Packaging structure of semiconductor module

Abstract

The utility model relates to the technical field of semiconductor packaging, in particular to a packaging structure of a semiconductor module, which comprises a metal base, a groove arranged at the lower end of the metal base, a fixing groove arranged on the inner wall of the groove, a mounting plate inserted in the groove, fixing sheets fixedly connected to two sides of the mounting plate, and a mounting base fixedly connected to the upper end of the metal base. A semiconductor chip is arranged at the upper end of the mounting base, a sealing cover is arranged above the mounting base, a heat dissipation groove is formed in the inner wall of the middle of the sealing cover, a plurality of heat dissipation fins are fixedly connected in the heat dissipation groove, a heat dissipation guide plate is fixedly connected to the lower ends of the heat dissipation fins, and the lower end of the heat dissipation guide plate directly faces the semiconductor chip. A heat dissipation silica gel layer is arranged between the heat dissipation guide plate and the semiconductor chip, positioning pieces are arranged at the four side ends of the mounting base, each positioning piece is composed of a mounting part, a positioning part and a limiting part, the semiconductor chip is prevented from being extruded to internal parts during packaging, and meanwhile the sealing performance and the packaging firmness are ensured.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor packaging, specifically to the packaging structure of semiconductor module. BACKGROUND

[0002] The semiconductor module is convenient to install, can greatly reduce the occupation of space, and makes the equipment smaller. The existing semiconductor mainly adopts interference fit packaging, the sealing cover and the base are mutually clamped, and pressing force is needed during packaging. However, positioning is not easy during packaging, and the silicone layer is easy to move during pressing, so that the silicone layer is not evenly coated, affecting subsequent heat dissipation. Moreover, the existing packaging structure cannot highlight the position of the internal semiconductor chip, which is not conducive to the installation of the subsequent heat dissipation structure. SUMMARY

[0003] The utility model discloses a packaging structure of semiconductor module to solve the problem in the background art.

[0004] To achieve the above object, the utility model provides the following technical scheme: the packaging structure of semiconductor module, including metal base, the lower extreme of metal base is equipped with recess, and the inner wall of recess is fixed with groove, and the recess is inserted and is installed with installation plate, both sides of installation plate are fixedly connected with fixed sheet, the upper end of metal base is fixedly connected with installation base, the upper end of installation base is equipped with semiconductor chip, the top of installation base is equipped with sealing cover, the middle inner wall of sealing cover is equipped with heat dissipation groove, a plurality of heat dissipation fins are fixedly connected in heat dissipation groove, the lower extreme of heat dissipation fin is fixedly connected with heat dissipation guide plate, the lower extreme of heat dissipation guide plate is opposite semiconductor chip, and the heat dissipation silica gel layer is equipped between heat dissipation guide plate and semiconductor chip, the four side ends of installation base are equipped with positioning sheet, the positioning sheet is composed of installation part, positioning part and limiting part, the upper end of metal base is equipped with four fixed columns, the upper end of fixed column is fixedly connected with mounting post, the locking ring is sleeved on the mounting post, and the inner wall of sealing cover is fixedly connected with clamping sleeve and positioning plate.

[0005] Preferably, the upper end of the metal base is a convex structure, the upper end of the metal base is provided with a sealing groove at the corner, the sealing groove is a back-shaped structure, the lower end of the sealing cover is inserted into the sealing groove, the inner wall of the lower end of the metal base is provided with a screw, and the lower end of the sealing cover is connected with the screw.

[0006] Preferably, the fixed sheet is an arc-shaped structure, the fixed sheet is an elastic iron sheet, the groove bottom of the fixed groove is an arc-shaped structure, and the fixed sheet and the fixed groove are clamped.

[0007] Preferably, the four side edges of the heat dissipation guide plate are inclined structures, and the top end of the heat dissipation guide plate abuts against the inner wall of the heat dissipation groove.

[0008] Preferably, the diameter of the mounting column is smaller than that of the fixing column, the mounting portion is horizontally arranged, the mounting column is inserted into the mounting column, and the locking ring is located at the upper end of the mounting portion.

[0009] Preferably, the side end of the mounting column is provided with two locking grooves in an annular structure, the upper end of the mounting column is inserted into the clamping sleeve, the locking ring and the inner wall of the clamping sleeve are both provided with protrusions, and the locking grooves and the protrusions are clamped.

[0010] Preferably, the positioning portion is in a V-shaped structure, the lower end of the positioning plate is inserted into the positioning portion, the limiting portion is vertically arranged, the limiting portion is inserted into the mounting base, and the semiconductor chip is located in the middle of the positioning portion.

