Capacitor, controller and vehicle

Abstract

The utility model relates to the technical field of vehicle production machine manufacturing, in particular to a capacitor, a controller and a vehicle. Comprising a thin-film capacitor core, a copper bar and a shell, the thin-film capacitor core and at least part of the copper bar are arranged in the shell, the thin-film capacitor core is connected with the copper bar, the copper bar is arranged between the thin-film capacitor core and the shell, the copper bar comprises a protruding part protruding towards the shell, a hole part is formed in the shell, and the protruding part is located in the hole part. Therefore, the copper bar is used for transmitting current between the capacitor and an external part, the thin-film capacitor core can generate heat due to work and is greatly influenced by temperature, the heat generated by the capacitor can be transmitted to the copper bar, and due to the fact that the protruding part of the copper bar is located at the hole part, the heat can be transmitted to the outside of the shell through the protruding part on the copper bar. Therefore, heat dissipation of the capacitor can be improved. Therefore, the temperature of the capacitor is effectively reduced, the service life of the capacitor is prolonged, the power density of electric control is improved, and the cost is reduced.

Description

Technical Field

[0001] This utility model relates to the technical field of vehicle manufacturing, specifically to a capacitor, a controller, and a vehicle. Background Technology

[0002] Vehicle controllers are used to drive and control motors, and are the core components of a vehicle. Thin-film capacitors are also crucial components of motor controllers, used to smooth bus voltage and providing DC support in the controller circuit. Existing controllers rely on potting compounds and housings to conduct heat from the internal core / electrodes to the outside. However, the potting compounds and housing materials used in current technology have low thermal conductivity. If the capacitor temperature rises excessively, the capacitor's lifespan is shortened, and in severe cases, it can even cause the capacitor to explode or the controller to fail. Designing a capacitor with high heat dissipation performance is a pressing technical challenge to prevent abnormal capacitor temperature rise from causing electronic control malfunctions or rendering the entire system unusable. Utility Model Content

[0003] The purpose of this application is to provide a capacitor, a controller, and a vehicle.

[0004] This application provides a capacitor including a thin-film capacitor core, a copper busbar, and a housing. The thin-film capacitor core and at least a portion of the copper busbar are disposed within the housing. The thin-film capacitor core is connected to the copper busbar, and the copper busbar is disposed between the thin-film capacitor core and the housing. The copper busbar includes a protrusion protruding into the housing. The housing forms a hole, and the protrusion is located in the hole.

[0005] In one exemplary embodiment of this application, the height of the protrusion in the height direction is greater than the thickness of the housing.

[0006] In one exemplary embodiment of this application, the capacitor further includes insulating paper, which is disposed outside the housing and is correspondingly disposed to the hole, and the insulating paper covers the hole.

[0007] In one exemplary embodiment of this application, the copper busbar includes an input terminal, an output terminal, and a main body. The main body is disposed within the housing, and the protrusion is disposed on the main body. The input terminal and the output terminal are connected to the main body and extend to the outside of the housing.

[0008] In one exemplary embodiment of this application, the number of input terminals is two; the housing includes a support base, the support base being correspondingly disposed with respect to the input terminals, the support base including a first support base and a second support base, the first support base being correspondingly disposed with respect to one of the input terminals, and the second support base being correspondingly disposed with respect to the other input terminal.

[0009] In one exemplary embodiment of this application, the housing includes an isolation portion disposed between the first support base and the second support base. The isolation portion protrudes toward one side of the input terminal and is located between the two input terminals.

[0010] This application also provides a controller, the controller including a housing, a heat-conducting part and the capacitor, the housing forming a receiving groove, the capacitor being disposed in the receiving groove, a gap being formed between the side of the housing facing the hole and the bottom surface of the receiving groove, and the heat-conducting part being disposed in the gap.

[0011] In one exemplary embodiment of this application, the thermally conductive part is a thermally conductive adhesive.

[0012] In an exemplary embodiment of this application, the housing has a capacitor mounting position, the capacitor is disposed at the capacitor mounting position, the housing has a cooling water channel, the cooling water channel is disposed on one side of the capacitor mounting position, the cooling water channel includes an inlet, a liquid storage tank and an outlet, and the inlet, the liquid storage tank and the outlet are connected in sequence.

[0013] This application also provides a vehicle including the aforementioned controller.

