Electronic circuit differential signal observation leading-out connection structure
The differential signal observation lead-out connection structure of electronic circuits, which is connected by pin headers and double-sided adhesive or hot melt adhesive, solves the problems of low efficiency and poor compatibility of traditional testing methods, improves signal stability and compatibility, and reduces costs while providing vibration protection.
Patent Information
- Application Number
- CN202422948477.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-29
- Publication Date
- 2025-11-18
- Estimated Expiration
- 2034-11-29
AI Technical Summary
Traditional manual testing methods are inefficient, robotic arm operations can easily cause displacement of the probe and the signal node under test, and existing oscilloscope connectors have poor compatibility and are expensive.
The differential signal observation lead-out connection structure of the electronic circuit is connected by pin headers and double-sided sponge tape or hot melt adhesive. The pin headers are soldered to the measurement points through wires, and the wires are soldered to the pins. The probes are fixed to the motherboard under test using double-sided sponge tape or hot melt adhesive, which limits the large displacement between the probe and the motherboard and increases stability.
It improves signal stability, expands the compatibility of measuring instruments, frees up manpower, reduces costs, and provides vibration protection during testing.
Smart Images
Figure CN223565741U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of circuit test measurement, and in particular to an electronic circuit differential signal observation lead-out connection structure. BACKGROUND
[0002] An oscilloscope is often used to observe the waveform of a differential signal in the process of integrated circuit verification, debugging, testing, etc. During measurement, an experimenter needs to hold an oscilloscope probe, and make the probe on the probe in contact with the signal node to be measured on a circuit board, while operating the circuit board to be measured and various instruments to observe signals and count data.
[0003] The traditional manual testing method wastes manpower and is inefficient. If a mechanical arm is used to fix the relative position of the oscilloscope probe and the circuit to be measured, the probe and the signal node to be measured are likely to be displaced relative to each other in the process of operating the instruments and the circuit board to be measured, resulting in testing failure. Some probe-specific connectors are provided by some oscilloscope manufacturers, which can be directly welded on any measurement point of the main board, but have poor compatibility and are expensive. NOVELTY CONTENT
[0004] To solve or alleviate at least one problem mentioned in the background, the present application provides an electronic circuit differential signal observation lead-out connection structure.
[0005] The electronic circuit differential signal observation lead-out connection structure provided by the embodiments of the present application comprises:
[0006] A pin array, comprising pins, one end of each pin being used for connecting to a probe of a measuring instrument, the pin array being connected to a main board to be measured by sponge double-sided adhesive or hot melt adhesive;
[0007] A wire, one end of the wire being welded to the other end of the pin, the other end of the wire being used for welding to a measurement point on the main board to be measured.
[0008] In at least one embodiment, the sponge double-sided adhesive is at least partially located between the pin array and the main board to be measured.
[0009] In at least one embodiment, the thickness of the sponge double-sided adhesive is not less than 1 mm.
[0010] In at least one embodiment, the pin array comprises two pins, the wire comprises a first wire and a second wire respectively welded to the two pins, and the first wire and the second wire are constructed into a twisted pair.
[0011] In at least one embodiment, the pin array comprises an insulating block, a plurality of pins are fixed to the insulating block, and the other ends of the plurality of pins are bent and located in the same plane.
[0012] In at least one embodiment, an insulating layer is arranged outside the wire.
[0013] In at least one embodiment, the row pin comprises four insertion pins arranged in an array.
[0014] In at least one embodiment, the row pin is a patch row pin.
[0015] In at least one embodiment, one end of the wire is wound and welded to the other end of the insertion pin.
[0016] In at least one embodiment, a measuring instrument is included, and one end of the insertion pin is connected to a probe of the measuring instrument.
[0017] The wire of the present application is welded to the measurement point, ensuring good contact and improving signal stability. The wire is welded to the insertion pin in the row pin, allowing the probe of the measuring instrument to be connected to the wire through a standard row pin, thereby expanding compatibility. The form of the row pin connected to the mainboard to be measured can limit the large displacement between the probe of the measuring instrument and the mainboard to be measured, thereby increasing stability. BRIEF DESCRIPTION OF DRAWINGS
[0018] Figure 1 A schematic diagram of a twisted pair reconstruction is shown.
[0019] Figure 2 A schematic diagram of an electronic circuit differential signal observation lead-out connection structure according to an embodiment of the present application is shown.
[0020] Figure 3 A schematic diagram of a row pin according to an embodiment of the present application is shown.
[0021] Figure 4 A schematic diagram of a reconstructed twisted pair combined with a row pin according to an embodiment of the present application is shown.
[0022] Figure 5 A schematic diagram of a twisted pair with one end welded to a row pin according to an embodiment of the present application is shown.
[0023] Figure 6 A schematic diagram of a row pin pasted with sponge double-sided tape according to an embodiment of the present application is shown.
[0024] Figure 7 A schematic diagram of a sponge double-sided tape pasted to a mainboard to be measured, and a wire welded to a measurement point according to an embodiment of the present application is shown.
