Wafer edge finding device and detection equipment

Abstract

The utility model relates to a wafer edge finding device and detection equipment, the wafer edge finding device comprises a bearing assembly and a driving assembly, the bearing assembly comprises a bearing structure and a shaft sleeve rotatably sleeving the bearing structure, and at least partial area of the inner wall of the shaft sleeve and the outer wall of the bearing structure are spaced to form a pressure guide cavity; the shaft sleeve is used for communicating the air pressure generator with the pressure guide cavity, a pressure guide channel communicating with the pressure guide cavity is arranged in the bearing structure, the two ends of the bearing structure extend out of the shaft sleeve, and the pressure guide channel communicates with the outside through one end and is used for adsorbing a wafer to one end of the bearing structure; the driving assembly comprises a connecting seat and a rotary driver arranged on the connecting seat, and the rotary driver is connected with the other end of the bearing structure so as to drive the bearing structure to rotate; wherein the shaft sleeve is connected with the connecting seat and is fixed relative to the connecting seat.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor manufacturing, in particular to a wafer edge detection device and detection equipment. BACKGROUND

[0002] Wafer edge detection is an important step in the semiconductor manufacturing process, which aims to determine the precise position of the wafer for subsequent processing and handling. For example, by identifying specific markers (such as notches or flat areas) on the wafer, the positioning and alignment of the wafer are achieved. The wafer edge detection process requires driving the wafer to move, and the material of the wafer is usually brittle, making it difficult to pick up and drive the wafer to move. Therefore, the current wafer edge detection device needs to drive the wafer to move through a complex structure while picking up the wafer. CONTENT OF THE UTILITY MODEL

[0003] Therefore, it is necessary to provide a wafer edge detection device and detection equipment to solve the problem of complex structure of the current wafer edge detection device.

[0004] The present application provides a wafer edge detection device, which comprises a bearing assembly and a driving assembly. The bearing assembly comprises a supporting structure and a shaft sleeve rotatably sleeved on the supporting structure. At least part of the inner wall of the shaft sleeve is spaced from the outer wall of the supporting structure to form a pressure guide cavity. The shaft sleeve is used for the gas pressure generator to communicate with the pressure guide cavity. The supporting structure is provided with a pressure guide channel communicating with the pressure guide cavity. The two ends of the supporting structure respectively extend outside the shaft sleeve. The pressure guide channel communicates with the outside through one end, and is used for adsorbing the wafer to one end of the supporting structure. The driving assembly comprises a connecting seat and a rotary driver arranged on the connecting seat. The rotary driver is connected with the other end of the supporting structure to drive the supporting structure to rotate. The shaft sleeve is connected with the connecting seat and fixed relative to the connecting seat.

[0005] In one embodiment, the supporting structure comprises a connecting shaft, and the pressure guide channel comprises a first hole section arranged in the connecting shaft. The connecting shaft is provided with a first communication hole communicating the first hole section and the pressure guide cavity. The connecting shaft is provided with a ring groove. At least part of the first communication hole is arranged in the groove wall of the ring groove. The shaft sleeve is sleeved on the connecting shaft, and the groove wall of the ring groove is part of the structure surrounding the pressure guide cavity.

[0006] In one of the embodiments, the supporting structure further comprises a tray connected with the connecting shaft, the pressure guiding channel comprises a second hole section arranged in the tray, the tray is used for supporting the wafer, the tray is used for contacting the wafer, a partial area of one side of the wafer is recessed and provided with a pressure guiding groove, the pressure guiding groove is in communication with the second hole section, and the pressure guiding groove is relatively closed to the outside when the tray is used for supporting the wafer and is covered by the wafer.

[0007] In one of the embodiments, the supporting structure further comprises a tray connected with the connecting shaft, the pressure guiding channel comprises a second hole section arranged in the tray, the tray is used for supporting the wafer, the tray is used for contacting the wafer, a partial area of one side of the wafer is recessed and provided with a pressure guiding groove, the pressure guiding groove is in communication with the second hole section, and the pressure guiding groove is relatively closed to the outside when the tray is used for supporting the wafer and is covered by the wafer.

