Cache cooling device of vehicle-mounted power amplifier and assembly line

Abstract

The utility model discloses a cache cooling device and an assembly line of a vehicle-mounted power amplifier, the cache cooling device comprises a descending cache mechanism and a lifting cache mechanism, the descending cache mechanism and the lifting cache mechanism are at least partially open, the descending cache mechanism and the lifting cache mechanism comprise: a bearing platform, the bearing platform is used for bearing a vehicle-mounted power amplifier and comprises a first bearing platform and a second bearing platform which are oppositely arranged; the conveying chains comprise the first conveying chain and the second conveying chain, the first conveying chain is connected with the first bearing table, and the second conveying chain is connected with the second bearing table; one end of the first driving mechanism is connected with the first conveying chain, and the other end of the first driving mechanism is connected with the second conveying chain; and the second driving mechanism is used for pushing the vehicle-mounted power amplifier from the descending caching mechanism to the lifting caching mechanism. The cache cooling device can cache and cool the circuit board, and is relatively convenient to use.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of vehicle-mounted power amplifier, specifically relates to a kind of vehicle-mounted power amplifier's buffer cooling device and assembly assembly line. BACKGROUND

[0002] In the existing automobile modification market, automobile sound modification occupies a large share, and vehicle-mounted power amplifier must be used in vehicle sound modification process. Vehicle-mounted power amplifier is the audio power amplifier in vehicle-mounted audio-video system, and the function of vehicle-mounted power amplifier is to select and preprocess the signal input by audio, and to amplify power to make electric signal have the ability to drive loudspeaker. Vehicle-mounted power amplifier generally includes circuit board, shell for accommodating circuit board and cover plate. In the process of processing circuit board, the speed of the previous process may be faster than that of the subsequent process. For example, the circuit board is generally welded with pin first, and then AOI test is carried out. The welding speed may be faster than the AOI test speed, which affects work efficiency. Moreover, the AOI test result may be affected by high heat of the circuit board just after welding, and the use is inconvenient. SUMMARY

[0003] Therefore, the utility model provides a kind of vehicle-mounted power amplifier's buffer cooling device and assembly assembly line, can buffer and cool vehicle-mounted power amplifier, and use is more convenient.

[0004] To achieve the above purpose, the utility model adopts the following technical scheme:

[0005] A kind of vehicle-mounted power amplifier's buffer cooling device, including descending buffer mechanism and lifting buffer mechanism, the descending buffer mechanism and the lifting buffer mechanism are at least partially open, the descending buffer mechanism and lifting buffer mechanism include:

[0006] Bearing table for bearing vehicle-mounted power amplifier, the bearing table includes oppositely arranged first bearing table and second bearing table, and the first bearing table and the second bearing table have space for accommodating the vehicle-mounted power amplifier between the first bearing table and the second bearing table;

[0007] Conveying chain for driving the first bearing table and the second bearing table to move in up-down direction, the conveying chain includes first conveying chain and second conveying chain, the first conveying chain and the first bearing table are connected, and the second conveying chain and the second bearing table are connected;

[0008] First drive mechanism for driving the conveying chain to move, one end of the first drive mechanism and the first conveying chain are connected, and the other end and the second conveying chain are connected;

[0009] A second driving mechanism is arranged between the descending buffer mechanism and the ascending buffer mechanism, and is used to push the vehicle-mounted power amplifier from the descending buffer mechanism to the ascending buffer mechanism.

[0010] In a preferred embodiment, the number of the bearing tables is multiple, and each of the bearing tables is arranged in the up-down direction. The buffer cooling device can buffer multiple vehicle-mounted power amplifiers at the same time, thereby improving the working efficiency.

[0011] In a preferred embodiment, the bearing table comprises a bearing seat and a baffle, and the baffle is fixedly connected with the bearing seat.

[0012] In a preferred embodiment, the bearing table has a bearing state of bearing the vehicle-mounted power amplifier, and in the bearing state, the baffle stands on the bearing seat to prevent the conveying chain from being bent. The baffle is used to increase the force receiving area of the conveying chain to prevent the vehicle-mounted power amplifier from falling.

