Conductive adhesive tape, conductive adhesive tape assembly and solar cell

Abstract

The utility model discloses a conductive adhesive tape, a conductive adhesive tape assembly and a solar cell, the conductive adhesive tape comprises a conductive functional layer, a conductive material layer and a conductive adhesive layer, the conductive adhesive layer wraps the whole or partial area of the outer surface of the conductive material layer, the conductive adhesive tape also comprises a surface protection layer, and the surface protection layer is a transparent conductive adhesive layer. And the surface protection layer incompletely covers the outer surface of the conductive functional layer. Bonding and electric connection with other conductive parts are achieved through the exposed conductive adhesive layer, rapid connection and separation between the conductive adhesive tape and other conductive parts are facilitated, and under protection of the surface protection layer, the covering area of the conductive functional layer can be prevented from being corroded or electroplated.

Description

[0001] This application claims priority to Chinese patent application No. CN2023115711486, filed on November 23, 2023, the contents of which are incorporated herein by reference. TECHNICAL FIELD

[0002] The utility model relates to the technical field of electroplating, in particular to a conductive adhesive tape, a conductive adhesive tape assembly and a solar cell. BACKGROUND

[0003] One of the current mainstream technologies is to form metal grid lines on a solar cell through electroplating technology. The principle is to set an anode in the electroplating solution and connect the anode to the positive pole of the electroplating power supply, place the solar cell in the electroplating solution and connect the solar cell to the negative pole of the electroplating power supply, so that the solar cell is placed near the anode or can be moved near the anode, and then an electric field is formed between the anode and the solar cell. Metal cations in the electroplating solution are deposited on the solar cell to form metal grid lines through the action of the electric field. The solar cell in the electroplating solution is generally connected to the negative pole of the power supply through a conductive connecting piece, such as a conductive clamp, a conductive lead, a conductive roller, a conductive probe, etc. In the electroplating process of the solar cell, the connection point of the conductive connecting piece and the solar cell will be electroplated, and even the entire surface of the conductive connecting piece immersed in the electroplating solution will be electroplated, which makes the solar cell and the conductive connecting piece easily adhere together after being electroplated; separating the solar cell and the conductive connecting piece after electroplating can easily cause the solar cell to break; after the solar cell and the conductive connecting piece are separated, the conductive connecting piece needs to be deplated to avoid affecting the electroplating effect of the subsequent solar cell.

[0004] Therefore, the applicant has developed a conductive adhesive tape to replace the existing conductive connecting piece. The conductive adhesive tape is connected to the solar cell in a flexible or elastic manner, which is different from the existing rigid connection and can reduce the breakage rate of the solar cell. As a consumable, the conductive adhesive tape does not need to be deplated after being separated from the solar cell, which saves the deplating time in the electroplating process and improves the electroplating efficiency.

[0005] However, how to improve the conductivity of the conductive adhesive tape, how to protect the local area of the conductive adhesive tape (such as anti-corrosion and anti-electroplating), and how to balance the conductivity and protection performance of the conductive adhesive tape have become new technical problems to be solved. UTILITY MODEL CONTENTS

[0006] The utility model aims to provide a conductive adhesive tape, a conductive adhesive tape assembly and a solar cell to solve one or more technical problems in the background art.

[0007] The first aspect of the utility model provides a conductive adhesive tape, it includes conductive function layer, the conductive function layer includes conductive material layer and conductive glue layer, the conductive glue layer is covered in the conductive material layer outer surface all or partial area, the conductive adhesive tape still includes surface protection layer, the surface protection layer does not cover the outer surface of the conductive function layer completely.

[0008] In some embodiments, the surface protection layer includes a shielding layer and a connecting glue layer, the shielding layer is connected to the outer surface of the conductive function layer through the connecting glue layer; or, the surface protection layer includes an insulating coating, the insulating coating is connected to the outer surface of the conductive function layer.

[0009] In some embodiments, the conductive function layer has at least a first exposed part and a second exposed part, a partial area of the conductive glue layer is exposed from the first exposed part, a partial area of the conductive material layer or another partial area of the conductive glue layer is exposed from the second exposed part, wherein the first exposed part and the second exposed part are located at different positions in the length direction of the conductive adhesive tape.

[0010] In some embodiments, the conductive adhesive tape has a layered structure, the upper surface of the conductive glue layer is connected to the lower surface of the conductive material layer, the conductive glue layer covers all or partial area of the lower surface of the conductive material layer, the outer surface of the conductive function layer includes the upper surface and the lower surface of the conductive function layer, wherein the first exposed part is located at the lower surface of the conductive function layer, and the second exposed part is located at the upper surface or the lower surface of the conductive function layer.

[0011] In some embodiments, the conductive material layer includes a conductive base layer, the upper surface of the conductive glue layer is connected to the lower surface of the conductive base layer, and the conductive glue layer covers all or partial area on the lower surface of the conductive base layer.

[0012] Alternatively, the conductive material layer includes a conductive base layer and a conductive coating layer, the conductive coating layer is coated on the lower surface of the conductive base layer, and the conductive coating layer covers all or partial area on the lower surface of the conductive base layer; the upper surface of the conductive glue layer is connected to the lower surface of the conductive coating layer, and the conductive glue layer covers all or partial area on the lower surface of the conductive coating layer.

[0013] In some embodiments, the surface protection layer includes a first protective layer, the first protective layer is arranged on the upper surface of the conductive function layer, and the first protective layer covers all or partial area of the upper surface of the conductive function layer.

[0014] And / or, the surface protective layer comprises a second protective layer, the second protective layer is arranged on the lower surface of the conductive functional layer, and the second protective layer does not completely cover the lower surface of the conductive adhesive layer.

[0015] In some embodiments, the conductive adhesive tape comprises the first protective layer, the first protective layer completely covers the upper surface of the conductive functional layer.

[0016] In some embodiments, the conductive adhesive tape further comprises the second protective layer, the second protective layer does not completely cover the lower surface of the conductive functional layer, and the lower surface of one end of the conductive functional layer is exposed and not covered.

[0017] In some embodiments, the conductive adhesive layer covers the lower surface of one end or both ends of the conductive material layer, and exposes the lower surface of the middle part of the conductive material layer, and the second protective layer covers the lower surface of the middle part of the conductive material layer and part of the lower surface of the conductive adhesive layer adjacent to the lower surface of the middle part of the conductive material layer.

[0018] In some embodiments, the conductive adhesive layer covers the lower surface of both ends of the conductive material layer, and exposes the lower surface of the middle part of the conductive material layer, the second protective layer is arranged in the air below the lower surface of the middle part of the conductive material layer, forming a hollow area between the conductive functional layer and the second protective layer, and the second protective layer covers part of the lower surface of the conductive adhesive layer close to the hollow area.

[0019] In some embodiments, the conductive adhesive tape further comprises the second protective layer, the second protective layer covers the lower surface of the middle part of the conductive functional layer and exposes the lower surface of both ends of the conductive functional layer, and a conductive cover layer is arranged on the lower surface of one end of the conductive functional layer.

[0020] In some embodiments, the conductive adhesive tape further comprises the second protective layer, the second protective layer does not completely cover the lower surface of the conductive functional layer, and the lower surface of one end of the conductive functional layer is exposed and not covered; and a glue-exposed groove is further arranged on the second protective layer, the glue-exposed groove penetrates through the second protective layer, so that part of the lower surface of the conductive functional layer is exposed from the glue-exposed groove.

[0021] In some embodiments, the conductive adhesive tape comprises the first protective layer and the second protective layer, the first protective layer covers the upper surface of one end of the conductive functional layer, the upper surface of the other end of the conductive functional layer is exposed and not covered; the second protective layer covers the lower surface of the other end of the conductive functional layer, and the lower surface of one end of the conductive functional layer is exposed and not covered,

[0022] The first exposed part is formed by the area of the lower surface of the conductive functional layer exposed, and the second exposed part is formed by the area of the upper surface of the conductive functional layer exposed.

[0023] In some embodiments, the conductive tape comprises the second protective layer, the second protective layer does not completely cover the lower surface of the conductive functional layer, and the lower surface of one end or both ends of the conductive functional layer is exposed without being covered, wherein the conductive base layer is a material layer of surface passivated metal.

[0024] In some embodiments, the conductive tape comprises the first protective layer and the second protective layer, the first protective layer covers the upper surface of one end of the conductive functional layer, and the upper surface of the other end of the conductive functional layer is exposed without being covered, forming the second exposed part; the second protective layer is provided with an adhesive exposure groove, the adhesive exposure groove penetrates the second protective layer, so that part of the lower surface of the conductive functional layer is exposed from the adhesive exposure groove, forming the first exposed part; and the first exposed part and the second exposed part are arranged at intervals in the length direction of the conductive tape.

[0025] In some embodiments, in the conductive functional layer, the conductive adhesive layer covers part of the area on the lower surface of the conductive material layer, and the conductive adhesive layer is provided with a third communication groove penetrating the conductive adhesive layer, so that part of the lower surface of the conductive material layer is exposed from the third communication groove; the conductive tape comprises the first protective layer and the second protective layer, wherein,

[0026] The first protective layer completely covers the upper surface of the conductive functional layer, or the first protective layer is provided with a first communication groove penetrating the first protective layer, so that part of the upper surface of the conductive material layer is exposed from the first communication groove, and the first communication groove is arranged directly above the third communication groove;

[0027] The second protective layer is provided with a second communication groove penetrating the second protective layer, and the second communication groove is arranged directly below the third communication groove, so that the lower surface of the conductive material layer is exposed from the third communication groove and the second communication groove, and the second protective layer does not cover one end of the conductive functional layer away from the second communication groove, so that the conductive functional layer at this end is exposed.

[0028] In some embodiments, part of the conductive adhesive layer is exposed from the first exposed part, and another part of the conductive adhesive layer is exposed from the second exposed part, wherein the lower surface of the conductive adhesive layer exposed from the second exposed part is provided with an anti-adhesion sheet.

[0029] In some embodiments, the conductive adhesive tape has a layered structure, the conductive functional layer has two groups of the conductive adhesive layers, the two groups of the conductive adhesive layers are respectively referred to as a first conductive adhesive layer and a second conductive adhesive layer, the lower surface of the first conductive adhesive layer is connected to the upper surface of the conductive material layer, the first conductive adhesive layer covers all or part of the area on the upper surface of the conductive material layer; the upper surface of the first conductive adhesive layer forms the upper surface of the conductive functional layer; the upper surface of the second conductive adhesive layer is connected to the lower surface of the conductive material layer, the second conductive adhesive layer covers all or part of the area on the lower surface of the conductive material layer; the lower surface of the second conductive adhesive layer forms the lower surface of the conductive functional layer, and the surface protection layer includes a first protection layer, the first protection layer is arranged on the upper surface of the conductive functional layer, and the first protection layer does not completely cover the upper surface of the first conductive adhesive layer.

[0030] And / or, the surface protection layer includes a second protection layer, the second protection layer is arranged on the lower surface of the conductive functional layer, and the second protection layer does not completely cover the lower surface of the second conductive adhesive layer.

[0031] In some embodiments, the length of the first exposed part is a, the length of the second exposed part is b, and the length of the conductive adhesive tape is L, wherein 0.05L≤a≤0.2L, 0.05L≤b≤0.4L, and 0.1L≤a+b≤0.6L.

[0032] In some embodiments, the first exposed part is the lower surface of one end of the conductive functional layer, and the second exposed part is the lower surface of the other end of the conductive functional layer.

[0033] Alternatively, the first exposed part is the lower surface of one end of the conductive functional layer, and the second exposed part is the upper surface of the other end of the conductive functional layer.

[0034] Alternatively, the first exposed part is a glue-exposed groove communicating with the lower surface of the conductive functional layer, and the second exposed part is the lower surface of the end of the conductive functional layer away from the glue-exposed groove.

[0035] In some embodiments, the first exposed part is a part of the lower surface of the conductive functional layer, the second exposed part is another part of the lower surface of the conductive functional layer, the conductive adhesive tape further has a third exposed part, a part of the upper surface of the conductive functional layer is exposed from the third exposed part, and the third exposed part is located directly above the second exposed part.

[0036] Alternatively, the first exposed part is a partial region of the lower surface of the conductive functional layer, and the second exposed part is a partial region of the upper surface of the conductive functional layer; the conductive functional layer further has a third exposed part, another partial region of the lower surface of the conductive functional layer is exposed from the third exposed part, and the third exposed part is located directly below the second exposed part.

[0037] In some embodiments, the conductive adhesive tape is cylindrical or prismatic, the conductive adhesive layer is wrapped around the periphery of the conductive material layer, and the surface protection layer is a third protection layer wrapped around the periphery of the conductive functional layer, the third protection layer only wraps the middle section of the conductive functional layer and exposes both ends of the conductive functional layer.

[0038] In some embodiments, the conductive adhesive layer comprises an adhesive and a conductive filler, the adhesive comprises epoxy resin, phenolic resin, polyimide, acrylic resin or polyurethane, and the conductive filler comprises carbon, metal or metal oxide, wherein the metal at least comprises Au, Ag, Cu or Ni.

[0039] In some embodiments, the conductive adhesive layer further comprises one or more of a curing agent, a diluent, a plasticizer, a coupling agent and an antifoaming agent; wherein the plasticizer at least comprises di-n-octyl phthalate or di-n-butyl phthalate.

[0040] The second aspect of the utility model provides a conductive adhesive tape assembly which comprises the conductive adhesive tape and a base film, and the conductive adhesive tape is bonded to the base film.

[0041] The third aspect of the utility model provides a solar cell piece, and the solar cell piece is bonded with the conductive adhesive tape.

[0042] Compared with the prior art, the conductive adhesive tape in the embodiment of the utility model is bonded and electrically connected to other conductive components through the exposed conductive adhesive layer, which facilitates the quick connection and separation of the conductive adhesive tape and other conductive components, and the covered area of the conductive functional layer can be prevented from being corroded or plated under the protection of the surface protection layer. BRIEF DESCRIPTION OF DRAWINGS

[0043] FIG. 1 is a first structure schematic diagram of a conductive adhesive tape according to an embodiment of the utility model; Figure 1 FIG. 2 is a second structure schematic diagram of the conductive adhesive tape according to the embodiment of the utility model;

[0044] FIG. 3 is a third structure schematic diagram of the conductive adhesive tape according to the embodiment of the utility model; Figure 2 FIG. 4 is a fourth structure schematic diagram of the conductive adhesive tape according to the embodiment of the utility model;

[0045] Figure 3 FIG. 5 is a fifth structure schematic diagram of the conductive adhesive tape according to the embodiment of the utility model; ​

[0046] Appendix Figure 4 This is a schematic diagram of the fourth structure of the conductive tape in Example 1;

[0047] Appendix Figure 5 This is a schematic diagram of the fifth structure of the conductive tape in Example 1;

[0048] Appendix Figure 6 This is a schematic diagram of the sixth structure of the conductive tape in Example 1;

[0049] Appendix Figure 7 This is a schematic diagram of the seventh structure of the conductive tape in Example 1;

[0050] Appendix Figure 8 This is a schematic diagram of the first structure of the conductive tape in Example 2;

[0051] Appendix Figure 9 This is a schematic diagram of the second structure of the conductive tape in Example 2;

[0052] Appendix Figure 10 This is a schematic diagram of the third structure of the conductive tape in Example 2;

[0053] Appendix Figure 11 This is a schematic diagram of the fourth structure of the conductive tape in Example 2;

[0054] Appendix Figure 12 This is a schematic diagram of the fifth structure of the conductive tape in Example 2; (See attached diagram) Figure 13 This is a schematic diagram of the sixth structure of the conductive tape in Example 2; (See attached diagram) Figure 14 This is a schematic diagram of the first structural design of the conductive tape in Example 3; (See attached diagram) Figure 15 This is a schematic diagram of the second structure of the conductive tape in Example 3; (See attached diagram) Figure 16 This is a schematic diagram of the third structure of the conductive tape in Example 3; (See attached diagram) Figure 17 This is a schematic diagram of the fourth structure of the conductive tape in Example 3; (See attached diagram) Figure 18 This is a schematic diagram of the fifth structure of the conductive tape in Example 3; (See attached diagram) Figure 19 This is a schematic diagram of the sixth structure of the conductive tape in Example 3; (See attached diagram) Figure 20 This is a schematic diagram of the seventh structure of the conductive tape in Example 3; (See attached diagram) Figure 21 This is a schematic diagram of the eighth structure of the conductive tape in Example 3; (See attached diagram) Figure 22 This is a schematic diagram of the first structure of the conductive tape in Example 4; (See attached diagram) Figure 23 This is a schematic diagram of the second structure of the conductive tape in Example 4; (See attached diagram) Figure 24 This is a schematic diagram of the third structure of the conductive tape in Example 4; (See attached diagram) Figure 25 This is a schematic diagram of the first structure of the conductive tape in Example 5; (See attached diagram) Figure 26This is a schematic diagram of the second structure of the conductive tape in Example 5; (See attached diagram) Figure 27 This is a schematic diagram of the third structure of the conductive tape in Example 5; (See attached diagram) Figure 28 This is a schematic diagram of the first structural design of the conductive tape in Example 6; (See attached diagram) Figure 29 This is a schematic diagram of the second structure of the conductive tape in Example 6; (See attached diagram) Figure 30 This is a schematic diagram of the third structure of the conductive tape in Example 6; (See attached diagram) Figure 31 This is a schematic diagram of the fourth structure of the conductive tape in Example 6; (See attached diagram) Figure 32 This is a schematic diagram of the fifth structure of the conductive tape in Example 6; (See attached diagram) Figure 33 This is a schematic diagram of the sixth structure of the conductive tape in Example 6; (See attached diagram) Figure 34 This is a schematic diagram of the first structure of the conductive tape in Example 7; (See attached diagram) Figure 35 This is a schematic diagram of the second structure of the conductive tape in Example 7; (See attached diagram) Figure 36 This is a schematic diagram of the third structure of the conductive tape in Example 7; (See attached diagram) Figure 37 This is a schematic diagram of the fourth structure of the conductive tape in Example 7; (See attached diagram) Figure 38 This is a schematic diagram of the fifth structure of the conductive tape in Example 7; (See attached diagram) Figure 39 This is a schematic diagram of the sixth structure of the conductive tape in Example 7; (See attached diagram) Figure 40 This is a schematic diagram of the seventh structure of the conductive tape in Example 7; (See attached diagram) Figure 41 This is a schematic diagram of the first structural design of the conductive tape in Example 8; (See attached diagram) Figure 42 This is a schematic diagram of the second structure of the conductive tape in Example 8; (See attached diagram) Figure 43 This is a schematic diagram of the third structure of the conductive tape in Example 8; (See attached diagram) Figure 44 This is a schematic diagram of the fourth structure of the conductive tape in Example 8; (See attached diagram) Figure 45 This is a schematic diagram of the fifth structure of the conductive tape in Example 8; (See attached diagram) Figure 46 This is a schematic diagram of the sixth structure of the conductive tape in Example 8; (See attached diagram) Figure 47 This is a schematic diagram of the first structure of the conductive tape in Example 9; (See attached diagram) Figure 48 This is a schematic diagram showing the placement of the anti-sticking sheet in Example 9;

[0055] Appendix Figure 49 This is a schematic diagram of the second structure of the conductive tape in Example 9; (See attached diagram) Figure 50 This is a schematic diagram of the third structure of the conductive tape in Example 9; (See attached diagram) Figure 51 This is a schematic diagram of the first structural design of the conductive tape in Example 10; (See attached diagram) Figure 52 This is a schematic diagram of the second structure of the conductive tape in Example 10; (See attached diagram) Figure 53 This is a schematic diagram of the third structure of the conductive tape in Example 10; (See attached diagram) Figure 54 This is a schematic diagram of the fourth structure of the conductive tape in Example 10;

[0056] Figure 8 is a cross-sectional view of a fifth configuration of the conductive tape of Example 10. Figure 55 Figure 9 is a left side view of the fifth configuration of the conductive tape of Example 10.

