Position calibration device
By using a calibration disk and nozzle pointing device in the drying equipment, the calibration error caused by the large distance between the nozzle and the disk was solved, the nozzle was accurately calibrated, and the wafer drying quality was improved.
Patent Information
- Application Number
- CN202422996282.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-05
- Publication Date
- 2025-11-21
- Estimated Expiration
- 2034-12-05
AI Technical Summary
In existing drying equipment, the distance between the nozzle of the spray bar and the disc is relatively large, resulting in a large position calibration error between the nozzle of the spray bar and the preset area, making it difficult to achieve accurate position calibration.
A position calibration device is used, including a calibration disk and a nozzle guide. The position of the spray bar is adjusted by the support arm so that the tip of the nozzle guide is aligned with the marked area on the calibration disk, thereby achieving accurate nozzle calibration.
It reduces the difficulty of spray bar position calibration, improves nozzle position calibration accuracy, reduces the possibility of wafer surface defects, and improves drying quality.
Smart Images
Figure CN223582953U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] Embodiments of the present application relate to the technical field of wafer drying, and particularly relate to a position calibration device. BACKGROUND
[0002] To improve the surface quality of a semiconductor wafer, the wafer is dried after being cleaned to remove as much as possible the deionized water spots or residues and other impurities on the wafer surface, so as to avoid the impurities on the wafer surface causing defects of the wafer.
[0003] The current drying equipment includes a cavity, a disc body and a spray rod. The disc body and the spray rod are located in the cavity. In the process of using the drying equipment, the wafer to be dried can be fixed on the disc body so as to be fixed in the cavity. Then the spray rod is automatically controlled to move to an initial position, and the spray rod is controlled to move from the initial position while the disc body is controlled to rotate, and the spray rod is controlled to spray fluid to the wafer, so as to realize cleaning and drying of the wafer.
[0004] However, the above process needs to accurately correct the initial position of the spray rod. Currently, it is realized by directly observing whether the fluid sprayed by the spray rod falls into the preset area of the disc body. Since the wafer needs to be placed between the nozzle of the spray rod and the disc body, the distance between the nozzle of the spray rod and the disc body is large and the space in the cavity is limited. Therefore, the position error between the estimated fluid falling point and the preset area is large, which leads to a large difficulty in the calibration process. SUMMARY
[0005] Therefore, embodiments of the present application provide a position calibration device to at least partially solve the above problems.
[0006] According to a first aspect of embodiments of the present application, a position calibration device is provided, which is applied to a drying equipment. The drying equipment further includes a bearing disc, a spray rod and a support arm. The bearing disc is used to bear a wafer when the drying equipment dries the wafer. The spray rod is used to spray fluid to the wafer. The spray rod is arranged on the support arm. The support arm is used to adjust the position of the spray rod. The position calibration device includes a calibration disc and a nozzle pointing piece. The calibration disc is used to be assembled between the spray rod and the bearing disc and is parallel to the bearing disc. An identification area is arranged on the side of the calibration disc close to the spray rod. The nozzle pointing piece is detachably connected to the spray rod. The nozzle pointing piece has a tip located on the spraying path of the spray rod. By adjusting the position of the spray rod on the support arm, the tip of the nozzle pointing piece is aligned with the identification area, and the position of the nozzle of the spray rod is calibrated.
[0007] In the embodiment of the present application, when the position of the nozzle of the spray rod is calibrated by the position calibration device, the calibration disc can be first installed on the bearing disc, then the position of the spray rod is adjusted through the support arm until the nozzle of the spray rod moves to the vicinity of the identification area on the calibration disc, then the nozzle pointing piece is installed on the spray rod, and the position of the spray rod on the support arm is adjusted so that the spray rod drives the tip to align with the identification area, so as to realize the position calibration of the nozzle of the spray rod. After the tip aligns with the identification area, the spray rod and the support arm can be relatively fixed, the calibration disc is removed from the bearing disc, the wafer is installed on the bearing disc, and the nozzle pointing piece is removed from the spray rod, so that the wafer can be dried subsequently. Thus, the position calibration of the nozzle of the spray rod before drying the wafer is realized by observing whether the tip of the nozzle pointing piece aligns with the identification area on the calibration disc. The tip of the nozzle pointing piece is on the gas injection path of the spray rod, so that the distance between the tip of the nozzle pointing piece and the calibration disc is small, and thus the error of estimating whether the tip of the nozzle pointing piece aligns with the identification area on the calibration disc is small, that is, the position calibration of the nozzle of the spray rod is more accurate, and thus the difficulty of position calibration of the spray rod is reduced. BRIEF DESCRIPTION OF DRAWINGS
[0008] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments described in the embodiments of the present application, and other drawings can also be obtained by those skilled in the art according to these drawings.