[0011] Compared with the prior art, the semiconductor chip packaging device has the following beneficial effects: the four side edges of the mounting base are all provided with positioning pieces, the positioning pieces can position and fix the installation of the semiconductor chip and can also position the installation of the sealing cover; the sealing cover can abut the heat dissipation guide plate against the heat dissipation silica gel layer during installation, so as to avoid damage to the heat dissipation silica gel layer and ensure the heat dissipation effect; the middle of the sealing cover is provided with a heat dissipation groove, the upper end of the heat dissipation groove is protruding, and when the heat dissipation structure is installed subsequently, the heat dissipation structure can be aligned with the position of the semiconductor chip, so as to reduce the occupation of space. BRIEF DESCRIPTION OF DRAWINGS

[0012] Fig. 1 It is a semiconductor chip packaging connection schematic diagram.

[0013] Fig. 2 It is a positioning piece connection schematic diagram.

[0014] In the figure: 1 metal base, 2 mounting plate, 3 fixing piece, 4 fixing groove, 5 mounting base, 6 semiconductor chip, 7 positioning piece, 71 mounting portion, 72 positioning portion, 73 limiting portion, 8 sealing cover, 9 heat dissipation fin, 10 heat dissipation guide plate, 11 heat dissipation silica gel layer, 12 positioning plate, 13 fixing column, 14 mounting column, 15 locking groove, 16 locking ring, 17 clamping sleeve. DETAILED DESCRIPTION

[0015] In order to deepen the understanding and understanding of the utility model, the technical solutions in the embodiments of the utility model will be clearly and completely described and introduced in combination with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments, and do not limit the embodiments in any form. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the scope of protection of the utility model.

[0016] Please refer to Figs. 1-2 The utility model provides a technical scheme: the packaging structure of semiconductor module, including metal base 1, the lower end of metal base 1 is equipped with recess, the inner wall on recess is fixed groove 4, recess is inserted and is installed plate 2, the both sides of installation plate 2 are fixedly connected with fixed sheet 3, the upper end of metal base 1 is fixedly connected with installation base 5, and installation base 5 upper end is equipped with semiconductor chip 6, and the top of installation base 5 is equipped with sealing cover 8, and the middle inner wall of sealing cover 8 is equipped with heat dissipation groove, and a plurality of heat dissipation fins 9 are fixedly connected in heat dissipation groove, and the lower end of heat dissipation fin 9 is fixedly connected with heat dissipation guide plate 10, and the lower end of heat dissipation guide plate 10 is opposite semiconductor chip 6, and heat dissipation silica gel layer 11 is equipped between heat dissipation guide plate 10 and semiconductor chip 6, and the four side ends of installation base 5 are equipped with positioning sheet 7, and positioning sheet 7 is composed of installation part 71, positioning part 72 and limiting part 73, and the upper end of metal base is equipped with four fixed columns 13, and the upper end of fixed column 13 is fixedly connected with mounting column 14, and mounting column 14 is sleeved with locking ring 16, and the inner wall of sealing cover 8 is fixedly connected with clamping sleeve 17 and positioning plate 12, and the upper end of heat dissipation groove is convex, when the subsequent heat dissipation structure is installed, the heat dissipation structure is aligned with the position of semiconductor chip, the heat dissipation efficiency is increased, and the occupation of space is reduced.

[0017] The upper end of metal base 1 is a convex structure, the lower end of metal base 1 is located at the corner and is provided with a sealing groove, the sealing groove is a back-shaped structure, the lower end of sealing cover 8 is inserted into the sealing groove, the inner wall of the lower end of metal base 1 is provided with a screw, the lower end of sealing cover 8 is connected with the screw, after sealing cover 8 is installed on metal base 1, the screw is used for fixing, the sealing property is ensured, the firmness of installation is ensured, interference fit is not needed for installation, and the damage of internal components and heat dissipation silica gel layer caused by extrusion during installation can be avoided.

[0018] Fixed sheet 3 is an arc-shaped structure, fixed sheet 3 is an elastic iron sheet, the groove bottom of fixed groove 4 is an arc-shaped structure, fixed sheet 3 and fixed groove 4 are clamped, and metal base 1 is positioned and connected with installation plate 2.

[0019] The four sides of the heat dissipation guide plate 10 are inclined structures, the top end of the heat dissipation guide plate 10 abuts against the inner wall of the heat dissipation groove, the diameter of the mounting column 14 is smaller than that of the fixing column 13, the mounting portion 71 is horizontally arranged, the mounting column 14 is inserted into the mounting column 14, the locking ring 16 is located at the upper end of the mounting portion 71, the side end of the mounting column 14 is provided with two locking grooves 15, the locking grooves 15 are annular structures, the upper end of the mounting column 14 is inserted into the clamping sleeve 17, the locking ring 16 and the inner wall of the clamping sleeve 17 are both provided with protrusions, the locking grooves 15 and the protrusions are clamped, the limiting portion 73 is inserted into the mounting base 5, then the mounting portion 71 is inserted into the mounting column 14, the locking ring 16 is inserted into the mounting column 14, and the locking ring 16 extrudes and fixes the positioning piece 7; when the semiconductor chip 6 is installed, the positioning piece 7 can limit and fix the installation of the semiconductor chip 6, so that the semiconductor chip is prevented from being dislocated.