[0057] Figure 56 Figure 10 is a cross-sectional view of a sixth configuration of the conductive tape of Example 10.

[0058] Figure 11 is a left side view of the sixth configuration of the conductive tape of Example 10. Figure 57 Figure 12 is a cross-sectional view of a first configuration of the conductive tape of Example 11.

[0059] Figure 58 Figure 13 is a left side view of the first configuration of the conductive tape of Example 11.

[0060] Figure 14 is a left side view of a modification of the first configuration of the conductive tape of Example 11. Figure 59 Figure 15 is a cross-sectional view of a second configuration of the conductive tape of Example 11.

[0061] Figure 60 Figure 16 is a left side view of the second configuration of the conductive tape of Example 11.

[0062] Figure 17 is a cross-sectional view of a third configuration of the conductive tape of Example 11. Figure 61 Figure 18 is a left side view of the third configuration of the conductive tape of Example 11.

[0063] Figure 62 Figure 19 is a cross-sectional view of a first configuration of the conductive tape of Example 12.

[0064] Figure 20 is a left side view of the first configuration of the conductive tape of Example 12. Figure 63 Figure 21 is a cross-sectional view of a second configuration of the conductive tape of Example 12.

[0065] Figure 64 Figure 22 is a left side view of the second configuration of the conductive tape of Example 12.

[0066] Figure 23 is a cross-sectional view of a third configuration of the conductive tape of Example 12. Figure 65 Figure 24 is a left side view of the third configuration of the conductive tape of Example 12.

[0067] Figure 66 Figure 25 is a cross-sectional view of a first configuration of the conductive tape assembly of Example 14.

[0068] Figure 26 is a left side view of the first configuration of the conductive tape assembly of Example 14. Figure 67 Figure 27 is a cross-sectional view of a second configuration of the conductive tape assembly of Example 14.

[0069] Figure 68 Figure 28 is a left side view of the second configuration of the conductive tape assembly of Example 14.

[0070] Figure 29 is a cross-sectional view of a first arrangement of the conductive tape on the base film of Example 14. Figure 69 Figure 30 is a left side view of the first arrangement of the conductive tape on the base film of Example 14.

[0071] Figure 70 ​​​​​​​​A second arrangement structure schematic diagram of the conductive adhesive tape on the bottom film in the embodiment 14 is shown in the figure;

[0072] The conductive adhesive tape is attached to the conductive connection part of the solar cell piece through the conductive connection part of the conductive adhesive tape. Figure 71 A third arrangement structure schematic diagram of the conductive adhesive tape on the bottom film in the embodiment 14 is shown in the figure;

[0073] The conductive adhesive tape is attached to the conductive connection part of the solar cell piece through the conductive connection part of the conductive adhesive tape. Figure 72 A first structure schematic diagram of the solar cell piece with the conductive adhesive tape in the embodiment 15 is shown in the figure;

[0074] The conductive adhesive tape is attached to the conductive connection part of the solar cell piece through the conductive connection part of the conductive adhesive tape. Figure 73 A second structure schematic diagram of the solar cell piece with the conductive adhesive tape in the embodiment 15 is shown in the figure;

[0075] In the above figures:

[0076] 1-conductive adhesive tape;

[0077] 10-conductive functional layer, 11-conductive base layer, 12-conductive adhesive layer, 12a-hollow area, 12b-third communication groove, 13-conductive coating layer;

[0078] 20-first protective layer, 20b-first communication groove, 21-first shielding layer, 22-first connecting adhesive layer, 23-first insulating coating layer;

[0079] 30-second protective layer, 30a-exposed adhesive groove, 30b-second communication groove, 31-second shielding layer, 32-second connecting adhesive layer, 33-second insulating coating layer;

[0080] 40-conductive cover layer;

[0081] 50-bottom film, 51-third connecting adhesive layer;

[0082] 60-adhesion-proof sheet;

[0083] 70-third protective layer, 71-third shielding layer, 72-third connecting adhesive layer, 73-third insulating coating layer;

[0084] 2-solar cell piece, 2a-conductive connection part. DETAILED DESCRIPTION

[0085] The utility model provides a kind of conductive adhesive tape, including conductive functional layer 10, the conductive functional layer 10 includes conductive material layer and conductive adhesive layer 12, conductive adhesive layer 12 is covered in the outer surface of conductive material layer all or partial area region. The conductive adhesive tape further includes surface protective layer, the surface protective layer does not cover the outer surface of conductive functional layer 10 completely, so that part of the area of conductive functional layer 10 is exposed and is used for the bonding and electrical connection of other conductive components, facilitate the quick connection and separation of conductive adhesive tape and other conductive components;Meanwhile, the area covered by surface protective layer on conductive functional layer 10 can avoid being corroded or being plated.

[0086] Specifically, the conductive functional layer 10 has at least a first exposed part and a second exposed part, a part of the conductive adhesive layer 12 is exposed from the first exposed part, and a part of the conductive material layer or another part of the conductive adhesive layer 12 is exposed from the second exposed part, wherein the first exposed part and the second exposed part are located at different positions in the length direction of the conductive adhesive tape; the first exposed part is used for bonding the area to be plated on the solar cell 2, and the second exposed part is used for bonding or connecting other conductive components.

[0087] In some conductive adhesive tapes, the surface protection layer specifically includes a shielding layer and a connecting adhesive layer, the shielding layer is connected to the outer surface of the conductive functional layer 10 through the connecting adhesive layer, so that the shielding layer can be well attached to the outer surface of the conductive functional layer 10 and is not easy to fall off. Especially, when the surface protection layer is connected to the outer surface of the conductive adhesive layer 12, if the connecting adhesive layer is not provided and the shielding layer is directly arranged on the outer surface of the conductive adhesive layer 12, that is, the shielding layer is adhered to the conductive adhesive layer 12 through the adhesion of the conductive adhesive layer 12, however, the adhesion and conductivity of the conductive adhesive layer 12 are negatively correlated, in order to balance the adhesion and conductivity of the conductive adhesive layer 12, the adhesion of the conductive adhesive layer 12 cannot be too strong, if the shielding layer is directly arranged on the outer surface of the conductive adhesive layer 12, the shielding layer is easy to fall off in the subsequent use process, and the shielding layer is connected to the outer surface of the conductive adhesive layer 12 through the connecting adhesive layer, the connecting adhesive layer can improve the adhesion between the shielding layer and the conductive adhesive layer 12, thereby reducing the risk of falling off of the shielding layer. In other conductive adhesive tapes, the surface protection layer can be an insulating coating layer, which is connected to the outer surface of the conductive functional layer 10.

[0088] According to some embodiments of the present application, the conductive adhesive tape has a layered structure, in the conductive functional layer 10, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive material layer, and the conductive adhesive layer 12 covers all or part of the area on the lower surface of the conductive material layer; the lower surface of the conductive adhesive layer 12 forms the lower surface of the conductive functional layer 10, as shown in the embodiment of Figures 1-50 ; in other embodiments, the upper and lower surfaces of the conductive material layer are both provided with the conductive adhesive layer 12, as shown in the embodiment of Figures 51-56 .

[0089] When the conductive adhesive tape is in a layered structure, the surface protective layer comprises a first protective layer 20 and / or a second protective layer 30, wherein the first protective layer 20 is arranged on the upper surface of the conductive functional layer 10, and the second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. When the second protective layer 30 is arranged on the lower surface of the conductive adhesive layer 12, the second protective layer 30 does not completely cover the lower surface of the conductive adhesive layer 12. The conductive adhesive tape in the embodiment can be bonded and electrically connected with other conductive components through the exposed conductive adhesive layer 12, so that the conductive adhesive tape can be quickly connected and separated with other conductive components, and the covered area of the conductive functional layer 10 can be prevented from being corroded or plated under the protection of the first protective layer 20 and / or the second protective layer 30.

[0090] In some conductive adhesive tapes, the conductive material layer can only comprise the conductive matrix layer 11, that is, the conductive functional layer 10 only comprises the conductive matrix layer 11 and the conductive adhesive layer 12, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive matrix layer 11, and the conductive adhesive layer 12 covers all or part of the area on the lower surface of the conductive matrix layer 11. In other conductive adhesive tapes, the conductive material layer can comprise the conductive matrix layer 11 and the conductive coating layer 13, that is, the conductive functional layer 10 comprises the conductive matrix layer 11, the conductive adhesive layer 12 and the conductive coating layer 13, the conductive coating layer 13 is arranged on the lower surface of the conductive matrix layer 11, the conductive coating layer 13 covers all or part of the area on the lower surface of the conductive matrix layer 11, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13, and the conductive adhesive layer 12 covers all or part of the area on the lower surface of the conductive coating layer 13.

[0091] According to some other embodiments of the present application, the conductive adhesive tape is in a cylindrical or prismatic shape, the conductive adhesive layer 12 is wrapped around the periphery of the conductive material layer, and the surface protective layer is a third protective layer wrapped around the periphery of the conductive functional layer 10, wherein the third protective layer only wraps the middle section of the conductive functional layer 10 and exposes the two ends of the conductive functional layer 10, as shown in the embodiment of Figures 57-63 .

[0092] The preferred embodiments of the present application will be described in detail below with reference to the drawings, so that the advantages and features of the present application can be more easily understood by those skilled in the art. It should be noted that the description of these embodiments is used to help understand the present application and does not constitute a limitation of the present application. The following embodiments are not only one embodiment, but a collection of some embodiments with similar schemes or features.

[0093] It should be noted that, in this paper, the terms "upper" and "lower" are defined with reference to the thickness direction of the conductive adhesive tape when the conductive adhesive tape is in a layered structure, and the corresponding Figures 1-47 , Figures 49-56The directions shown; the terms "left" and "right" correspond to the length extension direction of the conductive tape, which are also... Figures 1-47 , Figures 49-57 , Figure 60 , Figure 62 , Figures 64-68 The left and right directions are shown above. The above orientations and positional relationships are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0094] Example 1

[0095] like Figures 1-7 The conductive tape shown includes a conductive functional layer 10 and a first protective layer 20 disposed on the upper surface of the conductive functional layer 10.

[0096] In some conductive tapes, the conductive functional layer 10 includes at least a conductive substrate layer 11 and a conductive adhesive layer 12. The conductive substrate layer 11 forms a conductive material layer, and the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11. The conductive adhesive layer 12 covers all or part of the lower surface of the conductive substrate layer 11. When the conductive adhesive layer 12 only covers a part of the lower surface of the conductive substrate layer 11, it may be that the conductive adhesive layer 12 only covers the lower surface of one end of the conductive substrate layer 11, or the conductive adhesive layer 12 does not cover the lower surface of the other end of the conductive substrate layer 11.

[0097] In some other conductive tapes, to improve the conductivity of the conductive functional layer 10, a conductive coating 13 is also provided between the conductive substrate layer 11 and the conductive adhesive layer 12. The conductive coating 13 improves the conductivity of the conductive functional layer 10. The conductive substrate layer 11 and the conductive coating 13 together constitute a conductive material layer. The conductive coating 13 covers all or part of the lower surface of the conductive substrate layer 11, and the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating 13. The conductive adhesive layer 12 covers all or part of the lower surface of the conductive coating 13.

[0098] The first protective layer 20 is connected to the upper surface of the conductive functional layer 10. The first protective layer 20 completely covers the upper surface of the conductive functional layer 10 to prevent the upper surface of the conductive functional layer 10 from being corroded or electroplated.

[0099] In this embodiment, the first structure of the conductive tape is as follows: Figure 1As shown, the conductive adhesive tape comprises a conductive functional layer 10, and a first protective layer 20 arranged on the upper surface of the conductive functional layer 10. The conductive functional layer 10 comprises a conductive base layer 11 and a conductive adhesive layer 12, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire area of the lower surface of the conductive base layer 11. The first protective layer 20 comprises a first shielding layer 21 and a first connecting adhesive layer 22, the first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22, and the first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to avoid corrosion or electroplating of the conductive base layer 11. In this first structure, the surface protective layer only comprises the first protective layer 20, and the lower surface of the conductive adhesive layer 12 is completely exposed, part of which forms a first exposed part, and another part forms a second exposed part. The second structure of the conductive adhesive tape in this embodiment is shown in Figure 2 As shown, the conductive adhesive tape comprises a conductive functional layer 10, and a first protective layer 20 arranged on the upper surface of the conductive functional layer 10. The conductive functional layer 10 comprises a conductive base layer 11 and a conductive adhesive layer 12, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire area of the lower surface of the conductive base layer 11. The first protective layer 20 comprises a first shielding layer 21 and a first connecting adhesive layer 22, the first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22, and the first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to avoid corrosion or electroplating of the conductive base layer 11. In this first structure, the surface protective layer only comprises the first protective layer 20, and the lower surface of the conductive adhesive layer 12 is completely exposed, part of which forms a first exposed part, and another part forms a second exposed part. The second structure of the conductive adhesive tape in this embodiment is shown in

[0100] The third structure of the conductive adhesive tape in this embodiment is shown in Figure 3As shown, the conductive tape includes a conductive functional layer 10, and a first protective layer 20 is disposed on the upper surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11, a conductive adhesive layer 12, and a conductive coating layer 13. The conductive coating layer 13 is coated on the lower surface of the conductive substrate layer 11 and together with the conductive substrate layer 11 forms a conductive material layer, covering the entire lower surface of the conductive substrate layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13, and the conductive adhesive layer 12 covers the entire area of ​​the lower surface of the conductive coating layer 13. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive substrate layer 11 through the first connecting adhesive layer 22, and the first shielding layer 21 completely covers the upper surface of the conductive substrate layer 11 to prevent the conductive substrate layer 11 from being corroded or electroplated. In this third structure, the surface protective layer only includes the first protective layer 20, and the lower surface of the conductive adhesive layer 12 is completely exposed, with a portion forming the first exposed portion and another portion forming the second exposed portion.

[0101] The fourth structure of the conductive tape in this embodiment is as follows: Figure 4 As shown, the conductive tape includes a conductive functional layer 10, and a first protective layer 20 is disposed on the upper surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11, a conductive adhesive layer 12, and a conductive coating layer 13. The conductive coating layer 13 is coated on the lower surface of the conductive substrate layer 11, covering the entire lower surface of the conductive substrate layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13, covering the lower surface of the conductive coating layer 13 and exposing the lower surface of the right end of the conductive coating layer 13. For example, the conductive adhesive layer 12 covering the lower surface of the conductive coating layer 13 is bonded to the electroplating area on the solar cell, and the exposed right end of the conductive coating layer 13 is connected to a conductive clip, so that the current used for electroplating the solar cell can flow sequentially through the conductive clip and the conductive tape to the electroplating area on the solar cell. The lower surface of the right end of the conductive coating layer 13 is not provided with the conductive adhesive layer 12, which can prevent the lower surface of the right end of the conductive tape from sticking to the conductive clip and being unable to separate. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive substrate layer 11 through the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive substrate layer 11 to prevent the conductive substrate layer 11 from being corroded or electroplated.

[0102] The fifth structure of the conductive tape in this embodiment is as follows: Figure 5As shown, the conductive adhesive tape comprises a conductive functional layer 10, and a first protective layer 20 arranged on the upper surface of the conductive functional layer 10. The conductive functional layer 10 comprises a conductive base layer 11, a conductive adhesive layer 12, and a conductive coating layer 13. The conductive coating layer 13 is coated on the lower surface of the conductive base layer 11. The conductive coating layer 13 covers the lower surface of the conductive base layer 11 and exposes the lower surface of the right end of the conductive base layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13. The conductive adhesive layer 12 covers the entire area on the lower surface of the conductive coating layer 13 and exposes the lower surface of the right end of the conductive base layer 11. For example, the conductive adhesive layer 12 covering the lower surface of the conductive coating layer 13 is bonded to the area to be plated on the solar cell sheet. The exposed right end of the conductive base layer 11 is connected to the conductive clamp, so that the current for plating the solar cell sheet can flow to the area to be plated on the solar cell sheet through the conductive clamp and the conductive adhesive tape in sequence. The lower surface of the right end of the conductive base layer 11 is not provided with the conductive coating layer 13 and the conductive adhesive layer 12, so that the lower surface of the right end of the conductive adhesive tape cannot be bonded to the conductive clamp and cannot be separated. The first protective layer 20 comprises a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to avoid corrosion or plating of the conductive base layer 11.