[0009] Figure 1 is a structural schematic diagram of a drying equipment of an embodiment of the present application;
[0010] Figure 2 is a structural schematic diagram of a position calibration device of an embodiment of the present application;
[0011] Figure 3 is a structural schematic diagram of a calibration disc of an embodiment of the present application;
[0012] Figure 4 is a structural schematic diagram of a nozzle pointing piece of an embodiment of the present application;
[0013] Figure 5 is a sectional view of a position calibration device of an embodiment of the present application;
[0014] Figure 6 is a sectional view of a position calibration device of another embodiment of the present application.
[0015] Explanation of reference signs:
[0016] 1, bearing disc; 2, spray bar; 21, first straight bar; 22, second straight bar; 3, calibration disc; 31, identification area; 32, support column; 321, detection seat; 4, nozzle pointing piece; 41, tip; 42, clamp; 5, cavity; 6, baffle ring; 61, target side; 7, bracket bar. DETAILED DESCRIPTION
[0017] In order to make the purpose, technical scheme and advantages of the present application clearer, the embodiments of the present application will be further described in detail below with reference to the drawings.
[0018] In the description of the present application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.
[0019] The embodiments of the present application provide a position calibration device, which is applied to a drying device. The drying device can be a drying device based on the Marangoni effect or a drying device based on rotary drying, and the drying device involving a nozzle is within the protection scope of the present application.
[0020] Figure 1 is a schematic diagram of a drying device according to an embodiment of the present application. As shown in Figure 1 The drying device further includes a bearing disc 1, a spray bar 2 and a support arm. The bearing disc 1 can be disc-shaped, and is used to carry a wafer during drying of the wafer by the drying device and to drive the wafer to rotate around the axis of the wafer during drying of the wafer by the drying device. The spray bar 2 is used to spray fluid to the wafer during drying of the wafer by the drying device, and is arranged on the support arm. The position of the spray bar 2 on the support arm can be adjusted before the drying device dries the wafer. The support arm is used to adjust the position of the spray bar 2 before and during drying of the wafer by the drying device. The position calibration device is used to calibrate the initial position of the nozzle of the spray bar 2 before the drying device dries the wafer, so as to calibrate the initial landing point of the fluid sprayed by the spray bar 2 on the wafer installed on the bearing disc 1 during drying of the wafer by the drying device, and is removed from the drying device after calibration. The fluid sprayed by the spray bar 2 can be a liquid or a gas, for example, deionized water or a rinsing liquid containing deionized water, or a drying gas containing a surface active component, and the embodiments of the present application do not limit the specific components of the fluid sprayed by the spray bar 2.
[0021] Before the wafer is dried by using the drying device, the position of the nozzle of the spray rod 2 is first calibrated by the position calibration device. The specific process of calibration can be as follows: the position of the spray rod 2 is adjusted by the support arm, and the position of the spray rod 2 on the support arm is adjusted until the initial position of the nozzle of the spray rod 2 is calibrated by the position calibration device, and then the adjustment of the position of the spray rod 2 by the support arm and on the support arm is stopped to achieve the position calibration of the nozzle of the spray rod 2; then the position calibration device is removed from the drying device, and then the wafer is dried by using the drying device. The specific process of drying can be as follows: the wafer to be dried is fixed on the carrier disc 1, the carrier disc 1 drives the wafer to rotate around the axis of the wafer, and the spray rod 2 sprays fluid to the wafer at the same time, and the position of the spray rod 2 is adjusted reciprocally by the support arm to spray fluid to the wafer while the wafer and the spray rod 2 move relative to each other, thereby achieving the drying of the wafer.
[0022] The position calibration device is described in detail through multiple embodiments.
