Chip test system

Abstract

The utility model discloses a chip test system, which comprises a control device, a signal output device, a chip bearing device, a signal transmission device and a signal receiving and processing device, and is characterized in that the control device can control the chip bearing device to move a target chip to a first target position; second control information is sent to the signal output equipment to output an initial electric signal, so that the target chip emits light, the signal output equipment collects a target optical signal output by the target chip and transmits the target optical signal to the signal receiving and processing equipment, and the target optical signal is processed to obtain a target electric signal; and comparing the target electric signal with the initial electric signal to obtain a test result of the target chip. According to the chip test system provided by the invention, the performance of the target chip can be fully automatically tested, manual participation is not needed in the whole process, and the work of each device is accurately controlled through the control instruction, so that the test efficiency can be improved, and the test accuracy can also be improved.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of chip testing, in particular to a chip testing system. BACKGROUND

[0002] With the deepening of the research and the expansion of the application demand of the Vertical-Cavity Surface-Emitting Laser (VCSEL), the VCSEL plays an increasingly important role in the communication field such as big data center and supercomputer, especially in short distance transmission link.

[0003] In the field of optical communication, the performance of semiconductor lasers is very important. In the process of scientific research and production, it is found that the performance of different chips often has great difference. At present, the performance of each chip is mainly tested by manual and semi-automatic testing system, and the testing speed and testing accuracy are difficult to guarantee. UTILITY MODEL CONTENT

[0004] In view of the above defects or deficiencies in the prior art, it is desirable to provide a new chip testing system.

[0005] The present application provides a chip testing system, which comprises a control device, a signal output device, a chip carrying device, a signal transmission device and a signal receiving and processing device, wherein the control device is in communication connection with the signal output device, the chip carrying device, the signal transmission device and the signal receiving and processing device respectively;

[0006] The input end of the signal transmission device is arranged on the light path of the light emitted by the target chip based on the initial electrical signal output by the signal output device, and the output end of the signal transmission device is connected with the signal receiving and processing device;

[0007] The control device is configured to send a first control signal to the chip carrying device, wherein the first control signal carries the coordinates of the target chip;

[0008] The chip carrying device is configured to receive the first control signal sent by the control device, move the target chip to a first target position based on the coordinates of the target chip, and send a feedback signal to the control device;

[0009] The control device is configured to send a second control signal to the signal output device in response to the feedback signal;

[0010] The signal output device is configured to receive the second control signal sent by the control device, and output an initial electrical signal to the target chip;

[0011] The signal transmission device is configured to, in the case that the target chip emits light based on the initial electrical signal, collect a target optical signal output by the target chip, and transmit the target optical signal to the signal receiving and processing device.

[0012] The signal receiving and processing device is configured to perform photoelectric conversion processing on the target optical signal to obtain a target electrical signal, compare the target electrical signal with the initial electrical signal, and determine a test result of the target chip based on a comparison result.

[0013] In an optional embodiment, the signal output device comprises a signal transmitter, a probe, and a fixing device, the signal transmitter is connected to the probe through a connecting line, and the fixing device fixes the probe at a position corresponding to the first target position.

[0014] In an optional embodiment, the probe comprises a needle tip and a probe arm, the needle tip is inserted into the probe arm, one end of the probe arm away from the needle tip is connected to the signal transmitter through a connecting line, and an outer wall of the probe arm close to the needle tip is connected to the fixing device.

[0015] In an optional embodiment, the chip carrying device comprises a chip carrier and a first position adjusting device, a plurality of chips are placed on a first surface of the chip carrier, and the first position adjusting device is installed on a second surface of the chip carrier opposite to the first surface.

[0016] The first position adjusting device is configured to receive the first control signal sent by the control device, move the target chip placed on the first surface of the chip carrier to the first target position based on the coordinates of the target chip, and send a feedback signal to the control device.

[0017] In an optional embodiment, the signal transmission device comprises an optical fiber, an optical power device, and a second position adjusting device, the optical power device and the second position adjusting device are respectively connected to the control device in communication, an input end of the optical fiber is connected to the second position adjusting device, and an output end of the optical fiber is connected to the optical power device through the signal receiving and processing device.

[0018] The second position adjusting device is configured to receive a fifth control signal sent by the control device, and move the input end of the optical fiber to a light path on which the target chip emits light based on the initial electrical signal.

[0019] In an optional embodiment, the control device is further configured to receive a test requirement, parse the test requirement to obtain an identifier of the target chip, and match the identifier of the target chip with a coordinate information table to obtain coordinates of the target chip, the coordinate information table including identifiers of all chips placed on the chip carrier device and coordinates corresponding to each chip identifier.

[0020] In an optional embodiment, the signal receiving processing device includes a switching sub-device and a plurality of test sub-devices, an output end of the signal transmission device is connected to the switching sub-device, and the plurality of test sub-devices are respectively connected to different interfaces of the switching sub-device.

[0021] The control device is further configured to determine a target test sub-device from the plurality of test sub-devices according to the test requirement, and send a sixth control signal to the switching sub-device.

[0022] The switching sub-device is configured to receive the sixth control signal sent by the control device, connect an interface connected to the target test sub-device, and form a path between the signal transmission device and the target test sub-device.

