OPTOELECTRONIC DEVICE AND METHOD FOR OPERATING AN OPTOELECTRONIC DEVICE

Abstract

An optoelectronic device comprises an optoelectronic component structure with at least one optoelectronic component and an electronic semiconductor chip for electrically controlling the optoelectronic component structure. The electronic semiconductor chip includes an integrated network adapter for establishing an internet connection. When an internet connection is established, the electronic semiconductor chip is configured to perform data communication with an internet server regarding the operation of the optoelectronic component structure. A method for operating an optoelectronic device is further described.

Description

[0001] The present invention relates to an optoelectronic device. The invention further relates to a method for operating an optoelectronic device.

[0002] An optoelectronic device can comprise an optoelectronic component structure with one or more optoelectronic components and an electronic semiconductor chip for electrically controlling the component structure. The optoelectronic device can, for example, be used as a light source for a vehicle headlight and, for this purpose, comprise at least one light-emitting semiconductor chip as its optoelectronic component structure. Operation of the device can be controlled by a higher-level control device and can be carried out using operating information tailored to the optoelectronic component structure.

[0003] The production of an optoelectronic device for use in a vehicle headlight can be divided among several manufacturers. Initially, a primary manufacturer or supplier can provide a starting device comprising the electronic semiconductor chip and the optoelectronic component structure, along with the associated operating information. A subsequent manufacturer can then perform steps such as assembly with further components and integration or uploading the operating information to a storage device. The latter can be quite complex, considering factors such as training and the provision of suitable software and hardware.

[0004] The object of the present invention is to provide a solution for an improved optoelectronic device.

[0005] This problem is solved by the features of the independent claims. Further advantageous embodiments of the invention are specified in the dependent claims.

[0006] According to one aspect of the invention, an optoelectronic device is proposed. The device comprises an optoelectronic component structure with at least one optoelectronic component and an electronic semiconductor chip for electrically controlling the optoelectronic component structure. The electronic semiconductor chip has an integrated network adapter for establishing an internet connection. Furthermore, the electronic semiconductor chip is configured to perform data communication with an internet server regarding the operation of the optoelectronic component structure when an internet connection is established.

[0007] In the proposed optoelectronic device, the electronic semiconductor chip serves not only to electrically control and thus supply power to the optoelectronic component structure. The electronic semiconductor chip is also used to perform data communication with an internet server regarding the operation of the optoelectronic component structure. Accordingly, the electronic semiconductor chip has an integrated network adapter for establishing an internet connection. This design simplifies the manufacturing and implementation of the optoelectronic device. This can be advantageous when the process is distributed among multiple manufacturers. Furthermore, the data communication enables updates, software updates, and the creation of a history and diagnostics related to the operation of the optoelectronic device.

[0008] Further possible details and embodiments that may be considered for the optoelectronic device are described in more detail below.

[0009] As mentioned above, the electronic semiconductor chip is designed, among other things, to electrically control the optoelectronic component structure and thus provides it with an electrical supply. For this electrical control, the electronic semiconductor chip can have contacts that are electrically connected to mating contacts of the optoelectronic component structure. This electrical connection can be implemented in various ways. An electrically conductive connecting element (for example, solder or electrically conductive adhesive) and, if necessary, components such as electrical conductor structures can be used. It is also possible that the optoelectronic component structure is arranged on the electronic semiconductor chip. The optoelectronic device can also include other components such as a substrate and / or a housing. The aforementioned conductor structures can be separated from the substrate or housing.Its housing is enclosed.

[0010] The internet connection of the electronic semiconductor chip and the data communication conducted via this connection with the internet server can involve at least one other device or communication device, system, and / or network, such as a local network or intranet. The latter could, for example, be the intranet of a manufacturer or production line, a workshop, or even a device containing the optoelectronic device, such as a vehicle or smartphone. Furthermore, a higher-level control device can be involved in the internet connection and data communication, through which the other operations of the optoelectronic device can be controlled.

[0011] To establish an internet connection and conduct data communication, the network adapter integrated into the electronic semiconductor chip can be designed to understand and apply the protocols used. This can include protocols such as the Internet Protocol (IP) or protocols from the TCP / IP protocol suite (TCP, Transmission Control Protocol).

[0012] In one embodiment, the network adapter is a wireless network adapter. This allows part of the internet connection to be implemented wirelessly, or via radio link, and therefore in a simple and straightforward manner. The wireless network adapter could, for example, be a WLAN (Wireless Local Area Network) adapter. Another example is a Bluetooth adapter.

[0013] In another embodiment, the network adapter is a wired network adapter. This allows the internet connection to be established without a wireless connection, and therefore in a secure and reliable manner. The wired network adapter could, for example, be an Ethernet adapter.

[0014] In another embodiment, the electronic semiconductor chip is configured to receive operating information used for the operation of the optoelectronic component structure during data communication. Using this operating information, the operation of the optoelectronic component structure, or its electrical control, can be carried out reliably and in accordance with relevant specifications.

[0015] The operating information can be tailored to the optoelectronic component structure and, in this context, constitute calibration information specific to that structure. This calibration information can be generated based on a measurement previously performed on the optoelectronic component structure or device. Using this calibration information, the optoelectronic component structure can be operated in such a way that deviations from target values ​​are avoided or suppressed as much as possible.

[0016] In another embodiment, the optoelectronic device includes a non-volatile memory (NVM) for storing the received operating information. In this way, after receiving and storing or uploading the operating information to the non-volatile memory, the operation of the optoelectronic component structure can be carried out reliably. The non-volatile memory can be, for example, flash memory or EEPROM (Electrically Erasable Programmable Read-Only Memory).

[0017] Storing the operating information received by the electronic semiconductor chip in the non-volatile memory device can be accomplished with the aid of an additional or intermediate component. This could, for example, be a higher-level control device, as mentioned above. In this way, the electronic semiconductor chip can be implemented with a simple and cost-effective design.

[0018] Alternatively, the use of an intermediate component can be omitted. This is the case in the following embodiment, in which the electronic semiconductor chip is configured to store the operating information in the non-volatile memory device. This allows for fast storage of the operating information.

[0019] In another embodiment, the non-volatile memory is integrated into the electronic semiconductor chip. This further facilitates the rapid storage of operating information without the use of an additional component.

[0020] In another embodiment, the electronic semiconductor chip is configured to perform the electrical control of the optoelectronic component structure based on the operating information. In this way, the operation of the optoelectronic device can be achieved with a small number of components.