[0013] In a preferred embodiment, the buffer cooling device further comprises a plurality of first blocking pieces which are arranged on the conveying chain at intervals, and in the bearing state, the upper end of the baffle is fixed on the bearing seat, and the lower end of the baffle abuts against the first blocking piece.

[0014] In a preferred embodiment, the buffer cooling device further comprises a plurality of second blocking pieces which are arranged on the conveying chain at intervals, and the second blocking pieces are fixedly connected with the fixed block to fix the bearing seat on the conveying chain.

[0015] In a more preferred embodiment, the first driving mechanism comprises a motor, a first bevel gear connected with the output shaft of the motor, a second bevel gear engaged with the first bevel gear, and a driving wheel coaxially connected with the second bevel gear, and the conveying chain is arranged on the driving wheel, and the driving wheel drives the conveying chain to move in the up-down direction.

[0016] In a more preferred embodiment, the buffer cooling device is provided with a third driving mechanism arranged on the ascending buffer mechanism and used to push the vehicle-mounted power amplifier out of the ascending buffer mechanism.

[0017] In a preferred embodiment, the buffer cooling device further comprises a mechanical arm used to grab a carrier bearing the vehicle-mounted power amplifier and place the carrier on the descending buffer mechanism.

[0018] The utility model also adopts the following scheme:

[0019] An assembly line for an in-vehicle power amplifier includes circuit board soldering equipment and AOI testing equipment. The assembly line also includes the aforementioned buffer cooling device, which is disposed between the circuit board soldering equipment and the AOI testing equipment.

[0020] The present invention adopts the above solution and has the following advantages compared with the prior art:

[0021] The present invention relates to a buffer cooling device for a vehicle-mounted power amplifier. The circuit board of the vehicle-mounted power amplifier is placed between a first support platform and a second support platform. The vehicle-mounted power amplifier moves from top to bottom and then from bottom to top along with the first and second support platforms. During the movement, the circuit board of the vehicle-mounted power amplifier is buffered, which facilitates the smooth connection between the preceding and following processes. At the same time, the circuit board is also cooled to facilitate the subsequent processes. Attached Figure Description

[0022] To more clearly illustrate the technical solution of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of a buffer cooling device for a vehicle-mounted power amplifier according to an embodiment of the present utility model;

[0024] Figure 2 This is a partial schematic diagram of a buffer cooling device for a vehicle-mounted power amplifier according to an embodiment of the present utility model;

[0025] Figure 3 for Figure 2 A magnified view of a section at point A in the middle;

[0026] Figure 4 This is another partial schematic diagram of a buffer cooling device for a vehicle-mounted power amplifier according to an embodiment of the present utility model;

[0027] Figure 5 This is a partial side view of a buffer cooling device for a vehicle-mounted power amplifier according to an embodiment of the present invention;

[0028] Figure 6 This is a schematic diagram of a vehicle according to an embodiment of the present utility model;

[0029] Figure 7 This is a schematic diagram of the cooperation between the carrier piece and the carrier seat according to an embodiment of the present utility model;

[0030] Figure 8 This is a schematic diagram of the snap-fit ​​assembly according to an embodiment of the present utility model;

[0031] Figure 9 The figure shows a cap according to the embodiment of the present application.

[0032] Wherein,

[0033] 1, cache cooling device; 11, descending cache mechanism; 12, lifting cache mechanism;

[0034] 2, bearing table; 21, bearing seat; 211, step surface; 22, fixed block; 23, first bearing table; 24, second bearing table; 3, conveying chain; 32, first conveying chain; 33, second conveying chain; 35, blocking piece; 351, first blocking piece; 352, second blocking piece; 4, baffle;

[0035] 5, first driving mechanism; 51, motor; 52, first bevel gear; 53, second bevel gear; 54, driving wheel;

[0036] 6, base;