[0023] In an optional embodiment, the switching sub-device is an adjustable optical switch.

[0024] In an optional embodiment, the chip carrier device is specifically configured to parse the first control signal to obtain coordinates of the target chip.

[0025] The chip carrier device is further configured to move the target chip horizontally and in a direction close to an output end of the signal output device to the first target position based on the coordinates of the target chip and the position of the output end of the signal output device.

[0026] In an optional embodiment, the control device is further configured to send a third control signal to the signal transmission device.

[0027] The signal transmission device is further configured to receive the third control signal sent by the control device, move to collect a plurality of different optical signals on an optical path on which the target chip emits light based on the initial electrical signal, and transmit the plurality of optical signals to the control device.

[0028] The control device is further configured to receive the plurality of optical signals sent by the signal transmission device, determine a second target position corresponding to an optical signal with the largest power, and send a fourth control signal to the signal transmission device.

[0029] The signal transmission device is further configured to receive the fourth control signal sent by the control device, and move to the second target position to collect the target optical signal output by the target chip.

[0030] The test system for a chip provided in the application considers that the test for the performance of a chip currently stays in a manual or semi-automatic test stage, which makes it difficult to guarantee the test speed and test accuracy. The test system for a chip provided in the application includes a control device, a signal output device, a chip carrying device, a signal transmission device, and a signal receiving and processing device. The control device can send a first control signal to the chip carrying device, so that the chip carrying device moves a target chip to a first target position based on the coordinates of the target chip carried in the first control signal. After moving the target chip to the first target position, the chip carrying device sends a feedback signal to the control device. The control device sends a second control signal to the signal output device in response to the feedback signal, so that the signal output device outputs an initial electrical signal to the target chip under the control of the second control signal. The target chip emits light based on the initial electrical signal. The signal output device collects the target optical signal output by the target chip and transmits the target optical signal to the signal receiving and processing device. The signal receiving and processing device performs photoelectric conversion processing on the received target optical signal to obtain a target electrical signal, and compares the target electrical signal with the initial electrical signal. According to the comparison result, the test result of the target chip can be determined. The test system for a chip provided in the application can automatically test the performance of the target chip, and the whole process does not need human intervention. The work of each device is precisely controlled through control instructions, which not only improves the test efficiency, but also improves the test accuracy. BRIEF DESCRIPTION OF DRAWINGS

[0031] Other characteristics, objects and advantages of the application will become more apparent after reading the following detailed description of non-limiting embodiments, made with reference to the accompanying drawings:

[0032] Figure 1 A structural schematic diagram of a test system for a chip provided in the application;

[0033] Figure 2 A step flowchart of a test method for a chip provided in the application;

[0034] Figure 3 A structural schematic diagram of a chip carrying device provided in the application;

[0035] Figure 4 A structural schematic diagram of a signal output device provided in the application;

[0036] Figure 5 A structural schematic diagram of a signal transmission device provided in the application;

[0037] Figure 6 Another step flow chart of a chip testing method provided by the present application is provided as follows:

[0038] Figure 7 A structure schematic diagram of a signal receiving processing device provided by the present application is provided as follows:

[0039] Figure 8 A structure schematic diagram of a computer system of a control device provided by the present application is provided as follows.

[0040] Explanation of reference signs:

[0041] 1000, test system;

[0042] 10, control device; 20, signal output device; 30, chip carrying device; 40, signal transmission device; 50, signal receiving processing device; 60, target chip;

[0043] 201, signal transmitter; 202, probe; 203, fixing device;

[0044] 301, chip carrier; 302, first position adjusting device;

[0045] 401, optical fiber; 402, optical power device; 403, second position adjusting device;

[0046] 501, switching sub-device; 502, test sub-device. DETAILED DESCRIPTION

[0047] The present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the related application, but not to limit the application. In addition, it should be noted that only the parts related to the application are shown in the drawings for the convenience of description.

[0048] With the deepening of the research and the expansion of the application demand of the Vertical-Cavity Surface-Emitting Laser (VCSEL), the VCSEL plays an increasingly important role in the communication field such as large data center and supercomputer, especially in the short distance transmission link.

[0049] In the field of optical communication, the performance of semiconductor laser is very important. In the process of scientific research and production, it is found that the performance of different chips often has great difference. At present, the performance of each chip is mainly tested by manual and semi-automatic test system, and the test speed and test precision are difficult to guarantee. Therefore, a new test system is urgently needed to test the performance of the chip.

[0050] Please refer toFigure 1 , Figure 1 A chip testing system 1000 is provided in the present application, which comprises a control device 10, a signal output device 20, a chip bearing device 30, a signal transmission device 40 and a signal receiving and processing device 50.

[0051] The control device 10 can be a device with a CPU module, an input module, an output module, a communication module and the like.

[0052] The CPU module of the control device 10 is the core module of the control device 10, which is mainly responsible for processing input signals, executing program instructions, controlling output signals, and providing monitoring and diagnostic functions. The CPU module usually includes a central processor, a memory and a communication interface and the like.

[0053] The input module of the control device 10 is used to collect external signals, such as sensor signals, button signals, switch signals and the like.

