Printed circuit board (PCB) electroplating device

Abstract

The utility model discloses a PCB electroplating device, and relates to the technical field of PCB manufacturing, the PCB electroplating device comprises an electroplating bath, a lifting frame and a clamp assembly, strip-shaped limiting grooves are arrayed in the electroplating bath in the long axis direction, and the lifting frame is arranged in the long axis direction of the electroplating bath in a crossing mode; the clamp assembly is fixedly connected with the lifting frame and comprises a pair of clamps reset through a torsion spring, and when the clamp assembly moves downwards along with the lifting frame, the clamps are extruded by the strip-shaped limiting grooves to be opened. The strip-shaped limiting grooves are formed in the electroplating bath, the clamp assemblies in one-to-one correspondence with the strip-shaped limiting grooves are arranged on the clamp assemblies, and the clamp assemblies are driven by the lifting frame to descend, so that when the clamps enter the strip-shaped limiting grooves, the strip-shaped limiting grooves extrude the clamps, the clamps are opened, and the clamped parts of the PCBs are exposed; therefore, the whole board surface of the PCB can be fully immersed in the electroplating liquid, and electroplating is sufficient and thorough.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of PCB manufacturing, in particular to a PCB electroplating device. BACKGROUND

[0002] In the conventional PCB electroplating, the electroplating plate clamped by the clamp is immersed into the electroplating tank by the lifting frame to complete the electroplating. It is not difficult to find that the part of the PCB clamped by the clamp is not fully electroplated due to the clamping blockage, especially the electroplating under the large contact surface of the clamp and the PCB is not complete. CONTENT OF THE UTILITY MODEL

[0003] The main purpose of the present application is to provide a PCB electroplating device, which aims to solve the above technical problems.

[0004] The technical scheme adopted by the present application is as follows:

[0005] A PCB electroplating device comprises:

[0006] An electroplating tank, wherein a plurality of strip limiting grooves are arranged along the long axis direction of the electroplating tank;

[0007] A lifting frame, wherein the lifting frame is arranged across the long axis direction of the electroplating tank;

[0008] A clamp assembly, wherein the clamp assembly is fixedly connected to the lifting frame, and the clamp assembly comprises a pair of clamps which are reset by torsion springs, and the clamps are opened by being pressed by the strip limiting grooves during the downward movement of the lifting frame.

[0009] Optionally, the lifting frame comprises:

[0010] A gantry, wherein the gantry is arranged across the electroplating tank;

[0011] A lifting driving mechanism, wherein the lifting driving mechanism is arranged on the gantry;

[0012] A frame body, wherein the frame body is connected to the lifting driving mechanism and is driven to lift by the lifting driving mechanism.

[0013] Optionally, the lifting driving mechanism comprises:

[0014] A lead screw shaft, wherein the lead screw shaft is arranged in the vertical direction on the gantry through a bearing seat, and a driven bevel gear is coaxially arranged at the bottom of the lead screw shaft;

[0015] A light rod shaft, wherein the light rod shaft is vertically fixedly arranged on the gantry;

[0016] A driving motor is arranged transversely on the portal frame, and an output end of the driving motor is provided with a driving bevel gear which is engaged with the driven bevel gear.

[0017] Optionally, the frame body comprises:

[0018] A cross beam plate is connected with the lead screw shaft and the light pole shaft;

[0019] A connecting frame is fixed to the bottom of the cross beam plate and is fixedly connected with the clamp assembly.

[0020] Optionally, a pair of U-shaped columns are symmetrically arranged on the portal frame, and the lead screw shaft and the light pole shaft are located in the U-shaped columns.

[0021] Optionally, the clamp assembly comprises:

[0022] A clamp connecting plate is fixed with the lifting frame and is in the same direction as the long axis of the electroplating tank;

[0023] A clamp support plate is arranged in a direction perpendicular to the clamp connecting plate, and the clamp support plate corresponds to the strip-shaped limiting groove one-to-one, and both ends of the clamp support plate are provided with pin shafts for connecting the clamp jaws.