[0023] Figure 2 is a schematic view of the position calibration device of an embodiment of the present application. As shown in Figure 2 , the position calibration device comprises a calibration disc 3 and a nozzle pointing piece 4; the shape of the calibration disc 3 is almost the same as the shape and size of the wafer to be dried, and the calibration disc 3 is used to be assembled between the spray rod 2 and the carrier disc 1, the calibration disc 3 is parallel to the carrier disc 1, and when the calibration disc 3 is assembled between the spray rod 2 and the carrier disc 1, it can be detachably connected to the carrier disc 1, for example, the side of the calibration disc 3 close to the carrier disc 1 can be provided with a positioning column, and the side of the carrier disc 1 close to the calibration disc 3 can be provided with a positioning hole, and the calibration disc 3 and the carrier disc 1 are inserted and matched through the positioning column and the positioning hole, which can be as shown in Figure 3 , the side of the calibration disc 3 close to the carrier disc 1 is fixedly connected with a positioning column a, and based on this, the side of the carrier disc 1 close to the calibration disc 3 is provided with a positioning hole matched with the positioning column a; the side of the calibration disc 3 close to the spray rod 2 is provided with an identification area 31, and the size of the identification area 31 can be set according to the size of the nozzle of the spray rod 2, for example, the identification area 31 can be a circular area with a diameter of 1mm to 5mm; the nozzle pointing piece 4 is detachably connected to the spray rod 2, for example, clamped on the spray rod 2, etc., as shown in Figure 4 , the nozzle pointing piece 4 has a sharp end 41 on the spray path of the spray rod 2, and the part of the nozzle pointing piece 4 except the sharp end 41 can be cylindrical or tubular, and the sharp end 41 is integrally connected to one end of the cylindrical or tubular part, and the length of the nozzle pointing piece 4 can be 0.2mm to 0.7mm, and when the position of the nozzle of the spray rod 2 is calibrated, the position of the spray rod 2 on the support arm can be adjusted so that the sharp end 41 of the nozzle pointing piece 4 is aligned with the identification area 31.
[0024] It should be noted that the spray bars 2 can be provided with one or more, and a single spray bar 2 can have one or more nozzles. For example, the spray bars 2 are provided with two, and each spray bar 2 has one nozzle. The fluid sprayed from the nozzle of the first spray bar 2 is liquid, and the fluid sprayed from the nozzle of the second spray bar 2 is gas. When the spray bars 2 are provided with multiple, or the spray bar 2 is provided with one and the spray bar 2 has multiple nozzles, the side of the calibration disc 3 away from the spray bar 2 is provided with an identification area 31 corresponding to each nozzle. Hereinafter, the case where each spray bar 2 has one nozzle is taken as an example for description.
[0025] In the embodiment of the present application, when the position of the nozzle of the spray bar 2 is calibrated by the position calibration device, the calibration disc 3 can be first installed on the bearing disc 1, then the position of the spray bar 2 is adjusted by the support arm until the nozzle of the spray bar 2 moves to the vicinity of the identification area 31 on the calibration disc 3, then the nozzle pointing piece 4 is installed on the spray bar 2, and then the position of the spray bar 2 on the support arm is adjusted so that the spray bar 2 drives the tip 41 to align with the identification area 31, so as to realize the position calibration of the nozzle of the spray bar 2. After the tip 41 aligns with the identification area 31, the spray bar 2 and the support arm can be relatively fixed, the calibration disc 3 is removed from the bearing disc 1, the wafer is fixed to the bearing disc 1, and the nozzle pointing piece 4 is removed from the spray bar 2, so that the wafer can be dried subsequently. Therefore, the position calibration of the nozzle of the spray bar 2 before drying the wafer is realized by observing whether the tip 41 of the nozzle pointing piece 4 aligns with the identification area 31 on the calibration disc 3. The tip 41 of the nozzle pointing piece 4 is on the gas spraying path of the spray bar 2, so the distance between the tip 41 of the nozzle pointing piece 4 and the calibration disc 3 is small, and thus the error of estimating whether the tip 41 of the nozzle pointing piece 4 aligns with the identification area 31 on the calibration disc 3 is small, that is, the position calibration of the nozzle of the spray bar 2 is more accurate, and thus the difficulty of the position calibration of the spray bar 2 is reduced.