[0054] The output module of the control device 10 is used to control external devices. The communication module of the control device 10 is used to realize data communication between the control device 10 and other devices. The control device 10 establishes a communication connection with the signal output device 20, the chip bearing device 30, the signal transmission device 40 and the signal receiving and processing device 50 through the communication module.

[0055] The control device 10 can send control instructions to other devices based on the above-mentioned function modules, and can receive signals, data and the like sent by other devices. The control device 10 is, for example, a host computer, a computer device, a server, a controller and the like.

[0056] The control device 10 may, for example, also include a display module, a storage module, a power module, a bus module and the like, which will not be described here.

[0057] The signal output device 20 is used to output electrical signals to the chip, so that the chip emits light under the action of the electrical signals. The signal output device 20 is, for example, a combination of a signal transmitter and a signal line, a combination of a fixing device 203 and a probe 202 and the like.

[0058] The chip bearing device 30 is used to bear the chip, that is, each chip that needs to be tested can be placed on the chip bearing device 30, and in addition, the chip bearing device 30 can also move up and down and left and right according to the corresponding control signal. The chip bearing device 30 may, for example, include a carrier, a multi-axis drive motor and a movable slide rail and the like.

[0059] The signal transmission device 40 is configured to collect the optical signal emitted by the chip based on the electrical signal and transmit the optical signal to the signal receiving and processing device 50. The signal transmission device 40 includes, for example, an optical fiber 401 and a second position adjusting device 403.

[0060] The signal receiving and processing device 50 is configured to perform photoelectric conversion on the received optical signal to obtain an electrical signal. The signal receiving and processing device 50 includes, for example, a photoelectric converter and a signal analyzer. The signal analyzer can be at least one of a vector network analyzer, a bit error rate analyzer, a spectrum analyzer, etc. according to different functions.

[0061] Based on the above introduction to the structure of the test system 1000, the process of testing the chip by the test system 1000 will be described below, as shown in FIG. 2, including the following steps: Figure 2

[0062] In step S201, the control device 10 sends a first control signal to the chip carrying device 30, and the first control signal carries the coordinates of the target chip 60.

[0063] The control device 10 can send the first control signal to the chip carrying device 30 through the communication module. The first control signal is used to instruct the chip carrying device 30 to move the target chip 60 to a specified position. Since the chip carrying device 30 carries a plurality of chips, the first control signal carries the coordinates of the target chip 60, so that the chip carrying device 30 can obtain the coordinates of the target chip 60 by analyzing the first control signal after receiving the first control signal sent by the control device 10, and determine the target chip 60 from the plurality of chips according to the coordinates of the target chip 60, and move the target chip 60 to the specified position.

[0064] The target chip 60 is any one of the plurality of chips placed on the chip carrying device 30 that needs to be tested. The target chip 60 can be a chip specified by a test personnel. When the test personnel determines that the target chip 60 needs to be tested, the test personnel can input a corresponding test requirement to the control device 10 through the input module of the control device 10. The test requirement carries a unique mark, number, coordinates, etc. of the target chip 60. When the control device 10 receives the test requirement, the control device 10 can directly or indirectly obtain the coordinates of the target chip 60 by analyzing the test requirement, and generate a corresponding first control signal based on the coordinates of the target chip 60 and send the first control signal to the chip carrying device 30.

[0065] It should be noted that the first control signal can also carry a unique identifier of the chip carrying device 30, so that the control device 10 can accurately send the first control signal to the corresponding chip carrying device 30.

[0066] ​Exemplarily, the coordinates of the target chip 60 can be a three-dimensional coordinate or a two-dimensional coordinate, which is not limited in the present application.

[0067] In step S202, the chip carrying device 30 moves the target chip 60 to the first target position based on the coordinates of the target chip 60, and sends a feedback signal to the control device 10.

[0068] The chip carrying device 30 can include multiple chip carrying devices 30, which can be in communication connection with the control device 10 to accept the control of the control device 10. Each chip carrying device 30 has a unique identifier corresponding to itself, which is convenient for the control device 10 to identify and communicate. When the chip carrying device 30 carrying the target chip 60 receives the first control signal sent by the control device 10 through the receiver or the communication module thereon, the chip carrying device 30 can analyze the first control signal to obtain the coordinates of the target chip 60.

[0069] Since the test system 1000 provided by the present application is used to test the performance of the chip, when the chip carrying device 30 obtains the coordinates of the target chip 60, it can be determined that the performance of the target chip 60 needs to be tested at present, and then the target chip 60 needs to be moved to a position where the initial electrical signal output by the signal output device 20 can be received. In order to facilitate description, this position is referred to as the first target position.

[0070] When the chip carrying device 30 moves the target chip 60 to the first target position, a corresponding feedback signal can be generated to send the feedback signal to the control device 10, so that the control device 10 determines that the target chip 60 has been moved to the first target position through the feedback signal. That is, the target chip 60 has been moved to a position in contact with the signal output device 20, and the two are in a connected state.

[0071] In an optional embodiment, as shown in Figure 3 The chip carrying device 30 includes a chip carrier 301 and a first position adjusting device 302. A plurality of chips are placed on the first surface of the chip carrier 301, and the first position adjusting device 302 is installed on the second surface of the chip carrier 301 opposite to the first surface.