[0021] In another embodiment, the optoelectronic device includes an additional electronic chip for controlling the electronic semiconductor chip. The control of the electronic semiconductor chip by the additional chip can be based on operating information. This allows for a simple and cost-effective design for the electronic semiconductor chip.

[0022] Data communication between the electronic semiconductor chip and the internet server can take place via a website or web portal provided by the internet server. The electronic semiconductor chip can be configured to access the website or web portal using its associated internet address, or IP address (Internet Protocol address). This address can be stored within the electronic semiconductor chip itself.

[0023] In another embodiment, the electronic semiconductor chip is configured to transmit an associated identifier during data communication. This identifier can (also) be stored within the electronic semiconductor chip. Based on the identifier transmitted to the internet server, which is assigned to the optoelectronic device or component structure, the device and component structure can be identified. This allows the internet server to reliably transmit operating information, tailored to and used for the operation of the optoelectronic component structure, to the electronic semiconductor chip.

[0024] In another embodiment, the electronic semiconductor chip is configured to acquire operating data during the operation of the optoelectronic component structure and to transmit this data during data communication. The electronic semiconductor chip can have one or more integrated measuring devices for acquiring the operating data. This operating data can be used, for example, for quality assurance or for the further development of the optoelectronic device. Furthermore, it is possible to generate updated operating information for the operation of the optoelectronic component structure based on the operating data, which can then be transmitted to the electronic semiconductor chip via the internet server. This operating information can be specific calibration information tailored to the component structure, as described above.

[0025] The operating data can include, for example, recorded data or trends of parameters such as electrical current or voltage, temperature, and / or data relating to the operating time of the optoelectronic device. Based on this data, updated operating or calibration information can be generated and transmitted to the electronic semiconductor chip to control the operation of the optoelectronic component structure. In this way, potential aging effects or inhomogeneities in the optoelectronic component structure can be addressed and compensated for.

[0026] The optoelectronic component structure can be designed for light emission and, for this purpose, includes at least one light-emitting component. The light-emitting component can be a light-emitting semiconductor chip such as a light-emitting diode chip or a laser diode chip. In this way, the optoelectronic device can be a lighting device. The optoelectronic device can also be used, for example, as a light source for a vehicle headlight.

[0027] For the aforementioned application, a further embodiment provides that the optoelectronic component structure comprises a pixelated light-emitting semiconductor chip with separately controllable light-emitting pixels. By appropriately electrically controlling the light-emitting semiconductor chip and its pixels, which can be done via the electronic semiconductor chip and controlled by a higher-level control device, different illumination patterns can be flexibly provided. The pixelated light-emitting semiconductor chip can be arranged on the electronic semiconductor chip.

[0028] In another embodiment, the operating information is calibration information relating to the light-emitting pixels. Using this calibration information, the electrical control and operation of the light-emitting semiconductor chip and its pixels can be carried out in such a way that any operational deviations between the pixels are suppressed or compensated, thereby producing a homogeneous illuminated image. The calibration information can, for example, relate to the brightness and / or color coordinates of the light-emitting pixels.

[0029] The optoelectronic component structure can also be configured for light detection, and for this purpose must include at least one light-detecting component. This can be a photodiode or a photodiode chip.

[0030] Depending on its design, the optoelectronic device can be used in various fields. For example, it can be used in the automotive sector for external lighting (i.e., headlight applications as described above) or internal lighting, in industrial applications, or in the consumer goods sector.

[0031] According to a further aspect of the invention, a method for operating an optoelectronic device is proposed. The optoelectronic device comprises an optoelectronic component structure with at least one optoelectronic component and an electronic semiconductor chip for electrically controlling the optoelectronic component structure. The electronic semiconductor chip has an integrated network adapter for establishing an internet connection. The method includes activating the electronic semiconductor chip to establish an internet connection, such that the electronic semiconductor chip performs data communication with an internet server regarding the operation of the optoelectronic component structure.

[0032] The proposed method can be used during the manufacturing or implementation of the optoelectronic device. This process can be simplified through data communication between the electronic semiconductor chip and the internet server. This is particularly relevant when manufacturing is distributed among multiple manufacturers. Furthermore, the data communication can be used to update and analyze the operation of the optoelectronic device.

[0033] The optoelectronic device can be configured as described above or according to one or more of the embodiments described above. Therefore, features and details mentioned above relating to the optoelectronic device can be applied to the method accordingly. Likewise, features and details described relating to the method can also apply to the optoelectronic device.

[0034] As stated above, the internet connection between the electronic semiconductor chip and the internet server can include at least one other device or communication device, system, and / or network such as a local area network or intranet. The latter could, for example, be the intranet of a manufacturer, a production line, a workshop, etc.

[0035] Activating the electronic semiconductor chip to establish the internet connection can be performed by a control device. This process can be initiated by a user or operator. The control device can be a higher-level control device, as mentioned above, which is also used to control the other operations of the optoelectronic device.

[0036] In one embodiment, the electronic semiconductor chip is activated after the optoelectronic device has been manufactured. During data communication, the electronic semiconductor chip receives operating information used to control the optoelectronic component structure. Using this operating information, the optoelectronic component structure can then be operated by electrically controlling it.

[0037] With reference to the aforementioned embodiment, the manufacturing and implementation of the optoelectronic device, distributed across multiple manufacturers as described above, can be applied. Initially, a primary manufacturer or supplier can provide a starting device comprising the electronic semiconductor chip and the optoelectronic component structure with associated operating information. A subsequent manufacturer can then perform further steps to complete the optoelectronic device. This may include adding at least one additional component (for example, a non-volatile memory device) or assembling the starting device with at least one additional component. Finally, the electronic semiconductor chip can be activated as described above to initiate the transmission of operating information from the internet server to the electronic semiconductor chip.The operational information can then be saved. The complex use of software and hardware, and the corresponding training required with a conventional method for uploading operational information, is therefore not necessary.

[0038] In another embodiment, the electronic semiconductor chip is activated after the optoelectronic device has been put into operation. In this case, the electronic semiconductor chip receives updated operating information during data communication, which is used for the operation of the optoelectronic component structure. Based on this information, the further operation of the optoelectronic component structure can then be carried out.

[0039] The aforementioned embodiment allows for an update of the optoelectronic device. This can result in improved or optimized operation, for example, in the form of greater efficiency and / or compensation for aging effects previously observed in the optoelectronic component structure. For this purpose, the electronic semiconductor chip can be activated as described above to initiate the transmission of the updated operating information from the internet server to the electronic semiconductor chip. The operating information can then be stored.

