Wafer drying device
By designing a wafer drying device that combines a rotating nozzle with heated N2 gas, the problem of difficult drying of wafer edges was solved, achieving a more efficient and uniform wafer drying effect.
Patent Information
- Application Number
- CN202423245380.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-26
- Publication Date
- 2025-11-21
- Estimated Expiration
- 2034-12-26
AI Technical Summary
In existing wafer drying equipment for wet wafer drying processes, the wafer edges are difficult to dry, resulting in water stains that affect subsequent processes.
Design a wafer drying device, including a drying hood, a nozzle, a support, and bottom rollers. The device sprays IPA gas toward the center of the wafer by rotating the nozzle. After the cover is closed, N2 gas is sprayed by heating. Combined with temperature and humidity control, uniform drying is ensured.
It improves the drying efficiency and uniformity of wafers, prevents edge oxidation, and enhances the cleaning and drying effect.
Smart Images
Figure CN223580467U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to the field of semiconductor equipment relates to a wafer drying device. BACKGROUND
[0002] In the semiconductor process, the wafer is an important raw material of semiconductor products, its main component is silicon, the outer contour is thin sheet structure, usually also called silicon wafer, a variety of circuit element structures can be processed on the wafer, and finally form a chip to realize the function control of circuit, which has the indispensable significance in high-end manufacturing industry.
[0003] In the existing wet etching process, the slot type wet process still occupies a large proportion. In the wet slot drying process, N2 and isopropyl alcohol solvent (IPA) drying mode is often used, which uses IPA to reduce the surface tension of the wafer surface deionized water and reduce the wetting angle, so that the deionized water on the wafer surface is easier to fall off from the wafer surface, and the purpose of drying is achieved, but this mode still has some problems: the current drying tank design, the N2 and IPA nozzle port is on the lower surface of the tank body, which causes the wafer edge to be far away from the N2 nozzle port, not easy to dry, resulting in water stain residue, causing the wafer edge to be oxidized, affecting the subsequent process.
[0004] At present, it is necessary to provide a wafer drying device to effectively improve the drying effect of the wafer.
[0005] It should be noted that the above introduction to the technical background is only to facilitate the clear and complete description of the technical scheme of the present application, and to facilitate the understanding of those skilled in the art. The above technical scheme cannot be considered as known to those skilled in the art only because it is described in the background section of the present application. CONTENT OF THE UTILITY MODEL
[0006] In view of the above-mentioned shortcomings of the prior art, the purpose of the present utility model is to provide a wafer drying device to solve the problem of how to effectively improve the drying effect of the wafer.
[0007] To achieve the above-mentioned purpose, the utility model provides a wafer drying device, which comprises:
[0008] Tank body
[0009] Drying cover, the drying cover is located above the tank body, the drying cover comprises a heating cover and a bottom cover plate, the bottom cover plate is connected with the heating cover, and the opening and closing operation of the bottom cover plate and the heating cover form corresponding open space and closed space;
[0010] Nozzle, the nozzle is located in the drying cover
[0011] A support is arranged in the groove body, and a bottom roller is arranged on the support to support and rotate the wafer.
[0012] Optionally, the drying cover is in the shape of an arch, and a projection of the drying cover covers the wafer on the support.
[0013] Optionally, the heating cover is arranged above the drying cover, and the heating cover comprises a heating assembly connected to a control device to control the temperature in the drying cover.
[0014] Optionally, the connection between the bottom cover plate and the heating cover comprises buckle connection or rotary bearing connection.
[0015] Optionally, the spray head comprises a rotary spray head, and the spray head is directed to the center of the wafer by adjusting the rotation angle of the spray head.
[0016] Optionally, the spray heads are arranged at equal intervals in the drying cover.
[0017] Optionally, the drying cover further comprises exhaust pipes arranged on the left and right sides of the bottom cover plate to exhaust the gas to the left and right sides.
[0018] Optionally, the groove body comprises liquid inlet pipes and liquid outlet pipes arranged on the left and right sides of the groove body to flow the liquid in one direction.
