detection of single chip is carried out by this way, the space occupied by the device body is large, and the detection efficiency is low, so as to increase the production cost and reduce the production efficiency, which cannot meet the needs of the present production. UTILITY MODEL CONTENT

[0004] The utility model aims at the shortage of prior art, provides a chip four -sided detection device, which can reduce the space occupation and improve the chip detection efficiency, thereby reducing the production cost and improving the production efficiency.

[0005] The utility model provides a chip four -sided detection device, including annular transport component, feeding assembly, discharge assembly and chip detection component, the feeding assembly is used to place chip in the annular transport component, the annular transport component is used to transport chip, the chip detection component is located above the chip transported by the annular transport component, and the image of four sides of chip is grabbed simultaneously to detect, the discharge assembly is used to discharge chip on the annular transport component.

[0006] Further, the annular transport component includes an annular conveying system, a mover arranged on the annular conveying system, and a chip carrier arranged on the mover, the chip carrier is used to place the chip, and the mover is used to drive the chip carrier to move along the annular conveying system.

[0007] Further, the chip carrier includes a carrier plate arranged on the mover, and a suction assembly arranged on the carrier plate, the carrier plate is used to mount the suction assembly on the mover, and the suction assembly is used to place the chip.

[0008] Further, the adsorption assembly comprises a quick-change plate arranged on the carrier plate, a suction cup arranged on the quick-change plate, and a vacuum pump arranged on the carrier plate, the quick-change plate is used to mount the suction cup on the carrier plate, and the vacuum pump is used to form a negative pressure area on the suction cup, and the negative pressure area is used to adsorb the chip.

[0009] Further, the adsorption assembly further comprises a quick screw used to detachably connect the quick-change plate and the carrier plate, the quick-change plate is provided with a through hole, the carrier plate is provided with a threaded hole, and one end of the quick screw is screwed with the threaded hole after penetrating through the through hole.

[0010] Further, the annular conveying assembly is provided with a feeding position, the feeding assembly comprises a feeding box and a feeding carrying arm arranged between the feeding box and the feeding position, the feeding box is used to load the chip to be detected, and the feeding carrying arm is used to carry the chip to be detected in the feeding box to the feeding position.

[0011] Further, the annular conveying assembly is provided with a discharging position, the discharging assembly comprises a discharging box and a throwing box, and a discharging carrying arm arranged between the discharging box, the throwing box and the discharging position, the discharging carrying arm is used to carry the qualified chip in the discharging position to the discharging box, and carry the unqualified chip in the discharging position to the throwing box.

[0012] Further, the annular conveying assembly is provided with a detection position, the chip detection assembly comprises a support frame and at least one detection unit arranged on the support frame, the support frame is used to erect the detection unit above the detection position, and the detection unit is used to simultaneously capture images of four sides of the chip located in the detection position for detection.

[0013] Further, the chip detection assembly further comprises a Y-direction moving module arranged on the support frame and a Z-direction fine adjustment module arranged on the Y-direction moving module, the detection unit is arranged on the Z-direction fine adjustment module, the Y-direction moving module is used to adjust the position of the detection unit in the Y-axis direction, and the Z-direction fine adjustment module is used to adjust the position of the detection unit in the Z-axis direction.

[0014] Further, the detection unit comprises a detection camera, a telecentric lens arranged at the bottom of the detection camera, a shadowless ring light arranged at the bottom of the telecentric lens, and a prism module arranged at the bottom of the shadowless ring light.