[0008] In one of the embodiments, the wafer edge inspection device further comprises a detection module, the detection module comprises a detector and a light source, the light source is arranged in a spaced manner with the detector and faces the detector, and the driving assembly is further capable of driving the supporting assembly to move between a standby position and a working position; when the supporting assembly is in the working position, at least part of the structure of the wafer supported by the supporting assembly is located in the field of view of the detector, and the light source is located on the side of the wafer away from the detector; when the supporting assembly is in the standby position, the supporting structure is located outside the field of view of the detector.

[0009] In one of the embodiments, the driving assembly comprises a station switching structure, the station switching structure is connected with the connecting seat to drive the connecting seat and the supporting assembly to move between the working position and the standby position; the station switching structure comprises a first moving part and a second moving part, the first moving part is connected with the second moving part to drive the second moving part to move in a first direction, the second moving part is connected with the connecting seat to drive the connecting seat and the supporting assembly to move in a second direction, and the first direction intersects with the second direction.

[0010] In one of the embodiments, the wafer edge inspection device further comprises a stand, the light source and / or the detector are arranged in the stand in an adjustable manner.

[0011] In one of the embodiments, the supporting assembly further comprises a connecting plate, one end of the connecting plate is connected with the connecting seat, the other end of the connecting plate is connected with the shaft sleeve, the shaft sleeve is fixed relative to the connecting seat, and / or the supporting assembly further comprises a bearing, an inner ring of the bearing is sleeved with the supporting structure, and the shaft sleeve is sleeved with an outer ring of the bearing, so that the supporting structure can rotate relative to the shaft sleeve.

[0012] In one embodiment, the wafer edge-tracking device further includes a housing for connecting a fixing structure; the driving component is disposed within the housing, and the carrying component is disposed within the housing with a portion of its structure extending outside the housing to pick up the wafer located outside the housing.

[0013] Another aspect of this application provides a testing device, which includes the wafer edge-tracing device described above.

[0014] In the aforementioned wafer edge-tracking device, a bushing connects the pressure generator to a pressure-conducting chamber, which in turn connects to a pressure-conducting channel. This pressure-conducting channel is connected to the outside via one end of a support structure. Thus, the pressure generator can create a negative pressure within the pressure-conducting channel, causing the wafer to be attracted to one end of the support structure by this negative pressure. Furthermore, the bushing and the support structure are rotatably coupled; the bushing is connected to a connecting seat and fixed relative to it, while the support structure can rotate under the drive of the drive assembly, causing the wafer to rotate accordingly to achieve edge-tracking. In this application, a pressure-guiding cavity is formed by a bushing and a supporting structure, and the bushing and supporting structure are rotatable. The relatively fixed bushing can be easily connected to a pressure generator, creating a negative pressure within the pressure-guiding channel to adsorb and fix the wafer. The relatively rotatable supporting structure can easily drive the wafer to rotate. The pressure-guiding cavity formed by the bushing and supporting structure effectively connects the two relatively rotating components, allowing the negative pressure provided by the relatively fixed pressure generator to be easily transmitted to the relatively rotating supporting structure for adsorbing and fixing the wafer. In this application, a simple structure can simultaneously achieve wafer adsorption and pickup and wafer movement, simplifying the structure of the wafer edge-searching device and reducing its size. Attached Figure Description

[0015] Figure 1 This is an isometric schematic diagram of a wafer edge-tracing device provided in an embodiment of this application.

[0016] Figure 2 for Figure 1 Side view of the wafer edge-tracing device shown.

[0017] Figure 3 for Figure 2 A cross-sectional view of the carrier component along line AA in the wafer edge-tracing device shown.

[0018] Figure 4 for Figure 1 The diagram shows an isometric view of the supporting components in the wafer edge-tracing device.

[0019] Figure 5 for Figure 4 An exploded view of the load-bearing component shown.

[0020] Figure 6 for Figure 5A cantilevered schematic diagram of the pallet in the load-bearing assembly shown.

[0021] Figure 7 This is an isometric schematic diagram of a wafer edge-tracing device provided in another embodiment of this application.