[0103] As shown in the sixth structure of the conductive adhesive tape in the embodiment, Figure 6 As shown, the conductive adhesive tape comprises a conductive functional layer 10, and a first protective layer 20 arranged on the upper surface of the conductive functional layer 10. The conductive functional layer 10 comprises a conductive base layer 11, a conductive adhesive layer 12, and a conductive coating layer 13. The conductive coating layer 13 is coated on the lower surface of the conductive base layer 11. The conductive coating layer 13 covers the lower surface of the conductive base layer 11 and exposes the lower surface of the right end of the conductive base layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13. The conductive adhesive layer 12 covers the entire area on the lower surface of the conductive coating layer 13 and exposes the lower surface of the right end of the conductive base layer 11. For example, the conductive adhesive layer 12 covering the lower surface of the conductive coating layer 13 is bonded to the area to be plated on the solar cell sheet. The exposed right end of the conductive base layer 11 is connected to the conductive clamp, so that the current for plating the solar cell sheet can flow to the area to be plated on the solar cell sheet through the conductive clamp and the conductive adhesive tape in sequence. The lower surface of the right end of the conductive base layer 11 is not provided with the conductive coating layer 13 and the conductive adhesive layer 12, so that the lower surface of the right end of the conductive adhesive tape cannot be bonded to the conductive clamp and cannot be separated. The first protective layer 20 comprises a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to avoid corrosion or plating of the conductive base layer 11.

[0104] As shown in the seventh structure of the conductive adhesive tape in the embodiment, Figure 7As shown, the conductive functional layer 10 includes a conductive substrate layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11, and the conductive adhesive layer 12 covers the lower surface of the conductive substrate layer 11 and exposes the lower surface of the right end of the conductive substrate layer 11. For example, the conductive adhesive layer 12 covering the lower surface of the conductive substrate layer 11 is bonded to the electroplating area on the solar cell. The exposed right end of the conductive substrate layer 11 is connected to a conductive clip, allowing the current used for electroplating the solar cell to flow sequentially through the conductive clip and the conductive adhesive tape to the electroplating area on the solar cell. The lower surface of the right end of the conductive substrate layer 11 is not provided with the conductive adhesive layer 12, which prevents the lower surface of the right end of the conductive adhesive tape from adhering to the conductive clip and becoming inseparable. The first protective layer 20 includes a first insulating coating 23, which completely covers the upper surface of the conductive substrate layer 11 to prevent the conductive substrate layer 11 from being corroded or electroplated.

[0105] Example 2

[0106] like Figures 8-13 The conductive tape shown includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10.

[0107] In some conductive tapes, the conductive functional layer 10 includes at least a conductive substrate layer 11 and a conductive adhesive layer 12. The conductive substrate layer 11 forms a conductive material layer, and the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11. The conductive adhesive layer 12 covers all or part of the lower surface of the conductive substrate layer 11. When the conductive adhesive layer 12 only covers a part of the lower surface of the conductive substrate layer 11, it may be that the conductive adhesive layer 12 only covers the lower surface of one end of the conductive substrate layer 11, or the conductive adhesive layer 12 does not cover the lower surface of the other end of the conductive substrate layer 11.

[0108] In some other conductive tapes, to improve the conductivity of the conductive functional layer 10, a conductive coating 13 is also provided between the conductive substrate layer 11 and the conductive adhesive layer 12. The conductive coating 13 improves the conductivity of the conductive functional layer 10. The conductive substrate layer 11 and the conductive coating 13 together constitute a conductive material layer. The conductive coating 13 covers all or part of the lower surface of the conductive substrate layer 11, and the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating 13. The conductive adhesive layer 12 covers all or part of the lower surface of the conductive coating 13.

[0109] The first protective layer 20 is connected to the upper surface of the conductive functional layer 10, and completely covers the upper surface of the conductive functional layer 10 to avoid corrosion or electroplating of the upper surface of the conductive functional layer 10. The second protective layer 30 is connected to the lower surface of the conductive functional layer 10, and does not completely cover the lower surface of the conductive functional layer 10. The lower surface of the middle part of the conductive functional layer 10 is covered, and the lower surfaces of the two ends of the conductive functional layer 10 are exposed and not covered. The area of the lower surface of the conductive functional layer 10 that is covered can avoid being corroded or electroplated, and the area of the lower surface of the conductive functional layer 10 that is exposed can be used for conductive connection to other conductive components. At least one of the lower surface of the left end of the conductive functional layer 10 and the lower surface of the right end of the conductive functional layer 10 is formed by the lower surface of the conductive adhesive tape 12, so that one end of the conductive adhesive tape can be bonded to the electroplating area on the solar cell piece.

[0110] The first structure of the conductive adhesive tape in the embodiment is shown in Figure 8 The conductive adhesive tape includes a conductive functional layer 10. A first protective layer 20 is arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire area on the lower surface of the conductive base layer 11. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22, and completely covers the upper surface of the conductive base layer 11 to avoid corrosion or electroplating of the conductive base layer 11. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32, and does not completely cover the lower surface of the conductive adhesive layer 12. The lower surfaces of the two ends of the conductive adhesive layer 12 are exposed and not covered, forming a first exposed part and a second exposed part, respectively. The area of the lower surface of the conductive adhesive layer 12 that is covered can avoid being corroded or electroplated, and the area of the lower surface of the conductive adhesive layer 12 that is exposed can be used for conductive connection to other conductive components. The second structure of the conductive adhesive tape in the embodiment is shown in Figure 9As shown, the conductive adhesive tape comprises a conductive functional layer 10, a first protective layer 20 arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 comprises a conductive base layer 11 and a conductive adhesive layer 12, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, the conductive adhesive layer 12 covers part of the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 is arranged on the lower surface of the conductive base layer 11 and exposes the lower surface of the right end of the conductive base layer 11. For example, the conductive adhesive layer 12 arranged on the lower surface of the conductive base layer 11 forms a first exposed part for bonding to the plating area on the solar cell, and the right end of the exposed conductive base layer 11 forms a second exposed part for connecting to the conductive clamp, so that the current for plating the solar cell can flow to the plating area on the solar cell through the conductive clamp and the conductive adhesive tape in sequence; the lower surface of the right end of the conductive base layer 11 is not provided with the conductive adhesive layer 12, which can avoid the lower surface of the right end of the conductive adhesive tape from being bonded to the conductive clamp and being unable to be separated. The first protective layer 20 comprises a first shielding layer 21 and a first connecting adhesive layer 22, the first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22, and the first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to avoid corrosion or plating of the conductive base layer 11. The second protective layer 30 comprises a second shielding layer 31 and a second connecting adhesive layer 32, the second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32, the second shielding layer 31 does not completely cover the lower surface of the conductive adhesive layer 12, the lower surface of the left end of the conductive adhesive layer 12 is exposed and not covered, and the area of the lower surface of the conductive adhesive layer 12 covered can avoid corrosion or plating, and the area of the lower surface of the conductive adhesive layer 12 exposed can be used for conductive connection of other conductive components.

[0111] The third structure of the conductive adhesive tape in the embodiment is as shown in Figure 10As shown, the conductive adhesive tape comprises a conductive functional layer 10, a first protective layer 20 arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 comprises a conductive base layer 11, a conductive adhesive layer 12, and a conductive coating layer 13, the conductive coating layer 13 is coated on the lower surface of the conductive base layer 11 and forms a conductive material layer together with the conductive base layer 11, the conductive coating layer 13 covers the entire lower surface (i.e. the entire area on the lower surface) of the conductive base layer 11; the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13, and the conductive adhesive layer 12 covers the entire lower surface of the conductive coating layer 13. The first protective layer 20 comprises a first shielding layer 21 and a first connecting adhesive layer 22, the first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22, and the first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to avoid corrosion or electroplating of the conductive base layer 11. The second protective layer 30 comprises a second shielding layer 31 and a second connecting adhesive layer 32, the second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32, and the second shielding layer 31 does not completely cover the lower surface of the conductive adhesive layer 12, the lower surface of the conductive adhesive layer 12 at both ends is exposed and not covered, respectively forming a first exposed part and a second exposed part, the area of the lower surface of the conductive adhesive layer 12 that is covered can avoid corrosion or electroplating, and the area of the lower surface of the conductive adhesive layer 12 that is exposed can be used for conductive connection with other conductive components.

[0112] The fourth structure of the conductive adhesive tape in the embodiment is as shown in FIG. 4. Figure 11As shown, the conductive adhesive tape comprises a conductive functional layer 10, a first protective layer 20 arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 comprises a conductive base layer 11, a conductive adhesive layer 12, and a conductive coating layer 13. The conductive coating layer 13 is arranged on the lower surface of the conductive base layer 11 and forms a conductive material layer together with the conductive base layer 11. The conductive coating layer 13 covers the entire lower surface of the conductive base layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13. The conductive adhesive layer 12 covers part of the lower surface of the conductive coating layer 13. The conductive adhesive layer 12 is arranged on the lower surface of the conductive coating layer 13 and exposes the lower surface of the right end of the conductive coating layer 13. The first protective layer 20 comprises a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to prevent the conductive base layer 11 from being corroded or plated. The second protective layer 30 comprises a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. The second shielding layer 31 does not completely cover the lower surface of the conductive adhesive layer 12. The lower surface of the left end of the conductive adhesive layer 12 is exposed. The area of the lower surface of the conductive adhesive layer 12 that is covered can be prevented from being corroded or plated. The area of the lower surface of the conductive adhesive layer 12 that is exposed can be used for conductive connection with other conductive components.

[0113] Alternatively, on the basis of the above-mentioned first to fourth structures, the second shielding layer 31 can be directly arranged on the lower surface of the conductive adhesive layer 12, that is, the second shielding layer 31 is adhered to the conductive adhesive layer 12 through the adhesion of the conductive adhesive layer 12. However, the adhesion and conductivity of the conductive adhesive layer 12 are negatively correlated. In order to balance the conductivity and adhesion of the conductive adhesive layer 12, the adhesion of the conductive adhesive layer 12 cannot be too strong. If the second shielding layer 31 is directly arranged on the lower surface of the conductive adhesive layer 12, the second shielding layer 31 is likely to fall off in the subsequent use process. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. The second connecting adhesive layer 32 can improve the adhesion between the second shielding layer 31 and the conductive adhesive layer 12, thereby reducing the risk of the second shielding layer 31 falling off. The fifth structure of the conductive adhesive tape in the embodiment is as shown in Figure 12As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11, and the conductive adhesive layer 12 covers the entire lower surface of the conductive substrate layer 11. The first protective layer 20 includes a first insulating coating 23, which completely covers the upper surface of the conductive substrate layer 11 to prevent corrosion or electroplating. The second protective layer 30 includes a second insulating coating 33, which covers the lower surface of the conductive adhesive layer 12 and exposes the lower surfaces at both ends of the conductive adhesive layer 12. The covered area of ​​the lower surface of the conductive adhesive layer 12 is protected from corrosion or electroplating, while the exposed area can be used for conductive connection to other conductive components.

[0114] The sixth structure of the conductive tape in this embodiment is as follows: Figure 13 As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11, and the conductive adhesive layer 12 covers the lower surface of the conductive substrate layer 11 and exposes the lower surface of the right end of the conductive substrate layer 11. The lower surface of the right end of the conductive substrate layer 11 can be used for conductive connection to other conductive components. The first protective layer 20 includes a first insulating coating 23, which completely covers the upper surface of the conductive substrate layer 11 to prevent the upper surface of the conductive substrate layer 11 from being corroded or electroplated. The second protective layer 30 includes a second insulating coating 33, which covers the lower surface of the conductive adhesive layer 12 and exposes the lower surface of the left end of the conductive adhesive layer 12, while keeping the lower surface of the right end of the conductive substrate layer 11 exposed. The area covered by the lower surface of the conductive adhesive layer 12 can be prevented from being corroded or electroplated, and the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components.

[0115] Example 3

[0116] like Figures 14-21 The conductive tape shown includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10.

[0117] In some conductive adhesive tapes, the conductive functional layer 10 comprises at least a conductive base layer 11 and a conductive adhesive layer 12. The conductive base layer 11 forms a conductive material layer. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11. The conductive adhesive layer 12 covers part of the lower surface of the conductive base layer 11. Specifically, the conductive adhesive layer 12 covers the lower surface of one end or both ends of the conductive base layer 11, and exposes the lower surface of the middle part of the conductive base layer 11.

[0118] In other conductive adhesive tapes, in order to improve the conductivity of the conductive functional layer 10, a conductive coating layer 13 is arranged between the conductive base layer 11 and the conductive adhesive layer 12. The conductive coating layer 13 improves the conductivity of the conductive functional layer 10. The conductive material layer is formed by the conductive base layer 11 and the conductive coating layer 13. The conductive coating layer 13 covers all or part of the lower surface of the conductive base layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13. The conductive adhesive layer 12 covers all or part of the lower surface of the conductive coating layer 13.

[0119] The first protective layer 20 completely covers the upper surface of the conductive functional layer 10, so as to avoid corrosion or electroplating of the conductive functional layer 10. The second protective layer 30 does not completely cover the lower surface of the conductive functional layer 10. The lower surfaces of both ends of the conductive functional layer 10 are exposed and not covered. Alternatively, the second protective layer 30 covers the lower surface of the middle part of the conductive material layer and part of the lower surface of the conductive adhesive layer 12 adjacent thereto. The area of the lower surface of the conductive functional layer 10 that is covered can avoid corrosion or electroplating. The area of the lower surface of the conductive functional layer 10 that is exposed can be used for conductive connection with other conductive components. Alternatively, the conductive adhesive layer 12 covers the lower surfaces of both ends of the conductive material layer, and exposes the lower surface of the middle part of the conductive material layer. The second protective layer 30 is arranged in the air below the lower surface of the middle part of the conductive material layer, forming a hollow area 12a. The second protective layer 30 covers part of the conductive adhesive layer 12 close to the hollow area 12a. In this embodiment, the lower surface of the middle part of the conductive material layer is not provided with the conductive adhesive layer 12, which can reduce the amount of the conductive adhesive layer 12, and further reduce the overall cost of the conductive adhesive tape.

[0120] The first structure of the conductive adhesive tape in this embodiment is as shown in Figure 14As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11, and the conductive adhesive layer 12 covers the lower surfaces of the left and right ends of the conductive substrate layer 11, exposing the lower surface of the middle part of the conductive substrate layer 11. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive substrate layer 11 through the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive substrate layer 11 to prevent the conductive substrate layer 11 from being corroded or electroplated. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive functional layer 10 through the second connecting adhesive layer 32. The second shielding layer 31 covers the lower surface of the middle part of the conductive substrate layer 11 and a portion of the lower surface of the conductive adhesive layers 12 adjacent to it on the left and right sides. This can prevent the covered area from being corroded or electroplated. The exposed areas of the lower surfaces of the conductive adhesive layers 12 at both ends form the first exposed portion and the second exposed portion, which can be used for conductive connection to other conductive components.

[0121] In this embodiment, the second structure of the conductive tape is as follows: Figure 15 As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11. The conductive adhesive layer 12 covers the lower surface of the left end of the conductive substrate layer 11, exposing the lower surface of the middle part and the lower surface of the right end of the conductive substrate layer 11. The lower surface of the right end of the conductive substrate layer 11 forms a second exposed portion, which can be used for conductive connection to other conductive components. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive substrate layer 11 through the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive substrate layer 11 to prevent the conductive substrate layer 11 from being corroded or electroplated. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive functional layer 10 through the second connecting adhesive layer 32. The second shielding layer 31 covers the lower surface of the middle part of the conductive substrate layer 11 and part of the lower surface of the conductive adhesive layer 12 adjacent to it on the left, which can prevent the covered area from being corroded or electroplated. The exposed area of ​​the lower surface of the conductive adhesive layer 12 forms the first exposed part, which can be used to conductively connect other conductive components.

[0122] The third structure of the conductive tape in this embodiment is as follows: Figure 16As shown, the conductive adhesive tape comprises a conductive functional layer 10, a first protective layer 20 arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 comprises a conductive base layer 11, a conductive adhesive layer 12, and a conductive coating layer 13, the conductive coating layer 13 is coated on the lower surface of the conductive base layer 11 and forms a conductive material layer together with the conductive base layer 11, and the conductive coating layer 13 covers the entire lower surface of the conductive base layer 11; the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13, the conductive adhesive layer 12 covers the lower surfaces of the left and right ends of the conductive coating layer 13, and exposes the lower surface of the middle part of the conductive coating layer 13. The first protective layer 20 comprises a first shielding layer 21 and a first connecting adhesive layer 22, the first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22, and the first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to avoid corrosion or electroplating of the conductive base layer 11. The second protective layer 30 comprises a second shielding layer 31 and a second connecting adhesive layer 32, the second shielding layer 31 is connected to the lower surface of the conductive functional layer 10 through the second connecting adhesive layer 32, and the second shielding layer 31 covers the lower surface of the middle part of the conductive coating layer 13 and part of the lower surface of the conductive adhesive layer 12 adjacent to the left and right sides thereof, so that the covered area can be avoided from being corroded or electroplated, and the exposed area of the lower surface of the conductive adhesive layer 12 can be used for conductive connection with other conductive components.

[0123] The fourth structure of the conductive adhesive tape in the embodiment is as shown in Figure 17As shown, the conductive tape includes a conductive functional layer 10. A first protective layer 20 is disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 is disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11, a conductive adhesive layer 12, and a conductive coating layer 13. The conductive coating layer 13 is applied to the lower surface of the conductive substrate layer 11, covering the entire lower surface of the conductive substrate layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13, covering the lower surface of the left end of the conductive coating layer 13, exposing the lower surface of the middle part and the lower surface of the right end of the conductive coating layer 13. The lower surface of the right end of the conductive coating layer 13 can be used for conductive connection to other conductive components. The first protective layer 20 includes a first shielding layer 21 and a first adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive substrate layer 11 through the first adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive substrate layer 11 to prevent the conductive substrate layer 11 from being corroded or electroplated. The second protective layer 30 includes a second shielding layer 31 and a second adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive functional layer 10 through the second adhesive layer 32. The second shielding layer 31 covers the lower surface of the middle part of the conductive coating layer 13 and part of the lower surface of the conductive adhesive layer 12 adjacent to it on the left, which can prevent the covered area from being corroded or electroplated. The exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components.