[0015] The chip four-side detection device has the following beneficial effects:

[0016] (1) The annular conveying assembly of the device can simultaneously convey multiple chips to be detected in a loop, and then the chip detection assembly above the chips to be detected can capture the images of the four sides of the chips to be detected for detection, so as to reduce the space occupation of the equipment, improve the efficiency of single chip appearance detection, and further improve the production efficiency and reduce the production cost;

[0017] (2) The chip detection assembly of the device can capture the images of the four sides of the chip to be detected for detection, compared with the prior art, four stations need to be set, and one camera is arranged at each station to detect the appearance of the four sides of the chip, which can reduce the space occupation of the equipment, improve the efficiency of single chip appearance detection, and further improve the production efficiency and reduce the production cost;

[0018] (3) The suction cup of the device is arranged on the quick change plate, and the quick change plate and the carrier plate can be detachably connected through the quick screw, so that the suction cup can be replaced according to different chip products, and the device can be compatible with appearance detection of different chip products, the application range of the device is increased, and the practicality of the device is improved;

[0019] (4) The unloading assembly of the device includes a feeding box, a throwing box and an unloading carrying arm, the qualified chips are carried from the unloading position plate to the feeding box by the unloading carrying arm, and the unqualified chips are carried from the unloading position to the throwing box, so that the chips are sorted, the use of the chips in the subsequent process is facilitated, and the practicality of the device is further improved;

[0020] (5) The support frame of the device is arranged on the rack, and at least one detection unit is arranged on the support frame, so that the at least one detection unit is arranged above the detection position through the support frame, when the plurality of movers on the annular conveying system pass through the detection position in turn, the detection unit above the detection position captures the images of the four sides of the chip on the detection position for detection, so as to reduce the space occupation of the equipment, improve the efficiency of single chip appearance detection, further improve the production efficiency and reduce the production cost;

[0021] (6) The device adjusts the position of the Z fine adjustment module in the Y axis direction through the Y direction movement module, so as to adjust the position of the detection unit in the Y axis direction; the Z fine adjustment module can adjust the position of the detection unit in the Z axis direction, so that the device can be compatible with appearance detection of different chip products, the application range of the device is increased, and the practicality of the device is improved;

[0022] (7) The chip detection assembly of the device cooperates with the shadowless ring light and the prism module to clearly present the images of the four sides of the chip on the prism module, so that the detection camera can obtain the images of the four sides of the chip at one time through the telecentric lens, so that the device can realize the detection of the four sides of the chip to be detected at the same time, which can not only reduce the space occupation of the equipment, but also improve the efficiency of single chip appearance detection, further improve the production efficiency, and reduce the production cost. BRIEF DESCRIPTION OF DRAWINGS

[0023] The accompanying drawings, which are incorporated into and form a part of the specification, illustrate embodiments of the present application and, together with the description, serve to explain the principles of the application. In these drawings, like reference numerals are used to represent similar elements.

[0024] Fig. 1 It is a structural schematic view of a chip four-side detection device of an embodiment of the present application.

[0025] Fig. 2 It is a plane schematic view of a chip four-side detection device of an embodiment of the present application.

[0026] Fig. 3 It is a structural schematic view of a ring-shaped conveying assembly of a chip four-side detection device of an embodiment of the present application.

[0027] Fig. 4 It is a structural schematic view of a chip carrier of a chip four-side detection device of an embodiment of the present application.

[0028] Fig. 5 It is a structural schematic view of a chip detection assembly of a chip four-side detection device of an embodiment of the present application.

[0029] Fig. 6 It is a structural schematic view of a detection unit of a chip four-side detection device of an embodiment of the present application.

[0030] In the figure: 1, rack; 2, ring-shaped conveying assembly; 21, ring-shaped conveying system; 211, upper feeding position; 212, lower discharging position; 213, detection position; 22, mover; 23, chip carrier; 231, carrier plate; 232, quick-change plate; 233, suction cup; 234, vacuum pump; 235, quick screw; 3, upper feeding assembly; 31, carrier box; 32, upper feeding carrying arm; 4, lower discharging assembly; 41, discharging box; 42, throwing box; 43, lower discharging carrying arm; 5, chip detection assembly; 51, support frame; 52, detection unit; 521, detection camera; 522, telecentric lens; 523, shadowless ring light; 524, prism module; 53, Y-direction moving module; 54, Z-direction fine adjustment module. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in combination with the drawings in the embodiments of the utility model, and all other embodiments obtained by the ordinary skilled in the art without creative labor based on the embodiments in the utility model belong to the scope of protection of the utility model.