[0072] The first position adjusting device 302 moves the target chip 60 placed on the first surface of the chip carrier 301 to the first target position based on the coordinates of the target chip 60 in response to the first control signal, and sends a feedback signal to the control device 10.

[0073] The structure of the chip carrier 301 is, for example, circular, square, rectangular, etc. In order to avoid interference when testing the chips carried thereon, the material of the chip carrier 301 is mostly metal.

[0074] The first position adjusting device 302 is configured to move the target chip 60 to the first target position according to the first control signal. The first position adjusting device 302 can be a communication module capable of communicating with the communication module of the control device 10, receiving the first control signal sent by the control device 10, and moving the target chip 60 on the chip carrier 301 to the first target position based on the first control signal.

[0075] In an optional embodiment, the chip carrying device 30 can move the target chip 60 to the first target position by performing the following operations:

[0076] First, after receiving the first control signal sent by the control device 10, the chip carrying device 30 analyzes the first control signal to obtain the coordinates of the target chip 60. For example, the first position adjusting device 302 in the chip carrying device 30 can receive the first control signal and analyze the first control signal.

[0077] Second, the chip carrying device 30 moves the target chip 60 horizontally and in the direction of approaching the output end of the signal output device 20 to the first target position according to the coordinates of the target chip 60 and the position of the output end of the signal output device 20.

[0078] For example, the first position adjusting device 302 can first determine the horizontal distance between the horizontal coordinates of the target chip 60 and the horizontal coordinates of the output device of the signal output device 20, and determine the horizontal movement strategy of the target chip 60 (move left or right); then determine the vertical distance between the vertical coordinates of the target chip 60 and the vertical coordinates of the output device of the signal output device 20, and determine the vertical movement strategy of the target chip 60 (move up or down). After determining the horizontal movement strategy and the vertical movement strategy, the target chip 60 can be moved horizontally first and then vertically, or the target chip 60 can be moved vertically first and then horizontally, and finally the target chip 60 is moved to the first target position. The present application does not limit this.

[0079] It can be understood that when the first position adjusting device 302 moves the target chip 60 to the first target position, a corresponding feedback signal can be sent to the control device 10, so that the control device 10 performs the following operations based on the feedback signal.

[0080] Step S203, the control device 10 sends a second control signal to the signal output device 20 in response to the feedback signal;

[0081] The second control signal is used to control the signal output device 20 to output an initial electrical signal to the target chip 60. It can be understood that the second control signal can carry a unique identifier of the signal output device 20, so that the control device 10 accurately sends the second control signal to the signal output device 20. For example, the signal output device 20 includes a signal transmitter 201, and the communication module of the control device 10 can be in communication connection with the communication module of the signal transmitter 201, so that the communication module of the signal transmitter 201 receives the second control signal sent by the control device 10.

[0082] In step S204, the signal output device 20 outputs an initial electrical signal to the target chip 60 in response to the second control signal.

[0083] When the chip carrier device 30 moves the target chip 60 to the first target position, the output end of the signal output device 20 is in contact with the target chip 60, and both are in an on state. At this time, the signal output device 20 outputs an initial electrical signal according to the second control signal sent by the control device 10, so as to transmit the initial electrical signal to the target chip 60, so that the target chip 60 emits light under the action of the initial electrical signal.

[0084] In an optional embodiment, as shown in Figure 4 The signal output device 20 includes a signal transmitter 201, a probe 202, and a fixing device 203. The signal transmitter 201 is connected to the probe 202 through a connecting line, and the fixing device 203 fixes the probe 202 at a position corresponding to the first target position.

[0085] The signal transmitter 201 is used to generate an electrical signal and transmit the electrical signal to the probe 202 through the connecting line, and the probe 202 transmits the electrical signal to the target chip 60. The probe 202 includes a needle tip and a probe arm. The needle tip is one of a DC test needle, a coaxial DC test needle, an active needle, and a microwave needle, for example. The needle tip needs to be inserted into the probe arm for fixation, so the probe arm needs to match the needle tip. The size and material of the needle tip depend on the size of the chip and the required measurement type. The needle tip can directly contact the target chip 60. The fixing device 203 is connected to the probe arm to fix the probe 202 at a predetermined position, so that the chip carrier device 30 adjusts the position of the target chip 60 to make the probe 202 contact or be away from the target chip 60.

[0086] It should be noted that the signal transmitter 201 can be in communication connection with the control device 10 and change the parameters of the initial electrical signal output to the target chip 60 by changing the voltage, current, and other data under the control of the control signal sent by the control device 10, so as to meet different types of tests on the target chip 60.

[0087] Step S205, the signal transmission device 40 collects the target light signal output by the target chip 60 in the case that the target chip 60 emits light based on the initial electrical signal, and transmits the target light signal to the signal receiving and processing device 50.

[0088] The signal transmission device 40 can be arranged on the light path of the target chip 60 emitting light based on the initial electrical signal, so as to collect the target light signal emitted by the target chip 60 and transmit the target light signal to the signal receiving and processing device 50.