[0024] Optionally, the clamp jaw comprises a clamping part and a jaw handle part, and in a natural state, the jaw handle part is in an open state, and the clamping part is in a closed state.

[0025] Optionally, the width of the strip-shaped limiting groove is greater than the width of the clamping part in the closed state and is less than the width of the jaw handle part in the open state.

[0026] Optionally, the surface of the clamping part in contact with the PCB board is provided with anti-slip texture.

[0027] Optionally, the bottom of the strip-shaped limiting groove is provided with a slot which is the same width as the PCB board.

[0028] Compared with the prior art, the application has the following beneficial effects:

[0029] The PCB electroplating device provided by the embodiment of the application comprises a strip-shaped limiting groove arranged in the electroplating tank, a clamp assembly arranged in the strip-shaped limiting groove one-to-one on the clamp assembly, and a lifting frame for driving the clamp assembly to descend, so that when the clamp jaw enters the inside of the strip-shaped limiting groove, the clamp jaw is extruded by the strip-shaped limiting groove to be opened, and the part of the PCB board clamped is exposed, thereby helping the PCB board to be fully immersed in the electroplating liquid and being fully and completely electroplated. BRIEF DESCRIPTION OF DRAWINGS

[0030] Figure 1 A structural schematic diagram of the PCB electroplating device in one perspective view is provided in the embodiments of the present application.

[0031] Figure 2 For Figure 1 The enlarged view at A in the middle.

[0032] Explanation of reference numerals in the drawings:

[0033] 1-electroplating tank, 2-lifting frame, 201-gantry frame, 202-screw shaft, 203-light pole shaft, 204-driving motor, 205-driven bevel gear, 206-U-shaped stand, 3-frame body, 301-cross beam plate, 302-connection frame, 4-clamp assembly, 401-clamp connection plate, 402-clamp support plate, 403-clamp, 404-pivot shaft, 405-torsion spring, 5-strip limiting groove, 6-clamping groove. DETAILED DESCRIPTION

[0034] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0035] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present application are only used to explain the relative positional relationship, movement condition, etc. between components in a certain posture (as shown in the drawings), and if the certain posture changes, the directional indications also change accordingly.

[0036] In the present application, unless otherwise explicitly specified and limited, the terms "connection", "fixation" and the like should be understood in a broad sense, for example, "fixation" can be fixed connection, or detachable connection, or integral; can be mechanical connection, or electrical connection; can be direct connection, or indirect connection through an intermediate medium; can be internal connection of two elements or interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0037] In addition, if the description of "first", "second" and the like is involved in the embodiments of the present application, the description of "first", "second" and the like is only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can be explicitly or implicitly included at least one of the features. In addition, the meaning of "and / or" appearing throughout the text includes three parallel schemes. For example, "A and / or B" includes A scheme, or B scheme, or A and B scheme. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the realization of ordinary skilled in the art. When the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist and is not within the protection scope required by the present application.

[0038] Referring to the drawings Figure 1 The embodiments of the present application provide a PCB plating device, which comprises a plating tank 1, a lifting frame 2 and a clamp assembly 4. Wherein, a plurality of strip limiting grooves 5 are arranged in the plating tank 1 along the length direction, and the lifting frame 2 is arranged across the plating tank 1 along the length direction. The clamp assembly 4 is fixed to the lifting frame 2, and the clamp assembly 4 comprises a pair of clamps 403 which are reset by torsion springs 405. During the process of the clamp assembly 4 moving down with the lifting frame 2, the clamps 403 are squeezed and opened by the strip limiting grooves 5.

[0039] It can be imagined that during the plating of the PCB 7, the clamp assembly 4 clamps the PCB 7 to descend into the plating tank 1 with the lifting frame 2. During the process of entering the plating tank 1, the clamps 403 are squeezed and opened by the limiting grooves, and the position of the clamped PCB 7 is exposed, so that the entire surface of the PCB 7 is in contact with the plating solution and is fully plated.