[0032] Please refer to Figs. 1-6 The chip four-side detection device in the embodiments of the utility model comprises a rack 1, a ring-shaped conveying assembly 2, a feeding assembly 3, a discharging assembly 4 and a chip detection assembly 5, wherein the ring-shaped conveying assembly 2, the feeding assembly 3, the discharging assembly 4 and the chip detection assembly 5 are all arranged on the rack 1, so that the ring-shaped conveying assembly 2, the feeding assembly 3, the discharging assembly 4 and the chip detection assembly 5 are supported by the rack 1.

[0033] When the appearance of a single chip is detected, the chip to be detected is placed on the ring-shaped conveying assembly 2 by the feeding assembly 3, so that the ring-shaped conveying assembly 2 conveys the chip to be detected. During the conveying of the chip to be detected by the ring-shaped conveying assembly 2, the chip detection assembly 5 is above the chip to be detected, and the images of the four sides of the chip to be detected are captured for detection. After the chip detection is completed, the chip after detection on the ring-shaped conveying assembly 2 is discharged by the discharging assembly 4, so that the appearance detection of a single chip is completed.

[0034] In the embodiment, the ring-shaped conveying assembly 2 can simultaneously convey multiple chips to be detected in a ring line, and then the chip detection assembly 5 detects the chips to be detected conveyed on the ring-shaped conveying assembly 2 in sequence, so that the efficiency of the appearance detection of a single chip can be improved. Compared with the conventional conveying mode in which a straight line conveying assembly is usually used to simultaneously convey multiple chips to be detected in a straight line, the conveying mode of the ring-shaped conveying assembly 2 can reduce the space occupied by the equipment, thereby improving the production efficiency and reducing the production cost.

[0035] In the embodiment, the chip detection assembly 5 can simultaneously detect the four sides of the chip to be detected. Compared with the prior art in which four stations are arranged and one camera is arranged on each station to detect the appearance of the four sides of the chip, the space occupied by the equipment can be reduced, and the efficiency of the appearance detection of a single chip can be improved, so that the production efficiency is further improved and the production cost is reduced.

[0036] In the embodiment, the annular conveying assembly 2 comprises an annular conveying system 21, a mover 22 and a chip carrier 23, the mover 22 is arranged on the annular conveying system 21, and the chip carrier 23 is arranged on the mover 22. In actual implementation, the annular conveying system 21 is an annular intelligent magnetic driving conveying system, so that the mover 22 on the annular conveying system 21 can be driven to move along the annular conveying system 21.

[0037] When appearance detection of a single chip is performed, the feeding assembly 3 places the chip to be detected on the chip carrier 23, and drives the chip carrier 23 to move along the annular conveying system 21 by driving the mover 22 to move along the annular conveying system 21, so as to drive the chip to move along the annular conveying system 21.

[0038] Specifically, in the embodiment, the chip carrier 23 comprises a carrier plate 231 and a suction assembly, the carrier plate 231 is arranged on the mover 22, and the suction assembly is arranged on the carrier plate 231, so as to be fixedly connected with the mover 22 through the carrier plate 231, and realize installation of the suction assembly on the mover 22.

[0039] When appearance detection of a single chip is performed, the feeding assembly 3 places the chip to be detected on the chip carrier 23, and drives the chip carrier 23 to move along the annular conveying system 21 by driving the mover 22 to move along the annular conveying system 21, so as to drive the chip to move along the annular conveying system 21.

[0040] Further, in the embodiment, the suction assembly comprises a quick-change plate 232, a suction disc 233 and a vacuum pump 234, the quick-change plate 232 and the vacuum pump 234 are arranged on the carrier plate 231, and the suction disc 233 is arranged on the quick-change plate 232, so as to be installed on the carrier plate 231 through connection of the quick-change plate 232 and the carrier plate 231.

[0041] When the vacuum pump 234 operates, a negative pressure area is formed on the suction disc 233, so that when the feeding assembly 3 places the chip to be detected on the suction disc 233, the chip is adsorbed by the negative pressure area to be fixed on the suction disc 233; when the vacuum pump 234 stops operating, the negative pressure area on the suction disc 233 disappears, so that the chip is no longer fixed on the suction disc 233, and the discharging assembly 4 can conveniently discharge the chip on the suction disc 233.