[0040] It is possible to activate the electronic semiconductor chip multiple times in succession for the purpose of transmitting and receiving (updated) operating information. After the optoelectronic device has been manufactured or implemented, an initial or original operating information can be transmitted. Subsequently, at least one further or updated operating information can be transmitted.

[0041] The operating information can be calibration information specific to the optoelectronic component structure. Based on this, the optoelectronic component structure can be operated in such a way that target specifications are adhered to as closely as possible.

[0042] In another embodiment, the received operating information is stored in a non-volatile memory device of the optoelectronic device. Based on this stored operating information, the operation of the optoelectronic component structure can be reliably carried out. Storing the operating information in the non-volatile memory device can be accomplished with the aid of an additional or intermediate component, such as a higher-level control device, or by the electronic semiconductor chip itself. The non-volatile memory device can be a separate component from the electronic semiconductor chip. It is also possible for the non-volatile memory device to be integrated into the electronic semiconductor chip.

[0043] In a further embodiment, the electronic semiconductor chip transmits an associated identifier during data communication. This identifier, which is assigned to the optoelectronic device or component structure, enables identification of the device and component structure. Accordingly, the internet server can reliably transmit operating information, specific to and tailored to the optoelectronic device, to the electronic semiconductor chip during data communication.

[0044] In a further embodiment, the electronic semiconductor chip transmits operating data from the optoelectronic component structure during data communication. This operating data was acquired by the electronic semiconductor chip during the operation of the optoelectronic component structure. The operating data can be used, for example, for quality assurance or further development of the optoelectronic device. Furthermore, the operating data can be used to generate updated operating or calibration information tailored to the optoelectronic component structure, which can then be transmitted to the electronic semiconductor chip.

[0045] With regard to creating updated operating or calibration information, it may be considered, either additionally or alternatively, to perform a measurement on the optoelectronic device or component structure to provide measurement data and to transmit this measurement data to the internet server. The updated operating or calibration information can then be created taking into account this measurement data and, if necessary, also the operating data acquired by the electronic semiconductor chip and transmitted to the internet server.

[0046] The advantageous embodiments and further developments of the invention described above and / or set out in the dependent claims can be used individually or in any combination with each other, except, for example, in cases of clear dependencies or incompatible alternatives.

[0047] The properties, features, and advantages of this invention described above, as well as the manner in which they are achieved, will become clearer and more readily understandable in connection with the following description of exemplary embodiments, which are explained in more detail in conjunction with the schematic drawings. These show: Fig. 1 and Fig. 2 different views of an optoelectronic device used as a light source comprising an LED chip and an electronic semiconductor chip for electrically controlling the LED chip, wherein the electronic semiconductor chip has an integrated network adapter; Fig. 3 a representation of a lighting device with associated control device; Fig. 4. A representation of an established internet connection using a wireless network adapter; Fig. 5. A representation of an established internet connection using a wired network adapter; Fig. 6. A representation of another optoelectronic device used as a light source; Fig. 7 and Fig. 8 Flowcharts of procedures in which data communication with an Internet server takes place; Fig. 9 a block diagram to illustrate the manufacture and implementation of a lighting device; Fig. 10 a representation of another lighting device with associated control device; Fig. 11 a representation of another optoelectronic device used as a light source; Fig. 12 a representation of another lighting device with associated control device; and Fig. 13 and Fig. 14 illustrations of other optoelectronic devices.

[0048] Based on the schematic figures, embodiments of an optoelectronic device 100, 101 and a method for operating them are described. It should be noted that the schematic figures cannot be drawn to scale. Therefore, components and structures shown in the figures may be exaggerated in size or reduced in size for better understanding. Furthermore, it should be noted that features and details mentioned in relation to one embodiment also apply to other embodiments, and that several embodiments and their features can be combined. However, identical features can only be described in detail with respect to one embodiment.Regarding the figures, it should be noted that in side views, the upper sides of components (such as a support 130) are referred to as the front, and the corresponding lower sides as the back. Similarly, the terms "front" and "back" are used in reference to components located there (such as contacts).

[0049] The Fig. 1 and Fig. Figure 2 shows a side view and a top view of an optoelectronic device 100 according to one possible embodiment. The optoelectronic device 100 serves as the light source for a lighting device 101 for a vehicle headlight. Accordingly, the term light source 100 will be used in the following. The light source 100 comprises a light-emitting optoelectronic component structure 110 and an electronic semiconductor chip 120 for electrically controlling and energizing the component structure 110. The electronic semiconductor chip 120 can also be referred to as a driver chip or driver IC (integrated circuit). In this case, the optoelectronic component structure 110 includes a light-emitting optoelectronic semiconductor chip in the form of a monolithically constructed pixelated LED chip 111 (light-emitting diode).

[0050] The LED chip 111 has a large number of separately controllable light-emitting pixels 112. This differs from the schematic representation in Fig. 2. A much larger number of pixels 112 can be present, for example, in the four- or five-digit range. The pixels 112 can have lateral dimensions in the micrometer range and thus be micro-LEDs. The LED chip 111 is arranged on a front side of the electronic semiconductor chip 120 and is electrically connected to the electronic semiconductor chip 120 at this point. The electronic semiconductor chip 120 has front-side contacts which are electrically connected to corresponding rear-side contacts of the LED chip 111 using an electrically conductive connecting medium (for example, solder or electrically conductive adhesive) (not shown). In this way, the electronic semiconductor chip 120 can selectively energize individual, several, or all pixels 112 of the LED chip 111 and thereby electrically control them to emit light.In illumination mode, light radiation can be emitted from the LED chip 111 in one direction away from the electronic semiconductor chip 120 (not shown). The electronic semiconductor chip 120 also includes electronic circuit components (not shown) for electrical control and other functions.

[0051] Other components of the in the Fig. 1 and Fig. The two light sources 100 shown in Figure 2 consist of a carrier 130 and a surrounding housing frame 135. The electronic semiconductor chip 120 and the housing frame 135 are arranged on the front side of the carrier 130, and the housing frame 135 surrounds the electronic semiconductor chip 120 with the LED chip 111 mounted on it. The housing frame 135 can be a molded body made of a plastic material. The carrier 130 can be in the form of a printed circuit board (PCB). Other configurations are also possible, for example, in the form of a ceramic carrier. The carrier 130 has electrical conductor structures (not shown) with front and rear contacts, the front contacts of the carrier 130 being electrically connected to (further) front contacts (not shown) of the electronic semiconductor chip 120 via bond wires 139.In this way, the electronic semiconductor chip 120 can be electrically supplied via the carrier 130, and electrical control signals for controlling the lighting operation can be supplied to the electronic semiconductor chip 120 via the carrier 130.