[0040] Specifically:

[0041] As shown in Figure 1 The strip limiting grooves 5 are integrally formed on the inner walls of the plating tank 1 along the length direction. The strip limiting grooves 5 are U-shaped, and the groove width is greater than the width of the PCB 7, so that the PCB 7 can be inserted into the strip limiting grooves 5 during the descending process, and the two do not contact, and the plating solution can flow into the strip limiting grooves 5 and contact the PCB 7. The bottom of the strip limiting groove 5 is provided with a slot 6 with the same width as the PCB 7. When the clamps 403 are opened, the PCB 7 can be kept upright and not tilted due to the clamping restriction of the slot 6, so that the clamps 403 can re-clamp the PCB 7 after being closed.

[0042] In the embodiments, as Figure 1As shown, the lifting frame 2 includes a portal frame 201, a lifting driving mechanism and the frame body 3. The portal frame 201 is arranged across the electroplating tank 1, and the lifting driving mechanism is arranged on the portal frame 201 to drive the frame body 3 to move up and down. Specifically, the lifting driving mechanism includes a screw rod shaft 202, a light rod shaft 203 and a driving motor 204. The screw rod shaft 202 is arranged on the portal frame 201 to rotate along the vertical direction through a bearing seat. The bottom of the screw rod shaft 202 is coaxially provided with a driven bevel gear 205. The light rod shaft 203 is vertically fixedly arranged on the portal frame 201. A pair of U-shaped columns 206 are also symmetrically arranged on the portal frame 201. The screw rod shaft 202 and the light rod shaft 203 are located in the U-shaped columns 206. The screw rod shaft 202 is connected with the top bearing of the corresponding side of the U-shaped column 206, and the light rod shaft 203 is fixedly connected with the top side of the corresponding side of the U-shaped column 206. The driving motor 204 is transversely installed on the portal frame 201. The output end of the driving motor 204 is provided with a driving bevel gear. The driving bevel gear is engaged with the driven bevel gear 205. The driving motor 204 can drive the screw rod shaft 202 to rotate through the engagement of the driving bevel gear and the driven bevel gear 205.

[0043] In the above, the frame body 3 includes a cross beam plate 301 and a connecting frame 302. The two ends of the cross beam plate 301 are respectively provided with a screw rod hole and a light shaft hole. The cross beam plate 301 is connected with the screw rod shaft 202 and the light rod shaft 203 through the screw rod hole and the light rod hole. The connecting frame 302 is fixedly arranged at the bottom of the cross beam plate 301 and used for connecting the clamp assembly 4. It can be imagined that the screw rod shaft 202 is driven to rotate in the forward and reverse directions by the forward and reverse rotation of the driving motor 204, so that the cross beam plate 301 moves up and down.

[0044] Further, as shown in Figs. 1 and 2, Figure 1 and Figure 2 The clamp assembly 4 includes a clamp connecting plate 401, a clamp support plate 402 and a clamp jaw 403. The clamp connecting plate 401 is fixed with the connecting frame 302 and is in the same direction as the long axis direction of the electroplating tank 1. The clamp support plate 402 is arranged in a direction perpendicular to the clamp connecting plate 401. The clamp support plate 402 corresponds to the strip-shaped limiting groove 5 one by one. The two ends of the clamp support plate 402 are provided with pin shafts 404 used for connecting the clamp jaw 403. The clamp jaw 403 includes a clamping part and a jaw handle part. The surface of the clamping part in contact with the PCB plate 7 is provided with anti-slip texture to clamp the PCB plate 7. The jaw handle part is rotatably installed on the pin shaft 404. In the natural state, the jaw handle part is in the open state under the action of the torsional spring 405, and the clamping part is in the closed state. The width of the strip-shaped limiting groove 5 is greater than the width of the clamping part in the closed state and less than the width of the jaw handle part in the open state.