[0124] The fifth structure of the conductive tape in this embodiment is as follows: Figure 18 As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11, and the conductive adhesive layer 12 covers the lower surfaces of the left and right ends of the conductive substrate layer 11, exposing the lower surface of the middle portion of the conductive substrate layer 11. The first protective layer 20 includes a first insulating coating 23, which completely covers the upper surface of the conductive substrate layer 11 to prevent corrosion or electroplating of the conductive substrate layer 11. The second protective layer 30 includes a second insulating coating 33, which covers the lower surface of the middle portion of the conductive substrate layer 11 and portions of the lower surfaces of the conductive adhesive layers 12 adjacent to it on the left and right sides, preventing corrosion or electroplating of the covered area. The exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components.

[0125] The sixth structure of the conductive tape in this embodiment is as follows: Figure 19As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11, and the conductive adhesive layer 12 covers the lower surfaces of the left and right ends of the conductive substrate layer 11, exposing the lower surface of the middle part of the conductive substrate layer 11. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive substrate layer 11 through the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive substrate layer 11 to prevent the conductive substrate layer 11 from being corroded or electroplated. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second protective layer 30 (second shielding layer 31 and second connecting adhesive layer 32) is suspended below the lower surface of the middle part of the conductive substrate layer 11. A hollow area 12a is formed between the second protective layer 30 and the conductive functional layer 10. The second protective layer 30 covers the portion of the conductive adhesive layer 12 near the hollow area 12a, which can prevent the covered area from being corroded or electroplated. The exposed areas on the lower surfaces of the conductive adhesive layers 12 at both ends form a first exposed part and a second exposed part, which can be used for conductive connection to other conductive components.

[0126] The seventh structure of the conductive tape in this embodiment is as follows: Figure 20 As shown, the conductive tape includes a conductive functional layer 10. A first protective layer 20 is disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 is disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11, a conductive adhesive layer 12, and a conductive coating layer 13. The conductive coating layer 13 is applied to the lower surface of the conductive substrate layer 11, covering the entire lower surface of the conductive substrate layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13, covering the lower surfaces of the left and right ends of the conductive coating layer 13, exposing the lower surface of the middle part of the conductive coating layer 13. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive substrate layer 11 through the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive substrate layer 11 to prevent the conductive substrate layer 11 from being corroded or electroplated. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second protective layer 30 (the second shielding layer 31 and the second connecting adhesive layer 32) is suspended below the lower surface of the middle part of the conductive coating layer 13. A hollow area 12a is formed between the second protective layer 30 and the conductive functional layer 10. The second protective layer 30 covers a portion of the conductive adhesive layer 12 near the hollow area 12a, which can prevent the covered area from being corroded or electroplated. The exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components.

[0127] The eighth structure of the conductive adhesive tape in the embodiment is shown in Figure 21 The conductive adhesive tape includes a conductive functional layer 10, a first protective layer 20 arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11. The conductive adhesive layer 12 covers the lower surface of the conductive base layer 11 at both ends and exposes the lower surface of the middle part of the conductive base layer 11. The first protective layer 20 includes a first insulating coating layer 23, which completely covers the upper surface of the conductive base layer 11 to avoid corrosion or electroplating of the upper surface of the conductive base layer 11. The second protective layer 30 includes a second insulating coating layer 33. The second protective layer 30 (the second insulating coating layer 33) is arranged under the lower surface of the middle part of the conductive base layer 11 in an overhead manner. A hollow area 12a is formed between the second protective layer 30 and the conductive functional layer 10. The second protective layer 30 covers part of the conductive adhesive layer 12 close to the hollow area 12a, which can avoid corrosion or electroplating of the covered area. The exposed area of the lower surface of the conductive adhesive layer 12 can be used for conductive connection with other conductive components.

[0128] Embodiment 4

[0129] The conductive adhesive tape is shown in Figures 22-24 The conductive adhesive tape includes a conductive functional layer 10, a first protective layer 20 arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 arranged on the lower surface of the conductive functional layer 10.

[0130] The conductive functional layer 10 includes at least a conductive base layer 11 and a conductive adhesive layer 12. The conductive base layer 11 forms a conductive material layer. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11. The conductive adhesive layer 12 covers all or part of the lower surface of the conductive base layer 11. When the conductive adhesive layer 12 only covers part of the lower surface of the conductive base layer 11, the conductive adhesive layer 12 can only cover the lower surface of one end of the conductive base layer 11, or the conductive adhesive layer 12 can not cover the lower surface of the other end of the conductive base layer 11.

[0131] To improve the conductivity of the conductive functional layer 10, a conductive coating layer 13 is arranged between the conductive base layer 11 and the conductive adhesive layer 12. The conductive coating layer 13 improves the conductivity of the conductive functional layer 10. The conductive coating layer 13 and the conductive base layer 11 together form a conductive material layer. The conductive coating layer 13 covers all or part of the lower surface of the conductive base layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13. The conductive adhesive layer 12 covers all or part of the lower surface of the conductive coating layer 13.

[0132] The first protective layer 20 is connected to the upper surface of the conductive functional layer 10, and covers the upper surface of the left end of the conductive functional layer 10. The area of the upper surface of the conductive functional layer 10 that is covered can avoid being corroded or electroplated, and the area of the upper surface of the conductive functional layer 10 that is exposed forms a second exposed part, which can be used for conductive connection with other conductive parts. The second protective layer 30 is connected to the lower surface of the conductive functional layer 10, and covers the lower surface of the right end of the conductive functional layer 10. The area of the lower surface of the conductive functional layer 10 that is covered can avoid being corroded or electroplated, and the area of the lower surface of the conductive functional layer 10 that is exposed forms a first exposed part, which can be used for conductive connection with other conductive parts. When arranged, the area of the upper surface of the conductive functional layer 10 that is covered by the first protective layer 20 is larger than the area of the upper surface of the conductive functional layer 10 that is not covered, and the area of the lower surface of the conductive functional layer 10 that is covered by the second protective layer 30 is larger than the area of the lower surface of the conductive functional layer 10 that is not covered.

[0133] The first structure of the conductive adhesive tape in the embodiment is shown in Figure 22 The conductive adhesive tape includes a conductive functional layer 10, a first protective layer 20 arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12, and the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire area on the lower surface of the conductive base layer 11. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22, and the first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22, and the first shielding layer 21 covers the upper surface of the left end of the conductive base layer 11. The area of the upper surface of the conductive base layer 11 that is covered can avoid being corroded or electroplated, and the area of the upper surface of the conductive base layer 11 that is exposed can be used for conductive connection with other conductive parts. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32, and the second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32, and the second shielding layer 31 covers the lower surface of the right end of the conductive adhesive layer 12. The area of the lower surface of the conductive adhesive layer 12 that is covered can avoid being corroded or electroplated, and the area of the lower surface of the conductive adhesive layer 12 that is exposed can be used for conductive connection with other conductive parts.

[0134] The second structure of the conductive adhesive tape in the embodiment is shown in Figure 23As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11, a conductive adhesive layer 12, and a conductive coating layer 13. The conductive coating layer 13 is applied to the lower surface of the conductive substrate layer 11, covering the entire area of ​​the lower surface of the conductive substrate layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13, covering the entire area of ​​the lower surface of the conductive coating layer 13. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive substrate layer 11 through the first connecting adhesive layer 22, covering the upper surface of the left end of the conductive substrate layer 11. The covered area of ​​the upper surface of the conductive substrate layer 11 can be prevented from corrosion or electroplating, while the exposed area of ​​the upper surface of the conductive substrate layer 11 can be used for conductive connection to other conductive components. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. The second shielding layer 31 covers the lower surface of the right end of the conductive adhesive layer 12. The area of ​​the lower surface of the conductive adhesive layer 12 that is covered can be prevented from being corroded or electroplated. The exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components.

[0135] The third structure of the conductive tape in this embodiment is as follows: Figure 24 As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11, and the conductive adhesive layer 12 covers the entire lower surface of the conductive substrate layer 11. The first protective layer 20 includes a first insulating coating 23, which covers the upper surface of the left end of the conductive substrate layer 11 to prevent corrosion or electroplating of the covered upper surface. The exposed area of ​​the upper surface of the conductive substrate layer 11 can be used for conductive connection to other conductive components. The second protective layer 30 includes a second insulating coating 33, which covers the lower surface of the right end of the conductive adhesive layer 12. The covered area of ​​the lower surface of the conductive adhesive layer 12 is protected from corrosion or electroplating, and the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components.

[0136] Example 5

[0137] like Figures 25-27 The conductive tape shown includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10.

[0138] In some conductive adhesive tapes, the conductive functional layer 10 comprises at least a conductive base layer 11 and a conductive adhesive layer 12, the conductive base layer 11 forms a conductive material layer, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire area on the lower surface of the conductive base layer 11.

[0139] In other conductive adhesive tapes, in order to improve the conductivity of the conductive functional layer 10, a conductive coating layer 13 is arranged between the conductive base layer 11 and the conductive adhesive layer 12, the conductivity of the conductive functional layer 10 is improved through the conductive coating layer 13, the conductive base layer 11 and the conductive coating layer 13 together form a conductive material layer, the conductive coating layer 13 covers all or part of the area on the lower surface of the conductive base layer 11, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13, and the conductive adhesive layer 12 covers all or part of the area on the lower surface of the conductive coating layer 13.

[0140] The first protective layer 20 is connected to the upper surface of the conductive functional layer 10, and the first protective layer 20 completely covers the upper surface of the conductive functional layer 10 to avoid corrosion or electroplating of the conductive functional layer 10. The second protective layer 30 is connected to the lower surface of the conductive functional layer 10, and the second protective layer 30 does not completely cover the lower surface of the conductive functional layer 10, the lower surfaces at both ends of the conductive functional layer 10 are exposed and not covered, respectively forming a first exposed part and a second exposed part, and the area of the lower surface of the conductive functional layer 10 that is covered can avoid corrosion or electroplating, and the area of the lower surface of the conductive functional layer 10 that is exposed can be used for conductive connection with other conductive components. In some specific application environments, the exposed part of the lower surface of the conductive functional layer 10 is the conductive adhesive layer 12, the conductive adhesive layer 12 exposed on one end of the conductive functional layer 10 is bonded to a conductive component, and the other end of the conductive functional layer 10 is connected to a conductive component through other means, which causes the conductive adhesive layer 12 exposed on the other end of the conductive functional layer 10 to affect connection and disassembly, therefore, in this embodiment, the conductive adhesive layer 12 exposed on the other end of the conductive functional layer 10 is provided with a conductive covering layer 40, and the conductive covering layer 40 is made of a conductive material, such as a conductive metal such as copper, aluminum, iron, stainless steel, or a conductive silicone or other conductive material.

[0141] The first structure of the conductive adhesive tape in this embodiment is as shown in Figure 25As shown, the conductive adhesive tape comprises a conductive functional layer 10, a first protective layer 20 arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 comprises a conductive base layer 11 and a conductive adhesive layer 12, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire area on the lower surface of the conductive base layer 11. The first protective layer 20 comprises a first shielding layer 21 and a first connecting adhesive layer 22, the first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22, and the first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to avoid corrosion or electroplating of the conductive base layer 11. The second protective layer 30 comprises a second shielding layer 31 and a second connecting adhesive layer 32, the second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32, and the second shielding layer 31 does not completely cover the lower surface of the conductive adhesive layer 12, the lower surface of the left and right ends of the conductive adhesive layer 12 is exposed and not covered, the area of the lower surface of the conductive adhesive layer 12 that is covered can avoid corrosion or electroplating, and the area of the lower surface of the conductive adhesive layer 12 that is exposed can be used for conductive connection with other conductive components, wherein the exposed area on the lower surface of the right end of the conductive adhesive layer 12 is completely covered by a conductive covering layer 40 to avoid the exposed area on the lower surface of the right end of the conductive adhesive layer 12 from adhering to other conductive components.

[0142] The second structure of the conductive adhesive tape in the embodiment is as shown in FIG. 2. Figure 26As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11, a conductive adhesive layer 12, and a conductive coating layer 13. The conductive coating layer 13 is applied to the lower surface of the conductive substrate layer 11, covering the entire area of ​​the lower surface of the conductive substrate layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13, covering the entire area of ​​the lower surface of the conductive coating layer 13. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive substrate layer 11 through the first connecting adhesive layer 22, completely covering the upper surface of the conductive substrate layer 11 to prevent the conductive substrate layer 11 from being corroded or electroplated. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. The second shielding layer 31 does not completely cover the lower surface of the conductive adhesive layer 12; the lower surfaces at both ends of the conductive adhesive layer 12 are exposed and not covered. The covered areas of the lower surface of the conductive adhesive layer 12 can be protected from corrosion or electroplating, while the exposed areas can be used for conductive connections to other conductive components. The exposed area on the lower surface of the right end of the conductive adhesive layer 12 is completely covered by the conductive covering layer 40 to prevent the exposed area on the lower surface of the right end of the conductive adhesive layer 12 from adhering to other conductive components.

[0143] The third structure of the conductive tape in this embodiment is as follows: Figure 27 As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11, and the conductive adhesive layer 12 covers the entire area of ​​the lower surface of the conductive substrate layer 11. The first protective layer 20 includes a first insulating coating 23, which covers the entire area of ​​the upper surface of the conductive substrate layer 11 to prevent corrosion or electroplating of the upper surface of the conductive substrate layer 11. The second protective layer 30 includes a second insulating coating 33, which covers the lower surface of the conductive adhesive layer 12 and exposes the lower surfaces at both ends of the conductive adhesive layer 12. The covered area of ​​the lower surface of the conductive adhesive layer 12 is protected from corrosion or electroplating, while the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components. The exposed area on the lower right surface of the conductive adhesive layer 12 is completely covered by the conductive cover layer 40 to prevent the exposed area on the lower right surface of the conductive adhesive layer 12 from adhering to other conductive components.

[0144] Example 6

[0145] likeFigures 28-33 As shown in the figure, the conductive adhesive tape comprises a conductive functional layer 10 and a second protective layer 30 arranged on the lower surface of the conductive functional layer 10.

[0146] In some conductive adhesive tapes, the conductive functional layer 10 comprises at least a conductive base layer 11 and a conductive adhesive layer 12, the conductive material layer is composed of the conductive base layer 11, the conductive base layer 11 is a layer of surface passivated metal, for example, the conductive base layer 11 is an aluminum foil, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers all or part of the area on the lower surface of the conductive base layer 11. When the conductive adhesive layer 12 only covers part of the lower surface of the conductive base layer 11, the conductive adhesive layer 12 can only cover the lower surface of one end of the conductive base layer 11, or the conductive adhesive layer 12 can not cover the lower surface of the other end of the conductive base layer 11.

[0147] In other conductive adhesive tapes, in order to improve the conductivity of the conductive functional layer 10, a conductive coating layer 13 is arranged between the conductive base layer 11 and the conductive adhesive layer 12, the conductivity of the conductive functional layer 10 is improved through the conductive coating layer 13, the conductive material layer is composed of the conductive base layer 11 and the conductive coating layer 13, the conductive coating layer 13 covers all or part of the area on the lower surface of the conductive base layer 11, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13, and the conductive adhesive layer 12 covers all or part of the area on the lower surface of the conductive coating layer 13.

[0148] The second protective layer 30 is connected to the lower surface of the conductive functional layer 10, the second protective layer 30 does not completely cover the lower surface of the conductive functional layer 10, the lower surface of one end or both ends of the conductive functional layer 10 is exposed and not covered, the area of the lower surface of the conductive functional layer 10 that is covered can be prevented from being corroded or plated, and the area of the lower surface of the conductive functional layer 10 that is exposed can be used for conductive connection with other conductive components.

[0149] The first structure of the conductive adhesive tape in this embodiment is as shown in the figure Figure 28As shown in the figure, the conductive adhesive tape comprises a conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 comprises a conductive base layer 11 and a conductive adhesive layer 12. The conductive base layer 11 is preferably an aluminum foil. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire area on the lower surface of the conductive base layer 11. The second protective layer 30 comprises a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. The second shielding layer 31 does not completely cover the lower surface of the conductive adhesive layer 12. The lower surface of the left and right ends of the conductive adhesive layer 12 is exposed and not covered, thereby forming a first exposed part and a second exposed part, respectively. The area of the lower surface of the conductive adhesive layer 12 that is covered can avoid being corroded or plated, and the area of the lower surface of the conductive adhesive layer 12 that is exposed can be used for conductive connection with other conductive components.

[0150] A second structure of the conductive adhesive tape in the embodiment is shown in the figure. Figure 29 As shown in the figure, the conductive adhesive tape comprises a conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 comprises a conductive base layer 11 and a conductive adhesive layer 12. The conductive base layer 11 is preferably an aluminum foil. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire area on the lower surface of the conductive base layer 11. The second protective layer 30 comprises a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. The second shielding layer 31 does not completely cover the lower surface of the conductive adhesive layer 12. The lower surface of the left and right ends of the conductive adhesive layer 12 is exposed and not covered, thereby forming a first exposed part and a second exposed part, respectively. The area of the lower surface of the conductive adhesive layer 12 that is covered can avoid being corroded or plated, and the area of the lower surface of the conductive adhesive layer 12 that is exposed can be used for conductive connection with other conductive components.

[0151] A third structure of the conductive adhesive tape in the embodiment is shown in the figure. Figure 30As shown in the figure, the conductive adhesive tape comprises a conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 comprises a conductive base layer 11, a conductive adhesive layer 12 and a conductive coating layer 13. The conductive base layer 11 is preferably an aluminum foil. The conductive coating layer 13 is coated on the lower surface of the conductive base layer 11, and covers the entire area on the lower surface of the conductive base layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13, and the conductive adhesive layer 12 covers the entire area on the lower surface of the conductive coating layer 13. The second protective layer 30 comprises a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32, and the second shielding layer 31 does not completely cover the lower surface of the conductive adhesive layer 12. The lower surface of the conductive adhesive layer 12 at both ends is exposed and not covered. The area on the lower surface of the conductive adhesive layer 12 that is covered can avoid being corroded or plated, and the area on the lower surface of the conductive adhesive layer 12 that is exposed can be used for electrically connecting other conductive components.