[0052] The light source 100 may also include other components not shown. In this respect, the LED chip 111 may have a conversion layer for radiation conversion, for example, produced by spraying, which is arranged on a semiconductor body of the LED chip 111. The conversion layer allows a portion of the primary light radiation generated during operation to be converted into secondary light radiation. The primary and secondary light radiation can be blue and yellow, respectively, so that overall white light radiation can be emitted by the light source 100. Another possible component is a reflective potting material, which may be present in an area between the electronic semiconductor chip 120 and the housing frame 135, as well as on the front edge of the electronic semiconductor chip 120, and in which the bond wires 139 may be embedded.

[0053] The light source 100 is characterized by the fact that the electronic semiconductor chip 120, used for the electrical control of the optoelectronic component structure 110, or in this case the LED chip 111, has an integrated network adapter 121, via which the electronic semiconductor chip 120 can establish an internet connection. The electronic semiconductor chip 120 thus serves not only for the electrical control and therefore the electrical supply of the LED chip 111. The electronic semiconductor chip 120 is also used to carry out data communication with an internet server 180, specifically regarding the operation of the LED chip 111. This will be discussed in more detail below.

[0054] As stated above, the light source 100 is intended for use in a vehicle headlight. For illustration, the following is shown. Fig. 3 A side view of a further optoelectronic device 101 according to a possible embodiment, which includes the light source 100 described above. In Fig. For the sake of clarity, a simplified representation of the light source 100 has been chosen in Figure 3 and the following figures, in which components such as the housing frame 135 and the bond wires 139 have been omitted. The optoelectronic device 101 serves as the lighting device of a headlight (not shown) and is accordingly referred to below as the lighting device 101.

[0055] The lighting device 101, in addition to the light source 100, has a carrier plate 140. The light source 100 is located on the front of the carrier plate, and further components of the lighting device 101, namely an electronic add-on chip 145 and a non-volatile memory device 150 (NVM), are arranged to the side. The carrier plate 140 can be a printed circuit board (PCB). The carrier plate 140 has electrical conductor structures (not shown) with front-facing contacts that are electrically connected to mating contacts of the light source 100, the add-on chip 145, and the memory device 150 (not shown).With respect to the light source 100, the front contacts of the carrier plate 140 can be connected to the rear contacts of the carrier 130 of the light source 100 using an electrically conductive connecting medium (for example, solder or electrically conductive adhesive), so that an electrical connection exists between the conductor structures of the carrier 130 and the carrier plate 140. A corresponding electrical connection can exist with respect to the electronic add-on chip 145 and the non-volatile memory device 150. The electronic add-on chip 145 can be an ASIC chip (Application-Specific Integrated Circuit). The non-volatile memory device 150 can be or include an EEPROM (Electrically Erasable Programmable Read-Only Memory). Alternatively, the memory device 150 can be or include a flash memory.

[0056] As in Fig. As shown schematically in Figure 3, a higher-level control device 160 is assigned to the lighting device 101, via which the operation of the lighting device 101 can be controlled. The control device 160 can be implemented in the form of a microcontroller or may include a microcontroller. The control device 160 is electrically connected to the lighting device 101 or to conductor structures of the carrier plate 140 in a suitable manner. During lighting operation, the control device 160 can transmit corresponding commands in the form of electrical control signals to the electronic auxiliary chip 145 via the carrier plate 140 or its conductor structures. The auxiliary chip 145 can then transmit corresponding commands or electrical control signals for controlling the light source 100 to the electronic semiconductor chip 120 of the light source 100, also via the carrier plate 140 or its conductor structures and via the carrier 130 of the light source 100.Subsequently, the electronic semiconductor chip 120 can perform a corresponding electrical control of the LED chip 111 of the light source 100, and corresponding light patterns can be generated via the respective energized and thus light-emitting pixels 112 of the LED chip 111 (not shown).

[0057] The operation of the light source 100, or rather its electronic semiconductor chip 120, is controlled by the additional chip 145 using operating information stored in the memory device 150. This information is specific calibration data tailored to the light source 100 and its optoelectronic component structure 110, or LED chip 111. The calibration data, which can also be referred to as configuration data, may be in the form of a file and may have been generated based on a measurement previously performed on the light source 100 or the LED chip 111. In this way, the light source 100 and the LED chip 111 can be operated in such a way that target specifications are adhered to as closely as possible. The calibration data may relate to the brightness and / or color coordinates of the pixels 112 of the LED chip 111, enabling operation with high brightness or color temperature.Color homogeneity can be achieved, and thus homogeneous light patterns can be generated. To control the operation of the light source 100 based on this operating information, the additional electronic chip 145, which is electrically connected to the non-volatile storage device 150 via the carrier plate 140 or its conductor structures, can access the storage device 150. As explained in more detail below, an internet connection established via the electronic semiconductor chip 120 of the light source 100 can be used to provide or integrate the operating information into the lighting device 101.

[0058] The execution of internet access, which the electronic semiconductor chip 120 can perform via its network adapter 121, takes place in a manufactured state of the lighting device 101 in which the light source 100 is enclosed by the lighting device 101. With regard to internet access, various configurations for the network adapter 121 are possible.

[0059] Fig. Figure 4 shows a possible variant in which the network adapter 121 of the electronic semiconductor chip 120 of the light source 100 is wireless and can therefore communicate via radio connection. Fig. Figure 4 further illustrates an internet connection between the network adapter 121 and an internet server 180, via which data communication can take place between the network adapter 121 and the internet server 180 concerning the operation of the LED chip 111 of the light source 100. The network adapter 121 is connected wirelessly to a wireless communication device 170, which in turn is connected to the internet 190.

[0060] Internet server 180 is also connected to, or rather, part of, Internet 190. Data communication between network adapter 121 and Internet server 180 thus involves radio communication between network adapter 121 and wireless communication device 170, as well as data exchange between communication device 170 and Internet server 180 via Internet 190. This differs from the schematic representation in Fig. 4. In the connection between the network adapter 121 and the internet server 180, at least one other component, system and / or network not shown, such as an intranet, may be involved.

[0061] With regard to the wireless configuration of network adapter 121, it is possible that network adapter 121 is, for example, a WLAN adapter (Wireless Local Area Network). Accordingly, communication device 170 can be a WLAN communication device or a WLAN router, or it can include such a device. Alternatively, network adapter 121 can have a different configuration, for example, in the form of a Bluetooth adapter. In this case, communication device 170 can be a Bluetooth communication device, or it can include such a device.