[0022] Reference numerals: 10, wafer edge-tracking device; 20, wafer; 30, gas connector; 100, bearing assembly; 101, pressure guiding channel; 102, pressure guiding cavity; 103, first hole section; 104, second hole section; 110, support structure; 111, connecting shaft; 112, tray; 113, first connecting hole; 114, annular groove; 115, pressure guiding groove; 116, first mounting groove; 117, second mounting groove; 120, bushing; 121, second connecting hole; 122, mounting groove; 130, bearing; 140, connecting plate; 151, ... 1. Sealing ring; 152. Second sealing ring; 153. Third sealing ring; 200. Drive assembly; 210. Connecting seat; 220. Rotary driver; 230. Station switching structure; 240. First moving part; 241. First slide rail; 242. Slide table; 250. Second moving part; 251. Second slide rail; 300. Detection module; 310. Detector; 320. Light source; 400. Housing; 410. Base; 420. Cover; 421. Exposed opening; 500. Stand; S1. First direction; S2. Second direction. Detailed Implementation

[0023] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0024] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0025] In addition, if there are these terms "first", "second", these terms are only used for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second" can be explicitly or implicitly included at least one of the features. In the description of the present application, if there are the terms "a plurality of", the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise explicitly specified and limited.

[0026] In the present application, unless otherwise explicitly specified and limited, if there are the terms "mounting", "connecting", "connecting", "fixing" and the like, these terms should be broadly understood. For example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0027] In the present application, unless otherwise explicitly specified and limited, if there are the terms "first" and "second" and the like, the meaning can be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature "above", "above" and "above" of the second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" of the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0028] It should be noted that if an element is referred to as "fixed to" or "provided to" another element, it can be directly on another element or there can be a middle element. If an element is considered to be "connected" to another element, it can be directly connected to another element or there can be a middle element. If there is, the terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used in the present application are only for the purpose of description, and do not represent the only implementation.

[0029] Referring to Figures 1 to 3 , Figure 1 shows a perspective view of a wafer edge inspection device provided by an embodiment of the present application, Figure 2 is Figure 1 a side view of the wafer edge inspection device shown, Figure 3 is Figure 2A cross-sectional view of the wafer edge detection device along the line A-A. The wafer edge detection device 10 is used to detect the position of a wafer 20 and facilitate the alignment of the wafer 20. The wafer edge detection device 10 comprises a carrier assembly 100 and a driving assembly 200. The carrier assembly 100 is used to hold the wafer 20, and the carrier assembly 100 is capable of picking up the wafer 20 in cooperation with a pressure generator, so that the wafer 20 is fixed relative to the carrier assembly 100. The driving assembly 200 is connected to the carrier assembly 100, and the driving assembly 200 is capable of driving the carrier assembly 100 to move, so that the wafer 20 moves with the carrier assembly 100 to achieve edge detection.

[0030] The driving assembly 200 comprises a connecting seat 210 and a rotary driver 220, and the rotary driver 220 is arranged on the connecting seat 210. The carrier assembly 100 comprises a holding structure 110 and a shaft sleeve 120, and the shaft sleeve 120 is rotatably sleeved on the holding structure 110. At least part of the inner wall of the shaft sleeve 120 is spaced from the outer wall of the holding structure 110 to form a pressure guide cavity 102, and the shaft sleeve 120 is used for the pressure generator to communicate with the pressure guide cavity 102. The holding structure 110 is provided with a pressure guide channel 101 which communicates with the pressure guide cavity 102. That is, the pressure generator is capable of forming negative pressure in the pressure guide channel 101 through the pressure guide cavity 102. The two ends of the holding structure 110 respectively extend out of the shaft sleeve 120, and the pressure guide channel 101 communicates with the outside through one of the two ends, and is used to adsorb the wafer 20 to one end of the holding structure 110. The rotary driver 220 is connected to the other end of the holding structure 110 to drive the holding structure 110 to rotate. The shaft sleeve 120 is connected to the connecting seat 210 and is fixed relative to the connecting seat 210.