[0019] Optionally, the wafer drying device further comprises a detection device comprising a hygrometer, a thermometer or a thermohygrometer, and the detection device is arranged in the drying cover.
[0020] Optionally, the wafer drying device further comprises an alarm device in communication with the detection device, and the alarm device comprises an audible alarm, a light alarm or an audible-light alarm.
[0021] The wafer drying device comprises a spray head, a bottom cover plate and a drying cover, the rotation angle of the spray head is controlled to direct the spray head to the center of the wafer, and the liquid on the surface of the wafer is blown away to the maximum extent. When the wafer is separated from the water surface from top to bottom, the bottom cover plate is closed, a heating assembly is arranged in a heating cover to heat the gas, the hot gas is sprayed on the surface of the wafer to accelerate the evaporation of the moisture and improve the drying efficiency. The detection device is arranged, and the control device is connected to the heating assembly to control the temperature and humidity. The bottom roller is arranged at the bottom of the support to support and rotate the wafer, the uniformity of the wafer drying is ensured, the edge is prevented from being oxidized due to water stains, and the cleaning and drying effect of the wafer is improved. BRIEF DESCRIPTION OF DRAWINGS
[0022] Figure 1 A structure schematic diagram of a wafer drying device is shown.
[0023] Figure 2 A working structure schematic diagram of the wafer drying device before the wafer rises after being cleaned from the liquid surface is shown.
[0024] Figure 3 A working structure schematic diagram of the wafer drying device when the wafer completely separates from the water surface is shown.
[0025] Figure 4 A working structure schematic diagram of the wafer drying device in a closed state is shown.
[0026] Figure 5 A structure schematic diagram of a bottom roller of the wafer drying device is shown.
[0027] Figure 6 A three-dimensional structure schematic diagram of the wafer drying device is shown.
[0028] Explanation of reference signs
[0029] 100 tank
[0030] 111 liquid inlet pipeline
[0031] 112 liquid outlet pipeline
[0032] 120 bottom roller
[0033] 130 support
[0034] 140 driving device
[0035] 200 drying cover
[0036] 210 heating cover
[0037] 220 nozzle
[0038] 230 side wall
[0039] 231 detection member
[0040] 240 bottom cover plate
[0041] 241 exhaust pipeline
[0042] 300 movable connecting rod
[0043] 400 wafer DETAILED DESCRIPTION
[0044] The following describes the embodiments of the present application through specific examples. Those skilled in the art can easily understand other advantages and effects of the present application from the disclosure. The present application can also be implemented or applied through different embodiments, and the details in the specification can be modified or changed based on different viewpoints and applications without departing from the spirit of the present application.
[0045] It should be noted that the diagrams provided in the embodiments only schematically illustrate the basic concepts of the present application, and only the components related to the present application are shown in the diagrams, not the number, shape and size of the components in actual implementation. The shapes, number and proportions of the components in actual implementation can be changed arbitrarily, and the layout of the components can be more complex.
[0046] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of the present application.
[0047] Embodiment
[0048] Referring to Figures 1-6 The wafer drying device comprises a groove body 100, a drying cover 200, a spray head 220 and a support 130.
[0049] For example, referring to Figure 2 The groove body 100 is provided with a movable connecting rod 300. The drying cover 200 is located above the groove body 100 and is movable through the movable connecting rod 300.
[0050] Specifically, the drying cover 200 is connected through the movable connecting rod 300 and can move in all directions. After the wafer 400 in the groove body 100 is cleaned, the drying cover 200 is moved above the wafer 400 through the movable connecting rod 300, and the wafer 400 is placed in the drying cover 200 for closed drying after the wafer 400 surface is completely separated from the water surface. Of course, in some other embodiments, the device connected with the drying cover 200 in the present embodiment is not limited to the movable connecting rod 300, and the groove body 100 can also be provided with other devices instead of the movable connecting rod 300 to realize the movement of the drying cover 200, which will not be described in detail here.