[0089] In an optional embodiment, as shown in Figure 5 The signal transmission device 40 includes an optical fiber 401, an optical power detector 402, and a second position adjusting device 403. The optical power detector 402 and the position adjusting device 403 are respectively in communication connection with the control device 10. The input end of the optical fiber 401 is connected with the second position adjusting device 403. The first output end of the optical fiber 401 is connected with the optical power detector 402. The second output end of the optical fiber 401 is connected with the input end of the signal receiving and processing device 50.

[0090] The second position adjusting device 403 moves the input end of the optical fiber 401 to the light path of the target chip 60 emitting light based on the initial electrical signal in response to the fifth control signal of the control device 10.

[0091] The optical fiber 401 is used for collecting and transmitting the light signal. The optical power detector 402 is used for measuring the power of the light signal in the optical fiber 401. The second position adjusting device 403 is used for adjusting the position of the input end of the optical fiber 401, so as to receive the light signal with the maximum power through the optical fiber 401. The second position adjusting device 403 can include a communication module which is in communication connection with the communication module in the control device 10.

[0092] Since the target chip 60 is determined according to the test requirement before the test, the test object can be different for different tests. Therefore, when the target chip 60 needs to be tested, the position of the input end of the optical fiber 401 can not be on the light path of the target chip 60 emitting light based on the initial electrical signal. Therefore, the second position adjusting device 403 can move the input end of the optical fiber 401 to the light path of the target chip 60 emitting light based on the initial electrical signal based on the fifth control signal sent by the control device 10, so as to collect the light signal by the optical fiber 401.

[0093] For example, the second position adjusting device 403 can be the same device as the first position adjusting device 302, and can also be only a motor.

[0094] The input end of the optical fiber 401 in the signal transmission device 40 can be arranged on the light path of the light emitted by the target chip 60 based on the initial electrical signal, so that the optical signal can be collected and transmitted to the input end of the signal receiving and processing device 50 through the second output end of the optical fiber 401.

[0095] It should be noted here that since the light emitted by the target chip 60 is divergent and the size of the optical fiber 401 is limited, the position of the optical fiber 401 may not be able to collect the optical signal with the maximum power, at which time the following steps are performed to find the optical signal with the maximum power from the light signal emitted by the target chip 60 for output, so as to improve the accuracy of the test, as shown in the following steps. Figure 6

[0096] Step S601, the control device 10 sends a third control signal to the signal transmission device 40;

[0097] The step can be performed before the target signal is transmitted to the signal receiving and processing device 50. When the target chip 60 emits light based on the initial electrical signal, the control device 10 can send a third control signal to the signal transmission device 40 based on the feedback signal of the signal output device 20, and the third control signal can also carry the motion trajectory of the signal output device 20. The motion trajectory of the signal output device 20 can be calculated based on the hill climbing algorithm, local optimization algorithm, etc.

[0098] Optionally, the control device 10 can send the third control signal to the second position adjusting device 403 in the signal transmission device 40, and the third control signal can also carry the motion trajectory of the second position adjusting device 403.

[0099] Step S602, the signal transmission device 40 moves on the light path of the light emitted by the target chip 60 based on the initial electrical signal in response to the third control signal to collect a plurality of different optical signals, and transmits the plurality of optical signals to the control device 10;

[0100] When the signal transmission device 40 receives the third control signal, the third control signal is analyzed to obtain a plurality of position coordinates, and the signal transmission device 40 moves to the positions pointed by the plurality of position coordinates in sequence, and collects an optical signal at each position to obtain a plurality of different optical signals, and transmits the plurality of different optical signals to the control device 10.

[0101] Optionally, the third control signal can be received by the second position adjusting device 403 in the signal transmission device 40, the third control signal is analyzed to obtain the motion trajectory of the second position adjusting device 403, and the second position adjusting device 403 moves to the first position, the second position, the third position, the fourth position, and so on in sequence according to the motion trajectory. ​

[0102] The second position adjusting device 403 is connected with the input end of the optical fiber 401 in the signal transmission device 40, so when the second position adjusting device 403 moves, the input end of the optical fiber 401 will move to the first position, the second position, the third position, the fourth position, …, in turn. When the optical fiber 401 moves to the first position, the second position, the third position, the fourth position, …, in turn, the optical signal is collected at the first position and transmitted to the optical power device 402 in the signal transmission device 40 through the first output end; the optical signal is collected at the second position and transmitted to the optical power device 402 in the signal transmission device 40 through the first output end; the optical signal is collected at the third position and transmitted to the optical power device 402 in the signal transmission device 40 through the first output end; the optical signal is collected at the fourth position and transmitted to the optical power device 402 in the signal transmission device 40 through the first output end.

[0103] In step S603, the control device 10 determines the position corresponding to the optical signal with the maximum power in the multiple optical signals as the second target position, and sends a fourth control signal to the signal transmission device 40.

[0104] The signal transmission device 40 can directly transmit the multiple optical signals to the control device 10, and the control device 10 determines the optical signal with the maximum power in the multiple optical signals; or the signal transmission device 40 can obtain the power values corresponding to the multiple optical signals by measuring, calculating or other means, and transmit the multiple power values to the control device 10, and the control device 10 determines the optical signal with the maximum power value, and further determines the position corresponding to the optical signal with the maximum power value, which is called the second target position. After the second target position is determined, the signal transmission device 40 needs to move to the second target position again to collect the optical signal, so as to obtain the target optical signal. Therefore, the control device 10 generates the fourth control signal and sends the fourth control signal to the signal transmission device 40, so that the signal transmission device 40 moves to the second target position based on the fourth control signal to collect the target optical signal.