[0031] The shaft sleeve 120 is used for connecting the air pressure generator with the pressure guide cavity 102, the pressure guide cavity 102 is connected with the pressure guide channel 101, and the pressure guide channel 101 is connected with the outside through one end of the supporting structure 110. Thus, the air pressure generator can form a negative pressure in the pressure guide channel 101, so that the wafer 20 is adsorbed on one end of the supporting structure 110 by the negative pressure. In addition, the shaft sleeve 120 is rotatably connected with the supporting structure 110, the shaft sleeve 120 is fixed relative to the connecting seat 210, and the supporting structure 110 can be rotated under the driving of the driving assembly 200, so as to drive the wafer 20 to rotate and realize edge detection. In the present application, the shaft sleeve 120 and the supporting structure 110 are combined to form the pressure guide cavity 102, and the shaft sleeve 120 and the supporting structure 110 are rotatable, the shaft sleeve 120 which is fixed relative to the connecting seat 210 can be conveniently connected with the air pressure generator, so that the negative pressure in the pressure guide channel 101 can be formed to adsorb and fix the wafer 20, the rotatable supporting structure 110 can conveniently drive the wafer 20 to rotate, and the pressure guide cavity 102 formed by the shaft sleeve 120 and the supporting structure 110 can effectively connect the two parts which are rotatable relative to each other, so that the negative pressure provided by the air pressure generator which is fixed relative to the connecting seat 210 can be conveniently conducted to the rotatable supporting structure 110, and used for adsorbing and fixing the wafer 20. In the present application, the wafer 20 can be adsorbed and picked up and driven to move by a simple structure, the structure of the wafer edge detection device 10 can be simplified, and the volume of the wafer edge detection device 10 can be reduced.

[0032] Further, since the bearing assembly 100 in the wafer edge detection device 10 provided by the present application can realize the pressure guide function and the transmission function, the wafer edge detection device 10 has no special requirements for the rotary driver 220 and the air pressure generator, that is, the pressure guide function and the transmission function can be realized without other devices, and the related devices can be flexibly selected according to the requirements, so as to relatively reduce the cost and flexibly adapt to different requirements.

[0033] In one embodiment, the rotary driver 220 can be configured as a voice coil motor or a torque motor.

[0034] Please refer to Figure 1 In one embodiment, the bearing assembly 100 further comprises a connecting plate 140, one end of the connecting plate 140 is connected with the connecting seat 210, and the other end of the connecting plate 140 is connected with the shaft sleeve 120, so that the shaft sleeve 120 is fixed relative to the connecting seat 210.

[0035] Please refer to Figure 1 and Figure 2In one embodiment, the wafer edge inspection device 10 further comprises a detection module 300 for taking pictures of the wafer 20 so as to locate the wafer 20. The driving assembly 200 is capable of driving the carrying assembly 100 to rotate so as to expose different regions of the wafer 20 on the carrying assembly 100 to the detection field of view of the detection module 300, thereby achieving wafer edge inspection.

[0036] For further reference Figures 3 to 5 In one embodiment, the supporting structure 110 comprises a connecting shaft 111 and a tray 112, and the tray 112 is connected to the connecting shaft 111. The tray 112 is used to contact and support the wafer 20, and the connecting shaft 111 is used to connect the driving assembly 200. The shaft sleeve 120 can be sleeved on the connecting shaft 111, and the pressure guide channel 101 extends through the connecting shaft 111 to the tray 112. The pressure guide channel 101 can be in communication with the outside through one end of the tray 112.

[0037] For further reference Figure 3 and Figure 5 Further, the pressure guide channel 101 comprises a first hole section 103 and a second hole section 104. The first hole section 103 is arranged in the connecting shaft 111, and the second hole section 104 is arranged in the tray 112. The first hole section 103 and the second hole section 104 are in communication with each other, and a section of the second hole section 104 away from the first hole section 103 is in communication with the outside. The connecting shaft 111 is provided with a first communication hole 113, and the first communication hole 113 is in communication with the first hole section 103 and the pressure guide cavity 102. The connecting shaft 111 is provided with a ring groove 114 on the outer periphery, and at least part of the first communication hole 113 is arranged in the groove wall of the ring groove 114. The groove wall of the ring groove 114 is part of the structure surrounding the pressure guide cavity 102. In combination Figure 3 and Figure 5In the first aspect, since the annular groove 114 is recessed on the outer periphery of the connecting shaft 111, the area of the guide pressure cavity 102 can be relatively increased and the guide pressure effect can be improved without changing the size of the connecting shaft 111 and the shaft sleeve 120. Meanwhile, the probability of accidental cutting of the guide pressure cavity 102 due to the deflection and shaking of the connecting shaft 111 relative to the shaft sleeve 120 during rotation can be reduced, and the guide pressure reliability can be improved. In the second aspect, since the annular groove 114 is recessed on the outer periphery of the connecting shaft 111, at least part of the first communication hole 113 for communicating the guide pressure channel 101 is arranged on the groove wall of the annular groove 114, so that the probability of the first communication hole 113 being blocked by the inner wall of the shaft sleeve 120 can be reduced, and the guide pressure reliability can be improved. In the third aspect, since the annular grooves 114 are continuously distributed along the circumferential direction of the connecting shaft 111, the space in the annular grooves 114 can be used to communicate the areas of the guide pressure cavity 102 in the circumferential direction of the connecting shaft 111. Thus, when the connecting shaft 111 is rotated to each position relative to the shaft sleeve 120, the guide pressure cavity 102 can communicate the first communication hole 113 with the gas pressure generator, and the guide pressure reliability can be improved.