[0152] The fourth structure of the conductive adhesive tape in the embodiment is shown in the figure Figure 31 As shown in the figure, the conductive adhesive tape comprises a conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 comprises a conductive base layer 11, a conductive adhesive layer 12 and a conductive coating layer 13. The conductive base layer 11 is preferably an aluminum foil. The conductive coating layer 13 is coated on the lower surface of the conductive base layer 11, and covers the entire area on the lower surface of the conductive base layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13, and the conductive adhesive layer 12 covers the entire area on the lower surface of the conductive coating layer 13. The second protective layer 30 comprises a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32, and the second shielding layer 31 does not completely cover the lower surface of the conductive adhesive layer 12. The lower surface of the conductive adhesive layer 12 at both ends is exposed and not covered. The area on the lower surface of the conductive adhesive layer 12 that is covered can avoid being corroded or plated, and the area on the lower surface of the conductive adhesive layer 12 that is exposed can be used for electrically connecting other conductive components.

[0153] The fifth structure of the conductive adhesive tape in the embodiment is shown in the figure Figure 32As shown in the figure, the conductive adhesive tape comprises a conductive functional layer 10, and a second protective layer 30 arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 comprises a conductive base layer 11 and a conductive adhesive layer 12. The conductive base layer 11 is preferably an aluminum foil. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire lower surface of the conductive base layer 11. The second protective layer 30 comprises a second insulating coating layer 33, which covers the lower surface of the conductive adhesive layer 12 and exposes the lower surfaces of the left and right ends of the conductive adhesive layer 12. The area of the lower surface of the conductive adhesive layer 12 that is covered can be prevented from being corroded or electroplated, and the area of the lower surface of the conductive adhesive layer 12 that is exposed can be used for electrically connecting other conductive components.

[0154] As shown in the figure, the conductive adhesive tape comprises a conductive functional layer 10, and a second protective layer 30 arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 comprises a conductive base layer 11 and a conductive adhesive layer 12. The conductive base layer 11 is preferably an aluminum foil. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire lower surface of the conductive base layer 11. The second protective layer 30 comprises a second insulating coating layer 33, which covers the lower surface of the conductive adhesive layer 12 and exposes the lower surfaces of the left and right ends of the conductive adhesive layer 12. The area of the lower surface of the conductive adhesive layer 12 that is covered can be prevented from being corroded or electroplated, and the area of the lower surface of the conductive adhesive layer 12 that is exposed can be used for electrically connecting other conductive components. Figure 33 As shown in the figure, the conductive adhesive tape comprises a conductive functional layer 10, and a second protective layer 30 arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 comprises a conductive base layer 11 and a conductive adhesive layer 12. The conductive base layer 11 is preferably an aluminum foil. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire lower surface of the conductive base layer 11. The second protective layer 30 comprises a second insulating coating layer 33, which covers the lower surface of the conductive adhesive layer 12 and exposes the lower surfaces of the left and right ends of the conductive adhesive layer 12. The area of the lower surface of the conductive adhesive layer 12 that is covered can be prevented from being corroded or electroplated, and the area of the lower surface of the conductive adhesive layer 12 that is exposed can be used for electrically connecting other conductive components.

[0155] As shown in the figure, the conductive adhesive tape comprises a conductive functional layer 10, and a second protective layer 30 arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 comprises a conductive base layer 11 and a conductive adhesive layer 12. The conductive base layer 11 is preferably an aluminum foil. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire lower surface of the conductive base layer 11. The second protective layer 30 comprises a second insulating coating layer 33, which covers the lower surface of the conductive adhesive layer 12 and exposes the lower surfaces of the left and right ends of the conductive adhesive layer 12. The area of the lower surface of the conductive adhesive layer 12 that is covered can be prevented from being corroded or electroplated, and the area of the lower surface of the conductive adhesive layer 12 that is exposed can be used for electrically connecting other conductive components.

[0156] Figures 34-40 As shown in the figure, the conductive adhesive tape comprises a conductive functional layer 10, and a second protective layer 30 arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 comprises a conductive base layer 11 and a conductive adhesive layer 12. The conductive base layer 11 is preferably an aluminum foil. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire lower surface of the conductive base layer 11. The second protective layer 30 comprises a second insulating coating layer 33, which covers the lower surface of the conductive adhesive layer 12 and exposes the lower surfaces of the left and right ends of the conductive adhesive layer 12. The area of the lower surface of the conductive adhesive layer 12 that is covered can be prevented from being corroded or electroplated, and the area of the lower surface of the conductive adhesive layer 12 that is exposed can be used for electrically connecting other conductive components.

[0157] As shown in the figure, the conductive adhesive tape comprises a conductive functional layer 10, and a second protective layer 30 arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 comprises a conductive base layer 11 and a conductive adhesive layer 12. The conductive base layer 11 is preferably an aluminum foil. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire lower surface of the conductive base layer 11. The second protective layer 30 comprises a second insulating coating layer 33, which covers the lower surface of the conductive adhesive layer 12 and exposes the lower surfaces of the left and right ends of the conductive adhesive layer 12. The area of the lower surface of the conductive adhesive layer 12 that is covered can be prevented from being corroded or electroplated, and the area of the lower surface of the conductive adhesive layer 12 that is exposed can be used for electrically connecting other conductive components.

[0158] ​In some other conductive adhesive tapes, in order to improve the conductivity of the conductive functional layer 10, a conductive coating layer 13 is arranged between the conductive base layer 11 and the conductive adhesive layer 12, the conductivity of the conductive functional layer 10 is improved through the conductive coating layer 13, the conductive coating layer 13 and the conductive base layer 11 together form a conductive material layer, the conductive coating layer 13 covers all or part of the lower surface of the conductive base layer 11, and the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13, and the conductive adhesive layer 12 covers all or part of the lower surface of the conductive coating layer 13.

[0159] The first protective layer 20 is connected to the upper surface of the conductive functional layer 10, and the first protective layer 20 covers all or part of the upper surface of the conductive functional layer 10. The area of the upper surface of the conductive functional layer 10 that is covered can be prevented from being corroded or plated, and the area of the upper surface of the conductive functional layer 10 that is exposed can be used for conductive connection with other conductive components. The second protective layer 30 is connected to the lower surface of the conductive functional layer 10, and the second protective layer 30 is provided with an adhesive exposure groove 30a that penetrates the second protective layer 30, so that the lower surface of the conductive functional layer 10 is exposed from the adhesive exposure groove 30a, that is, the lower surface of the conductive adhesive layer 12 is exposed from the adhesive exposure groove 30a. Preferably, the adhesive exposure groove 30a extends to the edge along the width direction of the second protective layer 30, dividing the second protective layer 30 into two sections. Preferably, when the first protective layer 20 covers all of the upper surface of the conductive functional layer 10, the second protective layer 30 covers the lower surface of one end of the conductive functional layer 10, and the lower surface of the other end of the conductive functional layer 10 is exposed, the adhesive exposure groove 30a is arranged close to one end of the conductive functional layer 10, that is, the end of the conductive functional layer 10 that is not covered by the second protective layer 30 is arranged on a different end in the length direction of the conductive adhesive tape from the adhesive exposure groove 30a; when the first protective layer 20 covers the upper surface of one end of the conductive functional layer 10, and the upper surface of the other end of the conductive functional layer 10 is exposed, the second protective layer 30 covers all of the lower surface of the conductive functional layer 10 except for the adhesive exposure groove 30a, and the adhesive exposure groove 30a is arranged close to one end of the conductive functional layer 10, that is, the end of the upper surface of the conductive functional layer 10 that is not covered by the first protective layer 20 is arranged on a different end in the length direction of the conductive adhesive tape from the adhesive exposure groove 30a. The area of the lower surface of the conductive functional layer 10 that is covered can be prevented from being corroded or plated, and the area of the lower surface of the conductive functional layer 10 that is exposed can be used for conductive connection with other conductive components. In this embodiment, the conductive adhesive layer 12 is exposed through the adhesive exposure groove 30a, and when the conductive adhesive layer 12 that is exposed from the adhesive exposure groove 30a is adhered to other conductive components and then separated from the other conductive components, the probability of the conductive adhesive layer 12 remaining on the other conductive components can be reduced, and the conductive adhesive layer 12 can be more easily separated from the other conductive components as a whole.

[0160] The first structure of the conductive adhesive tape in this embodiment is as shown in Figure 34As shown, the conductive adhesive tape comprises a conductive functional layer 10, a first protective layer 20 arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 comprises a conductive base layer 11 and a conductive adhesive layer 12, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire area on the lower surface of the conductive base layer 11. The first protective layer 20 comprises a first shielding layer 21 and a first connecting adhesive layer 22, the first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22, and the first shielding layer 21 covers the upper surface of the left end of the conductive base layer 11. The area on the upper surface of the conductive base layer 11 that is covered can avoid being corroded or plated, and the area on the upper surface of the conductive base layer 11 that is exposed can be used for conductive connection with other conductive components. The second protective layer 30 comprises a second shielding layer 31 and a second connecting adhesive layer 32, the second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32, and the second protective layer 30 is provided with an adhesive exposure groove 30a near the left end. The adhesive exposure groove 30a penetrates the second protective layer 30 in the width direction, so that part of the lower surface of the conductive adhesive layer 12 is exposed from the adhesive exposure groove 30a, and the area on the lower surface of the conductive adhesive layer 12 that is not exposed from the adhesive exposure groove 30a is covered by the second shielding layer 31. The area on the lower surface of the conductive adhesive layer 12 that is covered can avoid being corroded or plated, and the area on the lower surface of the conductive adhesive layer 12 that is exposed can be used for conductive connection with other conductive components. In this embodiment, the conductive adhesive layer 12 is exposed through the adhesive exposure groove 30a. When the conductive adhesive layer 12 adheres to other conductive components and is separated from the other conductive components, the probability of the conductive adhesive layer 12 remaining on the other conductive components can be reduced, and the conductive adhesive layer 12 can be more easily separated from the other conductive components as a whole.

[0161] The second structure of the conductive adhesive tape in this embodiment is as shown in Figure 35As shown, the conductive adhesive tape comprises a conductive functional layer 10, a first protective layer 20 arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 comprises a conductive base layer 11, a conductive adhesive layer 12, and a conductive coating layer 13 coated on the lower surface of the conductive base layer 11 and covering the entire area on the lower surface of the conductive base layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13, and the conductive adhesive layer 12 covers the entire area on the lower surface of the conductive coating layer 13. The first protective layer 20 comprises a first shielding layer 21 and a first connecting adhesive layer 22, and the first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22. The first shielding layer 21 covers the upper surface of the left end of the conductive base layer 11, and the area on the upper surface of the conductive base layer 11 covered by the first shielding layer 21 can be prevented from being corroded or plated, and the area on the upper surface of the conductive base layer 11 exposed can be used for conductive connection with other conductive components. The second protective layer 30 comprises a second shielding layer 31 and a second connecting adhesive layer 32, and the second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. The second protective layer 30 is provided with an adhesive exposure groove 30a near the left end, and the adhesive exposure groove 30a penetrates the second protective layer 30, so that part of the lower surface of the conductive adhesive layer 12 is exposed from the adhesive exposure groove 30a, and the area on the lower surface of the conductive adhesive layer 12 except the area exposed from the adhesive exposure groove 30a is covered by the second shielding layer 31. The area on the lower surface of the conductive adhesive layer 12 covered by the second shielding layer 31 can be prevented from being corroded or plated, and the area on the lower surface of the conductive adhesive layer 12 exposed can be used for conductive connection with other conductive components. In this embodiment, the conductive adhesive layer 12 is exposed through the adhesive exposure groove 30a, and after the conductive adhesive layer 12 exposed from the adhesive exposure groove 30a adheres to other conductive components, the conductive adhesive layer 12 can be separated from the other conductive components more easily, and the probability of the conductive adhesive layer 12 remaining on the other conductive components can be reduced.

[0162] A third structure of the conductive adhesive tape in this embodiment is shown in FIG. 3. Figure 36As shown, the conductive adhesive tape comprises a conductive functional layer 10, a first protective layer 20 arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 comprises a conductive base layer 11 and a conductive adhesive layer 12, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire lower surface of the conductive base layer 11. The first protective layer 20 comprises a first insulating coating layer 23, which covers the upper surface of the left end of the conductive base layer 11 to avoid the upper surface of the conductive base layer 11 being corroded or plated, and the upper surface of the right end of the conductive base layer 11 is exposed and can be used for conductive connection with other conductive components. The second protective layer 30 comprises a second shielding layer 31 and a second connecting adhesive layer 32, the second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32, and the second protective layer 30 is provided with an adhesive exposure groove 30a near the left end, the adhesive exposure groove 30a penetrates the second protective layer 30, so that part of the lower surface of the conductive adhesive layer 12 is exposed from the adhesive exposure groove 30a, and the area of the lower surface of the conductive adhesive layer 12 except the area exposed from the adhesive exposure groove 30a is covered by the second shielding layer 31. The area of the lower surface of the conductive adhesive layer 12 covered by the second shielding layer 31 can avoid being corroded or plated, and the area of the lower surface of the conductive adhesive layer 12 exposed from the adhesive exposure groove 30a can be used for conductive connection with other conductive components. In this embodiment, the conductive adhesive layer 12 is exposed through the adhesive exposure groove 30a, and after the conductive adhesive layer 12 exposed from the adhesive exposure groove 30a adheres to other conductive components, the probability of the conductive adhesive layer 12 remaining on the other conductive components can be reduced during the process of separating the conductive adhesive layer 12 from the other conductive components, and the conductive adhesive layer 12 is more easily separated from the other conductive components as a whole.

[0163] The fourth structure of the conductive adhesive tape in this embodiment is as shown in FIG. 4. Figure 37As shown, the conductive adhesive tape comprises a conductive functional layer 10, a first protective layer 20 arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 comprises a conductive base layer 11 and a conductive adhesive layer 12, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire area on the lower surface of the conductive base layer 11. The first protective layer 20 comprises a first shielding layer 21 and a first connecting adhesive layer 22, the first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22, and the first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to avoid corrosion or electroplating of the conductive base layer 11. The second protective layer 30 comprises a second shielding layer 31 and a second connecting adhesive layer 32, the second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32, and the second shielding layer 31 does not completely cover the lower surface of the conductive adhesive layer 12. The second shielding layer 31 does not cover the lower surface of the right end of the conductive adhesive layer 12, and the second protective layer 30 is provided with an adhesive exposure groove 30a near the left end. The adhesive exposure groove 30a penetrates the second protective layer 30, so that part of the lower surface of the conductive adhesive layer 12 is exposed from the adhesive exposure groove 30a. Except for the area exposed from the adhesive exposure groove 30a and the lower surface of the right end of the conductive adhesive layer 12, the other areas on the lower surface of the conductive adhesive layer 12 are covered by the second shielding layer 31. The covered area on the lower surface of the conductive adhesive layer 12 can avoid corrosion or electroplating, and the exposed area on the lower surface of the conductive adhesive layer 12 can be used for conductive connection with other conductive components. In this embodiment, the conductive adhesive layer 12 is exposed through the adhesive exposure groove 30a. When the conductive adhesive layer 12 adheres to other conductive components and is separated from the other conductive components, the probability of the conductive adhesive layer 12 remaining on the other conductive components can be reduced, and the conductive adhesive layer 12 can be more easily separated from the other conductive components as a whole.

[0164] The fifth structure of the conductive adhesive tape in this embodiment is as shown in Figure 38As shown, the conductive adhesive tape comprises a conductive functional layer 10, a first protective layer 20 arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 comprises a conductive base layer 11 and a conductive adhesive layer 12, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, the conductive adhesive layer 12 covers part of the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 is arranged on the lower surface of the conductive base layer 11 and exposes the lower surface of the right end of the conductive base layer 11. For example, the conductive adhesive layer 12 arranged on the lower surface of the conductive base layer 11 is bonded to the area to be plated on the solar cell, and the exposed right end of the conductive base layer 11 is connected to the conductive clamp, so that the current for plating the solar cell can flow to the area to be plated on the solar cell through the conductive clamp and the conductive adhesive tape in sequence; the lower surface of the right end of the conductive base layer 11 is not provided with the conductive adhesive layer 12, which can avoid the lower surface of the right end of the conductive adhesive tape from being bonded to the conductive clamp and being unable to be separated. The first protective layer 20 comprises a first shielding layer 21 and a first connecting adhesive layer 22, the first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22, and the first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to avoid corrosion or plating of the conductive base layer 11. The second protective layer 30 comprises a second shielding layer 31 and a second connecting adhesive layer 32, the second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32, the second protective layer 30 is provided with an adhesive exposure groove 30a near the left end, the adhesive exposure groove 30a penetrates the second protective layer 30, so that part of the lower surface of the conductive adhesive layer 12 is exposed from the adhesive exposure groove 30a, and the lower surface of the conductive adhesive layer 12 is covered by the second shielding layer 31 except the area exposed from the adhesive exposure groove 30a. The covered area of the lower surface of the conductive adhesive layer 12 can avoid corrosion or plating, and the exposed area of the lower surface of the conductive adhesive layer 12 can be used for conductive connection with other conductive components. In the embodiment, the conductive adhesive layer 12 is exposed through the adhesive exposure groove 30a, and after the conductive adhesive layer 12 exposed from the adhesive exposure groove 30a is adhered to other conductive components, the probability of the conductive adhesive layer 12 remaining on the other conductive components can be reduced in the process of separating the conductive adhesive layer 12 from the other conductive components, and the conductive adhesive layer 12 is more easily separated from the other conductive components as a whole.