[0045] From the above, it can be imagined that the PCB electroplating device provided by the application can realize the following functions during electroplating:

[0046] The PCB 7 is clamped by the clamp 403, the driving motor 204 drives the screw shaft 202 to rotate forward, and the frame body 3 carries the clamp assembly 4 to immerse into the electroplating tank 1, and the PCB 7 contacts with the electroplating solution after entering the electroplating tank 1, and the PCB 7 is clamped by the clamping groove 6 when it contacts with the bottom of the electroplating tank 1, at this time, the handle part of the clamp 403 contacts with the strip-shaped limiting groove 5, and the frame body 3 continues to descend for a small distance, the handle part is extruded by the strip-shaped limiting groove 5 and is closed because the width of the handle part is larger than the width of the strip-shaped limiting groove 5, the clamping part is forced to open, the part of the PCB 7 clamped is exposed to contact with the electroplating solution, and thus the whole board surface is electroplated. The driving motor 204 reverses after the frame body 3 descends to the lowest point, the frame body 3 carries the clamp assembly 4 to move upward, the handle part exits the strip-shaped limiting groove 5, the clamping part re-clamps the PCB 7 under the action of the torsion spring 405, and then the PCB 7 is taken out of the electroplating tank 1 to complete the electroplating.

[0047] The above only describes the preferred embodiments of the present application, and is not used to limit the present application, any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. A PCB plating apparatus, characterized by comprising: The utility model relates to a PCB board electroplating device, including: Electroplating tank, which has a strip limiting groove arrayed along the long axis direction inside; Lifting frame, which is arranged across the long axis direction of the electroplating tank; Clamp assembly, which is fixedly connected to the lifting frame, and includes a pair of clamps reset by torsion springs, wherein the clamps are squeezed to open by the strip limiting groove during the process of the clamp assembly moving downward with the lifting frame.

2. The PCB plating apparatus of claim 1, wherein, The lifting frame includes: Gantry, which is arranged across the electroplating tank; Lifting drive mechanism, which is arranged on the gantry; Frame body, which is connected to the lifting drive mechanism and is driven to lift by the lifting drive mechanism.

3. The PCB plating apparatus of claim 2, wherein, The lifting drive mechanism includes: Lead screw shaft, which is arranged in the vertical direction on the gantry by a bearing seat, and has a driven bevel gear coaxially arranged at the bottom of the lead screw shaft; Light pole shaft, which is fixedly arranged in the vertical direction on the gantry; Drive motor, which is arranged laterally on the gantry, and has a driving bevel gear arranged at the output end of the drive motor, which meshes with the driven bevel gear.

4. The PCB plating apparatus of claim 3, wherein, The frame body includes: Cross beam plate, which is connected to the lead screw shaft and the light pole shaft; Connecting frame, which is fixedly connected to the clamp assembly at the bottom of the cross beam plate.

5. The PCB plating apparatus of claim 3, wherein, A pair of U-shaped columns are symmetrically arranged on the gantry, and the lead screw shaft and the light pole shaft are located in the U-shaped columns.

6. The PCB plating apparatus of claim 1, wherein, The clamp assembly includes: Clamp connecting plate, which is fixed to the lifting frame and is in the same direction as the long axis direction of the electroplating tank; Clamp support plate, which is arranged in a direction perpendicular to the clamp connecting plate, and has a pin shaft for connecting the clamp arranged at both ends of the clamp support plate, which corresponds to the strip limiting groove.

7. The PCB plating apparatus of claim 1, wherein The clamp includes a clamping part and a clamp handle part, wherein the clamp handle part is in an open state and the clamping part is in a closed state in the natural state.

8. The PCB plating apparatus of claim 7, wherein, The width of the strip limiting groove is greater than the width of the clamping part in the closed state and less than the width of the clamp handle part in the open state.

9. The PCB plating apparatus of claim 7, wherein, The surface of the clamping part in contact with the PCB board is provided with anti-slip texture.

10. The PCB plating apparatus of claim 1, wherein, The bottom of the strip limiting groove is provided with a slot with a width equal to that of the PCB board.

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