[0025] Figure 8 A schematic diagram of a use scenario of an electronic circuit differential signal observation lead-out connection structure according to an embodiment of the present application is shown.
[0026] REFERENCE SIGNS
[0027] 100 pin
[0028] 110 pin
[0029] 120 insulation block
[0030] 200 mainboard to be measured
[0031] 210 measuring point
[0032] 300 wire
[0033] 301 first wire
[0034] 302 second wire
[0035] 400 sponge double-sided tape
[0036] 500 probe
[0037] 600 solder DETAILED DESCRIPTION
[0038] The exemplary embodiments of the present application are described below with reference to the accompanying drawings. It should be understood that the specific description is only for teaching the person skilled in the art how to implement the present application, and is not intended to exhaust all possible ways of the present application, nor to limit the scope of the present application.
[0039] The electronic circuit differential signal observation lead-out connection structure (hereinafter, sometimes referred to as "connection structure") is provided in the embodiments of the present application.
[0040] Referring to Figure 2 , Figure 7 , Figure 8 , the electronic circuit differential signal observation lead-out connection structure can include a pin 100, a mainboard 200 to be measured, and a wire 300. The pin 100 can include a pin 110, one end of which is used to be connected to a probe 500 of a measuring instrument, and the other end is soldered to the wire 300. The other end of the wire 300 is used to be soldered to a measuring point 210 on the mainboard 200 to be measured. Among them, the measuring instrument can be an oscilloscope, and the probe 500 can be a differential probe of the oscilloscope. The measuring point 210 can be located on the top layer or the bottom layer of the mainboard 200 to be measured, and the measuring point 210 can be a measuring point of a differential circuit.
[0041] In the present application, the plug-in form between the probe 500 and the pin 100 is a common form of circuit connection, that is, the connection structure provided in the present application can be compatible with a plurality of probes with conventional specifications. At the same time, the wire 300 is soldered to the measuring point 210, which ensures good contact and improves signal stability.
[0042] In addition, the pin 100 is also connected to the to-be-tested mainboard 200 through the sponge double-sided adhesive tape 400 or the hot melt adhesive. The connection position of the pin 100 and the to-be-tested mainboard 200 can be close to the measurement point 210. It should be understood that when the pin 100 is not connected to the to-be-tested mainboard 200, if a large displacement occurs between the probe 500 and the to-be-tested mainboard 200, the solder joint formed by the lead 300 and the measurement point 210 will be directly pulled, which is easy to cause damage. The form that the pin 100 is connected to the to-be-tested mainboard 200 proposed in the present application can limit the large displacement between the probe 500 and the to-be-tested mainboard 200, and increase the stability.
[0043] In addition, after assembly, it is not necessary to hold by hand, which liberates manpower and improves work efficiency. The raw material for manufacturing the connection structure is easy to obtain, and the cost is relatively low.
[0044] In the embodiment in which the pin 100 is connected to the to-be-tested mainboard 200 through the sponge double-sided adhesive tape 400, the sponge double-sided adhesive tape 400 is at least partially located between the pin 100 and the to-be-tested mainboard 200, and the upper and lower surfaces of the sponge double-sided adhesive tape 400 have a certain degree of freedom, so that the solder joint formed by the lead 300 and the measurement point 210 has a certain degree of freedom with the pin 100, which plays a role in resisting vibration. For example, during the test, the to-be-tested mainboard 200 may vibrate due to actions such as plugging and unplugging a graphics card, and the probe 500 is held by a mechanical arm and is relatively immobile. At this time, the freedom between the measurement point 210 and the pin 100 means that the probe 500 can move relative to the to-be-tested mainboard 200, avoiding rigid damage. Moreover, after the test is completed, the pin 100 needs to be removed, and the sponge double-sided adhesive tape 400 also has the advantage of being easy to remove.
[0045] Further, the thickness of the sponge double-sided adhesive tape 400 can be not less than 1 mm. The applicant finds that the sponge double-sided adhesive tape 400 is too thin, which increases rigidity, and the thickness can be controlled in the range of not less than 1 mm.
[0046] In the embodiment in which the pin 100 is connected to the to-be-tested mainboard 200 through the hot melt adhesive, the fixed form of the hot melt adhesive is more stable, and also plays a role in limiting the large displacement between the probe 500 and the to-be-tested mainboard 200.
[0047] In an embodiment of the present application, the pin 100 can include two pins 110, and the lead 300 includes a first lead 301 and a second lead 302 respectively welded to the two pins 110, and the first lead 301 and the second lead 302 are constructed into a twisted pair. The twisted pair provides the effect of a differential line for signal transmission, reducing the interference received by the signal in the transmission process.
[0048] Further, an insulating layer is provided outside the lead 300. It can be understood that when the lead 300 is welded with the pin 110 and the measurement point 210, a section of the insulating layer can be peeled off, and then welded.