[0051] For example, referring to Figure 1The groove body 100 further comprises a liquid inlet pipe 111 and a liquid outlet pipe 112, which are arranged on two sides of the groove body 100 respectively to make the liquid flow in one direction.
[0052] Specifically, in order to facilitate the liquid to be quickly removed from the groove body 100 after cleaning the wafer 400, as an example, the liquid inlet pipe 111 and the liquid outlet pipe 112 are arranged on two sides of the groove body 100 respectively to make the liquid form a unidirectional flow in the groove body 100, which is beneficial to improve the liquid flow efficiency and uniformity, reduce the formation of dead angle and vortex, improve the processing efficiency, and reduce pollution.
[0053] As an example, the drying cover 200 comprises a heating cover 210 and a bottom cover plate 240, the bottom cover plate 240 is directly connected with the heating cover 210, and the opening and closing operation of the bottom cover plate 240 forms a corresponding open space and closed space with the heating cover 210. The connection mode between the bottom cover plate 240 and the heating cover 210 includes buckle connection or rotary bearing connection.
[0054] In the embodiment, referring to Figures 1-6 The bottom cover plate 240 and the heating cover 210 can also be provided with a side wall 230 to realize the open space or the closed space through the opening and closing operation of the bottom cover plate 240.
[0055] Further, in the embodiment, the bottom cover plate 240 and the side wall 230 can be connected through buckle connection or rotary bearing connection to realize the opening and closing operation of the bottom cover plate 240. When the bottom cover plate 240 is opened to form an open space, the displacement of the wafer 400 between the liquid surface and the heating cover 210 can be realized, and when the bottom cover plate 240 is closed, the closed drying of the wafer 400 in the heating cover 210 can be realized.
[0056] In order to ensure that the hot air in the drying cover 200 is uniformly distributed from top to bottom, and to avoid local overheating or uneven temperature, the heating cover 210 is located above the drying cover 200, and the heating cover 210 comprises a heating assembly (not labeled), which is connected with a control member (not labeled) to realize the control of the temperature in the drying cover 200.
[0057] Specifically, the heating cover 210 can also be provided with a detection member 231, which includes a thermometer. When the drying cover 200 dries the wafer 400, the detection member 231 detects the temperature in the drying cover 200, so that the control member obtains temperature feedback and controls the heating assembly to heat to a set temperature range, so as to accurately control the temperature in the drying cover 200, such as gradient heating, temperature holding and step-by-step cooling, etc., to meet the temperature requirements of the drying cover 200, and facilitate the volatilization and drying of the gas. In this embodiment, the temperature set range in the drying cover 200 is 60-200°C, for example, 60°C, 80°C, 100°C, 130°C, 150°C, 180°C, 200°C, etc. The preferred temperature setting is 150°C. When the temperature detected by the thermometer in the drying cover 200 exceeds or is lower than 150°C, the control member controls the heating assembly to increase or decrease the heating power, so that the temperature in the drying cover 200 reaches the set temperature, to realize automation.
[0058] As an example, refer to Figures 1-5 The detection member 231 also includes a hygrometer, which is connected with the control member to realize the control of the gas flow in the drying cover 200.
[0059] Further, in order to make the gas flow control in the drying cover 200 more convenient, a certain humidity value is set, so that when the humidity detected by the hygrometer exceeds the set humidity value, the control member controls the gas flow and carries away the volatilized water vapor to reduce the humidity in the drying cover 200. In this embodiment, the hygrometer is arranged on the side wall 230 to facilitate the detection of humidity.
[0060] In this embodiment, the humidity range set in the drying cover 200 is <5% RH, for example, 1% RH, 2% RH, 3% RH, 4% RH, 5% RH, etc. When the humidity in the drying cover 200 exceeds 5% RH, the control member controls to increase the gas flow of the gas inlet pipeline, so as to realize automation. Of course, in some other embodiments, in addition to the humidity meter, thermometer, the wafer drying device can also be provided with a hygrometer, a PH meter, etc. to realize the environment test in the drying cover 200.