[0026] Further, the embodiment of the present application can also make the initial landing point of the fluid on the wafer during drying the wafer be smaller than the ideal landing point, and thus the landing point path of the fluid on the wafer during drying the wafer is smaller than the ideal landing point path, so as to realize more comprehensive drying of the wafer surface, reduce the possibility of causing defects such as wafer center area defects, edge area defects or random defects, and improve the quality of the wafer after drying.
[0027] In a possible implementation manner, as shown in Figure 1 The drying device further includes a box-shaped cavity 5 and a ring-shaped stop ring 6. The stop ring 6 can be a circular ring. The axis of the stop ring 6, the axis of the calibration disc 3 and the axis of the bearing disc 1 coincide. The stop ring 6 is fixedly connected in the cavity 5. The calibration disc 3 and the bearing disc 1 are located in the space surrounded by the stop ring 6. The wall body of the cavity 5 can be provided with an avoiding opening (Figure 1 The cavity 5 in the cavity 5 hides part of the wall of the cavity 5, and the hidden wall includes a wall with a relief opening; the cavity 5 is provided with a translation driving element for driving the carrier disc 1 to move relative to the retaining ring 6 in a direction perpendicular to the carrier disc 1. The translation driving element can be a gas cylinder or a lead screw, and the present application does not limit the same.
[0028] In the present application, when the calibration disc 3 is installed on the carrier disc 1, the carrier disc 1 can be first driven by the translation driving element to move from the space surrounded by the retaining ring 6 to the outside of the space surrounded by the retaining ring 6, and then the calibration disc 3 is connected with the carrier disc 1. After the connection is completed, the carrier disc 1 drives the calibration disc 3 to move from the outside of the space surrounded by the retaining ring 6 to the inside of the space surrounded by the retaining ring 6 through the translation driving element. When the calibration disc 3 is removed from the carrier disc 1, the carrier disc 1 can first drive the calibration disc 3 to move from the inside of the space surrounded by the retaining ring 6 to the outside of the space surrounded by the retaining ring 6 through the translation driving element, and then the calibration disc 3 is removed from the carrier disc 1. The wafer to be dried is fixed on the carrier disc 1, and then the carrier disc 1 drives the calibration disc 3 to move from the outside of the space surrounded by the retaining ring 6 to the inside of the space surrounded by the retaining ring 6 through the translation driving element. Thus, by setting the translation driving element to drive the carrier disc 1 to move relative to the retaining ring 6 in a direction perpendicular to the carrier disc 1, the calibration disc 3 can be conveniently installed and removed from the carrier disc 1, and the efficiency of installing and removing the calibration disc 3 is improved.
[0029] In a possible implementation, as shown in Figure 5 and Figure 6 The calibration disc 3 is provided with a plurality of support columns 32 at the edge of the side surface away from the carrier disc 1 and along the circumference of the calibration disc 3. The support column 32 can be integrally connected or fixedly connected with the calibration disc 3, and the end surface of the support column 32 away from the calibration disc 3 is located outside the space surrounded by the retaining ring 6 or flush with the target side 61 of the retaining ring 6. The target side 61 of the retaining ring 6 is one annular side of the retaining ring 6, and the calibration disc 3 is closer to the target side 61 of the retaining ring 6 relative to the carrier disc 1. The detection seat 321 is provided on the end surface of the support column 32 away from the calibration disc 3. The detection seat 321 can be a long strip plate, and the present application does not limit the same. The first end of the detection seat 321 is opposite to the target side 61 of the retaining ring 6.
[0030] In the embodiment of the present application, when the position of the spray rod 2 is calibrated by the position calibration device, after the calibration disc 3 is installed on the bearing disc 1, and before the position of the spray rod 2 is adjusted by the support arm to move the nozzle of the spray rod 2 to the vicinity of the identification area 31 on the calibration disc 3, the distance between the first end of each detection seat 321 and the target side 61 of the stop ring 6 can be tested by using a feeler gauge, and the parallelism of the calibration disc 3 relative to the stop ring 6 can be determined according to the distance between the first end of each detection seat 321 and the target side 61 of the stop ring 6. When the parallelism is poor (for example, the flatness of the plane formed by all the detection seats 321 is greater than or equal to 0 mm to 0.08 mm), the rotation member (for example, the rotation member is a motor, and a corresponding gasket can be added between the motor base and the motor body included in the motor) that drives the rotation of the bearing disc 1 can be adjusted to adjust the parallelism of the bearing disc 1 relative to the stop ring 6, thereby achieving the adjustment of the parallelism of the calibration disc 3 relative to the stop ring 6. Thus, the parallelism of the calibration disc 3 relative to the stop ring 6 can be improved by the detection seat 321, and the parallelism of the wafer relative to the stop ring 6 during drying can be improved.