[0042] In the embodiment, the adsorption assembly further comprises a quick screw 235, through which the detachable connection of the quick-change plate 232 and the carrier plate 231 can be realized. Specifically, a through hole is arranged on the quick-change plate 232, and a threaded hole is arranged on the carrier plate 231, and the quick screw 235 is screwed with the threaded hole after penetrating through the through hole, so as to realize the fixed connection of the quick-change plate 232 and the carrier plate 231.

[0043] When the quick screw 235 is screwed out of the threaded hole, the quick-change plate 232 can be detached on the carrier plate 231, so as to facilitate the replacement of the suction cup 233 according to different chip products, and thus the device can be compatible with the appearance detection of different chip products, the application range of the device is increased, and the practicability of the device is improved.

[0044] In the embodiment, the feeding assembly 3 comprises a carrier box 31 and a feeding handling arm 32, and the carrier box 31 and the feeding handling arm 32 are arranged on the rack 1. The carrier box 31 is used for loading the chips to be detected, and the feeding handling arm 32 is used for handling the chips to be detected. An upper feeding position 211 is arranged on the ring-shaped conveying assembly 2, and the feeding handling arm 32 is located between the carrier box 31 and the upper feeding position 211.

[0045] When the mover 22 on the ring-shaped conveying system 21 moves to the upper feeding position 211, the feeding handling arm 32 is used to carry the chips to be detected in the carrier box 31 to the suction cup 233 of the mover 22, and the vacuum pump 234 is started at the same time, so that the negative pressure area formed on the suction cup 233 adsorbs the chips to be detected, thereby realizing the feeding of the chips to be detected on the ring-shaped conveying assembly 2.

[0046] In the present application, when the chip detection assembly 5 detects the chips, there are two results: one is that the chip detection is unqualified, and the other is that the chip detection is qualified, so that after the detection is completed, the chips are divided into qualified chips and unqualified chips.

[0047] In the embodiment, the discharging assembly 4 comprises a discharging box 41, a throwing box 42 and a discharging handling arm 43, and the discharging box 41, the throwing box 42 and the discharging handling arm 43 are arranged on the rack 1. A discharging position 212 is arranged on the ring-shaped conveying assembly 2, and the discharging handling arm 43 is located between the discharging box 41, the throwing box 42 and the discharging position 212.

[0048] When the chip detection is qualified, the mover 22 on the ring-shaped conveying system 21 continues to move and drives the qualified chip to the discharging position 212, and at the same time, the vacuum pump 234 stops running, the negative pressure area on the suction cup 233 disappears, so that the chip is no longer fixed on the suction cup 233, and then the discharging handling arm 43 is used to carry the qualified chip to the discharging box 41.

[0049] When the chip is detected as unqualified, the mover 22 on the ring conveying system 21 continues to move, driving the unqualified chip to the unloading position 212, while the vacuum pump 234 stops running, the negative pressure area on the suction cup 233 disappears, the chip is no longer fixed on the suction cup 233, and the unqualified chip is carried to the material throwing box 42 through the unloading carrying arm 43, so that the chip is sorted, the use of the chip in the subsequent process is facilitated, and the practicability of the device is further enhanced.

[0050] In the embodiment, the chip detection assembly 5 comprises a support frame 51 and at least one detection unit 52, and a detection position 213 is arranged on the ring conveying assembly 2. The support frame 51 is arranged on the rack 1, and the at least one detection unit 52 is arranged on the support frame 51, so that the at least one detection unit 52 is erected above the detection position 213 through the support frame 51.

[0051] When the plurality of movers 22 on the ring conveying system 21 pass through the detection position 213 in turn, the detection unit 52 above the detection position 213 captures the images of the four sides of the chip at the detection position 213 for detection, so that the space occupied by the equipment can be reduced, the efficiency of the appearance detection of a single chip can be improved, the production efficiency can be further improved, and the production cost can be reduced.