[0020] The positioning portion 72 is in V-shaped structure, the lower end of the positioning plate 12 is inserted into the positioning portion 72, the limiting portion 73 is vertically arranged, the limiting portion 73 is inserted into the mounting base 5, the semiconductor chip 6 is located in the middle of the positioning portion 72, when the sealing cover 8 is encapsulated, the positioning plate 12 is inserted into the positioning portion 72, the sealing cover 8 is preliminarily positioned, the clamping sleeve 17 can be positioned and inserted into the mounting column 14, so that the sealing cover 8 is fixed and limited, and the sealing cover 8 is prevented from extruding the internal components during installation.

[0021] Although the embodiments of the present application have been shown and described, it should be stressed that the above description is merely an introduction and description of the use mode of the embodiments of the present application, and does not limit the present application in any form. It can be understood by those skilled in the art that the embodiments can be changed, modified, replaced and changed in various ways without departing from the principles and spirits of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A semiconductor module packaging structure, including a metal base (1), characterized in that: The lower end of the metal base (1) is provided with a groove, and a fixing groove (4) is provided on the inner wall of the groove. A mounting plate (2) is inserted into the groove. Fixing plates (3) are fixedly connected to both sides of the mounting plate (2). A mounting base (5) is fixedly connected to the upper end of the metal base (1). A semiconductor chip (6) is provided on the upper end of the mounting base (5). A sealing cover (8) is provided above the mounting base (5). A heat dissipation groove is provided on the middle inner wall of the sealing cover (8). Multiple heat dissipation fins (9) are fixedly connected in the heat dissipation groove. A heat dissipation guide plate (10) is fixedly connected to the lower end of the heat dissipation fins (9). The heat dissipation guide plate (10) is fixedly connected to the lower end of the heat dissipation fins (9). 0) The lower end is directly opposite the semiconductor chip (6). A heat dissipation silicone layer (11) is provided between the heat dissipation guide plate (10) and the semiconductor chip (6). The four sides of the mounting base (5) are provided with positioning pieces (7). The positioning pieces (7) are composed of mounting part (71), positioning part (72) and limiting part (73). The upper end of the metal substrate is provided with four fixing posts (13). The upper end of the fixing posts (13) is fixedly connected with mounting posts (14). A locking ring (16) is sleeved on the mounting posts (14). A snap sleeve (17) and a positioning plate (12) are fixedly connected to the inner wall of the sealing cover (8).

2. The packaging structure of the semiconductor module according to claim 1, characterized in that: The upper end of the metal base (1) is a convex-shaped structure. The upper end of the metal base (1) is provided with a sealing groove at the corner. The sealing groove is a U-shaped structure. The lower end of the sealing cover (8) is inserted into the sealing groove. The lower end of the metal base (1) is provided with screws. The lower end of the sealing cover (8) is connected to the screws.

3. The packaging structure of the semiconductor module according to claim 1, characterized in that: The fixing piece (3) has an arc-shaped structure and is an elastic iron sheet. The bottom of the fixing groove (4) has an arc-shaped structure, and the fixing piece (3) and the fixing groove (4) are engaged.

4. The packaging structure of the semiconductor module according to claim 1, characterized in that: The four sides of the heat dissipation guide plate (10) are inclined, and the top of the heat dissipation guide plate (10) abuts against the inner wall of the heat dissipation groove.

5. The packaging structure of the semiconductor module according to claim 1, characterized in that: The diameter of the mounting post (14) is smaller than that of the fixed post (13). The mounting part (71) is horizontally arranged. The mounting post (14) is inserted into the mounting post (14). The locking ring (16) is located at the upper end of the mounting part (71).

6. The packaging structure of the semiconductor module according to claim 1, characterized in that: The mounting post (14) has two locking grooves (15) on its side. The locking grooves (15) are annular structures. The upper end of the mounting post (14) is inserted into the snap sleeve (17). The inner walls of the locking ring (16) and the snap sleeve (17) are provided with protrusions. The locking grooves (15) and the protrusions snap together.

7. The packaging structure of the semiconductor module according to claim 1, characterized in that: The positioning part (72) has a V-shaped structure. The lower end of the positioning plate (12) is inserted into the positioning part (72). The limiting part (73) is vertically arranged and is inserted into the mounting base (5). The semiconductor chip (6) is located in the middle of the limiting part (73).

Images