[0037] 7, carrier; 71, carrier seat; 72, carrier piece; 721, first carrier piece; 722, second carrier piece; 723, third carrier piece; 73, clamping assembly; 731, first pressing block; 732, second pressing block; 7321, clamping surface; 733, clamping piece; 7331, clamping hook; 74, cap; 75, first connecting pin; 76, second connecting pin; 77, elastic piece;

[0038] 8, circuit board; 9, support; 91, driven wheel. DETAILED DESCRIPTION

[0039] The preferred embodiments of the present application will be described in detail with reference to the drawings, so that the advantages and features of the present application can be more easily understood by those skilled in the art. It should be noted that the description of these embodiments is used to help understand the present application, but does not constitute a limitation of the present application. In addition, the technical features involved in each embodiment of the present application described below can be combined with each other as long as they do not conflict with each other.

[0040] The present embodiment provides an assembly line for vehicle-mounted power amplifier, which comprises a circuit board welding device, an AOI testing device and a cache cooling device 1 located between the circuit board welding device and the AOI testing device.

[0041] Referring to Figures 1 to 9As shown, the buffer cooling device 1 of the vehicle-mounted power amplifier is arranged on a base 6, and the buffer cooling device 1 comprises a support 9, a mechanical arm, a parallelly arranged descending buffer mechanism 11 and a lifting buffer mechanism 12, and the descending buffer mechanism 11 and the lifting buffer mechanism 12 are at least partially open to allow airflow to pass through to facilitate cooling of the vehicle-mounted power amplifier. The descending buffer mechanism 11 and the lifting buffer mechanism 12 are arranged on the support 9 and are used to carry and transport the vehicle-mounted power amplifier, and in this embodiment, the descending buffer mechanism 11 and the lifting buffer mechanism 12 have the same structure. Figure 1 The descending buffer mechanism 11 and the lifting buffer mechanism 12 are arranged in parallel, Figure 2 A schematic view of the descending buffer mechanism 11 or the lifting buffer mechanism 12 is shown, and the descending buffer mechanism 11 and the lifting buffer mechanism 12 are each provided with a first driving mechanism 5, and the first driving mechanism 5 is arranged to enable the descending buffer mechanism 11 and the lifting buffer mechanism 12 to work simultaneously, thereby improving work efficiency. It should be noted that this embodiment mainly buffers and cools the circuit board of the vehicle-mounted power amplifier, and the previous process of the buffer cooling is to solder the pins of the circuit board. The circuit board 8 is arranged on the carrier 7 as shown, Figures 6 to 9 When the soldering is completed, the mechanical arm picks up the carrier 7 on the conveying belt and places it on the descending buffer mechanism 11 for buffering.

[0042] Further, the carrier 7 comprises a carrier sheet 72 and a carrier seat 71, the carrier sheet 72 is detachably connected to the carrier seat 71, and the carrier sheet 72 and the type of the circuit board 8 are in one-to-one correspondence, which can be quickly adapted and replaced during production, that is, the carrier of this embodiment can be compatible with different products for production. The carrier sheet 72 comprises a first carrier sheet 721, a second carrier sheet 722 and a third carrier sheet 723 arranged at intervals, and the circuit board comprises a first circuit board and a second circuit board, a first mechanism for carrying the first circuit board is formed between the first carrier sheet 721 and the second carrier sheet 722, and a second mechanism for carrying the second circuit board is formed between the second carrier sheet 722 and the third carrier sheet 723. The carrier sheet 72 uses less material, saves materials and reduces production costs. In addition, the number of carrier sheets 72 is more than one, which has the advantages of being less likely to deform and being more convenient to process.