[0165] The sixth structure of the conductive adhesive tape in the embodiment is as shown in Figure 39As shown, the conductive adhesive tape comprises a conductive functional layer 10, a first protective layer 20 arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 comprises a conductive base layer 11, a conductive adhesive layer 12, and a conductive coating layer 13, the conductive coating layer 13 is arranged on the lower surface of the conductive base layer 11, the conductive coating layer 13 covers the entire area on the lower surface of the conductive base layer 11, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13, and the conductive adhesive layer 12 covers the entire area on the lower surface of the conductive coating layer 13. The first protective layer 20 comprises a first shielding layer 21 and a first connecting adhesive layer 22, the first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22, and the first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to avoid corrosion or electroplating of the conductive base layer 11. The second protective layer 30 comprises a second shielding layer 31 and a second connecting adhesive layer 32, the second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32, and the second shielding layer 31 does not completely cover the lower surface of the conductive adhesive layer 12, specifically, the second shielding layer 31 does not cover the lower surface of the right end of the conductive adhesive layer 12, and the second protective layer 30 is provided with an exposed adhesive groove 30a near the left end, the exposed adhesive groove 30a penetrates the second protective layer 30, so that part of the lower surface of the conductive adhesive layer 12 is exposed from the exposed adhesive groove 30a, except for the exposed area from the exposed adhesive groove 30a and the lower surface of the right end of the conductive adhesive layer 12, the other areas on the lower surface of the conductive adhesive layer 12 are covered by the second shielding layer 31. The covered area on the lower surface of the conductive adhesive layer 12 can avoid corrosion or electroplating, and the exposed area on the lower surface of the conductive adhesive layer 12 can be used for conductive connection with other conductive components. In this embodiment, the conductive adhesive layer 12 is exposed through the exposed adhesive groove 30a, and in the process of separating the conductive adhesive layer 12 from other conductive components after the conductive adhesive layer 12 adheres to other conductive components from the exposed adhesive groove 30a, the probability of the conductive adhesive layer 12 remaining on the other conductive components can be reduced, and the conductive adhesive layer 12 is more easily separated from the other conductive components as a whole.

[0166] The seventh structure of the conductive adhesive tape in this embodiment is as shown in Figure 40As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11, and the conductive adhesive layer 12 covers the entire area of ​​the lower surface of the conductive substrate layer 11. The first protective layer 20 includes a first insulating coating 23, which covers the entire area of ​​the upper surface of the conductive substrate layer 11 to prevent the upper surface of the conductive substrate layer 11 from being corroded or electroplated. The second protective layer 30 includes a second insulating coating 33. The second insulating coating 33 does not completely cover the lower surface of the conductive adhesive layer 12. Specifically, the second insulating coating 33 does not cover the lower surface of the right end of the conductive adhesive layer 12, and an exposed adhesive groove 30a is provided on the second insulating coating 33 near its left end. The exposed adhesive groove 30a penetrates the second insulating coating 33, so that a portion of the lower surface of the conductive adhesive layer 12 is exposed from the exposed adhesive groove 30a. Except for the area exposed from the exposed adhesive groove 30a and the lower surface of the right end of the conductive adhesive layer 12, the other areas on the lower surface of the conductive adhesive layer 12 are covered by the second insulating coating 33. The covered area on the lower surface of the conductive adhesive layer 12 can be prevented from being corroded or electroplated, and the exposed area on the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components. In this embodiment, the conductive adhesive layer 12 is exposed through the adhesive exposure groove 30a. After the conductive adhesive layer 12 exposed from the adhesive exposure groove 30a adheres to other conductive components, the probability of the conductive adhesive layer 12 remaining on other conductive components can be reduced during the separation process. The conductive adhesive layer 12 is easier to separate from other conductive components as a whole.

[0167] Example 8

[0168] like Figures 41-46 As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 is disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 is disposed on the lower surface of the conductive functional layer 10.

[0169] In some conductive tapes, the conductive functional layer 10 includes at least a conductive substrate layer 11 and a conductive adhesive layer 12. The conductive substrate layer 11 forms a conductive material layer. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11, and the conductive adhesive layer 12 covers a portion of the lower surface of the conductive substrate layer 11. A third connecting groove 12b is provided on the conductive adhesive layer 12, penetrating the conductive adhesive layer 12, so that a portion of the lower surface of the conductive substrate layer 11 is exposed from the third connecting groove 12b. Preferably, the third connecting groove 12b is provided adjacent to one end of the conductive adhesive layer 12.

[0170] In some other conductive adhesive tapes, in order to improve the conductive performance of the conductive functional layer 10, a conductive coating layer 13 is arranged between the conductive base layer 11 and the conductive adhesive layer 12, the conductive performance of the conductive functional layer 10 is improved through the conductive coating layer 13, the conductive coating layer 13 and the conductive base layer 11 together form a conductive material layer, the conductive coating layer 13 covers all or part of the lower surface of the conductive base layer 11, and the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13, and the conductive adhesive layer 12 covers all or part of the lower surface of the conductive coating layer 13.

[0171] The first protective layer 20 completely covers the upper surface of the conductive functional layer 10, so as to avoid corrosion or electroplating of the conductive functional layer 10; or, the first protective layer 20 is provided with a first communication groove 20b penetrating through the first protective layer 20, so that part of the upper surface of the conductive base layer 11 is exposed from the first communication groove 20b, and the first communication groove 20b is arranged directly above the third communication groove 12b. The second protective layer 30 is arranged on the lower surface of the conductive functional layer 10, the second protective layer 30 is provided with a second communication groove 30b penetrating through the second protective layer 30, the second communication groove 30b is arranged directly below the third communication groove 12b, so that the lower surface of the conductive base layer 11 is exposed from the second communication groove 30b, and the second protective layer 30 does not cover one end of the conductive functional layer 10 away from the second communication groove 30b, so that the conductive functional layer 10 at the end is exposed, that is, the conductive adhesive layer 12 at the end is exposed, for electrically connecting other conductive components. In the embodiment, the upper surface of the conductive base layer 11 is exposed through the first communication groove 20b, and the lower surface of the conductive base layer 11 is exposed through the third communication groove 12b and the second communication groove 30b, when the conductive adhesive tape is used as a conductive connecting piece, the other conductive components directly contact and connect the upper surface of the conductive base layer 11 through the first communication groove 20b, and directly contact and connect the lower surface of the conductive base layer 11 through the third communication groove 12b and the second communication groove 30b, so as to reduce the resistance of the current passing through the conductive adhesive tape, and improve the stability of the electrical connection between the other conductive components and the conductive adhesive tape. The other conductive components can be conductive clamps, conductive probes, etc.

[0172] The first kind of structure of the conductive adhesive tape in the embodiment is as shown in Figure 41As shown, the conductive adhesive tape comprises a conductive functional layer 10, a first protective layer 20 arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 comprises a conductive base layer 11 and a conductive adhesive layer 12, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers part of the lower surface of the conductive base layer 11. Specifically, the conductive adhesive layer 12 is provided with a third communication groove 12b penetrating the conductive adhesive layer 12, so that part of the lower surface of the conductive base layer 11 is exposed from the third communication groove 12b. Except for the area exposed from the third communication groove 12b, the rest of the lower surface of the conductive base layer 11 is covered by the conductive adhesive layer 12. Specifically, the third communication groove 12b is arranged adjacent to the right end of the conductive adhesive layer 12. The first protective layer 20 comprises a first shielding layer 21 and a first connecting adhesive layer 22, the first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22, and the first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to avoid corrosion or electroplating of the conductive base layer 11. The second protective layer 30 comprises a second shielding layer 31 and a second connecting adhesive layer 32, the second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32, and the second protective layer 30 (the second shielding layer 31 and the second connecting adhesive layer 32) is provided with a second communication groove 30b penetrating the second protective layer 30, the second communication groove 30b is arranged directly below the third communication groove 12b, so that part of the lower surface of the conductive base layer 11 is exposed from the third communication groove 12b and the second communication groove 30b, forming a second exposed part; the second protective layer 30 does not cover one end of the conductive adhesive layer 12 away from the second communication groove 30b, i.e. the left end of the conductive adhesive layer 12, so that the lower surface of the left end of the conductive adhesive layer 12 is exposed, forming a first exposed part.

[0173] The second structure of the conductive adhesive tape in the embodiment is as shown in Figure 42As shown, the conductive adhesive tape comprises a conductive functional layer 10, a first protective layer 20 arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 comprises a conductive base layer 11 and a conductive adhesive layer 12, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, the conductive adhesive layer 12 covers part of the lower surface of the conductive base layer 11, the conductive adhesive layer 12 is provided with a third communication groove 12b penetrating the conductive adhesive layer 12, so that the lower surface of the conductive base layer 11 is exposed from the third communication groove 12b. Except for the area exposed from the third communication groove 12b, the rest of the lower surface of the conductive base layer 11 is covered by the conductive adhesive layer 12. Specifically, the third communication groove 12b is arranged adjacent to the right end of the conductive adhesive layer 12. The first protective layer 20 comprises a first shielding layer 21 and a first connecting adhesive layer 22, the first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22, and the first shielding layer 21 partially covers the upper surface of the conductive base layer 11 to avoid the covered area of the conductive base layer 11 from being corroded or plated. The first protective layer 20 (the first shielding layer 21 and the first connecting adhesive layer 22) is provided with a first communication groove 20b penetrating the first protective layer 20, so that part of the upper surface of the conductive base layer 11 is exposed from the first communication groove 20b, and the first communication groove 20b is arranged directly above the third communication groove 12b. The second protective layer 30 comprises a second shielding layer 31 and a second connecting adhesive layer 32, the second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32, and the second protective layer 30 (the second shielding layer 31 and the second connecting adhesive layer 32) is provided with a second communication groove 30b penetrating the second protective layer 30, the second communication groove 30b is arranged directly below the third communication groove 12b, so that part of the lower surface of the conductive base layer 11 is exposed from the third communication groove 12b and the second communication groove 30b, the second protective layer 30 does not cover the end of the conductive adhesive layer 12 away from the second communication groove 30b, i.e. the left end of the conductive adhesive layer 12, so that the lower surface of the left end of the conductive adhesive layer 12 is exposed to form a first exposed part; the exposed area of the upper surface of the conductive base layer 11 and the exposed area of the lower surface of the conductive base layer 11 respectively form a second exposed part and a third exposed part.

[0174] The third structure of the conductive adhesive tape in the embodiment is as shown in Figure 43As shown, the conductive adhesive tape comprises a conductive functional layer 10, a first protective layer 20 arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 comprises a conductive base layer 11, a conductive adhesive layer 12, and a conductive coating layer 13. The conductive coating layer 13 is arranged on the lower surface of the conductive base layer 11 and covers the entire area on the lower surface of the conductive base layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13, and the conductive adhesive layer 12 covers part of the area on the lower surface of the conductive coating layer 13. The conductive adhesive layer 12 is provided with a third communication groove 12b which penetrates the conductive adhesive layer 12, so that the lower surface of the conductive coating layer 13 is exposed from the third communication groove 12b. Except for the area exposed from the third communication groove 12b, the remaining area on the lower surface of the conductive coating layer 13 is covered by the conductive adhesive layer 12. Specifically, the third communication groove 12b is arranged adjacent to the right end of the conductive adhesive layer 12. The first protective layer 20 comprises a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22, and the first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to avoid corrosion or electroplating of the conductive base layer 11. The second protective layer 30 comprises a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. The second protective layer 30 (the second shielding layer 31 and the second connecting adhesive layer 32) is provided with a second communication groove 30b which penetrates the second protective layer 30. The second communication groove 30b is arranged directly below the third communication groove 12b, so that part of the lower surface of the conductive coating layer 13 is exposed from the third communication groove 12b and the second communication groove 30b. The second protective layer 30 does not cover the left end of the conductive adhesive layer 12, i.e., the left end of the conductive adhesive layer 12, so that the lower surface of the left end of the conductive adhesive layer 12 is exposed.

[0175] The fourth structure of the conductive adhesive tape in the embodiment is as shown in FIG. 4. Figure 44As shown, the conductive adhesive tape comprises a conductive functional layer 10, a first protective layer 20 arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 comprises a conductive base layer 11, a conductive adhesive layer 12, and a conductive coating layer 13. The conductive coating layer 13 is arranged on the lower surface of the conductive base layer 11 and covers the entire area on the lower surface of the conductive base layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13, and the conductive adhesive layer 12 covers part of the area on the lower surface of the conductive coating layer 13. A third communication groove 12b is arranged on the conductive adhesive layer 12 and penetrates the conductive adhesive layer 12, so that the lower surface of the conductive coating layer 13 is exposed from the third communication groove 12b. Except for the area exposed from the third communication groove 12b, the remaining area on the lower surface of the conductive coating layer 13 is covered by the conductive adhesive layer 12. Specifically, the third communication groove 12b is arranged adjacent to the right end of the conductive adhesive layer 12. The first protective layer 20 comprises a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22, and the first shielding layer 21 partially covers the upper surface of the conductive base layer 11 to avoid the covered area on the conductive base layer 11 from being corroded or plated. A first communication groove 20b is arranged on the first protective layer 20 (the first shielding layer 21 and the first connecting adhesive layer 22) and penetrates the first protective layer 20, so that the upper surface of the conductive base layer 11 is exposed from the first communication groove 20b. The first communication groove 20b is arranged directly above the third communication groove 12b. The second protective layer 30 comprises a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. A second communication groove 30b is arranged on the second protective layer 30 (the second shielding layer 31 and the second connecting adhesive layer 32) and penetrates the second protective layer 30. The second communication groove 30b is arranged directly below the third communication groove 12b, so that part of the lower surface of the conductive coating layer 13 is exposed from the third communication groove 12b and the second communication groove 30b. The second protective layer 30 does not cover the end of the conductive adhesive layer 12 away from the second communication groove 30b, i.e., the left end of the conductive adhesive layer 12, so that the lower surface of the left end of the conductive adhesive layer 12 is exposed.

[0176] The fifth structure of the conductive adhesive tape in the embodiment is as shown in FIG. 5. Figure 45As shown, the conductive adhesive tape comprises a conductive functional layer 10, a first protective layer 20 arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 comprises a conductive base layer 11 and a conductive adhesive layer 12, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, the conductive adhesive layer 12 covers part of the lower surface of the conductive base layer 11, the conductive adhesive layer 12 is provided with a third communication groove 12b, the third communication groove 12b penetrates the conductive adhesive layer 12, and part of the lower surface of the conductive base layer 11 is exposed from the third communication groove 12b. Except for the area exposed from the third communication groove 12b, the rest of the lower surface of the conductive base layer 11 is covered by the conductive adhesive layer 12. Specifically, the third communication groove 12b is arranged adjacent to the right end of the conductive adhesive layer 12. The first protective layer 20 comprises a first insulating coating layer 23, the first insulating coating layer 23 completely covers the upper surface of the conductive base layer 11, so as to avoid the upper surface of the conductive base layer 11 from being corroded or electroplated. The second protective layer 30 comprises a second insulating coating layer 33, the second protective layer 30 (the second insulating coating layer 33) is provided with a second communication groove 30b, the second communication groove 30b penetrates the second protective layer 30, the second communication groove 30b is arranged directly below the third communication groove 12b, so that the lower surface of the conductive base layer 11 is exposed from the third communication groove 12b and the second communication groove 30b, the second protective layer 30 does not cover the end of the conductive adhesive layer 12 away from the second communication groove 30b, i.e. the left end of the conductive adhesive layer 12, so that the lower surface of the left end of the conductive adhesive layer 12 is exposed.

[0177] The sixth structure of the conductive adhesive tape in the embodiment is as shown in Figure 46As shown, the conductive tape includes a conductive functional layer 10. A first protective layer 20 is disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 is disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11, and the conductive adhesive layer 12 covers a portion of the lower surface of the conductive substrate layer 11. A third connecting groove 12b is disposed on the conductive adhesive layer 12, penetrating the conductive adhesive layer 12, so that a portion of the lower surface of the conductive substrate layer 11 is exposed from the third connecting groove 12b. Except for the area exposed from the third connecting groove 12b, the remaining area of ​​the lower surface of the conductive substrate layer 11 is covered by the conductive adhesive layer 12. Specifically, the third connecting groove 12b is disposed adjacent to the right end of the conductive adhesive layer 12. The first protective layer 20 includes a first insulating coating 23, which partially covers the upper surface of the conductive substrate layer 11 to prevent corrosion or electroplating of the covered area on the conductive substrate layer 11. A first connecting groove 20b is provided on the first protective layer 20 (first insulating coating 23), penetrating the first protective layer 20 so that a portion of the upper surface of the conductive substrate layer 11 is exposed from the first connecting groove 20b. The first connecting groove 20b is located directly above the third connecting groove 12b. The second protective layer 30 includes a second insulating coating 33. A second connecting groove 30b is provided on the second protective layer 30 (second insulating coating 33). The second connecting groove 30b penetrates the second protective layer 30 and is located directly below the third connecting groove 12b, so that a portion of the lower surface of the conductive substrate layer 11 is exposed from the third connecting groove 12b and the second connecting groove 30b. The second protective layer 30 does not cover the end of the conductive adhesive layer 12 away from the second connecting groove 30b, that is, the left end of the conductive adhesive layer 12, so that the lower surface of the left end of the conductive adhesive layer 12 is exposed.

[0178] Example 9

[0179] like Figures 47-50 As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 is disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 is disposed on the lower surface of the conductive functional layer 10.

[0180] In some conductive tapes, the conductive functional layer 10 includes at least a conductive substrate layer 11 and a conductive adhesive layer 12. The conductive substrate layer 11 forms a conductive material layer, and the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11. The conductive adhesive layer 12 covers all or part of the lower surface of the conductive substrate layer 11. For example, the conductive adhesive layer 12 may only cover the lower surface of one end of the conductive substrate layer 11, or the conductive adhesive layer 12 may not cover the lower surface of the other end of the conductive substrate layer 11.

[0181] In some other conductive adhesive tapes, in order to improve the conductivity of the conductive functional layer 10, a conductive coating layer 13 is arranged between the conductive base layer 11 and the conductive adhesive layer 12, the conductivity of the conductive functional layer 10 is improved through the conductive coating layer 13, the conductive coating layer 13 and the conductive base layer 11 together form a conductive material layer, the conductive coating layer 13 covers all or part of the lower surface of the conductive base layer 11, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13, and the conductive adhesive layer 12 covers all or part of the lower surface of the conductive coating layer 13.