[0105] Alternatively, the signal transmission device 40 can obtain the multiple power values by measuring with the optical power device 402 and send them to the control device 10, and the control device 10 determines the optical signal with the maximum power and further determines the position of the optical signal collected by the optical fiber 401 when the second position adjusting device 403 moves to the position, and determines the position as the second target position. After the second target position is determined, the optical fiber 401 needs to move to the second target position again to collect the optical signal, so as to obtain the target optical signal. Therefore, the control device 10 generates the fourth control signal and sends the fourth control signal to the second position adjusting device 403 in the signal transmission device 40.

[0106] Step S604, the signal transmission device 40 moves to the second target position to collect the target optical signal output by the target chip 60 in response to the fourth control signal.

[0107] The signal transmission device 40 can analyze the fourth control signal to obtain the second target position after receiving the fourth control signal sent by the control device 10, and move to the second target position to collect the optical signal to obtain the target optical signal.

[0108] Alternatively, the fourth control signal sent by the control device 10 can be received by the second position adjusting device 403, and the second position adjusting device 403 analyzes the fourth control signal to obtain the second target position, and drives the input end of the optical fiber 401 to move to the second target position. The optical fiber 401 collects the optical signal at the second target position to obtain the target optical signal.

[0109] Step S206, the signal receiving and processing device 50 performs photoelectric conversion processing on the target optical signal to obtain a target electrical signal, and compares the target electrical signal with the initial electrical signal to determine the test result of the target chip 60 according to the comparison result.

[0110] The signal receiving and processing device 50 is configured to perform photoelectric conversion processing on the received optical signal to obtain a corresponding electrical signal, and analyze the electrical signal to obtain the test result of the target chip 60.

[0111] In an optional embodiment, as shown in Figure 7 The signal receiving and processing device 50 includes a switching sub-device 501 and a plurality of test sub-devices 502, the output end of the signal transmission device 40 is connected to the switching sub-device 501, and the plurality of test sub-devices 502 are respectively connected to different interfaces of the switching sub-device 501,

[0112] The control device 10 determines a target test sub-device 502 from the plurality of test sub-devices 502 according to the test requirement, and sends a sixth control signal to the switching sub-device 501;

[0113] The switching sub-device 501 connects the interface connected to the target test sub-device 502 in response to the sixth control signal, so that a path is formed between the signal transmission device 40 and the target test sub-device 502.

[0114] The switching sub-device 501 is for example an adjustable switch, and the plurality of test sub-devices 502 are for example a vector network analyzer, a bit error rate analyzer, a spectrum analyzer, etc. The vector network analyzer is used to perform S21 test on the target chip 60, the bit error rate analyzer is used to perform bit error rate test on the target chip 60, and the spectrum analyzer is used to perform spectrum test on the target chip 60. Therefore, when it is required to perform a certain type of test on the target chip 60, the switching sub-device 501 is controlled to switch to the interface connected to the target test sub-device 502, so as to connect the signal transmission device 40 and the target test sub-device 502, that is, to form a path between the signal transmission device 40 and the target test sub-device 502. In this way, the optical signal collected by the signal transmission device 40 can be received by the target test sub-device 502, so that the target test sub-device 502 can perform corresponding analysis according to the display result of the received target optical signal.

[0115] In an optional embodiment, the control device 10 can store a coordinate information table including the identification of all the chips on the chip carrying device 30 and the coordinates corresponding to the identification of each chip. The control device 10 of the present application can analyze the test requirement received from the tester to obtain the identification of the target chip 60, and match the identification of the target chip 60 with the stored coordinate information table, so as to obtain the coordinates of the target chip 60.

[0116] Further, after obtaining the coordinates of the target chip 60 by the above-mentioned manner, the control device 10 can generate a first control signal based on the coordinates of the target chip 60, the first control signal carrying the coordinates of the target chip 60, and send the first control signal to the chip carrying device 30.

[0117] Next, an example of a complete test process for the target chip 60 is provided as follows:

[0118] First, the tester sends a test requirement to the control device 10, the test requirement carrying the identification of the target chip 60;

[0119] Second, the control device 10 receives the test requirement, analyzes the test requirement to obtain the identification of the target chip 60, reads the coordinate information table stored in the memory address, matches the identification of the target chip 60 with the coordinate information table, obtains the coordinates of the target chip 60, generates a corresponding first control signal based on the coordinates of the target chip 60, and sends the first control signal to the chip carrying device 30;

[0120] Third, the chip carrying device 30 receives the first control signal, analyzes the first control signal to obtain the coordinates of the target chip 60, moves the target chip 60 to the first target position according to the coordinates of the target chip 60, and sends a feedback signal to the control device 10;

[0121] Fourth, the control device 10 receives the feedback signal, generates a second control signal, and sends the second control signal to the signal output device 20;