[0043] The carrier 7 further comprises a clamping assembly 73 and a cover 74 above the circuit board 8, the clamping assembly 73 is used to clamp the cover 74 to avoid the cover 74 from deforming or loosening. Each cover 74 has two oppositely arranged clamping assemblies 73. The clamping assembly 73 has a first pressing block 731, a second pressing block 732 and a clamping piece 733, and the cover 74 is located between the first pressing block 731 and the second pressing block 732. The second pressing block 732 is fixedly arranged on the carrier seat 7, the first pressing block 731 is arranged on the cover 74, and the clamping piece 7322 is connected to the first pressing block 731 through a first connecting pin 75 and a second connecting pin 76, and an elastic piece 77 is sleeved on the first connecting pin 75. The clamping piece 733 has a clamping hook 7331, and the second pressing block 732 has a clamping surface 7321. When the clamping assembly 73 is clamped on the cover 74, the clamping hook 7331 is clamped on the clamping surface 7321. When it is needed to separate the cover 74 from the clamping assembly 73, the upper end of the clamping piece 733 is poked, and the upper end of the clamping piece 733 rotates around the second connecting pin 76 towards the middle of the cover 74, at this time the elastic piece 77 is compressed, the clamping hook 7331 leaves the clamping surface 7321, the clamping assembly 73 loses the clamping effect on the cover 74, and the cover 74 can be separated from the clamping assembly 73.

[0044] When the carrier 7 is grabbed by the mechanical hand to the descending buffer mechanism 11, the buffer cooling device 1 starts to buffer and cool the circuit board 8. Further, the descending buffer mechanism 11 and the lifting buffer mechanism 12 comprise the bearing table 2 and the conveying chain 3.

[0045] Further, the bearing table 2 comprises oppositely arranged first bearing table 23 and second bearing table 24, and the first bearing table 23 and the second bearing table 24 have a space for accommodating the carrier 7, more specifically, the carrier 7 is located between the first bearing table 23 and the second bearing table 24; the conveying chain 3 is used to drive the first bearing table 23 and the second bearing table 24 to move along the up-down direction, the conveying chain 3 comprises a first conveying chain 32 and a second conveying chain 33, the first conveying chain 32 is connected with the first bearing table 23, and the second conveying chain 33 is connected with the second bearing table 24, wherein the number of the first bearing table 23 and the second bearing table 24 is multiple and they are arranged at intervals along the up-down direction, and the buffer cooling device can buffer multiple vehicle-mounted power amplifiers at the same time, thereby improving the working efficiency.

[0046] Furthermore, the support platform 2 includes a support seat 21 and a baffle 4 fixedly connected to the support seat 21. Specifically, the support seat 21 has a stepped surface 211 for supporting the vehicle power amplifier; a fixing block 22 is provided between the support seat 21 and the baffle 4, and the baffle 4 is fixed to the support seat 21 by the fixing block 22. It should be noted that the baffle 4 is provided here to increase the force-bearing area of ​​the conveyor chain 3 or to prevent the conveyor chain 3 from bending. More specifically, the carrier 7 is relatively heavy. When the carrier 7 is placed on the first support platform 23 and the second support platform 24, the first support platform 23 and the second support platform 24 tend to rotate inward due to the large force they bear (the "inward" here refers to the part between the first support platform 23 and the second support platform 24). Since the conveyor chain 3 is flexible, if the force-bearing area is small, the bearing force on the first support platform 23 and the second support platform 24 will also be small. At this time, the carrier 7 is more likely to fall off the first support platform 23 and the second support platform 24. Therefore, in this embodiment, a baffle 4 is added to the fixing block 22 to ensure that the carrier 7 will not easily fall off the support platform 2.

[0047] The first drive mechanism 5 is used to drive the conveyor chain 3 to move. One end of the first drive mechanism 5 is connected to the first conveyor chain 32, and the other end is connected to the second conveyor chain 33. The first drive mechanism 5 includes a motor 51, a first bevel gear 52 connected to the output shaft of the motor 51, a second bevel gear 53 meshing with the first bevel gear 52, and a drive wheel 54 coaxially connected to the second bevel gear 53. The conveyor chain 3 is mounted on the drive wheel 54. The bracket 9 is also provided with a driven wheel 91. The transmission chain 3 is wound around the drive wheel 54 and the driven wheel 91. The drive wheel 54 and the driven wheel 91 drive the conveyor chain 3 to move up and down. In addition, the first drive mechanism 5 in this embodiment can simultaneously drive the first conveyor chain 32 and the second conveyor chain 33 to move, resulting in high working efficiency.