[0038] It should be noted that one end of the first hole section 103 is in communication with the second hole section 104, and the other end is in communication with the first communication hole 113. The present application does not limit the relationship between the hole diameter of the first communication hole 113 and the groove width of the annular groove 114. For example, the first communication hole 113 can be arranged only on one side groove wall (or bottom wall) of the annular groove 114; or, as shown in Figure 5 the first communication hole 113 can extend from one side groove wall of the annular groove 114 to the other side groove wall of the annular groove 114 through the bottom wall of the annular groove 114. Even, the first communication hole 113 can extend outward from the annular groove 114 to other areas arranged on the outer periphery of the connecting shaft 111. The arrangement can be set according to actual needs, and will not be described here.

[0039] Please refer to Figure 3 In one embodiment, the shaft sleeve 120 is provided with a second communication hole 121, and the second communication hole 121 penetrates the shaft sleeve 120. The gas pressure generator is in communication with the second communication hole 121, so as to form a negative pressure in the guide pressure cavity 102, the first communication hole and the guide pressure channel 101 through the second communication hole 121, and adsorb and fix the wafer 20. Further, the gas pressure generator includes a gas joint 30, and the gas joint 30 is inserted into the second communication hole 121. In short, the bearing assembly 100 is provided with the second communication hole 121, the guide pressure cavity 102, the first communication hole 113, the first hole section 103, the second hole section 104 and the guide pressure groove 115 which are sequentially communicated.

[0040] Please refer to Figures 4 to 6In one embodiment, the tray 112 is provided with a pressure guide groove 115 on the side that contacts the wafer 20, and the pressure guide groove 115 is in communication with the second hole section 104, so that the negative pressure suction effect of the second hole section 104 can be transmitted to the pressure guide groove 115. When the tray 112 is used to support the wafer 20, the pressure guide groove 115 is covered by the wafer 20 and is relatively closed to the outside. By providing the pressure guide groove 115 on the side of the tray 112 that contacts the wafer 20, the area of the tray 112 that provides negative pressure suction can be increased, and the effect of suction fixation can be improved.

[0041] Further, the arrangement of the pressure guide groove 115 can be designed according to actual needs, such as a spider web type, a concentric ring type, a spiral type, and the like. The tray 112 can be used to support wafers 20 of different sizes, such as 4 inches, 6 inches, 8 inches, 12 inches, and the like.

[0042] Please refer to Figures 3 to 5 In one embodiment, the bearing assembly 100 further includes a bearing 130, the inner ring of the bearing 130 is sleeved on the support structure 110, and the shaft sleeve 120 is sleeved on the outer ring of the bearing 130, so that the support structure 110 can rotate relative to the shaft sleeve 120. The bearing 130 is arranged between the bearing 130 and the connecting shaft 111, so that they can rotate smoothly and are axially fixed.

[0043] As Figure 3 Further, the lower end surface of the shaft sleeve 120 can be provided with a mounting groove 122, and the bearing 130 is embedded in the mounting groove 122, so as to reduce the interval between the inner wall of the shaft sleeve 120 and the outer wall of the connecting shaft 111, and facilitate the realization of high sealing performance.

[0044] Please refer to Figures 3 to 5 In one embodiment, the bearing assembly 100 includes a first sealing ring 151, a second sealing ring 152, and a third sealing ring 153. The first sealing ring 151 and the second sealing ring 152 are both sleeved on the connecting shaft 111, and the first sealing ring 151 and the second sealing ring 152 are respectively located on different sides of the position of the annular groove 114 on the connecting shaft 111 in the axial direction, and the first sealing ring 151 and the second sealing ring 152 are both abutted against the inner circumferential wall of the shaft sleeve 120, so as to seal the two ends of the pressure guide cavity 102. Since the first sealing ring 151 and the second sealing ring 152 are both annularly sleeved on the outer circumference of the connecting shaft 111, that is, they are continuously distributed along the circumferential direction of the connecting shaft 111, therefore, during the rotation of the connecting shaft 111, the first sealing ring 151 and the second sealing ring 152 can continuously provide sealing effect, so as to keep the pressure guide cavity 102 sealed.