[0122] Fifth, the signal output device 20 receives the second control signal, outputs the initial electrical signal to the target chip 60, and sends the feedback signal to the control device 10;

[0123] Sixth, the control device 10 receives the feedback signal, generates a third control signal, and sends the third control signal to the signal transmission device 40;

[0124] Seventh, the signal transmission device 40 moves to collect a plurality of different optical signals on the light path based on the initial electrical signal emitted by the target chip 60 according to the third control signal, and transmits the plurality of optical signals to the control device 10;

[0125] Eighth, the control device 10 determines the position corresponding to the optical signal with the maximum power among the plurality of optical signals as a second target position, generates a fourth control signal, and sends the fourth control signal to the signal transmission device 40;

[0126] Ninth, the signal transmission device 40 moves to the second target position in response to the fourth control signal to collect the target optical signal output by the target chip 60, and transmits the target optical signal to the signal receiving and processing device 50;

[0127] Tenth, the signal receiving and processing device 50 performs photoelectric conversion processing on the target optical signal to obtain a target electrical signal, compares the target electrical signal with the initial electrical signal, and determines the test result of the target chip 60 according to the comparison result.

[0128] The chip test system provided in the application considers that the current chip performance test is still in the manual or semi-automatic test stage, which makes it difficult to guarantee the test speed and test accuracy. The chip test system provided in the application comprises a control device, a signal output device, a chip bearing device, a signal transmission device and a signal receiving and processing device. The control device can send a first control signal to the chip bearing device, so that the chip bearing device moves a target chip to a first target position based on the coordinates of the target chip carried in the first control signal. After moving the target chip to the first target position, the chip bearing device sends a feedback signal to the control device. The control device sends a second control signal to the signal output device in response to the feedback signal, so that the signal output device outputs an initial electrical signal to the target chip under the control of the second control signal. The target chip emits light based on the initial electrical signal. The signal output device collects a target optical signal output by the target chip and transmits the target optical signal to the signal receiving and processing device. The signal receiving and processing device performs photoelectric conversion processing on the received target optical signal to obtain a target electrical signal, and compares the target electrical signal with the initial electrical signal. According to the comparison result, the test result of the target chip can be determined. The chip test system provided in the application can automatically test the performance of the target chip, and the whole process does not need manual participation. The work of each device is precisely controlled through control instructions, which can not only improve the test efficiency, but also improve the test accuracy.

[0129] Reference will now be made to the following description Figure 8 which shows the structure schematic diagram of the computer system 800 suitable for realizing the control device of the embodiments of the application.

[0130] As shown in Figure 8 , the computer system 800 comprises a central processing unit (CPU) 801 which can perform various appropriate actions and processes according to the programs stored in a read-only memory (ROM) 802 or loaded from a storage part 808 to a random access memory (RAM) 803. In the RAM 803, various programs and data required for the operation of the system 800 are also stored. The CPU 801, the ROM 802 and the RAM 803 are connected to each other through a bus 804. An input / output (I / O) interface 805 is also connected to the bus 804.

[0131] The following components are connected to the I / O interface 808: an input part 806 including a keyboard, a mouse, etc.; an output part 807 including a cathode ray tube (CRT), a liquid crystal display (LCD), etc., and a speaker, etc.; a storage part 808 including a hard disk, etc.; and a communication part 809 including a network interface card such as a LAN card, a modem, etc. The communication part 809 performs communication processing via a network such as the Internet. A drive 810 is also connected to the I / O interface 805 as necessary. A removable media 811 such as a magnetic disk, an optical disk, a magneto-optical disk, a semiconductor memory, etc. is attached to the drive 810 as necessary, so that a computer program read out therefrom is installed in the storage part 808 as necessary.

[0132] In particular, the processes described above with reference to the Figure 2 , Figure 6 embodiments of the present disclosure can be implemented as a computer software program. For example, an embodiment of the present disclosure includes a computer program product that includes a computer program tangibly embodied on a machine-readable medium, the computer program including program code for executing the methods described above. In such an embodiment, the computer program can be downloaded and installed from a network via the communication part 809, and / or installed from the removable media 811. Figure 2 Figure 6 The flow diagrams and the block diagrams in the drawings are illustrations of possible architectures, functions, and operations for systems, methods, and computer program products according to various embodiments of the present invention. In this regard, each block in the flow diagrams and the block diagrams can represent a module, a segment, or a portion of code, which comprises one or more executable instructions for implementing the specified logical functions. It should also be noted that in some alternative implementations, the functions noted in the blocks can occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently or the blocks may

[0133] be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams and / or flow diagrams, and combinations thereof, can be implemented by special purpose hardware-based systems that perform the specified functions or operations, or combinations of special purpose hardware and computer instructions.

[0134] ​The units or modules described in the embodiments of the present application can be implemented in the form of software or in the form of hardware. The described units or modules can also be arranged in a processor, for example, can be described as: a processor includes XX unit, YY unit and ZZ unit. In some cases, the names of these units or modules do not constitute a limitation on the units or modules themselves, for example, the XX unit can also be described as: a unit for XX.

[0135] As another aspect, the present application also provides a computer readable storage medium, which can be a computer readable storage medium included in the device described in the above embodiments; or can exist independently, and is not assembled into the device. The computer readable storage medium stores one or more programs, which are used by one or more processors to execute the formula input method described in the present application.