[0052] In actual implementation, a plurality of detection units 52 can be arranged on the support frame 51 along the Y-axis direction, so that when the plurality of movers 22 pass through the detection position 213 in turn, the plurality of detection units 52 respectively capture the images of the four sides of the chips on the plurality of movers 22 for detection, so that the efficiency of the appearance detection of a single chip can be further improved.

[0053] In the embodiment, the chip detection unit 52 further comprises a Y-direction moving module 53 and a Z-direction fine adjustment module 54. The Y-direction moving module 53 is arranged on the support frame 51, the Z-direction fine adjustment module 54 is arranged on the Y-direction moving module 53, and the detection unit 52 is arranged on the Z-direction fine adjustment module 54.

[0054] When the appearance of the chip is detected, the position of the Z-direction fine adjustment module 54 in the Y-axis direction can be adjusted through the Y-direction moving module 53, so that the position of the detection unit 52 in the Y-axis direction is adjusted; the position of the detection unit 52 in the Z-axis direction can be accurately adjusted through the Z-direction fine adjustment module 54, so that the device can be compatible with the appearance detection of different chip products, the application range of the device is increased, and the practicability of the device is improved.

[0055] Specifically, in actual implementation, a sliding rail can be arranged on the support frame 51 along the Y-axis direction, the Y-direction moving module 53 includes a sliding block in sliding connection with the sliding rail, and a linear motor for driving the sliding block to move on the sliding rail, and the Z-direction fine adjustment module 54 is fixedly installed on the sliding block, so that the Z-direction fine adjustment module 54 is driven to move along the Y-axis direction through the back-and-forth movement of the sliding block on the sliding rail, and the plurality of detection units 52 are driven to move along the Y-axis direction, thereby realizing the adjustment of the positions of the plurality of detection units 52 along the Y-axis direction.

[0056] Specifically, the Z-direction fine adjustment module 54 can be a plurality of micro-adjustment sliding platforms fixedly installed on the sliding block along the Z-axis direction, and one detection unit 52 is fixedly installed on each micro-adjustment sliding platform, so that the positions of the plurality of detection units 52 along the Z-axis direction are precisely adjusted through the plurality of micro-adjustment sliding platforms.

[0057] In the embodiment, the detection unit 52 includes a detection camera 521, a telecentric lens 522, a shadowless ring light 523, and a prism module 524, the telecentric lens 522 is arranged at the bottom of the detection camera 521, the shadowless ring light 523 is arranged at the bottom of the telecentric lens 522, and the prism module 524 is arranged at the bottom of the shadowless ring light 523.

[0058] The telecentric lens 522 can effectively reduce or eliminate lens distortion, and keep the accuracy and authenticity of imaging; the shadowless ring light 523 can eliminate the shadow generated by the light source on the shooting object, and ensure that the shooting object will not have obvious shadow area under the light, thereby improving the accuracy and consistency of shooting; and the prism module 524 is mainly used for light refraction and separation, and can separate light of different wavelengths or change the propagation direction of light.

[0059] Therefore, the detection unit 52 can clearly present the images of the four sides of the chip on the prism module 524 through the cooperation of the shadowless ring light 523 and the prism module 524, so that the detection camera 521 can obtain the images of the four sides of the chip through the telecentric lens 522 at one time for detection, thereby enabling the device to simultaneously detect the four sides of the chip to be detected, which can not only reduce the space occupation of the equipment, but also improve the efficiency of single-chip appearance detection, further improve the production efficiency, and reduce the production cost.

[0060] The above-described content can be implemented alone or in various combinations, and these variants are within the protection scope of the present application.

[0061] It is to be noted that, in the present text, relational terms such as first and second and the like can be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can also include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element preceded by "comprises... a" does not, without more constraints, foreclose the existence of additional identical elements in the process, method, article, or apparatus that comprises the element.