[0045] As Figure 3Further, the tray 112 can be mounted on the end of the connecting shaft 111, and the third sealing ring 153 is abutted between the lower end surface of the tray 112 and the upper end surface of the connecting shaft 111, so as to improve the sealing performance of the connecting position of the tray 112 and the connecting shaft 111, and improve the adsorption and fixing effect.

[0046] Please refer to Figure 3 and Figure 5 In one embodiment, the shaft sleeve 120 and / or the connecting shaft 111 is provided with a first mounting groove 116, and two first mounting grooves 116 are respectively arranged at different sides of the connecting shaft 111 at the position of the upper annular groove 114 in the axial direction. The first sealing ring 151 and the second sealing ring 152 are respectively arranged in the two first mounting grooves 116, so as to be fixed in the axial direction relative to the shaft sleeve 120 and / or the connecting shaft 111, and reduce the probability of sealing failure caused by the position shift of the first sealing ring 151 and the second sealing ring 152 during the relative rotation of the connecting shaft 111 and the shaft sleeve 120. Of course, part of the first sealing ring 151 and the second sealing ring 152 will be exposed outside the first mounting groove 116, so as to be used for sealing abutment.

[0047] Further, one of the lower end surface of the tray 112 and the upper end surface of the connecting shaft 111 is provided with a second mounting groove 117, and the third sealing ring 153 is arranged in the second mounting groove 117, and the third sealing ring 153 is at least partially exposed outside the second mounting groove 117, so as to be used for sealing abutment.

[0048] Please refer to Figure 3 The first sealing ring 151 and the second sealing ring 152 can be arranged on the same side of the bearing 130. The bearing 130 can be arranged outside the pressure guide cavity 102, so as to facilitate the realization of high sealing effect.

[0049] Please refer to Figure 1 and Figure 2In one embodiment, the driving assembly 200 is capable of not only rotating the carrying assembly 100, but also moving the carrying assembly 100 between the standby position and the working position. When the carrying assembly 100 is at the standby position, the wafer 20 can be conveniently transferred to the carrying assembly 100 by an automatic conveying device such as a robot or manually. When the carrying assembly 100 is at the working position, at least part of the wafer 20 is located in the detection field of view of the detection module 300, and the detection module 300 can conveniently perform edge detection on the wafer 20. Further, the detection module 300 comprises a detector 310 and a light source 320, and the light source 320 is arranged to be spaced apart from the detector 310 and faces the detector 310. When the carrying assembly 100 is at the working position, at least part of the structure of the wafer 20 carried by the carrying assembly 100 is located in the field of view of the detector 310, and the light source 320 is located on the side of the wafer 20 away from the detector 310. At this time, along the shooting direction of the detector 310, the detector 310, the wafer 20 and the light source 320 are arranged in sequence, and the light source 320 provides backlighting effect, so that the detector 310 can obtain image information with higher contrast, which is conducive to analyzing specific marks on the wafer 20. When the carrying assembly 100 is at the standby position, the supporting structure 110 is located outside the field of view of the detector 310, so as to facilitate loading and unloading.

[0050] Please refer to Figure 1 and Figure 2 In one embodiment, the driving assembly 200 comprises a station switching structure 230, which is connected with the connecting seat 210 to drive the connecting seat 210 and the carrying assembly 100 to move between the working position and the standby position. Further, the carrying assembly 100 can also have a starting position. When the wafer edge detection device 10 completes the wafer edge detection action, the carrying assembly 100 can be driven to reset to the starting position. Similarly, when the wafer edge detection process is needed, the carrying assembly 100 can be driven to move from the starting position to other positions. The station switching structure 230 can drive the carrying assembly 100 to move to the starting position, the working position and the standby position.

[0051] Further, the station switching structure 230 comprises a first moving part 240 and a second moving part 250, and the first moving part 240 is connected with the second moving part 250 to drive the second moving part 250 to move along a first direction S1. The second moving part 250 is connected with the connecting seat 210 to drive the connecting seat 210 and the carrying assembly 100 to move along a second direction S2. The first direction S1 intersects with the second direction S2. In this way, the driving assembly 200 can drive the carrying assembly 100 to move in two intersecting directions, which improves the flexibility of the movement of the carrying assembly 100 and facilitates flexible arrangement of the positions of various stations. Further, the first direction S1 can be arranged perpendicularly to the second direction S2.