[0061] Further, the wafer drying device can also include an alarm, which communicates with the detection member 231. The alarm includes an acoustic alarm, a light alarm or an acoustic and light alarm. The test alarm line is set by the detection member 231. When the environment test value in the drying cover 200 exceeds the alarm line, the device can be triggered to alarm to remind the corresponding personnel to monitor. Further, the wafer drying device can also include an alarm, which communicates with the detection member 231. The alarm includes an acoustic alarm, a light alarm or an acoustic and light alarm. The test alarm line is set by the detection member 231. When the environment test value in the drying cover 200 exceeds the alarm line, the device can be triggered to alarm to remind the corresponding personnel to monitor.
[0062] Further, in order to prevent the drying cover 200 from being corroded and leaked due to external environment, the embodiment preferably adopts a Teflon drying cover.
[0063] For example, in order to ensure that the hot air can be evenly distributed on the surface of the wafer 400, avoiding local overheating or uneven temperature, the drying cover 200 is in the shape of an arch, and the projection of the drying cover 200 covers the wafer 400 on the support 130.
[0064] Specifically, the drying cover 200 is in the shape of an arch, preferably a circular arch. The wafer drying device in the embodiment is a multi-piece wafer drying device, that is, referring to Figure 6 Generally, the wafers 400 are placed in a row on the support 130 to realize batch processing of the wafers 400 and improve productivity. Of course, the wafer drying device can also be a single-piece wafer drying device according to needs. In the embodiment, in order to ensure that the surface of the wafers 400 in a row can be evenly heated or contacted with the drying gas, the projection of the drying cover 200 covers the wafers 400 on the support 130, so as to realize efficient drying of the whole row of wafers 400.
[0065] For example, the spray head 220 is located in the drying cover 200 and delivers gas into the drying cover 200.
[0066] For example, in order to ensure that each part of the surface of the wafer 400 is evenly affected by the gas, the spray head 220 is arranged at equal intervals in the drying cover 200, and the spray head 220 can be a rotary spray head, which is adjusted to face the center of the wafer 400 by adjusting the rotation angle of the spray head 220. Of course, in some other drying devices, the spray head 220 can also be adaptively adjusted in distribution interval and position according to the actual distribution of the wafers 400 in the groove 100.
[0067] Further, referring to Figure 6 , the spray head 220 is located in the drying cover 200 and is arranged at equal intervals corresponding to the wafer 400; during the process of the wafer 400 being separated from the liquid surface after cleaning and entering the drying cover 200, the rotation angle of the spray head 220 is controlled to face the center of the wafer 400, so as to maximize the blowing away of the liquid on the surface of the wafer 400. The spray head 220 can be rotated by 0°-180°, and in the embodiment, preferably, the spray head 220 can be adjusted by 15°-165°, for example, can be rotated by 15°, 50°, 80°, 120°, 140°, 165°, or any value within this range, so as to ensure that the spray head 220 covers most of the area of the wafer 400, while avoiding unnecessary excessive rotation, improving the efficiency and accuracy of operation.
[0068] In the embodiment, in order to make the shower head 220 more evenly act on the surface of the wafer 400, improve the drying efficiency and quality, the shower head 220 is uniformly distributed along the arch shape in the heating cover 210.
[0069] In the closed state, the distance between the shower head 220 and the wafer 400 needs to be set to an appropriate distance. The appropriate distance can ensure that the airflow has enough time to mix and diffuse before reaching the wafer 400, forming a uniform airflow. At the same time, within this distance range, the thermal effect of the gas sprayed by the shower head 220 on the wafer 400 is effectively controlled, preventing thermal shock or overheating damage caused by too close distance. The distance between the shower head 220 and the wafer 400 is set to be between 20 cm and 30 cm, for example, 20 cm, 23 cm, 25 cm, 28 cm, 30 cm, etc. Any value within this range; wherein, in the embodiment, the distance between the shower head 220 and the wafer 400 is preferably 25 cm, of course, in some other embodiments, the distance between the shower head 220 and the wafer 400 can be designed according to the actual situation.