[0062] Fig. Figure 5 illustrates an alternative variant in which the network adapter 121 of the electronic semiconductor chip 120 of the light source 100 is wired. Fig. Figure 5 further illustrates an internet connection between network adapter 121 and an internet server 180, enabling data communication between network adapter 121 and internet server 180 regarding the operation of the LED chip 111 of the light source 100. Network adapter 121 is connected via a wired connection to a communication device 171, which in turn is connected to the internet 190. Internet server 180 is also connected to, or rather, is part of, the internet 190. The data communication between network adapter 121 and internet server 180 thus includes data exchange between network adapter 121 and communication device 171, as well as data exchange between communication device 171 and internet server 180 via the internet 190.In this configuration, the network adapter 121 can be an Ethernet adapter, and the communication device 171 can be an Ethernet communication device.

[0063] At the in Fig. In the embodiment shown in Figure 5, the connection between the network adapter 121 and the communication device 171 can be implemented as follows. The network adapter 121 can be connected via internal conductors of the electronic semiconductor chip 120 to rear contacts of the electronic semiconductor chip 120, which in turn, as described above, are connected to front contacts and thus conductor structures of the carrier 130 of the light source 100. In the case of the lighting device 101 (see Figure 5), the connection between the network adapter 121 and the communication device 171 can be implemented as follows. Fig. 3) Furthermore, a connection exists between conductor structures of the carrier 130 and conductor structures of the carrier plate 140. In this case, the communication device 171 can be connected to conductor structures of the carrier plate 140, so that the connection between the network adapter 121 and the communication device 171 can be established partly via the carrier 130 and the carrier plate 140.

[0064] Accordingly Fig. 4 can be in relation to Fig. 5. The connection between the network adapter 121 and the internet server 180 must involve at least one other component, system, and / or network, such as an intranet. The higher-level control device 160 (see below) can also be used. Fig. 3) be included by connecting the control device 160 to and upstream of the communication device 171, or by integrating the communication device 171 into the control device 160 (not shown).

[0065] For internet access and data communication with the internet server 180, the network adapter 121 of the electronic semiconductor chip 120 is designed to understand and use the corresponding protocols. This includes protocols such as the Internet Protocol (IP) and protocols from the TCP / IP protocol suite (TCP, Transmission Control Protocol). Other possible protocols include, for example, [the following]. Fig. 4, a Wi-Fi or Bluetooth protocol, and, with regard to Fig. 5, an Ethernet protocol.

[0066] The in the Fig. 4 and Fig. Figure 5 shows an internet connection and data communication between the electronic semiconductor chip 120 and the internet server 180. This connection is based on a website or web portal provided by the internet server 180. The electronic semiconductor chip 120 is configured to access the website or web portal using its associated internet address or IP address (Internet Protocol address). This address is stored in the electronic semiconductor chip 120.

[0067] The electronic semiconductor chip 120 of the light source 100 can, in addition to components such as circuit structures, the network adapter 121, etc., include further components. In this respect, it shows Fig. 6. One possible embodiment in which the electronic semiconductor chip 120 of the light source 100 has an integrated measuring device 125. The measuring device 125 serves to record operating data during the operation of the light source 100 or of its LED chip 111. The operating data, which can be stored in the electronic semiconductor chip 120 of the light source 100, can also be the subject of data communication with the internet server 180.

[0068] The operating data may include, for example, recorded data or trends of parameters relating to the operation of the LED chip 111, such as electrical current or voltage, temperature, as well as data relating to the operating time of the light source 100 or the LED chip 111. Furthermore, it is possible that the electronic semiconductor chip 120 is designed to record several of the aforementioned operating data and accordingly has several measuring devices 125.

[0069] The implementation of internet access by the electronic semiconductor chip 120 of the light source 100 can be carried out according to the in Fig. The process described in the flowchart shown in section 7 is applied. In process step 201, the lighting device 101, comprising the light source 100, is first manufactured. Step 201 includes providing or manufacturing the light source 100 and providing associated operating information used for the operation of the light source 100 or its LED chip 111. As stated above, the operating information is specific calibration information relating to the LED chip 111 and its light-emitting pixels 112. The calibration information can be in the form of a calibration file and can be generated by performing a measurement on the light source 100 or the LED chip 111. In this context, a sorting process called binning, in which the light source 100 is generated together with other light sources, can also be performed. Accordingly, the calibration information can also be referred to as BIN information or BIN file.In step 201, further components are added or assembled to manufacture the lighting device 101. With reference to the in . Fig. In the embodiment shown, these additional components include the carrier plate 140, the electronic add-on chip 145, and the non-volatile memory device 150. Furthermore, step 201 may involve the integration or implementation of the lighting device 101 in an end product such as a vehicle headlight or vehicle. Step 201 may also establish a connection with the higher-level control device 160.

[0070] In a further procedural step 202 (see Fig. 7) The electronic semiconductor chip 120 of the light source 100 is activated to establish an internet connection, so that the electronic semiconductor chip 120 performs data communication 210 with an internet server 180 regarding the operation of the optoelectronic component structure 110, or in this case, the LED chip 111. As indicated above, the internet connection can be implemented using a local network or intranet, in this case, an intranet of a manufacturer or production line. Activation can be carried out by a suitable control device after initiation by a user or operator. The control device can be the higher-level control device 160. The control device in question can be accessed, inter alia, via the carrier 140 and its conductor structures, and optionally with the additional aid of...The electronic add-on chip 145 sends an activation command to the electronic semiconductor chip 120 of the light source 100.

[0071] As explained above, data communication 210 takes place on the basis of a website or web portal provided by the internet server 180. The electronic semiconductor chip 120 accesses the relevant website or web portal using an associated internet address stored in the electronic semiconductor chip 120.

[0072] In the course of data communication 210 (step 202), the electronic semiconductor chip 120 also transmits an associated identifier or identification information (ID) to the Internet server 180, as described in Fig. 7 is represented by an arrow 211. The identifier is also stored in the electronic semiconductor chip 120. It is possible that the aforementioned internet address and the identifier are stored in a ROM (Read-Only Memory) or a comparable, read-only memory of the electronic semiconductor chip 120. Based on the identifier assigned to the light source 100 or the LED chip 111, the internet server 180 can identify the light source 100 or the LED chip 111. Subsequently, or based on this, the internet server 180 transmits the specific calibration information (BIN information or BIN file) belonging to the light source 100 or the LED chip 111, as shown in Fig. 7 is represented by an arrow 212.