[0031] It should be noted that before or during the movement of the bearing disc 1 driven by the translation driving member to move the calibration disc 3 relative to the stop ring 6 in a direction perpendicular to the bearing disc 1, the first end of the detection seat 321 can be moved to a position away from the stop ring 6.
[0032] In a possible implementation, as shown in Figure 5 and Figure 6 the detection seat 321 is magnetically attracted to the end face of the support column 32 away from the calibration disc 3. The magnetic attraction force of each detection seat 321 can be in the range of 1 N to 5 N. The second end of the detection seat 321 is rotationally connected to the end face of the support column 32 away from the calibration disc 3. The rotation axis direction of the rotationally connected second end of the detection seat 321 is perpendicular to the axis direction of the calibration disc 3. The second end of the detection seat 321 is used in the process of moving the calibration disc 3 from the space surrounded by the stop ring 6 to the outside of the space surrounded by the stop ring 6 driven by the translation driving member. When the end face of the support column 32 away from the calibration disc 3 is located in the space surrounded by the stop ring 6, the detection seat 321 rotates relative to the support column 32 under the extrusion force of the stop ring 6 on the first end of the detection seat 321, so that the first end of the detection seat 321 can avoid the stop ring 6.
[0033] Thus, when the calibration disc 3 moves the detection seat 321 relative to the stop ring 6, the first end of the detection seat 321 can automatically avoid the stop ring 6, which can reduce the possibility of damage to the detection seat 321 and the stop ring 6 caused by accidental contact when the calibration disc 3 moves the detection seat 321 relative to the stop ring 6.
[0034] In a possible implementation, the side surface of the calibration disc 3 close to the spray rod 2 is frosted, so that the frosted surface of the calibration disc 3 can reduce the interference caused by ambient light, so that it is easier to observe the identification area 31 in the box-shaped cavity 5.
[0035] Optionally, the identification disc can adopt a transparent frosted appearance of PVC (Polyvinyl chloride), and the identification area 31 can adopt a clean paint with high background recognition degree injected into the back of the identification disc (i.e. the part close to the bearing disc 1), which can reduce the pollution of the internal cavity of the box-shaped cavity 5, and assist in determining the position of the tip 41 through the paint with color, further reducing the calibration difficulty.
[0036] Optionally, the nozzle pointing piece 4 can be made of POM (Polyoxymethylene) or PPS (Polyphenylene sulfide), which has the advantages of no pollution and self-lubrication.
[0037] In a possible implementation, as shown in Figure 1 and Figure 2 , the nozzle pointing piece 4 is slidably connected with the spray rod 2 in a direction parallel to the gas injection path of the spray rod 2, and the slidable distance can be in millimeters, for example, 0mm to 15mm, so that during the installation of the nozzle pointing piece 4, the distance between the nozzle and the calibration disc 3 can be adjusted by sliding the nozzle pointing piece 4 relative to the spray rod 2, so as to adjust the distance between the tip 41 of the nozzle pointing piece 4 and the nozzle of the spray rod 2, thereby improving the applicability of the nozzle pointing piece 4.
[0038] In a possible implementation, as shown in Figure 1 and Figure 2 , the spray rod 2 includes a first straight rod 21, which has a cylindrical rod shape and a length direction parallel to the gas injection path of the spray rod 2; the nozzle pointing piece 4 is connected with a clamp 42, which can be connected with the nozzle pointing piece 4 in a fixed connection, detachable connection or integral connection manner, and the clamp 42 is used for clamping at any position outside the first straight rod 21.
[0039] In the embodiment of the present application, the clamp 42 clamped at different positions outside the first straight rod 21 can realize the sliding of the nozzle pointing piece 4 relative to the spray rod 2, and in addition, the nozzle pointing piece 4 is connected to the spray rod 2 by clamping with the clamp 42, which can facilitate the connection of the nozzle pointing piece 4 and the spray rod 2.