[0070] In order to avoid the wafer 400 from having residual water stains at the edge position far away from the shower head 220 during the drying process, the support 130 is also provided with a bottom roller 120, which is used to support the wafer 400 and drive it to rotate.
[0071] Specifically, referring to Figure 4 , the bottom roller 120 is located at the bottom of the support 130, and the support 130 is located in the groove 100 to support the wafer 400 to separate from the water surface. The support 130 supports the wafer 400 to separate from the water surface through the driving device 140. When the wafer 400 starts to separate from the liquid surface, the bottom roller 120 starts to rotate, so that the wafer 400 can rotate to dry, ensuring the uniformity of the wafer 400 drying, preventing the edge from being oxidized due to residual water stains; in addition, the driving device 140 can control the wafer 400 by adjusting the rising speed and distance of the support 130, etc. to improve the cleaning and drying effect of the wafer 400.
[0072] In the embodiment, the bottom roller 120 and the support 130 can be connected through a sliding block, or can be connected through rotation or screw connection to realize fixation, and the bottom roller 120 is provided with an arc space to adapt to the rotation of the wafer 400.
[0073] As an example, the wafer drying device further comprises an air inlet pipe (not labeled) and an air outlet pipe 241, the air inlet pipe is located above the drying cover 200, and the air inlet pipe is in communication with the spray head 220 to realize the input and spraying of the gas.
[0074] Specifically, the air inlet pipe provides the gas to the spray head 220, and the gas is sprayed into the inside of the drying cover 200 through the spray head 220, the gas includes IPA gas, N2 gas and mixed gas of IPA and N2, in this embodiment, referring to Figure 3 When the wafer 400 starts to separate from the liquid surface after being cleaned, the spray head 220 sprays IPA gas, because the IPA gas has the characteristics of low surface tension and easy evaporation, when the IPA gas flows to the surface of the wafer 400, it replaces the water with higher surface tension on the surface of the wafer 400, thereby removing the water stains on the surface of the wafer 400. Then, referring to Figure 4 After the bottom cover plate 240 is closed, the spray head 220 further sprays N2, and the heating assembly starts to heat at the same time, so that the gas on the surface of the wafer 400 becomes heated N2, which can accelerate the evaporation of water and IPA and improve the drying efficiency.
[0075] The air outlet pipe 241 is located at the bottom of the drying cover 200 to exhaust the drying gas and the volatile gas.
[0076] Specifically, when the wafer 400 in the drying cover 200 is dried, the N2 sprayed by the spray head 220 drives the residual water vapor on the surface of the wafer 400 to be exhausted through the air outlet pipe 241 under the heating of the heating assembly, and the air outlet pipe 241 is arranged on both sides of the wafer 400 corresponding to the spray head 220. This structure helps to realize the left-right symmetrical exhaust of the gas, optimizes the outflow path of the gas, reduces the possibility of gas retention in the drying cover 200, avoids local gas accumulation, and ensures that the surface of the wafer 400 can be effectively dried.
[0077] In the present embodiment, the working process of the wafer drying device is as follows: first, when the wafer 400 is placed in the tank 100 for cleaning, the wafer drying device is displaced to the cleaning position of the wafer 400 by the movable connecting rod 300 arranged at the upper part of the tank 100. The support 130 drives the wafer 400 to start moving away from the liquid surface, from the bottom to the top in the wafer drying device. During the process of moving away from the liquid surface, the bottom cover plate 240 of the wafer drying device is in an open state, and the shower head 220 located above the drying cover 200 sprays IPA gas towards the wafer 400. Since the IPA gas has the characteristics of low surface tension and easy evaporation, the water stains on the surface of the wafer 400 can fall from top to bottom. When the wafer 400 completely moves away from the liquid surface, the bottom cover plate 240 starts to close, and the drying cover 200 is in a closed state. At this time, the gas blown by the shower head 220 is switched to N2, and the heating assembly of the heating cover 210 starts to work. According to the different types of IPA, the temperature set is different. Subsequently, the temperature in the drying cover 200 rises, driving N2 to form an upward convection current from the top of the drying cover 200. The heated N2 can accelerate the evaporation of water and IPA, and improve the drying efficiency of the wafer 400.