[0014] This application discloses a capacitor, controller, and vehicle, which offer the following advantages: The device includes a thin-film capacitor core, a copper busbar, and a housing. The thin-film capacitor core and at least a portion of the copper busbar are housed within the housing. The thin-film capacitor core is connected to the copper busbar, which is located between the thin-film capacitor core and the housing. The copper busbar includes a protrusion extending into the housing, and the housing forms a hole with the protrusion located within the hole. Thus, the copper busbar facilitates current transfer between the capacitor and external components. The thin-film capacitor core generates heat during operation, and this heat is highly sensitive to temperature fluctuations. The heat generated by the capacitor is transferred to the copper busbar. Since the protrusion on the copper busbar is located within the hole, the heat can be transferred to the outside of the housing through the protrusion, thereby increasing the capacitor's heat dissipation. This effectively reduces the capacitor's temperature, extends its lifespan, increases the power density of the electronic control system, and reduces costs.

[0015] Other features and advantages of this application will become apparent from the following detailed description, or may be learned in part from practice of this application.

[0016] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description

[0017] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. It is obvious that the drawings described below are merely some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.

[0018] Figure 1 This is an exploded schematic diagram of a capacitor in an embodiment of this utility model;

[0019] Figure 2 This is a partial cross-sectional schematic diagram of a capacitor according to an embodiment of this utility model;

[0020] Figure 3 This is an axial side view of a capacitor according to an embodiment of the present invention;

[0021] Figure 4 This is an exploded view of a controller according to an embodiment of this utility model.

[0022] Explanation of reference numerals in the attached figures:

[0023] 10. Capacitor; 11. Film capacitor core; 12. Copper busbar; 121. Protrusion; 122. Input terminal; 123. Output terminal; 124. Main body; 13. Housing; 131. Hole; 132. Support base; 1321. First support base; 1322. Second support base; 133. Isolation part; 14. Insulating paper; 20. Controller; 21. Box; 211. Receptacle; 212. Cooling water channel; 2121. Water inlet; 2122. Liquid storage tank; 2123. Water outlet; 213. Capacitor mounting position; 22. Heat-conducting part. Detailed Implementation

[0024] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided to make this application more comprehensive and complete, and to fully convey the concept of the exemplary embodiments to those skilled in the art.

[0025] Furthermore, the described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Numerous specific details are provided in the following description to give a thorough understanding of embodiments of this application. However, those skilled in the art will recognize that the technical solutions of this application can be practiced without one or more of the specific details, or other methods, components, apparatuses, steps, etc., can be employed. In other instances, well-known methods, apparatuses, implementations, or operations are not shown or described in detail to avoid obscuring various aspects of this application.

[0026] The present application will now be described in further detail with reference to the accompanying drawings and specific embodiments. It should be noted that the technical features involved in the various embodiments described below can be combined with each other as long as they do not conflict with each other. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present application, and should not be construed as limiting the present application.

[0027] It should be noted that "multiple" in this article refers to two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone. The character " / " generally indicates that the preceding and following related objects have an "or" relationship.

[0028] Vehicle controllers are used to drive and control motors, and are the core components of a vehicle. Thin-film capacitors are also crucial components of motor controllers, used to smooth bus voltage and providing DC support in the controller circuit. Existing controllers rely on potting compounds and housings to conduct heat from the internal core / electrodes to the outside. However, the potting compounds and housing materials used in current technology have low thermal conductivity. If the capacitor temperature rises excessively, the capacitor's lifespan is shortened, and in severe cases, it can even cause the capacitor to explode or the controller to fail. Designing a capacitor with high heat dissipation performance is a pressing technical challenge to prevent abnormal capacitor temperature rise from causing electronic control malfunctions or rendering the entire system unusable.

[0029] To solve the above technical problems, refer to Figures 1 to 3 As shown, this application provides a capacitor 10, including a thin-film capacitor core 11, a copper busbar 12, and a housing 13. The thin-film capacitor core 11 and at least a portion of the copper busbar 12 are disposed within the housing 13. The thin-film capacitor core 11 is connected to the copper busbar 12, which is located between the thin-film capacitor core 11 and the housing 13. The copper busbar 12 includes a protrusion 121 protruding into the housing 13. The housing 13 forms a hole 131, and the protrusion 121 is located within the hole 131. Thus, the copper busbar 12 is used to transfer current between the capacitor 10 and external components. The thin-film capacitor core 11 generates heat during operation, and the heat generated by the capacitor 10 is significantly affected by temperature. This heat is transferred to the copper busbar 12. Since the protrusion 121 of the copper busbar 12 is located within the hole 131, the heat can be transferred to the outside of the housing 13 through the protrusion 121 on the copper busbar 12, thereby increasing the heat dissipation of the capacitor 10. This effectively reduces the temperature of capacitor 10, increases its lifespan, and consequently increases the power density of the electronic control system while reducing costs.