[0073] The calibration information received by the electronic semiconductor chip 120 of the light source 100 is further stored in the non-volatile storage device 150 of the lighting device 101 (see Figure 1). Fig. 3) stored. It is possible for the electronic semiconductor chip 120 itself (i.e., in this case via the carrier plate 140 and its conductor structures) to access the storage device 150 and store the calibration information there. Alternatively, the storage of the calibration information received by the electronic semiconductor chip 120 can be carried out via another or intermediate component. This could be the higher-level control device 160, which is appropriately connected to the light source 100 for this purpose, or the additional electronic chip 145. The storage of the calibration information can be carried out according to the in Fig. Step 202, as shown in the illustration, can be attributed to step 7.

[0074] Subsequently (or after implementation in a final product), the lighting device 101 is put into operation. This includes carrying out the lighting operation as described above. The calibration information received during data communication between the electronic semiconductor chip 120 of the light source 100 and the internet server 180 is used so that the lighting operation can be carried out according to the target specifications.

[0075] Data communication between the electronic semiconductor chip 120 of the light source 100 and the internet server 180 can occur not only once, but also multiple times. To illustrate such a procedure, the following is shown. Fig. 8. Another flowchart, which is an extension of the flowchart from Fig. Figure 7 represents the process. First, the above-described process steps 201 and 202 are carried out. Step 201 comprises providing the light source 100 along with the associated calibration information and manufacturing the lighting device 101 (and, if applicable, its implementation). Step 202 comprises the initial activation of the electronic semiconductor chip 120 to establish an internet connection, so that the electronic semiconductor chip 120 performs initial data communication 210 with the internet server 180. During data communication 210, calibration information belonging to the light source 100 or the LED chip 111 is transmitted. This is initial calibration information. It is stored in the non-volatile memory device 150.

[0076] Subsequently (or after implementation in a final product), the lighting device 101 is put into operation. Lighting operation takes place using the calibration information. Fig. In step 8, the commissioning of the lighting device 101 is not shown in a separate step.

[0077] In a subsequent process step 203, the electronic semiconductor chip 120 of the light source 100 is activated again to establish an internet connection, so that the electronic semiconductor chip 120 performs further data communication 210 with the internet server 180 concerning the operation of the optoelectronic component structure 110, or in this case, the LED chip 111. Similarly, activation can be carried out by a suitable control device (for example, the control device 160) after initiation by a user or operator. For data communication 210, the electronic semiconductor chip 120 again calls up the website or web portal provided by the internet server 180 using the internet address. Here too, the electronic semiconductor chip 120 transmits the associated identifier (ID) to the internet server 180 (arrow 211). Thereupon, orBased on this, the internet server 180 sends calibration information (BIN information or BIN file, arrow 213) belonging to the light source 100 or the LED chip 111 to the electronic semiconductor chip 120. This is updated calibration information that can be used to recalibrate the light source 100 or the LED chip 111, replacing the first or original calibration information, and is also stored in the non-volatile memory device 150 of the lighting device 101 (see . Fig. 3) is stored. According to the description above, this process can be carried out by the electronic semiconductor chip 120 itself or via an intermediate component (for example, the control device 160 or the electronic auxiliary chip 145).

[0078] The updated calibration information can be used to optimize the operation of the light source 100 and the lighting device 101. This could include, for example, achieving greater efficiency and / or compensating for aging effects previously observed on the LED chip 111, such as burn-in. The updated calibration information may be generated based on a measurement performed on the light source 100.

[0079] In this respect, the following can be used: Fig. 6. The described design of the electronic semiconductor chip 120 with one or more integrated measuring devices 125 for acquiring operating data of the LED chip 111 is used. As in Fig. As indicated by arrow 214, the electronic semiconductor chip 120 can transmit this operating data to the Internet server 180 as part of data communication 210. The updated calibration information can be created using the transmitted operating data and then transmitted from the Internet server 180 to the electronic semiconductor chip 120 (arrow 213). The creation of the updated calibration information can be performed by the Internet server 180.

[0080] Additionally or alternatively, measurement data obtained externally by measuring the light source 100 or the lighting device 101 can be transmitted to the internet server 180, as shown in Fig. 8 is indicated by an arrow 215. The updated calibration information can be created by the Internet server 180, taking into account these measurement data (and, if applicable, the operating data transmitted by the electronic semiconductor chip 120), and then transmitted to the electronic semiconductor chip 120 (arrow 213).

[0081] As mentioned above, the light source 100 and the lighting device 101 are used in a vehicle headlight. Calibration or recalibration can be performed in conjunction with a workshop visit, for example, as part of a service appointment or to replace a defective or accident-damaged headlight and subsequently calibrate it. In the workshop, a special measuring device or a smartphone with a suitable application can be used to capture the light pattern of the LED chip 111, and the corresponding measurement data can be transmitted to the internet server 180 (arrow 215). A new calibration information or BIN file can then be created and sent to the electronic semiconductor chip 120 (arrow 213).In this example, the internet connection between the electronic semiconductor chip 120 and the internet server 180 can be implemented with the involvement of an intranet of the workshop.

[0082] Data such as luminance can also be collected using cameras integrated into the vehicle.

[0083] The relevant measurement data can be recorded in a suitable measurement environment (for example, a darkened room with a screen). Furthermore, it is possible to record measurement data relating to luminance or light color over time during the operation of the lighting device 101 using the vehicle cameras and then transmit this data to the internet server 180 during a workshop visit (arrow 215). This can be used to detect relatively large deviations from the target values.

[0084] The lighting device 101 is then restarted, with a lighting operation being performed using the updated calibration information. If necessary, step 203 can then be performed at least one more time to provide a further update regarding the operation of the lighting device 101.

[0085] The manufacture and implementation of the lighting device 101 can be divided among different manufacturers. The data communication with an internet server 180 described above offers a simplification in this context. This is illustrated by the block diagram of Fig. 9 clearly. Here, an initial manufacturer or supplier 221 provides the light source 100 and associated (initial) calibration information 230. A subsequent manufacturer 222 assembles the light source with further components, thereby producing the lighting device 101. This device can then be implemented in an end product such as a vehicle. The initial manufacturer 221 also makes the calibration information 230 available for download on a web portal 240 provided by an internet server 180. Initial internet access 250 to the web portal 240, and thus data communication with the internet server 180, can be initiated by the manufacturer 222 of the lighting device 101 during or after its production. The calibration information 230 provided by the initial manufacturer 221 can then be accessed by the manufacturer 222 of the lighting device 101.The original calibration information 230 for the electronic semiconductor chip 120 can be transferred and integrated or stored in the lighting device 101. No complex software or hardware is required on the part of the manufacturer 222. Furthermore, after implementation or commissioning of the lighting device 101, another internet connection 251 to the web portal 240 can be established to provide an update for the operation of the lighting device 101. Updated calibration information for the electronic semiconductor chip 120 can then be transferred and integrated or stored in the lighting device 101.