[0049] Further, the pin strip 100 can include four pins 110 arranged in an array. Exemplarily, the pin strip 100 can be a 2.54 mm pitch, 2x2 arranged pogo pin strip, and the pins can be bent relative to the head. The 2x2 array structure is more stable, and of course, other models of pin strips 100 can be selected.
[0050] Further, referring to Figure 4 , the pin strip 100 includes an insulating block 120, and the plurality of pins 110 are fixed to the insulating block 120, and the other ends of the plurality of pins 110 are bent and located in the same plane. On one side of the insulating block 120, one end of the wire 300 is wound and welded to the other end of the pin 110.
[0051] In one embodiment, the electronic circuit differential signal observation lead-out connection structure includes a measuring instrument, and one end of the pin 110 is connected to a probe 500 of the measuring instrument.
[0052] In the following, a specific embodiment is also provided.
[0053] In an experiment of studying the correlation between the power plane noise of a certain system and the behavior of the system, an oscilloscope is used to observe the voltage waveform on the differential feedback line of the power supply. The measurement point 210 is a pair of pins of a 0402 packaged pogo resistor.
[0054] First step: Select the pin strip 100. Taking a 2.54 mm pitch pin strip 100 as an example, a 2x2 specification pogo pin strip is selected, as shown in Figure 3 .
[0055] Second step: Reconstruct the twisted pair wire. Select two wires 300 (first wire 301, second wire 302) about 3 cm long, and twist them together. Strip about 3 mm of the insulation layer of the two wire ends at one end of the twisted pair wire; strip about 1 cm of the insulation layer of the two wire ends at the other end, and wrap them around the two pins of the pogo pin strip 100, as shown in Figure 1 , Figure 4 .
[0056] Third step: Weld the pin strip 100 and the wire 300. Use a soldering iron to melt the solder 600 at the pin where the wire 300 is wrapped, so that the wire 300 and the pin 100 are firmly soldered together, as shown in Figure 5 .
[0057] Fourth step: Paste the sponge double-sided tape 400. Paste the pin strip 100 on the upper surface of the sponge double-sided tape 400, as shown in Figure 6 .
[0058] Fifth step: fixing the connecting structure. The bottom of the sponge double-sided tape 400 is pasted to the measuring point 210 of the mainboard 200 to be measured, and the 3mm bare wire joints of the twisted pair are welded on the measuring point 210, as shown in Figure 7
[0059] Sixth step: connecting the probe 500 with the connecting structure of the needle 100, as shown in Figure 8 The probe 500 can also be fixed by a mechanical arm, or properly placed on the circuit board to be measured.
[0060] The application of the differential signal observation lead-out connecting structure can be realized by the above-described operation.
[0061] The above is the preferred embodiment of the present application. It should be pointed out that, for those skilled in the art, without departing from the principles of the present application, a number of improvements and refinements can be made, which should also be considered as the protection scope of the present application.
Claims
1. An electronic circuit differential signal observation extraction connection structure characterized by comprising: The utility model relates to a kind of test fixture for measuring the mainboard of computer, including: Pin, the mainboard to be measured, the pin includes pin, one end of the pin is used to connect the probe of measuring instrument, the pin is connected to the mainboard to be measured by sponge double-sided adhesive tape or hot melt adhesive; Wire, one end of the wire is welded to the other end of the pin, the other end of the wire is used to be welded to the measuring point on the mainboard to be measured.
2. The electronic circuit differential signal observation pull-out connection structure according to claim 1, characterized by, The sponge double-sided adhesive tape is at least partially located between the pin and the mainboard to be measured.
3. The electronic circuit differential signal observation pull-out connection structure according to claim 2, characterized by, The thickness of the sponge double-sided adhesive tape is not less than 1mm.
4. The electronic circuit differential signal observation pull-out connection structure according to claim 1, characterized by, The pin includes two pins, the wire includes first wire and second wire respectively welded to the two pins, and the first wire and the second wire are constructed into a twisted pair.
5. The electronic circuit differential signal observation pull-out connection structure according to claim 1, characterized by, The pin includes an insulating block, and a plurality of pins are fixed to the insulating block. The other ends of the plurality of pins are bent and located in the same plane.
6. The electronic circuit differential signal observation pull-out connection structure according to claim 1, characterized by, The wire is provided with an insulating layer outside.
7. The electronic circuit differential signal observation pull-out connection structure according to claim 1, characterized by, The pin includes four pins arranged in an array.
8. The electronic circuit differential signal observation pull-out connection structure according to claim 1, characterized by, The pin is a patch pin.
9. The electronic circuit differential signal observation pull-out connection structure according to claim 1, characterized by, One end of the wire is wound and welded to the other end of the pin.
10. The electronic circuit differential signal observation pull-out connection structure according to claim 1, characterized by, The utility model relates to a kind of test fixture for measuring the mainboard of computer, including: Pin, the mainboard to be measured, the pin includes pin, one end of the pin is used to connect the probe of measuring instrument.