[0052] In one embodiment, the first moving component 240 comprises a first driver (not shown in the figure, the same below), a first slide rail 241 extending along a first direction S1, and a slide table 242 in sliding cooperation with the first slide rail 241. The first driver is connected with the slide table 242 to drive the slide table 242 to slide along the first slide rail 241. The second moving component 250 comprises a second driver (not shown in the figure, the same below) and a second slide rail 251 extending along a second direction S2 and arranged on the slide table 242. The connecting seat 210 is in sliding cooperation with the second slide rail 251, and the second driver is connected with the connecting seat 210 to drive the connecting seat 210 to move along the second direction S2. The first driver and the second driver can be configured as a screw motor module, a hydraulic module, a pneumatic module, or a synchronous belt driving module.

[0053] In one embodiment, the first moving component 240 and the second moving component 250 can further be provided with a reading head and a sensor, etc. to accurately know whether the relevant structure is moved to the position.

[0054] As to the wafer edge inspection movement, the following is a brief description: first, the first moving component 240 drives the second moving component 250, the connecting seat 210, and the carrying assembly 100 to move from the starting position to the standby position along the first direction S1 to receive the wafer 20. Then, the first moving component 240 drives the second moving component 250 and the carrying assembly 100 to move along the first direction S1, and the second moving component 250 drives the carrying assembly 100 to move along the second direction S2, so that the carrying assembly 100 moves from the standby position to the working position. When the carrying assembly 100 moves to the working position, the rotary driver 220 drives the carrying assembly 100 to rotate to start the edge inspection. At this time, the detection module 300 is used to detect the starting edge of the wafer 20. When the detection module 300 finds the starting edge of the wafer 20, the driving assembly 200 stops, and the wafer edge inspection device 10 alarms to inform that the edge inspection has been completed.

[0055] In one embodiment, the wafer edge inspection device 10 comprises a base 410 and a stand 500, and the driving assembly 200 and the stand 500 are arranged on the base 410. The detection module 300 is arranged on the stand 500. Further, the light source 320 and / or the detector 310 are arranged on the stand 500 in a position-adjustable manner, so that the position of the light source 320 and / or the detector 310 can be adjusted according to different sizes and different types of wafers 20, thereby improving the accuracy of the edge inspection.

[0056] Please refer to Figure 7In one embodiment, the wafer edge inspection device 10 further comprises a box 400, which comprises a cover 420 and the base 410 as described above. The box 400 is used to connect to a fixed structure, which can be the ground, a table top, a table surface, or a mounting portion of an apparatus to which the wafer edge inspection device 10 is applied, etc. The drive assembly 200 is arranged in the box 400, and the carrying assembly 100 is arranged in the box 400 and partially extends out of the box 400 to pick up the wafer 20 outside the box 400. That is, all the components of the wafer edge inspection device 10 except the box 400 can be arranged in the box 400 or partially arranged in the box 400. The wafer edge inspection device 10 thus forms a module, so that the wafer edge inspection device 10 can be independently applied to inspect the wafer edge, and the wafer edge inspection device 10 can also be applied in other apparatuses to form an overall wafer 20 manufacturing pipeline.

[0057] Further, the carrying assembly 100 and the drive assembly 200 are arranged in the base 410, and the cover 420 covers the two assemblies. The cover 420 is provided with an exposure opening 421, and part of the connecting shaft 111 of the carrying assembly 100 and the tray 112 are exposed to the cover 420 through the exposure opening 421. The detection module 300 is arranged outside the cover 420 to detect the wafer 20 on the tray 112.

[0058] Another embodiment of the present application further provides a detection apparatus, which comprises the wafer edge inspection device 10 as described in each embodiment. Further, the detection apparatus further comprises an air pressure generator, which is in communication with the carrying assembly 100.

[0059] The technical features of the above-described embodiments can be combined in any manner. For the sake of brevity, not all possible combinations of the technical features described in the above embodiments are described, but it should be understood that any combination of the technical features is within the scope of the present application as long as the combination does not result in contradictions.