[0182] The first protective layer 20 is connected to the upper surface of the conductive functional layer 10, and the first protective layer 20 completely covers the upper surface of the conductive functional layer 10 to avoid corrosion or electroplating of the upper surface of the conductive functional layer 10. The second protective layer 30 is connected to the lower surface of the conductive functional layer 10, and the second protective layer 30 does not completely cover the lower surface of the conductive functional layer 10, the lower surface of the middle part of the conductive functional layer 10 is covered, and the lower surface of the two ends of the conductive functional layer 10 is exposed and not covered. The area of the lower surface of the conductive functional layer 10 that is covered can avoid being corroded or electroplated, and the area of the lower surface of the conductive functional layer 10 that is exposed can be used for conductive connection with other conductive components. The exposed area of the lower surface of at least one end of the conductive functional layer 10 is the lower surface of the conductive adhesive layer 12, and the exposed lower surface of the conductive adhesive layer 12 is provided with an anti-sticking piece 60, which can reduce the adhesion of the conductive adhesive layer 12, reduce the bonding area of the lower surface of the conductive adhesive layer 12, and further reduce the risk of leaving residual glue on the components to which the conductive adhesive layer 12 is bonded.

[0183] The first structure of the conductive adhesive tape in the embodiment is as shown in Figures 47-48As shown, the conductive adhesive tape comprises a conductive functional layer 10, a first protective layer 20 arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 comprises a conductive base layer 11 and a conductive adhesive layer 12, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire area on the lower surface of the conductive base layer 11. The first protective layer 20 comprises a first shielding layer 21 and a first connecting adhesive layer 22, the first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22, and the first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to avoid corrosion or electroplating of the conductive base layer 11. The second protective layer 30 comprises a second shielding layer 31 and a second connecting adhesive layer 32, the second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32, and the second shielding layer 31 does not completely cover the lower surface of the conductive adhesive layer 12, the lower surface of the middle part of the conductive adhesive layer 12 is covered, and the lower surface of the two ends of the conductive adhesive layer 12 is exposed and not covered, the area of the lower surface of the conductive adhesive layer 12 that is covered can avoid corrosion or electroplating, and the area of the lower surface of the conductive adhesive layer 12 that is exposed can be used for conductive connection with other conductive components. The lower surface of the left end of the conductive adhesive layer 12 is provided with an anti-adhesion piece 60, which can reduce the adhesion of the conductive adhesive layer 12, reduce the bonding area of the lower surface of the conductive adhesive layer 12, and further reduce the risk of leaving residual adhesive on the components to which the conductive adhesive layer 12 is bonded.

[0184] The second structure of the conductive adhesive tape in the embodiment is as shown in Figure 49As shown, the conductive adhesive tape comprises a conductive functional layer 10, a first protective layer 20 arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 comprises a conductive base layer 11, a conductive adhesive layer 12, and a conductive coating layer 13. The conductive coating layer 13 is arranged on the lower surface of the conductive base layer 11 and covers the entire area on the lower surface of the conductive base layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13, and the conductive adhesive layer 12 covers the entire area on the lower surface of the conductive coating layer 13. The first protective layer 20 comprises a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22, and the first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to avoid corrosion or electroplating of the conductive base layer 11. The second protective layer 30 comprises a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32, and the second shielding layer 31 does not completely cover the lower surface of the conductive adhesive layer 12. The lower surface of the middle part of the conductive adhesive layer 12 is covered, and the lower surfaces of the two ends of the conductive adhesive layer 12 are exposed and not covered. The area of the lower surface of the conductive adhesive layer 12 that is covered can avoid corrosion or electroplating, and the area of the lower surface of the conductive adhesive layer 12 that is exposed can be used for conductive connection with other conductive components. An anti-adhesion sheet 60 is arranged on the lower surface of the left end of the conductive adhesive layer 12. The anti-adhesion sheet 60 can reduce the adhesion of the conductive adhesive layer 12, reduce the bonding area of the lower surface of the conductive adhesive layer 12, and further reduce the risk of leaving residual adhesive on the components to which the conductive adhesive layer 12 is bonded.

[0185] The third structure of the conductive adhesive tape in the present embodiment is as shown in FIG. 3. Figure 50As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11, and the conductive adhesive layer 12 covers the entire lower surface of the conductive substrate layer 11. The first protective layer 20 includes a first insulating coating 23, which completely covers the upper surface of the conductive substrate layer 11 to prevent corrosion or electroplating. The second protective layer 30 includes a second insulating coating 33, which covers the lower surface of the conductive adhesive layer 12 and exposes the lower surfaces at both ends of the conductive adhesive layer 12. The covered area of ​​the lower surface of the conductive adhesive layer 12 is protected from corrosion or electroplating, while the exposed area can be used for conductive connection to other conductive components. An anti-sticking sheet 60 is provided on the lower surface of the left end of the conductive adhesive layer 12. The anti-sticking sheet 60 can reduce the adhesion of the conductive adhesive layer 12 and reduce the bonding area of ​​the lower surface of the conductive adhesive layer 12, thereby reducing the risk of the conductive adhesive layer 12 leaving residual adhesive on the parts it is bonded to.

[0186] Example 10

[0187] like Figures 51-56 The conductive tape shown includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10.

[0188] The conductive functional layer 10 includes a conductive material layer and a conductive adhesive layer 12. In this embodiment, conductive adhesive layers 12 are provided on both the upper and lower surfaces of the conductive material layer. For ease of description, the conductive adhesive layers 12 provided on the upper and lower surfaces of the conductive material layer are respectively referred to as the first conductive adhesive layer and the second conductive adhesive layer.

[0189] In some conductive tapes, a conductive material layer is formed by a conductive substrate layer 11. A conductive adhesive layer 12 is provided on both the upper and lower surfaces of the conductive substrate layer 11. A first conductive adhesive layer covers all or part of the upper surface of the conductive substrate layer 11, and a second conductive adhesive layer covers all or part of the lower surface of the conductive substrate layer 11. For example, the first conductive adhesive layer only covers the upper surface of one end of the conductive substrate layer 11, and the second conductive adhesive layer only covers the lower surface of the corresponding end of the conductive substrate layer 11.

[0190] In some conductive adhesive tapes, in order to improve the conductive performance of the conductive functional layer 10, a conductive coating layer 13 is arranged between the conductive base layer 11 and the conductive adhesive layer 12, and the conductive performance of the conductive functional layer 10 is improved through the conductive coating layer 13, i.e., the conductive base layer 11 and the conductive coating layer 13 together constitute a conductive material layer. Above the conductive base layer 11, the conductive coating layer 13 covers all or part of the upper surface of the conductive base layer 11, the lower surface of the first conductive adhesive layer is connected to the upper surface of the conductive coating layer 13, and the first conductive adhesive layer covers all or part of the upper surface of the conductive coating layer 13. Below the conductive base layer 11, the conductive coating layer 13 covers all or part of the lower surface of the conductive base layer 11, the upper surface of the second conductive adhesive layer is connected to the lower surface of the conductive coating layer 13, and the second conductive adhesive layer covers all or part of the lower surface of the conductive coating layer 13.

[0191] The first protective layer 20 does not completely cover the upper surface of the conductive functional layer 10, the upper surface of the middle part of the conductive functional layer 10 is covered, and the upper surfaces of the two ends of the conductive functional layer 10 are exposed and not covered. The area of the upper surface of the conductive functional layer 10 that is covered can be prevented from being corroded or plated, and the area of the upper surface of the conductive functional layer 10 that is exposed can be used for conductive connection with other conductive components. The second protective layer 30 does not completely cover the lower surface of the conductive functional layer 10, the lower surface of the middle part of the conductive functional layer 10 is covered, and the lower surfaces of the two ends of the conductive functional layer 10 are exposed and not covered. The area of the lower surface of the conductive functional layer 10 that is covered can be prevented from being corroded or plated, and the area of the lower surface of the conductive functional layer 10 that is exposed can be used for conductive connection with other conductive components.

[0192] In a specific application environment, the first conductive adhesive layer and the second conductive adhesive layer of one conductive adhesive tape can each bond one solar cell, i.e., the one conductive adhesive tape can simultaneously bond two solar cells and simultaneously plate the two solar cells, thereby reducing the amount of conductive adhesive tape used as a consumable and reducing the cost of plating the solar cells. Preferably, the solar cells are single-sided plated solar cells, such as IBC solar cells.

[0193] The first structure of the conductive adhesive tape in this embodiment is as shown in Figure 51As shown, the conductive adhesive tape comprises a conductive functional layer 10, a first protective layer 20 arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 comprises a conductive base layer 11 and a conductive adhesive layer 12, and the upper surface and the lower surface of the conductive base layer 11 are both provided with the conductive adhesive layer 12. The first conductive adhesive layer covers the entire area on the upper surface of the conductive base layer 11, and the second conductive adhesive layer covers the entire area on the lower surface of the conductive base layer 11. The first protective layer 20 comprises a first shielding layer 21 and a first connecting adhesive layer 22, and the first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22. The first shielding layer 21 does not completely cover the upper surface of the first conductive adhesive layer, and the upper surface of the middle part of the first conductive adhesive layer is covered, while the upper surfaces of the two ends of the first conductive adhesive layer are exposed and not covered. The area of the upper surface of the first conductive adhesive layer that is covered can avoid being corroded or electroplated, and the area of the upper surface of the first conductive adhesive layer that is exposed can be used for conductive connection with other conductive components. The second protective layer 30 comprises a second shielding layer 31 and a second connecting adhesive layer 32, and the second shielding layer 31 is connected to the lower surface of the second conductive adhesive layer through the second connecting adhesive layer 32. The second shielding layer 31 does not completely cover the lower surface of the second conductive adhesive layer, and the lower surface of the middle part of the second conductive adhesive layer is covered, while the lower surfaces of the two ends of the second conductive adhesive layer are exposed and not covered. The area of the lower surface of the second conductive adhesive layer that is covered can avoid being corroded or electroplated, and the area of the lower surface of the second conductive adhesive layer that is exposed can be used for conductive connection with other conductive components.

[0194] The second structure of the conductive adhesive tape in the embodiment is shown in Figure 52 The difference between the second structure of the conductive adhesive tape in the embodiment and the first structure of the conductive adhesive tape in the embodiment is that the first conductive adhesive layer covers part of the area on the upper surface of the conductive base layer 11, i.e., the first conductive adhesive layer covers the upper surface of the left end of the conductive base layer 11, and the upper surface of the right end of the conductive base layer 11 is exposed, and the second conductive adhesive layer covers the entire area on the lower surface of the conductive base layer 11. Without a drawing, the conductive adhesive tape in the embodiment can also have the following structure: the first conductive adhesive layer covers the upper surface of the left end of the conductive base layer 11, and the upper surface of the right end of the conductive base layer 11 is exposed, and the second conductive adhesive layer covers the lower surface of the left end of the conductive base layer 11, and the lower surface of the right end of the conductive base layer 11 is exposed.

[0195] The third structure of the conductive adhesive tape in the embodiment is shown in Figure 53The difference between the second structure of the conductive adhesive tape in the embodiment and the first structure of the conductive adhesive tape in the embodiment is that a conductive coating layer 13 is arranged between the conductive base layer 11 and the conductive adhesive layer 12 to improve the conductivity of the conductive functional layer 10.

[0196] The fourth structure of the conductive adhesive tape in the embodiment is shown in Figure 54 The difference between the fourth structure of the conductive adhesive tape in the embodiment and the second structure of the conductive adhesive tape in the embodiment is that a conductive coating layer 13 is arranged between the conductive base layer 11 and the conductive adhesive layer 12 to improve the conductivity of the conductive functional layer 10.

[0197] The fifth structure of the conductive adhesive tape in the embodiment is shown in Figure 55 The difference between the fifth structure of the conductive adhesive tape in the embodiment and the first structure of the conductive adhesive tape in the embodiment is that the first protective layer 20 includes a first insulating coating layer 23, the first insulating coating layer 23 is connected to the upper surface of the conductive base layer 11, the first insulating coating layer 23 does not completely cover the upper surface of the first conductive adhesive layer, the upper surface of the middle part of the first conductive adhesive layer is covered, the upper surfaces of the two ends of the first conductive adhesive layer are exposed and not covered, the area of the upper surface of the first conductive adhesive layer that is covered can avoid being corroded or plated, and the area of the upper surface of the first conductive adhesive layer that is exposed can be used for conductive connection with other conductive components. The second protective layer 30 includes a second insulating coating layer 33, the second insulating coating layer 33 is connected to the lower surface of the second conductive adhesive layer, the second insulating coating layer 33 does not completely cover the lower surface of the second conductive adhesive layer, the lower surface of the middle part of the second conductive adhesive layer is covered, the lower surfaces of the two ends of the second conductive adhesive layer are exposed and not covered, the area of the lower surface of the second conductive adhesive layer that is covered can avoid being corroded or plated, and the area of the lower surface of the second conductive adhesive layer that is exposed can be used for conductive connection with other conductive components.

[0198] The sixth structure of the conductive adhesive tape in the embodiment is shown in Figure 56As shown, the difference between this and the fifth structure of the conductive tape in this embodiment is that the first conductive adhesive layer covers a portion of the upper surface of the conductive substrate layer 11, that is, the first conductive adhesive layer covers the upper surface of the left end of the conductive substrate layer 11, exposing the upper surface of the right end of the conductive substrate layer 11, and the second conductive adhesive layer covers the entire area of ​​the lower surface of the conductive substrate layer 11. (Not shown in the figure) The conductive tape in this embodiment can also adopt the following structure: the first conductive adhesive layer covers the upper surface of the left end of the conductive substrate layer 11, exposing the upper surface of the right end of the conductive substrate layer 11, and the second conductive adhesive layer covers the lower surface of the left end of the conductive substrate layer 11, exposing the lower surface of the right end of the conductive substrate layer 11.

[0199] Example 11

[0200] like Figures 57-63 As shown, the conductive tape has a cylindrical structure, including a conductive functional layer 10 located at the center of the cylinder, and a third protective layer 70 covering the outer periphery of the conductive functional layer 10. The third protective layer 70 only covers the middle section of the conductive functional layer 10, leaving the two ends of the conductive functional layer 10 exposed. The third protective layer 70 prevents corrosion of the middle section of the conductive functional layer 10, and the exposed areas at both ends of the conductive functional layer 10 can be used for conductive connection to other conductive components. The conductive functional layer 10 includes a conductive substrate layer 11 located at the center of the cylinder, and a conductive adhesive layer 12 covering the outer periphery of the conductive substrate layer 11. To improve conductivity, a conductive coating layer 13 is also provided between the conductive substrate layer 11 and the conductive adhesive layer 12. The conductive material layer is formed by the conductive substrate layer 11, or the conductive material layer is formed by the conductive substrate layer 11 and the conductive coating layer 13 together.

[0201] In this embodiment, the first structure of the conductive tape is as follows: Figures 57-58 As shown, the third protective layer 70 specifically includes a third shielding layer 71 and a third adhesive layer 72. The third shielding layer 71 is bonded and covered around the conductive functional layer 10 via the third adhesive layer 72. The conductive functional layer 10 includes a conductive substrate layer 11 located at the center of the cylinder, and a conductive adhesive layer 12 covering the periphery of the conductive substrate layer 11. Figure 59 As shown, as a modified structure, the exposed ends of the conductive functional layer 10 are flat, which facilitates the bonding of the conductive adhesive layer 12 to other conductive components.

[0202] In this embodiment, the second structure of the conductive tape is as follows: Figures 60-61As shown, the difference between the first structure of the conductive adhesive tape in the embodiment and the first structure of the conductive adhesive tape in the embodiment is that: in order to improve the conductive performance of the conductive functional layer 10, a conductive coating layer 13 is further arranged between the conductive base layer 11 and the conductive adhesive layer 12, so as to improve the conductive performance of the conductive functional layer 10. The conductive functional layer 10 includes the conductive base layer 11 located at the center of the cylinder, the conductive coating layer 13 wrapped around the periphery of the conductive base layer 11, and the conductive adhesive layer 12 wrapped around the periphery of the conductive coating layer 13.

[0203] As shown in the third structure of the conductive adhesive tape in the embodiment, Figures 62-63 As shown, the difference between the first structure of the conductive adhesive tape in the embodiment and the first structure of the conductive adhesive tape in the embodiment is that: the third protective layer 70 specifically includes a third insulating coating layer 73, and the third insulating coating layer 73 is bonded and wrapped around the periphery of the conductive functional layer 10.

[0204] In other embodiments, the shape of the conductive adhesive tape can be a prism, which includes the conductive functional layer 10 located at the center of the prism, and the third protective layer 70 wrapped around the periphery of the conductive functional layer 10; or the middle section of the conductive adhesive tape is in the shape of a prism, and the two ends of the conductive adhesive tape are flat. For example, the shape of the conductive adhesive tape can be a triangular prism, which includes the conductive functional layer 10 located at the center of the triangular prism, and the third protective layer 70 wrapped around the periphery of the conductive functional layer 10.

[0205] Embodiment 12

[0206] As shown in the conductive adhesive tape, Figures 64-66 The conductive adhesive tape includes a conductive functional layer 10, a first protective layer 20 arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 at least includes a conductive base layer 11 and a conductive adhesive layer 12, the conductive base layer 11 constitutes a conductive material layer, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers all or part of the area on the lower surface of the conductive base layer 11.

[0207] The first protective layer 20 and / or the second protective layer 30 can refer to or refer to the structures in the aforementioned embodiments 1-9. The conductive functional layer 10 has at least two exposed parts, one of which is a first exposed part for bonding a first conductive component, and the other is a second exposed part for bonding or connecting a second conductive component. In a specific application embodiment, the conductive adhesive tape is used as a conductive connecting piece for electroplating of a solar cell, the first conductive component can be a seed layer or a TCO layer on a solar cell, and the second conductive component can be a conductive clamp or a conductive support.

[0208] As shown in the conductive adhesive tape, Figure 64As shown, the first exposed part is the lower surface of the left end of the conductive functional layer 10, and specifically can be the lower surface of the left end of the conductive adhesive layer 12. The second exposed part is the lower surface of the right end of the conductive functional layer 10, and specifically can be the lower surface of the right end of the conductive adhesive layer 12.

[0209] As shown in FIG. 1, the first exposed part is the lower surface of the left end of the conductive functional layer 10, and specifically can be the lower surface of the left end of the conductive adhesive layer 12. The second exposed part is the upper surface of the right end of the conductive functional layer 10, and specifically can be the upper surface of the right end of the conductive base layer 11. Figure 65 As shown in FIG. 1, the first exposed part is the lower surface of the left end of the conductive functional layer 10, and specifically can be the lower surface of the left end of the conductive adhesive layer 12. The second exposed part is the upper surface of the right end of the conductive functional layer 10, and specifically can be the upper surface of the right end of the conductive base layer 11.