[0030] In some embodiments, refer to Figures 1 to 3As shown, the thin-film capacitor core 11 includes multiple cells arranged at intervals to form a cell array. Each cell can be connected to the copper busbar 12 to receive and convert electrical signals from the copper busbar 12. The number and specifications of the thin-film capacitor cores 11 are selected according to the actual situation.

[0031] In some embodiments, refer to Figures 1 to 3 As shown, the copper busbar 12 may include an input copper busbar 12 and an output copper busbar 12. The input copper busbar 12 is connected to an external power source, which is generally a vehicle battery, and transmits the battery's electrical signals to the thin-film capacitor core 11. The output copper busbar 12 is connected to an external IGBT module and is used to transmit the electrical signals converted by the battery cell to the IGBT module.

[0032] In some embodiments, the housing 13 is a plastic housing 13, which can serve as insulation and protection. The size and specifications of the housing 13 are selected according to the actual situation.

[0033] In some embodiments, refer to Figures 1 to 3 As shown, the height of the protrusion 121 in the height direction is greater than the thickness of the housing 13. Since the protrusion 121 in the height direction can be exposed outside the housing 13, it can come into contact with external heat-conducting components, effectively transferring heat to the outside of the housing 13 of the capacitor 10, resulting in better heat dissipation.

[0034] In some embodiments, refer to Figures 1 to 3 As shown, the capacitor 10 also includes insulating paper 14, which is disposed outside the housing 13 and corresponds to the hole 131, covering the hole 131. The insulating paper 14 covering the hole 131 can shield the protrusion 121, thereby achieving insulation between the protrusion 121 and the outside. Covering the hole 131 with insulating paper 14 increases the area of ​​insulation for the protrusion 121, enhancing the insulation effect.

[0035] In some embodiments, refer to Figures 1 to 3 As shown, the copper busbar 12 includes an input terminal 122, an output terminal 123, and a main body 124. The main body 124 is located inside the housing 13, and a protrusion 121 is located on the main body 124. The input terminal 122 and the output terminal 123 extend from the main body 124 to the outside of the housing 13. The input terminal 122 is located on the input copper busbar 12, and the output terminal 123 is located on the output copper busbar 12. The input terminal 122 and the output terminal 123 extending to the outside of the housing 13 facilitate connection with external batteries and IGBT modules.

[0036] In some embodiments, refer to Figures 1 to 3As shown, there are two input terminals 122. The housing 13 includes a support base 132, which is correspondingly arranged with the input terminals 122. The support base 132 includes a first support base 1321 and a second support base 1322. The first support base 1321 is corresponding to one of the input terminals 122, and the second support base 1322 is corresponding to the other input terminal 122. The input terminals 122 include a positive input terminal 122 and a negative input terminal 122, which transmit positive and negative electricity respectively. The support base 132 of the housing 13 can support the input terminals 122 to maintain their stability. Furthermore, the first support base 1321 and the second support base 1322 provide better support.

[0037] In some embodiments, refer to Figures 1 to 3 As shown, the housing 13 includes an isolation portion 133, which is disposed between the first support base 1321 and the second support base 1322. The isolation portion 133 protrudes towards one side of the input terminal 122 and is located between the two input terminals 122. The isolation portion 133 disposed between the first support base 1321 and the second support base 1322 can isolate the two input terminals 122, thereby achieving electrical insulation between the two input terminals 122.

[0038] In some embodiments, capacitor 10 further includes epoxy potting compound, and the epoxy potting compound layer is filled between the thin film capacitor core 11 and the shell 13; the wall thickness of the plastic shell is selected according to the actual situation. Such a design is simple and reasonable, easy to manufacture, and can greatly ensure the reliability of heat dissipation and electrical performance of this utility model.

[0039] In this application, since the protrusion 121 of the copper busbar 12 is located in the hole 131, heat can be transferred to the outside of the housing 13 through the protrusion 121 on the copper busbar 12, thereby increasing the heat dissipation of the capacitor 10. This effectively reduces the temperature of the capacitor 10, increases the lifespan of the capacitor 10, and thus increases the power density of the electronic control and reduces costs. The housing 13 support base 132 supports the input terminal 122 to maintain the stability of the input terminal 122. Furthermore, the isolation base provided between the first support base 1321 and the second support base 1322 can isolate the two input terminals 122, achieving electrical insulation between the two input terminals 122.