[0040] Optionally, the clamp can include two clamping plates, and a hinge shaft and a torsional spring are connected between the two clamping plates to realize the clamping function of the clamp, and the clamping force of the clamp can be 0.12N.M to 0.2N.M.
[0041] In a possible implementation, as shown in Figure 1 The spray rod 2 further comprises a second straight rod 22, which has a cylindrical rod shape and whose length direction is perpendicular to the length direction of the first straight rod 21; the first end of the second straight rod 22 is in communication with the first end of the first straight rod 21, and the second end of the first straight rod 21 is the nozzle of the spray rod 2; the second end of the second straight rod 22 is connected with the support arm, and the length of the second straight rod 22 extending out of the support arm and the rotation angle of the second straight rod 22 relative to the support arm are adjustable.
[0042] In the embodiment, when the position of the spray rod 2 on the support arm is adjusted, the second straight rod 22 can be extended and retracted relative to the support arm, and the second straight rod 22 can also be rotated relative to the support arm to adjust the rotation angle of the second straight rod 22 relative to the support arm, so as to finely adjust the position of the nozzle relative to the support arm, thereby making it easier to align the tip 41 with the identification area 31 and further reducing the difficulty of position calibration of the spray rod 2.
[0043] In a possible implementation, as shown in Figure 1 and Figure 2 The support arm comprises a support rod 7 and a rotation driving member; the support rod 7 is located outside the side of the calibration disc 3 away from the bearing disc 1 and outside the space surrounded by the retaining ring 6, the length direction of the support rod 7 is parallel to the length direction of the second straight rod 22, the second end of the second straight rod 22 is slidingly connected to the first end of the support rod 7 along the length direction of the second straight rod 22, and the second end of the second straight rod 22 is rotationally connected to the first end of the support rod 7 about the axis of the second straight rod 22, the support rod 7 is provided with a locking member, which is used to relatively fix the second straight rod 22 and the support rod 7 after the tip 41 is aligned with the identification area 31, so that the spray rod 2 and the support rod 7 are relatively fixed when the wafer is dried, and the specific structure of the locking member is not limited in the embodiment; the second end of the support rod 7 is rotationally connected to the cavity 5 about a direction perpendicular to the length direction of the support rod 7; the rotation driving member is connected with the support rod 7 and the cavity 5, and is used to drive the support rod 7 to rotate relative to the cavity 5 in the process of adjusting the movement of the tip 41 driven by the spray rod 2, so that the tip 41 of the nozzle pointing member 4 driven by the spray rod 2 is aligned with the identification area 31, and the rotation driving member is, for example, a motor, and the rotation precision of the support rod 7 relative to the cavity 5 can be 0.1° to 0.3°.
[0044] In the embodiment, in the process of calibrating the position of the nozzle of the spray rod 2, the position of the spray rod 2 is adjusted by the support arm, that is, the rotation driving member is controlled to drive the support rod 7 to rotate relative to the cavity 5, and then the support rod 7 can drive the spray rod 2 to move, so that the structure of the support arm is simple, easy to implement and low in cost.
[0045] In a possible implementation, the rotating driving member is further configured to drive the support rod 7 to rotate relative to the cavity 5 when the drying device is drying the wafer.
[0046] In the embodiment, when the position of the spray rod 2 is adjusted by the support arm during the drying of the wafer, the rotating driving member is controlled to drive the support rod 7 to rotate relative to the cavity 5, and then the support rod 7 can drive the spray rod 2 to move. Therefore, at least part of the way of adjusting the position of the spray rod 2 during the calibration of the position of the nozzle of the spray rod 2 and the way of adjusting the position of the spray rod 2 during the drying of the wafer are both achieved by the support rod 7, so that the support arm can be smaller in size, simpler in structure, and lower in cost.
[0047] The use process of the position calibration device provided in the embodiment is as follows:
[0048] S1, mounting the calibration disc 3 on the bearing disc 1.
[0049] S2, mounting the nozzle pointing member 4 on the spray rod 2.
[0050] S3, adjusting the position of the spray rod 2 on the support arm, so that the spray rod 2 drives the tip 41 of the nozzle pointing member 4 to move until the tip 41 is aligned with the identification area 31 on the calibration disc 3.