[0048] The buffer cooling device 1 also includes multiple baffles 35 spaced apart on the conveyor chain 3. Specifically, refer to... Figure 2 and Figure 3 As shown, the baffle plate 35 includes a first baffle plate 351 and a second baffle plate 352 spaced apart. The support platform 2 is in a supporting state for the vehicle-mounted power amplifier. In the supporting state, the upper end of the baffle plate 4 is fixed to the support base 21, and the lower end of the baffle plate 4 abuts against the first baffle plate 351. Here, "upper end" and "lower end" refer to the supporting state. The second baffle plate 352 and the fixing block 22 are fixedly connected to fix the support base 21 to the conveyor chain 3. In the supporting state, the baffle plate 4 stands upright on the support base 21 and abuts against the first baffle plate 351. The baffle plate 4 reduces the deformation of the conveyor chain 3 and increases the force-bearing area of ​​the conveyor chain 3.

[0049] The buffer cooling device 1 further comprises a second driving mechanism and a third driving mechanism (not shown in the figure), the second driving mechanism is arranged between the descending buffer mechanism 11 and the lifting buffer mechanism 12 for pushing the carrier on the descending buffer mechanism 11 to the lifting buffer mechanism 12, and the third driving mechanism is arranged on the lifting buffer mechanism 12 for pushing the carrier on the lifting buffer mechanism 12 out for discharging, wherein the second driving mechanism and the third driving mechanism are specifically air cylinders, and the air cylinders specifically push the carrier seat 71 of the carrier 7.

[0050] In the embodiment, when the circuit board of the vehicle-mounted power amplifier is buffered and cooled, the manipulator first places the carrier on the bearing table of the descending buffer mechanism 11, specifically between the first bearing table 23 and the second bearing table 24, then the first driving mechanism 5 drives the first conveying chain 32 and the second conveying chain 33 to rotate in the up-down direction, the first conveying chain 32 and the second conveying chain 33 convey the carrier 7 from the top end of the descending buffer mechanism 11 to the bottom end of the descending buffer mechanism 11, then the second driving mechanism conveys the carrier 7 to the bottom end of the lifting buffer mechanism 12, at this time, the carrier 7 is located on the bearing table 2 of the lifting buffer mechanism 12, and the conveying chain 3 of the lifting buffer mechanism 12 conveys the carrier 7 from the bottom end of the lifting buffer mechanism 12 to the top end of the lifting buffer mechanism 12, then the third driving mechanism pushes the carrier out of the lifting buffer mechanism 12 for discharging, after discharging, the upper end of the clamping piece 733 is manually actuated, the upper end of the clamping piece 733 rotates around the second connecting pin 76 towards the middle of the gland 74, at this time, the elastic piece 77 is compressed, the clamping hook 7331 is away from the clamping surface 7321, the clamping assembly 73 loses the clamping effect on the gland 74, the gland 74 can be separated from the clamping assembly 73, then the circuit board 8 below the gland 74 is subjected to AOI test, wherein the AOI test refers to automatic optical inspection.

[0051] The buffer cooling device of the embodiment not only can buffer and cool the vehicle-mounted power amplifier between the welding and AOI test processes, but also the descending buffer mechanism 11 and the lifting buffer mechanism 12 work simultaneously, for example, when the descending buffer mechanism 11 transports the carrier downward, the lifting buffer mechanism 12 can simultaneously transport the carrier upward, and further the descending buffer mechanism 11 and the lifting buffer mechanism 12 can simultaneously buffer and cool multiple carriers 7, so that the working efficiency is higher.

[0052] As shown in the specification and claims, the terms "comprise" and "include" only indicate the inclusion of the steps and elements explicitly identified, and these steps and elements do not constitute an exclusive list, and the method or device can also include other steps or elements. The term "and / or" used herein includes any combination of one or more related listed items.