[0136] The above description is merely preferred embodiments of the present application and a description of the principles of the technology used. Those skilled in the art should understand that the scope of the application disclosed in the present application is not limited to the technical solutions formed by the specific combinations of the above technical features, and should also cover other technical solutions formed by any combinations of the above technical features or their equivalent features without departing from the inventive concept. For example, the above features are replaced with the technical features disclosed in the present application (but not limited to) having similar functions to form technical solutions.

Claims

1. A chip testing system, characterized in that, The testing system includes a control device, a signal output device, a chip carrier device, a signal transmission device, and a signal receiving and processing device. The control device is communicatively connected to the signal output device, the chip carrier device, the signal transmission device, and the signal receiving and processing device. The input terminal of the signal transmission device is set in the optical path of the light emitted by the target chip based on the initial electrical signal output by the signal output device, and the output terminal of the signal transmission device is connected to the signal receiving and processing device. The control device is used to send a first control signal to the chip carrier device, the first control signal carrying the coordinates of the target chip; The chip carrier device is used to receive the first control signal sent by the control device, move the target chip to a first target position based on the coordinates of the target chip, and send a feedback signal to the control device; The control device is configured to send a second control signal to the signal output device in response to the feedback signal; The signal output device is used to receive the second control signal sent by the control device and output an initial electrical signal to the target chip; The signal transmission device is used to collect the target optical signal output by the target chip when the target chip emits light based on the initial electrical signal, and to transmit the target optical signal to the signal receiving and processing device. The signal receiving and processing device is used to perform photoelectric conversion processing on the target optical signal to obtain a target electrical signal, and compare the target electrical signal with the initial electrical signal to determine the test result of the target chip based on the comparison result.

2. The testing system according to claim 1, characterized in that, The signal output device includes a signal transmitter, a probe, and a fixing device. The signal transmitter is connected to the probe via a connecting line, and the fixing device fixes the probe at a position corresponding to the first target position.

3. The testing system according to claim 2, characterized in that, The probe includes a needle tip and a probe arm. The needle tip is inserted into the probe arm. The end of the probe arm away from the needle tip is connected to the signal transmitter via a connecting wire. The outer wall of the probe arm near the needle tip is connected to the fixing device.

4. The testing system according to claim 1, characterized in that, The chip carrier device includes a chip carrier disk and a first position adjustment device. Multiple chips are placed on a first surface of the chip carrier disk, and the first position adjustment device is installed on a second surface of the chip carrier disk opposite to the first surface. The first position adjustment device is used to receive the first control signal sent by the control device, move the target chip placed on the first surface of the chip carrier disk to the first target position based on the coordinates of the target chip, and send a feedback signal to the control device.

5. The testing system according to claim 1, characterized in that, The signal transmission device includes an optical fiber, an optical power unit, and a second position adjustment device. The optical power unit and the position adjustment device are respectively communicatively connected to the control device. The input end of the optical fiber is connected to the second position adjustment device, and the output end of the optical fiber is connected to the optical power unit through the signal receiving and processing device. The second position adjustment device is used to receive the fifth control signal sent by the control device and move the input end of the optical fiber to the optical path of the target chip lasing light based on the initial electrical signal.

6. The testing system according to claim 1, characterized in that, The control device is also used to receive test requirements, parse the test requirements to obtain the identifier of the target chip, and match the identifier of the target chip with a coordinate information table to obtain the coordinates of the target chip. The coordinate information table includes the identifiers of all chips placed on the chip carrier device and the coordinates corresponding to the identifiers of each chip.

7. The testing system according to claim 6, characterized in that, The signal receiving and processing device includes a switching sub-device and multiple test sub-devices. The output terminal of the signal transmission device is connected to the switching sub-device, and the multiple test sub-devices are respectively connected to different interfaces of the switching sub-device. The control device is further configured to determine the target test sub-device from the plurality of test sub-devices according to the test requirements, and send a sixth control signal to the switching sub-device; The switching sub-device is used to receive the sixth control signal sent by the control device and connect the interface of the target test sub-device so as to form a path between the signal transmission device and the target test sub-device.

8. The testing system according to claim 7, characterized in that, The switching sub-device is an adjustable optical switch.

9. The testing system according to claim 1, characterized in that, The chip carrier device is specifically used to parse the first control signal to obtain the coordinates of the target chip; The chip carrier device is further configured to move the target chip horizontally and along a direction close to the output end of the signal output device to the first target position based on the coordinates of the target chip and the position of the output end of the signal output device.

10. The testing system according to claim 1, characterized in that, The control device is also used to send a third control signal to the signal transmission device; The signal transmission device is also used to receive the third control signal sent by the control device, move along the optical path of the light emitted by the target chip based on the initial electrical signal to collect multiple different optical signals, and transmit the multiple optical signals to the control device. The control device is further configured to receive the plurality of optical signals sent by the signal transmission device, determine the second target position corresponding to the optical signal with the highest power, and send a fourth control signal to the signal transmission device; The signal transmission device is also used to receive the fourth control signal sent by the control device, and move to the second target position to collect the target optical signal output by the target chip.

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