[0086] The following section explains further variants and configurations that may be considered for an optoelectronic device 100, 101 described here, and its operation, including internet access and data communication with an internet server 180. Similar features and aspects, as well as identical and equivalent components, are not described in detail again below. For details, please refer to the description above. Furthermore, the possibility of combining features from two or more of the configurations described here is noted.

[0087] Fig. Figure 10 shows a side view of a further embodiment of the lighting device 101, with a representation of the control device 160 associated with the lighting device 101. In contrast to Fig. 3 indicates the lighting device 101 of Fig. 10 no additional electronic chip 145. Accordingly, the design of Fig. 10 can be understood as the integration of the additional chip 145 into the electronic semiconductor chip 120 of the light source 100. The electronic semiconductor chip 120 can be an ASIC chip. During illumination operation, the control device 160 can transmit commands in the form of electrical control signals to the electronic semiconductor chip 120 via the carrier plate 140 and the carrier 130 or conductor structures thereof. The electronic semiconductor chip 120 can then electrically control the LED chip 111 of the light source 100 accordingly. The electronic semiconductor chip 120 can perform the electrical control of the LED chip 111 using the operating or calibration information stored in the non-volatile memory device 150. For this purpose, the electronic semiconductor chip 120 is connected via the carrier 130 and the carrier plate 140 or conductor structures thereof.Conductor structures of the same are electrically connected to the storage device 150, so that the electronic semiconductor chip 120 can access the storage device 150.

[0088] The electronic semiconductor chip 120 of the in Fig. The light source 100 shown in Figure 10 also features the integrated network adapter 121. This allows the electronic semiconductor chip 120 to perform internet access, as described above, for the purpose of data communication with an internet server 180.

[0089] The same applies to the in Fig. 11 Light source 100 shown in a side view, which is a further development of light source 100 of Fig. 10 represents. Fig. Figure 12 shows a side view of the lighting device 101 with the light source 100. Fig. 11, including a representation of the associated control device 160. In contrast to the previously described embodiments, the non-volatile memory device 150 used to store the operating or calibration information is integrated into the electronic semiconductor chip 120 of the light source 100. Accordingly, the Fig. Figure 12 shows the lighting device 101, the light source 100 arranged on the carrier plate 140, and no further non-volatile storage device to the side of the light source 100. In lighting mode, the electronic semiconductor chip 120 can electrically control the LED chip 111 based on the operating or calibration information stored in its own non-volatile storage device 150. As described above, the relevant information can be received by the electronic semiconductor chip 120 during data communication with an internet server 180 and then stored by the semiconductor chip 120 in the non-volatile storage device 150.

[0090] Further possible modifications may be considered with regard to the optoelectronic component structure 110.

[0091] This is the case with the in Fig. Figure 13 shows a further optoelectronic device 100, which can be used, for example, in a mobile device such as a smartphone (not shown). The optoelectronic component structure 110 comprises several or three optoelectronic components 115. The device 100 also has a carrier 131 on the front of which the components 115 and the electronic semiconductor chip 120 used for electrically controlling the components 115 are arranged side by side. The carrier 131 has electrical conductor structures with front-facing contacts, which are electrically connected to contacts of the electronic semiconductor chip 120 and the optoelectronic components 115 (not shown). In this way, the electronic semiconductor chip 120 is electrically connected to the components 115, and the electronic semiconductor chip 120 can electrically control and energize the components 115.The optoelectronic components 115 can be light-emitting semiconductor chips 115.

[0092] The in Fig. The optoelectronic device 100 shown in Figure 13 can, for example, be an RGB component. The semiconductor chips 115 can be LED chips and designed to generate different light radiations, i.e., red, green, and blue light radiation. The LED chips can also be micro-LEDs. The same applies to the following variant.

[0093] Another possible embodiment, which is suitable for device 100 of Fig. One of the options that could be considered is an RGI component. The semiconductor chips could be 115 LED chips, and be designed to generate red, green, and infrared light radiation.

[0094] The device 100 of Fig. Furthermore, 13 can comprise not only light-emitting semiconductor chips 115 in the form of LED chips. It is also possible that at least one or all of the semiconductor chips 115 are implemented in the form of laser diode chips. These can be edge emitters or surface emitters (VCSELs, Vertical-Cavity Surface-Emitting Lasers).

[0095] Furthermore, at least one optoelectronic component 115 may be a detector, a light-detecting component 115, or a light-detecting semiconductor chip 115. This could be a photodiode or a photodiode chip. In this way, the device 100 can be used, for example, for monitoring vital parameters. Configurations with only light-detecting components 115 or semiconductor chips 115 are also possible.

[0096] Fig. Figure 14 shows a top view of another optoelectronic device 100. In this embodiment, the optoelectronic component structure 110 comprises several matrix-like arranged LED chips 117. The device 100 also has a carrier 132 on which the LED chips 117 and the electronic semiconductor chip 120 used for electrically controlling the LED chips 117 are arranged side by side. The carrier 131 has electrical conductor structures with contacts that are electrically connected to contacts of the electronic semiconductor chip 120 and the LED chips 117 (not shown). This electrically connects the electronic semiconductor chip 120 to the LED chips 117, enabling the electronic semiconductor chip 120 to electrically control and energize the LED chips 117. The LED chips 117 can be configured to generate different colored light radiation, i.e., red, green, and blue light radiation.In this way, the optoelectronic device 100 can, for example, be a display device. Furthermore, the carrier 132 can be transparent and, if necessary, implemented as a film. This allows the optoelectronic device 100 to be used, for example, as a transparent lighting device.

[0097] Even in the Fig. 13 and Fig. In the embodiments shown in Figure 14, the electronic semiconductor chip 120 has the structure described above with the integrated network adapter 121, enabling the electronic semiconductor chip 120 to establish internet access for data communication with an internet server 180. During data communication, operating or calibration information associated with the optoelectronic component structure 110 can be transmitted to the electronic semiconductor chip 120 as described above, which allows the component structure 110 to be operated. The operating information can be stored in a non-volatile memory device 150, which is implemented as a separate component of a device comprising the respective optoelectronic device 100, or it can be integrated into the electronic semiconductor chip 120 itself.Activating the electronic semiconductor chip 120 to establish the internet connection can be performed by a control device. The control device can also control the other operation of the respective optoelectronic device 100 (not shown).