[0053] It should be noted that, unless otherwise specified, when a certain feature is said to be "fixed", "connected" to another feature, it can be directly fixed, connected to another feature, or indirectly fixed, connected to another feature. In addition, the up, down, left, right and other descriptions used in the utility model are only relative to the mutual position relationship of the components of the utility model in the drawings.

[0054] The above examples are only for illustrating the technical concept and characteristics of the utility model, and are a preferred embodiment, the purpose of which is to enable those skilled in the art to understand the content of the utility model and implement it, and it cannot limit the protection scope of the utility model. Any equivalent transformation or modification made according to the principle of the utility model should be covered within the protection scope of the utility model.

Claims

1. A buffer cooling device for a vehicle-mounted power amplifier, characterized in that, The cache includes a fall-down mechanism and a rise-up mechanism, both of which are at least partially open. The fall-down mechanism and the rise-up mechanism include: A support platform for supporting a vehicle-mounted amplifier, the support platform including a first support platform and a second support platform disposed opposite to each other, with a space between the first support platform and the second support platform for accommodating the vehicle-mounted amplifier; A conveyor chain is used to drive the first carrier platform and the second carrier platform to move in the vertical direction. The conveyor chain includes a first conveyor chain and a second conveyor chain. The first conveyor chain is connected to the first carrier platform, and the second conveyor chain is connected to the second carrier platform. A first driving mechanism is used to drive the conveyor chain to move. One end of the first driving mechanism is connected to the first conveyor chain, and the other end is connected to the second conveyor chain. A second drive mechanism is used to push the vehicle power amplifier from the lowering buffer mechanism to the raising buffer mechanism, and the second drive mechanism is located between the lowering buffer mechanism and the raising buffer mechanism.

2. The buffer cooling device according to claim 1, characterized in that, The number of the support platforms is multiple, and each support platform is arranged in the vertical direction.

3. The buffer cooling device according to claim 2, characterized in that, The support platform includes a support base and a baffle, and the baffle and the support base are fixedly connected.

4. The buffer cooling device according to claim 3, characterized in that, The support platform is in a supporting state to support the vehicle-mounted power amplifier. In the supporting state, the baffle stands upright on the support to prevent the conveyor chain from bending.

5. The buffer cooling device according to claim 4, characterized in that, The buffer cooling device further includes a first baffle plate, and the first baffle plate is multiple and spaced apart on the conveyor chain. When the carrier platform is in the bearing state, the upper end of the baffle plate is fixed on the carrier seat, and the lower end of the baffle plate abuts against the first baffle plate.

6. The cache cooling device according to claim 4, characterized in that, The buffer cooling device further includes a second blocking plate and a fixing block located between the carrier and the baffle. The number of the second blocking plates is multiple and they are spaced apart on the conveyor chain. The second blocking plates and the fixing block are fixedly connected to fix the carrier on the conveyor chain.

7. The buffer cooling device according to claim 1, characterized in that, The first drive mechanism includes a motor, a first bevel gear connected to the output shaft of the motor, a second bevel gear meshing with the first bevel gear, and a drive wheel coaxially connected to the second bevel gear. The transmission chain is disposed on the drive wheel, and the drive wheel drives the transmission chain to move in the up and down direction.

8. The buffer cooling device according to claim 1, characterized in that, The buffer cooling device is provided with a third drive mechanism, which is disposed on the lifting buffer mechanism for pushing the vehicle power amplifier out of the lifting buffer mechanism.

9. The buffer cooling device according to claim 1, characterized in that, The buffer cooling device also includes a robotic arm, which is used to grab the vehicle carrying the vehicle amplifier and place the vehicle on the lowering buffer mechanism.

10. An assembly line for a vehicle-mounted power amplifier, comprising circuit board soldering equipment and AOI testing equipment, characterized in that, The assembly line further includes a buffer cooling device as described in any one of claims 1 to 9, the buffer cooling device being disposed between the circuit board soldering equipment and the AOI testing equipment.

Images