[0210] Figure 66 As shown in FIG. 1, the first exposed part is the lower surface of the left end of the conductive functional layer 10, and specifically can be the lower surface of the left end of the conductive adhesive layer 12. The second exposed part is the upper surface of the right end of the conductive functional layer 10, and specifically can be the upper surface of the right end of the conductive base layer 11.

[0211] Suppose the size of the first exposed part extending along the length direction of the conductive adhesive tape is a, i.e. the length of the first exposed part is a, the size of the second exposed part extending along the length direction of the conductive adhesive tape is b, i.e. the length of the second exposed part is b, and the length of the conductive adhesive tape is L, then 0.01L≤a<0.5L, 0.01L≤b<0.5L, and 0.02L≤a+b<L are satisfied; preferably, 0.05L≤a≤0.2L, 0.05L≤b≤0.4L, and 0.1L≤a+b≤0.6L. The values of a and b should be moderate; if too large, the conductive functional layer 10 is excessively exposed, and the first protective layer 20 and / or the second protective layer 30 cannot play a better protection role. In addition, the first exposed part has too large an area, making it too firmly bonded to the first conductive part and easily leaving residual glue on the first conductive part; if too small, it is prone to poor contact. In addition, the first exposed part has too small an area, making it not tightly bonded to the first conductive part, and thus the conductive adhesive tape is prone to falling off the first conductive part.

[0212] Embodiment 13

[0213] On the basis of the foregoing embodiments 1-10, the conductive functional layer 10 at least includes a conductive base layer 11 and a conductive adhesive layer 12. The material of the conductive base layer 11 includes but is not limited to one or an alloy material composed of any two or more of gold, silver, platinum, copper, aluminum, nickel, and stainless steel, or a multilayer structure formed by stacking multiple kinds of gold, silver, platinum, copper, aluminum, nickel, and stainless steel along the thickness direction.

[0214] ​The conductive adhesive layer 12 is a conductive pressure-sensitive adhesive layer or a conductive heat-sensitive adhesive layer or a non-woven conductive adhesive layer. The conductive adhesive layer 12 includes a base and a conductive filler. The base includes an adhesive, a curing agent and a diluent, and can further include additives such as a plasticizer, a coupling agent and an antifoaming agent. The adhesive can be an epoxy resin, a phenolic resin, a polyimide, an acrylic resin or a polyurethane. The conductive filler can be carbon, metal or metal oxide, and preferably a single metal powder or a mixture of multiple metal powders with low resistivity, such as Au, Ag, Cu and Ni. For example, the material composition of the conductive adhesive layer 12 includes a pressure-sensitive adhesive acrylic resin and a plasticizer, which can be di-n-octyl phthalate or di-n-butyl phthalate, to improve the removability of the conductive adhesive layer 12 and reduce or avoid the risk of leaving adhesive residue during peeling of the conductive adhesive layer 12 from the adherend. The conductive adhesive layer 12 can only include the adhesive and the conductive filler, for example, the conductive adhesive layer 12 includes an acrylic resin and Ni powder.

[0215] The conductive functional layer 10 further includes a conductive coating layer 13, which can be a carbon coating layer, for example, the conductive functional layer 10 can be a carbon-coated copper foil or a carbon-coated aluminum foil.

[0216] The first shielding layer 21 can be an insulating film layer or a hydrophobic film layer, the second shielding layer 31 can be an insulating film layer or a hydrophobic film layer, and the third shielding layer 71 can be an insulating film layer or a hydrophobic film layer. The materials of the first shielding layer 21, the second shielding layer 31 and the third shielding layer 71 can all be polyethylene terephthalate (PET), polyethylene (PE) or polypropylene (PP). The materials of the first connecting adhesive layer 22, the second connecting adhesive layer 32 and the third connecting adhesive layer 72 can all be silicone adhesive.

[0217] Embodiment 14

[0218] Based on the foregoing embodiments 1-11, as shown in Figures 67-71 The conductive adhesive tape assembly includes the conductive adhesive tape 1 and the base film 50, and the conductive adhesive tape 1 is bonded to the base film 50, so that the conductive adhesive tape 1 is convenient to store and transport. For example, the conductive adhesive tape 1 is bonded to the base film 50, and the conductive adhesive tape assembly is wound to form a roll, so that the conductive adhesive tape 1 is convenient to store and transport; when used, the conductive adhesive tape 1 can be torn from the base film 50. As shown in Figure 67 The conductive functional layer 10 of the conductive adhesive tape 1 is bonded to the base film 50, and specifically, the conductive functional layer 10 includes the conductive adhesive layer 12, and the conductive adhesive layer 12 is bonded to the base film 50. As shown in Figure 68 The second protective layer 30 of the conductive adhesive tape 1 is bonded to the base film 50, and specifically, the second protective layer 30 can not have an adhesive function, and the base film 50 is provided with the third connecting adhesive layer 51, and the second protective layer 30 is bonded to the base film 50 through the third connecting adhesive layer 51.

[0219] The arrangement structure of the conductive tape 1 on the base film 50 can be adopted as follows: Figures 69-71 The structure shown. (As illustrated) Figure 69 As shown, the conductive tape 1 extends in the same direction as the base film 50. The conductive tape 1 is arranged in a rectangular array on the base film 50, with multiple conductive tapes 1 arranged along the length of the base film 50 and also along its width. Figure 70 As shown, the length extension direction of the conductive tape 1 is the same as the width extension direction of the base film 50. The conductive tapes 1 are arranged in a linear array on the base film 50, with multiple conductive tapes 1 spaced apart along the length direction of the base film 50. Figure 71 As shown, the conductive tape 1 is divided into two groups along the width direction of the base film 50. Each group of conductive tape 1 is inclinedly arranged on the base film 50 and spaced apart along the length direction of the base film 50. Each group of conductive tape 1 is in a linear array.

[0220] Example 15

[0221] This embodiment provides a solar cell 2, on which a conductive tape 1 is adhered. The conductive tape 1 can refer to or incorporate the structure described in embodiments 1-11 above. When electroplating metal grid lines on the solar cell 2, the conductive tape 1 is used to connect the solar cell 2 and the negative terminal of the electroplating power source.

[0222] Specifically, the conductive tape 1 includes a conductive functional layer 10 and a surface protective layer (e.g., a first protective layer 20 and / or a second protective layer 30). The conductive functional layer 10 is covered by the surface protective layer, and at least two portions of the conductive functional layer 10 are exposed. One portion is used to bond the electroplating area on the solar cell 2, referred to as the first exposed portion, and the other portion is used to bond or connect a second conductive component, referred to as the second exposed portion. The second conductive component is electrically connected to the negative terminal of the electroplating power supply through a wire. The second conductive component can be a conductive clip or a conductive support. The second exposed portion can be bonded to the conductive clip or the conductive support, or the second exposed portion can be clamped by the conductive clip.

[0223] Specifically, such as Figures 72-73 As shown, the area to be electroplated on the solar cell 2 includes the conductive area at the edge of the solar cell 2, which is called the conductive connection portion 2a. There may be one or more conductive connection portions 2a. Figure 72 As shown, conductive connection portions 2a are provided on both sides of the solar cell 2, and multiple conductive connection portions 2a are provided on each side of the solar cell 2. One end of the conductive tape 1 is adhered to the conductive connection portion 2a, that is, the first exposed portion of the conductive tape 1 is connected to the conductive connection portion 2a. Conductive tape 1 is adhered to each conductive connection portion 2a. Figure 72As shown, the conductive adhesive tape 1 adhered to the solar cell 2 is kept in a flat state, and in order to facilitate the connection of the second exposed part of the conductive adhesive tape 1 to the second conductive component, the conductive adhesive tape 1 adhered to the solar cell 2 can be subjected to a bending treatment, such as Figure 73 As shown, the conductive adhesive tape 1 adhered to the solar cell 2 is kept in a flat state, and in order to facilitate the connection of the second exposed part of the conductive adhesive tape 1 to the second conductive component, the conductive adhesive tape 1 adhered to the solar cell 2 can be subjected to a bending treatment, such as

[0224] The above embodiments are only for illustrating the technical concept and characteristics of the present application, and the purpose is to enable those skilled in the art to understand the content of the present application and implement it, and cannot limit the protection scope of the present application. Any equivalent changes or modifications made according to the essence of the present application shall be covered within the protection scope of the present application.

Claims

1. A conductive tape, characterized in that, The conductive tape includes a conductive functional layer, which comprises a conductive material layer and a conductive adhesive layer. The conductive adhesive layer covers all or part of the outer surface of the conductive material layer. The conductive tape also includes a surface protective layer, which does not completely cover the outer surface of the conductive functional layer.

2. The conductive tape according to claim 1, characterized in that, The surface protective layer includes a shielding layer and a bonding adhesive layer, wherein the shielding layer is connected to the outer surface of the conductive functional layer via the bonding adhesive layer; or, the surface protective layer includes an insulating coating, wherein the insulating coating is connected to the outer surface of the conductive functional layer.

3. The conductive tape according to claim 1, characterized in that, The conductive functional layer has at least a first exposed portion and a second exposed portion. A portion of the conductive adhesive layer is exposed from the first exposed portion, and a portion of the conductive material layer or another portion of the conductive adhesive layer is exposed from the second exposed portion. The first exposed portion and the second exposed portion are located at different positions along the length of the conductive tape.

4. The conductive tape according to claim 3, characterized in that, The conductive tape has a layered structure, with the upper surface of the conductive adhesive layer connected to the lower surface of the conductive material layer. The conductive adhesive layer covers all or part of the lower surface of the conductive material layer. The outer surface of the conductive functional layer includes the upper and lower surfaces of the conductive functional layer. The first exposed portion is located on the lower surface of the conductive functional layer, and the second exposed portion is located on either the upper or lower surface of the conductive functional layer.

5. The conductive tape according to claim 4, characterized in that, The conductive material layer includes a conductive substrate layer, the upper surface of the conductive adhesive layer is connected to the lower surface of the conductive substrate layer, and the conductive adhesive layer covers all or part of the lower surface of the conductive substrate layer. Alternatively, the conductive material layer includes a conductive substrate layer and a conductive coating layer, wherein the conductive coating layer is applied to the lower surface of the conductive substrate layer and covers all or part of the lower surface of the conductive substrate layer; the upper surface of the conductive adhesive layer is connected to the lower surface of the conductive coating layer and covers all or part of the lower surface of the conductive coating layer.

6. The conductive tape according to claim 4, characterized in that, The surface protective layer includes a first protective layer, which is disposed on the upper surface of the conductive functional layer and covers all or part of the upper surface of the conductive functional layer. And / or, the surface protective layer includes a second protective layer disposed on the lower surface of the conductive functional layer, and the second protective layer does not completely cover the lower surface of the conductive adhesive layer.

7. The conductive tape according to claim 6, characterized in that, The conductive tape includes the first protective layer, which completely covers the upper surface of the conductive functional layer.

8. The conductive tape according to claim 7, characterized in that, The conductive tape also includes the second protective layer, which does not completely cover the lower surface of the conductive functional layer, and the lower surface of one or both ends of the conductive functional layer is exposed and not covered.

9. The conductive tape according to claim 8, characterized in that, The conductive adhesive layer covers the lower surface of one or both ends of the conductive material layer and exposes the lower surface of the middle part of the conductive material layer. The second protective layer covers the lower surface of the middle part of the conductive material layer and a portion of the lower surface of the conductive adhesive layer adjacent to it.

10. The conductive tape according to claim 8, characterized in that, The conductive adhesive layer covers the lower surfaces of both ends of the conductive material layer and exposes the lower surface of the middle part of the conductive material layer. The second protective layer is suspended below the lower surface of the middle part of the conductive material layer, forming a hollow area between the conductive functional layer and the second protective layer. The second protective layer covers a portion of the lower surface of the conductive adhesive layer near the hollow area.

11. The conductive tape according to claim 7, characterized in that, The conductive tape also includes the second protective layer, which covers the lower surface of the middle part of the conductive functional layer and exposes the lower surfaces of both ends of the conductive functional layer. A conductive covering layer is provided on the lower surface of one end of the conductive functional layer.

12. The conductive tape according to claim 7, characterized in that, The conductive tape also includes the second protective layer, which does not completely cover the lower surface of the conductive functional layer, with one end of the lower surface of the conductive functional layer exposed and not covered; the second protective layer is also provided with an adhesive groove, which penetrates the second protective layer, so that a portion of the lower surface of the conductive functional layer is exposed from the adhesive groove.

13. The conductive tape according to claim 6, characterized in that, The conductive tape includes a first protective layer and a second protective layer. The first protective layer covers the upper surface of one end of the conductive functional layer, while the upper surface of the other end of the conductive functional layer is exposed. The second protective layer covers the lower surface of the other end of the conductive functional layer, while the lower surface of one end of the conductive functional layer is exposed. The exposed area on the lower surface of the conductive functional layer forms the first exposed portion, and the exposed area on the upper surface of the conductive functional layer forms the second exposed portion. The first exposed portion and the second exposed portion are located at opposite ends along the length of the conductive tape.

14. The conductive tape according to claim 6, characterized in that, The conductive tape includes the second protective layer, which does not completely cover the lower surface of the conductive functional layer. One or both ends of the lower surface of the conductive functional layer are exposed and not covered. The conductive material layer includes a conductive substrate layer, which is a material layer with surface passivated metal.

15. The conductive tape according to claim 6, characterized in that, The conductive tape includes the first protective layer and the second protective layer. The first protective layer covers the upper surface of one end of the conductive functional layer, while the upper surface of the other end of the conductive functional layer is exposed and not covered, forming the second exposed portion. The second protective layer is provided with an exposed adhesive groove, which penetrates the second protective layer, so that a portion of the lower surface of the conductive functional layer is exposed from the exposed adhesive groove, forming the first exposed portion; The first exposed portion and the second exposed portion are spaced apart along the length of the conductive tape.

16. The conductive tape according to claim 6, characterized in that, In the conductive functional layer, the conductive adhesive layer covers a portion of the lower surface of the conductive material layer. A third connecting groove is provided on the conductive adhesive layer, penetrating the conductive adhesive layer, so that a portion of the lower surface of the conductive material layer is exposed from the third connecting groove. The conductive tape includes the first protective layer and the second protective layer, wherein... The first protective layer completely covers the upper surface of the conductive functional layer, or the first protective layer is provided with a first connecting groove, the first connecting groove penetrates the first protective layer, so that part of the upper surface of the conductive material layer is exposed from the first connecting groove, and the first connecting groove is located directly above the third connecting groove. The second protective layer is provided with a second connecting groove, which penetrates the second protective layer. The second connecting groove is located directly below the third connecting groove, so that the lower surface of the conductive material layer is exposed from the third connecting groove and the second connecting groove. The second protective layer does not cover the end of the conductive functional layer away from the second connecting groove, so that the conductive functional layer at that end is exposed.

17. The conductive tape according to claim 3, characterized in that, A portion of the conductive adhesive layer is exposed from the first exposed portion, and another portion of the conductive adhesive layer is exposed from the second exposed portion, wherein an anti-sticking sheet is provided on the lower surface of the conductive adhesive layer exposed from the second exposed portion.

18. The conductive tape according to claim 3, characterized in that, The conductive tape has a layered structure, and the conductive functional layer has two sets of conductive adhesive layers, which are respectively referred to as the first conductive adhesive layer and the second conductive adhesive layer. The lower surface of the first conductive adhesive layer is connected to the upper surface of the conductive material layer, and the first conductive adhesive layer covers all or part of the upper surface of the conductive material layer. The upper surface of the first conductive adhesive layer is formed as the upper surface of the conductive functional layer. The upper surface of the second conductive adhesive layer is connected to the lower surface of the conductive material layer, and the second conductive adhesive layer covers all or part of the lower surface of the conductive material layer; the lower surface of the second conductive adhesive layer forms the lower surface of the conductive functional layer. The surface protective layer includes a first protective layer, which is disposed on the upper surface of the conductive functional layer, and the first protective layer does not completely cover the upper surface of the first conductive adhesive layer. And / or, the surface protective layer includes a second protective layer disposed on the lower surface of the conductive functional layer, and the second protective layer does not completely cover the lower surface of the second conductive adhesive layer.

19. The conductive tape according to claim 3, characterized in that, The length of the first exposed portion is a, the length of the second exposed portion is b, and the length of the conductive tape is L, wherein 0.05L≤a≤0.2L, 0.05L≤b≤0.4L, and 0.1L≤a+b≤0.6L.

20. The conductive tape according to claim 3, characterized in that, The first exposed portion is the lower surface of one end of the conductive functional layer, and the second exposed portion is the lower surface of the other end of the conductive functional layer; Alternatively, the first exposed portion is the lower surface of one end of the conductive functional layer, and the second exposed portion is the upper surface of the other end of the conductive functional layer; Alternatively, the first exposed portion is an adhesive groove connected to the lower surface of the conductive functional layer, and the second exposed portion is the lower surface of the conductive functional layer away from the adhesive groove.

21. The conductive tape according to claim 3, characterized in that, The first exposed portion is a portion of the lower surface of the conductive functional layer, and the second exposed portion is another portion of the lower surface of the conductive functional layer; the conductive tape also has a third exposed portion, a portion of the upper surface of the conductive functional layer is exposed from the third exposed portion, and the third exposed portion is located directly above the second exposed portion; Alternatively, the first exposed portion is a portion of the lower surface of the conductive functional layer, and the second exposed portion is a portion of the upper surface of the conductive functional layer; the conductive functional layer also has a third exposed portion, from which another portion of the lower surface of the conductive functional layer is exposed, and the third exposed portion is located directly below the second exposed portion.

22. The conductive tape according to claim 1, characterized in that, The conductive tape is cylindrical or prismatic. The conductive adhesive layer covers the outer periphery of the conductive material layer. The surface protective layer is a third protective layer covering the outer periphery of the conductive functional layer. The third protective layer only covers the middle section of the conductive functional layer, leaving both ends of the conductive functional layer exposed.

23. A conductive tape assembly, characterized in that, The invention includes the conductive tape and the base film as described in any one of claims 1 to 22, wherein the conductive tape is adhered to the base film.

24. A solar cell, characterized in that, The solar cell is adhered with the conductive tape as described in any one of claims 1 to 22.

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