[0062] Finally, it should be noted that the above embodiments are merely used to illustrate the technical solutions of the present application, rather than limiting it. Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacements for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A chip four-sided inspection device, characterized in that: It includes a ring transport assembly (2), a loading assembly (3), a unloading assembly (4), and a chip detection assembly (5). The loading assembly (3) is used to place the chip on the ring transport assembly (2). The ring transport assembly (2) is used to transport the chip. The chip detection assembly (5) is located above the chip transported by the ring transport assembly (2) and is used to capture images of the four sides of the chip for detection at the same time. The unloading assembly (4) is used to unload the chip on the ring transport assembly (2).

2. The chip four-sided inspection device as described in claim 1, characterized in that: The annular transport assembly (2) includes an annular transport system (21), a mover (22) disposed on the annular transport system (21), and a chip carrier (23) disposed on the mover (22). The chip carrier (23) is used to place a chip, and the mover (22) is used to drive the chip carrier (23) to move along the annular transport system (21).

3. The chip four-sided inspection device as described in claim 2, characterized in that: The chip carrier (23) includes a carrier plate (231) disposed on the mover (22) and an adsorption assembly disposed on the carrier plate (231). The carrier plate (231) is used to mount the adsorption assembly on the mover (22), and the adsorption assembly is used to place the chip.

4. The chip four-sided inspection device as described in claim 3, characterized in that: The adsorption assembly includes a quick-change plate (232) disposed on the carrier plate (231), a suction cup (233) disposed on the quick-change plate (232), and a vacuum pump (234) disposed on the carrier plate (231). The quick-change plate (232) is used to mount the suction cup (233) on the carrier plate (231), and the vacuum pump (234) is used to form a negative pressure zone on the suction cup (233). The negative pressure zone is used to adsorb the chip.

5. The chip four-sided inspection device as described in claim 4, characterized in that: The adsorption assembly also includes a quick-release screw (235) that detachably connects the quick-change plate (232) and the carrier plate (231). The quick-change plate (232) has a through hole, and the carrier plate (231) has a threaded hole. One end of the quick-release screw (235) passes through the through hole and is screwed into the threaded hole.

6. The chip four-sided inspection device as described in claim 1, characterized in that: The annular transport assembly (2) is provided with a loading position (211). The loading assembly (3) includes a material carrier (31) and a loading and handling arm (32) located between the material carrier (31) and the loading position (211). The material carrier (31) is used to load the chip to be tested, and the loading and handling arm (32) is used to transport the chip to be tested in the material carrier (31) to the loading position (211).

7. The chip four-sided inspection device as described in claim 1, characterized in that: The annular transport assembly (2) is provided with a feeding position (212). The feeding assembly (4) includes a feeding box (41) and a throwing box (42), as well as a feeding and handling arm (43) disposed between the feeding box (41), the throwing box (42) and the feeding position (212). The feeding and handling arm (43) is used to transport qualified chips from the feeding position (212) to the feeding box (41) and to transport unqualified chips from the feeding position (212) to the throwing box (42).

8. The chip four-sided inspection device as described in claim 1, characterized in that: The annular transport assembly (2) is provided with a detection position (213). The chip detection assembly (5) includes a support frame (51) and at least one detection unit (52) disposed on the support frame (51). The support frame (51) is used to mount the detection unit (52) above the detection position (213). The detection unit (52) is used to simultaneously capture images of the four sides of the chip located at the detection position (213) for detection.

9. The chip four-sided inspection device as described in claim 8, characterized in that: The chip detection assembly (5) further includes a Y-axis moving module (53) disposed on the support frame (51) and a Z-axis fine adjustment module (54) disposed on the Y-axis moving module (53). The detection unit (52) is disposed on the Z-axis fine adjustment module (54). The Y-axis moving module (53) is used to adjust the position of the detection unit (52) in the Y-axis direction, and the Z-axis fine adjustment module (54) is used to adjust the position of the detection unit (52) in the Z-axis direction.

10. A chip four-sided inspection device as described in claim 8, characterized in that: The detection unit (52) includes a detection camera (521), a telecentric lens (522) located at the bottom of the detection camera (521), a shadowless ring light (523) located at the bottom of the telecentric lens (522), and a prism module (524) located at the bottom of the shadowless ring light (523).

Images