[0040] This application also provides a controller 20, as shown in the reference. Figures 1 to 4As shown, the device includes a housing 21, a heat-conducting part 22, and a capacitor 10. The housing 21 forms a receiving groove 211, and the capacitor 10 is disposed in the receiving groove 211. A gap exists between the side of the housing 13 facing the hole 131 and the bottom surface of the receiving groove 211, and the heat-conducting part 22 is disposed in the gap. The heat of the capacitor 10 is transferred to the housing 21 through the heat-conducting part 22. Specifically, the heat-conducting part 22 is disposed between the protrusion 121 and the housing 21. Since the copper busbar 12 has the greatest heat, the heat of the copper busbar 12 can be transferred to the housing 21 through the heat-conducting part 22, making the heat conduction path more efficient and achieving a better heat dissipation effect.

[0041] In some embodiments, the thermally conductive part 22 is made of thermally conductive adhesive with a thermal conductivity of 1.5 W / mK. This allows the heat from the high-temperature copper busbar 12 protrusion 121 to be quickly conducted to the housing 21. Specifically, the thermal conductivity of the copper busbar 12 is 401 W / mK. In contrast, in conventionally designed capacitors 10, the copper busbar 12 is isolated from the housing by epoxy potting compound. The thermal conductivity of the epoxy potting compound and the housing material is typically 0.2–0.6 W / mK, resulting in poor heat conduction.

[0042] In some embodiments, refer to Figures 1 to 4 As shown, the housing 21 has a capacitor mounting position 213, where the capacitor 10 is mounted. The housing 21 also forms a cooling water channel 212, located on one side of the capacitor mounting position 213. The cooling water channel 212 includes an inlet 2121, a storage tank 2122, and an outlet 2123, which are sequentially connected. The heat generated by the capacitor 10 is transferred to the cooling water channel 212 via the capacitor mounting position 213. Coolant can enter the storage tank 2122 from the inlet 2121 and then flow out from the outlet 2123, forming a circulating water system. The coolant in the storage tank 2122 can carry away the heat from the capacitor 10, achieving a good heat dissipation effect.

[0043] This application also provides a vehicle including the aforementioned controller 20.

[0044] In this application, unless otherwise expressly specified and limited, the terms "set up (provided)" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0045] In the description of this specification, references to terms such as "some embodiments" indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment is included in at least one embodiment of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of those different embodiments or examples.

[0046] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application. Therefore, any changes or modifications made in accordance with the claims and description of this application should fall within the scope of this patent application.

Claims

1. A capacitor, characterized in that, The device includes a thin-film capacitor core, a copper busbar, and a housing. The thin-film capacitor core and at least a portion of the copper busbar are disposed within the housing. The thin-film capacitor core is connected to the copper busbar. The copper busbar is disposed between the thin-film capacitor core and the housing. The copper busbar includes a protrusion protruding into the housing. The housing forms a hole, and the protrusion is located in the hole.

2. The capacitor according to claim 1, characterized in that, The height of the protrusion in the vertical direction is greater than the thickness of the housing.

3. The capacitor according to claim 1, characterized in that, The capacitor also includes insulating paper, which is disposed outside the housing and is correspondingly disposed to the hole, and the insulating paper covers the hole.

4. The capacitor according to claim 1, characterized in that, The copper busbar includes an input terminal, an output terminal, and a main body. The main body is located inside the housing, and the protrusion is located on the main body. The input terminal and the output terminal are connected to the main body and extend to the outside of the housing.

5. The capacitor according to claim 4, characterized in that, The number of input terminals is two; The housing includes a support base, which is correspondingly disposed with the input terminal. The support base includes a first support base and a second support base, wherein the first support base is correspondingly disposed with one of the input terminals and the second support base is correspondingly disposed with the other input terminal.

6. The capacitor according to claim 5, characterized in that, The housing includes an isolation section disposed between the first support base and the second support base. The isolation section protrudes towards one side of the input terminal and is located between the two input terminals.

7. A controller, characterized in that, The controller includes a housing, a heat-conducting part, and a capacitor as described in any one of claims 1 to 6. The housing forms a receiving groove, the capacitor is disposed in the receiving groove, a gap exists between the side of the housing facing the hole and the bottom surface of the receiving groove, and the heat-conducting part is disposed in the gap.

8. The controller according to claim 7, characterized in that, The thermally conductive part is thermally conductive adhesive.

9. The controller according to claim 7, characterized in that, The enclosure has a capacitor mounting position, the capacitor is located at the capacitor mounting position, the enclosure forms a cooling water channel, the cooling water channel is located on one side of the capacitor mounting position, the cooling water channel includes an inlet, a liquid storage tank and an outlet, the inlet, the liquid storage tank and the outlet are connected in sequence.

10. A vehicle, characterized in that, Includes the controller as described in any one of claims 7 to 9.

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