[0060] The above-described embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, but it should not be understood as a limitation on the patent scope of the present application. It should be noted that, for those skilled in the art, several modifications and improvements can be made without departing from the concept of the present application, and these are within the protection scope of the present application. Therefore, the patent protection scope of the present application should be subject to the appended claims.

Claims

1. A wafer edge-searching device, characterized in that, The wafer edge-searching device includes: A support assembly includes a support structure and a bushing rotatably fitted onto the support structure. At least a portion of the inner wall of the bushing is spaced from the outer wall of the support structure to form a pressure-guiding cavity. The bushing is used to supply a pressure generator to the pressure-guiding cavity. The support structure has a pressure-guiding channel communicating with the pressure-guiding cavity. Both ends of the support structure extend outward from the bushing. The pressure-guiding channel is connected to the outside through one end and is used to adsorb a wafer onto one end of the support structure. A drive assembly includes a connecting base and a rotary driver disposed on the connecting base, the rotary driver being connected to the other end of the support structure to drive the support structure to rotate; The bushing is connected to the connecting seat and fixed relative to the connecting seat.

2. The wafer edge-searching device according to claim 1, characterized in that, The supporting structure includes a connecting shaft, the pressure guiding channel includes a first hole section disposed in the connecting shaft, the connecting shaft has a first communicating hole connecting the first hole section and the pressure guiding cavity, and an annular groove is recessed on the outer periphery of the connecting shaft, at least a portion of the first communicating hole is formed in the groove wall of the annular groove; The bushing is fitted onto the connecting shaft, and the groove wall of the annular groove forms part of the pressure guiding cavity.

3. The wafer edge-searching device according to claim 2, characterized in that, The support structure also includes a tray connected to the connecting shaft. The pressure guiding channel includes a second hole section provided in the tray. The tray is used to support the wafer. A portion of the tray on the side that contacts the wafer is recessed with a pressure guiding groove. The pressure guiding groove communicates with the second hole section. When the tray is used to support the wafer, the pressure guiding groove is covered by the wafer and closed relative to the outside.

4. The wafer edge-searching device according to claim 2, characterized in that, The bearing assembly includes a first sealing ring and a second sealing ring, both of which are fitted onto the connecting shaft. The first sealing ring and the second sealing ring are located on different sides of the annular groove along the axial direction of the connecting shaft, and both the first sealing ring and the second sealing ring abut against the inner circumferential wall of the bushing, thereby sealing both ends of the pressure guiding cavity.

5. The wafer edge-searching device according to claim 1, characterized in that, It also includes a detection module, which includes a detector and a light source. The light source is spaced apart from the detector and faces the detector. The driving component can also drive the carrying component to move between the waiting position and the working position. When the carrier component is in the working position, at least a portion of the structure of the wafer carried by the carrier component is located within the field of view of the detector, and the light source is located on the side of the wafer away from the detector; When the supporting component is in the waiting position, the supporting structure is located outside the field of view of the detector.

6. The wafer edge-searching device according to claim 5, characterized in that, The driving component includes a station switching structure, which is connected to the connecting seat to drive the connecting seat and the bearing component to move between the working position and the waiting position. The workstation switching structure includes a first moving component and a second moving component. The first moving component is connected to the second moving component to drive the second moving component to move along a first direction. The second moving component is connected to the connecting seat to drive the connecting seat and the bearing assembly to move along a second direction. The first direction and the second direction intersect.

7. The wafer edge-searching device according to claim 5, characterized in that, The wafer edge-tracing device also includes a stand, on which the light source and / or the detector are tunably positioned.

8. The wafer edge-searching device according to claim 1, characterized in that, The carrier component also includes: A connecting plate, one end of which is connected to the connecting seat and the other end of which is connected to the bushing, thereby fixing the bushing relative to the connecting seat; and / or The bearing has an inner ring fitted onto the supporting structure, and a bushing fitted onto the outer ring of the bearing, allowing the supporting structure to rotate relative to the bushing.

9. The wafer edge-searching apparatus according to any one of claims 1 to 8, characterized in that, It also includes a housing for connecting and fixing structures; the drive assembly is located inside the housing, and the load-bearing assembly is located inside the housing with a portion of its structure extending outside the housing to pick up the wafer located outside the housing.

10. A testing device, characterized in that, The testing equipment includes the wafer edge-tracing device as described in any one of claims 1 to 9.

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