[0078] Of course, in other embodiments, the position of the wafer drying device is not limited to the upper part of the tank 100, but can also be arranged at other positions of the tank 100. In some embodiments, the drying cover 200 is divided into left and right parts and hung above the tank 100, so as to realize the opening and closing of the space by opening and closing the left and right parts. The present application does not make specific limitation on the placement of the wafer drying device, which can be set according to the actual situation.
[0079] At the same time, the gas in the wafer drying device is not limited to IPA gas and N2, and the blowing sequence and heating sequence of the gas are not limited, which can be set according to the actual situation.
[0080] In summary, the utility model provides a kind of wafer drying device, is set in drying cover, bottom cover, by controlling the rotation angle of spray head, so that spray head is oriented to the center of wafer, maximum limit guarantees the elimination of water mark on wafer surface.When wafer is separated from water surface from bottom to top, bottom cover is closed, by setting heating assembly in heating cover, realize the heating of gas, hot gas is sprayed to wafer surface, can accelerate evaporation of moisture, improve drying efficiency;Simultaneously by setting detection piece, and setting control piece connection heating assembly, can realize the control of temperature and humidity;By setting bottom roller in support bottom, to realize the support and rotary drying of wafer, ensure the uniformity of wafer drying, prevent edge from being oxidized due to water mark residue, improve the cleaning and drying effect of wafer.The utility model effectively overcomes the shortcomings in the prior art and has high industrial utilization value.
[0081] The above embodiments only exemplarily illustrate the principles and effects of the utility model, and are not used to limit the utility model.Anyone skilled in the art can modify or change the above embodiments without departing from the spirit and scope of the utility model.Therefore, all equivalent modifications or changes completed by those skilled in the art without departing from the spirit and technical thought disclosed by the utility model should be covered by the claims of the utility model.
Claims
1. A wafer drying apparatus characterized by comprising: The wafer drying device comprises: a groove body; a drying cover located above the groove body, the drying cover comprising a heating cover and a bottom cover plate, the bottom cover plate being connected with the heating cover, and the bottom cover plate and the heating cover forming corresponding open space and closed space through opening and closing operation of the bottom cover plate; a spray head located in the drying cover; a support located in the groove body, and the support being provided with a bottom roller for supporting and rotating the wafer.
2. The wafer drying apparatus according to claim 1, characterized by The drying cover is in the shape of an arch, and the projection of the drying cover covers the wafer on the support.
3. The wafer drying apparatus according to claim 1, wherein The heating cover is located above the drying cover, and the heating cover comprises a heating assembly connected with a control element to control the temperature in the drying cover.
4. The wafer drying apparatus according to claim 1, characterized by The connection mode of the bottom cover plate and the heating cover comprises buckle connection or rotary bearing connection.
5. The wafer drying apparatus according to claim 1, wherein The spray head comprises a rotary spray head, and the spray head is adjusted to face the center of the wafer by adjusting the rotation angle of the spray head.
6. The wafer drying apparatus according to claim 1, wherein The spray head is arranged at equal intervals in the drying cover.
7. The wafer drying apparatus according to claim 1, wherein The drying cover further comprises exhaust pipes located on the left and right sides of the bottom cover plate to realize left and right exhaust of gas.
8. The wafer drying apparatus according to claim 1, wherein The groove body comprises liquid inlet pipes and liquid outlet pipes arranged on the left and right sides of the groove body to make the liquid flow in one direction.
9. The wafer drying apparatus according to claim 1, wherein The wafer drying device further comprises a detection element, the detection element comprising a hygrometer, a thermometer or a temperature and humidity meter, and the detection element being located in the drying cover.
10. The wafer drying apparatus according to claim 9, wherein The wafer drying device further comprises an alarm, the alarm being in communication with the detection element, and the alarm comprising an audible alarm, a light alarm or an audible and light alarm.