[0098] In addition to the embodiments described above and illustrated in the figures, further embodiments are conceivable which may include further modifications and / or combinations of features.

[0099] For example, it is possible to replace the above numerical data with other data. Therefore, for example, the number in Fig. 13 The optoelectronic component structure 110 shown can be implemented with other numbers of optoelectronic components 115, including only one light-emitting or light-detecting component 115.

[0100] Regarding possible combinations, the one in the Fig. 10, Fig. 11, Fig. 12, Fig. 13 and Fig. 14 electronic semiconductor chips shown 120, corresponding Fig. 6, have at least one integrated measuring device 125 for recording operating data. The operating data can be transmitted to an internet server 180 during data communication.

[0101] For the based on Fig. As explained in section 8, the transmission of operating data (arrow 214) can be used additionally or solely for the purpose of creating a history or diagnosis regarding the operation of the optoelectronic component structure 110. This can be used to further develop the optoelectronic component structure 110 or device 100.

[0102] In an embodiment of the electronic semiconductor chip 120 with integrated non-volatile memory device 150, as shown by Fig. As explained in section 11, reference is also made to the possibility of providing the optoelectronic device 100 in a pre-configured state, i.e., in a state in which (initial or original) operating or calibration information is already stored in the storage device 150. After commissioning, an internet connection can be established via the electronic semiconductor chip 120 in order to transmit updated operating or calibration information to the electronic semiconductor chip 120, as described above, and / or to transmit recorded operating data to an internet server 180.

[0103] Although the invention has been further illustrated and described in detail by means of preferred embodiments, the invention is not limited by the disclosed examples and other variations can be derived from them by the person skilled in the art without leaving the scope of protection of the invention. REFERENCE MARK LIST 100 optoelectronic device, light source 101 optoelectronic device, lighting device 110 optoelectronic component structure 111 LED chips 112 pixels 115 optoelectronic component, semiconductor chip 117 LED chips 120 electronic semiconductor chips 121 network adapters 125 Measuring device 130 carriers 131 carriers 132 carriers 135 Housing frames 139 Bond wire 140 carrier plate 145 Additional chip 150 Non-volatile storage device 160 Control device 170 Communication device 171 Communication device 180 Internet servers 190 Internet 201 Procedure step 202 Procedure step 203 Procedure step 210 Data communication 211 Transmission identifier 212 Transmission of calibration information 213 Transmission of updated calibration information 214 Transmission of operational data 215 Transmission of measurement data 221 manufacturers 222 manufacturers 230 Calibration information 240 Web portal 250 Internet access 251 additional internet accesses

Claims

[1] comprising an optoelectronic device (100, 101): an optoelectronic component structure (110) comprising at least one optoelectronic component (111, 115, 117), an electronic semiconductor chip (120) for electrically controlling the optoelectronic component structure (110), wherein the electronic semiconductor chip (120) has an integrated network adapter (121) for establishing an Internet connection, and wherein the electronic semiconductor chip (120) is configured to carry out data communication with an Internet server (180) with regard to the operation of the optoelectronic component structure (110) when an Internet connection is available. [2] Optoelectronic device according to claim 1, wherein the network adapter (121) is a wireless network adapter. [3] Optoelectronic device according to claim 1, wherein the network adapter (121) is a wired network adapter. [4] Optoelectronic device according to one of the preceding claims, wherein the electronic semiconductor chip (120) is configured to receive operating information used for the operation of the optoelectronic component structure (110) during data communication. [5] Optoelectronic device according to claim 4, further comprising a non-volatile storage device (150) for storing the operating information. [6] Optoelectronic device according to claim 5, wherein the electronic semiconductor chip (120) is configured to store the operating information in the non-volatile storage device (150). [7] Optoelectronic device according to one of claims 5 or 6, wherein the non-volatile storage device (150) is integrated into the electronic semiconductor chip (120). [8] Optoelectronic device according to one of claims 4 to 7, wherein the electronic semiconductor chip (120) is configured to perform the electrical control of the optoelectronic component structure (110) based on the operating information. [9] Optoelectronic device according to any one of claims 4 to 8, wherein the operating information is calibration information specific to the optoelectronic component structure (110). [10] Optoelectronic device according to one of the preceding claims, wherein the electronic semiconductor chip (120) is configured to send an associated identifier during data communication. [11] Optoelectronic device according to one of the preceding claims, wherein the electronic semiconductor chip (120) is configured to acquire operating data during the operation of the optoelectronic component structure (110) and to transmit the operating data in the course of data communication. [12] Optoelectronic device according to one of the preceding claims, wherein the optoelectronic component structure (110) comprises a pixelated light-emitting semiconductor chip (111) with separately controllable light-emitting pixels (112). [13] Optoelectronic device according to one of the preceding claims, further comprising an additional electronic chip (145) for controlling the electronic semiconductor chip (120). [14] Method for operating an optoelectronic device (100, 101), wherein the optoelectronic device (100, 101) comprises an optoelectronic component structure (110) with at least one optoelectronic component (111, 115, 117) and an electronic semiconductor chip (120) for electrically controlling the optoelectronic component structure (110), wherein the electronic semiconductor chip (120) has an integrated network adapter (121) for establishing an Internet connection, and the procedure includes the following: Activating the electronic semiconductor chip (120) to establish an internet connection, so that the electronic semiconductor chip (120) performs data communication with an Internet server (180) with regard to the operation of the optoelectronic component structure (110). [15] Method according to claim 14, wherein the activation of the electronic semiconductor chip (120) takes place after the manufacture of the optoelectronic device (100, 101), wherein the electronic semiconductor chip (120) receives operating information used for the operation of the optoelectronic component structure (110) during data communication. [16] Method according to one of claims 14 or 15, wherein the activation of the electronic semiconductor chip (120) takes place after commissioning of the optoelectronic device (100, 101), wherein the electronic semiconductor chip (120) receives updated operating information used for the operation of the optoelectronic component structure (110) during data communication. [17] Method according to one of claims 15 or 16, wherein the operating information is stored in a non-volatile storage device (150) of the optoelectronic device (100, 101). [18] Method according to any one of claims 15 to 17, wherein the operating information is calibration information specific to the optoelectronic component structure (110). [19] Method according to any one of claims 14 to 18, wherein the electronic semiconductor chip (120) sends an associated identifier during data communication. [20] Method according to one of claims 14 to 19, wherein the electronic semiconductor chip (120) sends operating data of the optoelectronic component structure (110) during data communication, which were acquired by the electronic semiconductor chip (120) during the operation of the optoelectronic component structure (110).

Images