[0051] The position calibration device provided in the embodiment can reduce the time consumption of the calibration process of the nozzle by nearly 10 times, greatly improves the nozzle calibration efficiency, improves the equipment maintenance efficiency, reduces the influence of subjective judgment of the worker on the calibration result, and improves the calibration accuracy of the nozzle by more than one time.
[0052] It should be noted that, in the present document, relational terms such as first and second and the like can be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus. An element proceeded by "comprises a... " does not, without more constraints, exclude the existence of additional identical elements in the process, method, article, or apparatus that comprises the element.
[0053] Finally, it should be noted that the above merely provides a preferred embodiment of the present application, which is only used for explaining the technical scheme of the present application, and is not used for limiting the protection scope of the present application. Any modification, equivalent replacement, improvement, and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims
1. A position calibration device, characterized by, The position calibration device is applied to a drying apparatus, the drying apparatus further comprises a carrier disk, a spray rod and a support arm, the carrier disk is used to carry a wafer when the drying apparatus dries the wafer, the spray rod is used to spray fluid to the wafer, the spray rod is arranged on the support arm, and the support arm is used to adjust the position of the spray rod; the position calibration device comprises a calibration disk and a nozzle pointing piece; The calibration disk is used to be assembled between the spray rod and the carrier disk and is parallel to the carrier disk, and the calibration disk is provided with an identification area close to the side surface of the spray rod; The nozzle pointing piece is detachably connected on the spray rod, the nozzle pointing piece has a tip located on the spraying path of the spray rod, and the position of the nozzle of the spray rod is calibrated by adjusting the position of the spray rod on the support arm so that the tip of the nozzle pointing piece carried by the spray rod is aligned with the identification area.
2. The device according to claim 1, wherein The nozzle pointing piece is slidably connected with the spray rod in a direction parallel to the gas spraying path of the spray rod.
3. The apparatus of claim 2, wherein, The spray rod comprises a first straight rod, and the length direction of the first straight rod is parallel to the gas spraying path of the spray rod; The nozzle pointing piece is connected with a clamp, and the clamp is used to be clamped at any position outside the first straight rod.
4. The apparatus of claim 3, wherein, The spray rod further comprises a second straight rod, and the length direction of the second straight rod is perpendicular to the length direction of the first straight rod; The first end of the second straight rod is communicated with the first end of the first straight rod, and the second end of the first straight rod is the nozzle of the spray rod; The second end of the second straight rod is connected with the support arm, and the length of the second straight rod extending out of the support arm and the rotation angle of the second straight rod relative to the support arm are adjustable.
5. The apparatus of claim 4, wherein, The drying apparatus further comprises a cavity, and the support arm comprises a support rod and a rotation driving piece; The length direction of the support rod is parallel to the length direction of the second straight rod, the second end of the second straight rod is slidably connected with the first end of the support rod in the length direction of the second straight rod, and the second end of the second straight rod is rotationally connected with the first end of the support rod around the axis of the second straight rod, the support rod is provided with a locking piece, the locking piece is used to relatively fix the second straight rod and the support rod after the tip is aligned with the identification area, and the second end of the support rod is rotationally connected with the cavity around a direction perpendicular to the length direction of the support rod; The rotation driving piece is connected with the support rod and the cavity, and the rotation driving piece is used to drive the support rod to rotate relative to the cavity so that the tip of the nozzle pointing piece carried by the spray rod is aligned with the identification area.
6. The device according to claim 5, wherein The rotation driving piece is further used to drive the support rod to rotate relative to the cavity when the drying apparatus dries the wafer.
7. The apparatus of claim 1, wherein, The drying apparatus further comprises a box-shaped cavity and a ring-shaped stop ring, the stop ring is connected in the cavity, and the calibration disk and the carrier disk are located in the space surrounded by the stop ring. A translation driving element is arranged on the cavity and used to drive the carrier disc to move relative to the retaining ring along a direction perpendicular to the carrier disc.
8. The apparatus of claim 7, wherein, A plurality of support columns are arranged on the calibration disc at the edge of the side surface of the carrier disc in the circumferential direction of the calibration disc, and the support columns are located outside the space surrounded by the retaining ring or flush with the target side of the retaining ring away from the end surface of the calibration disc, wherein the target side of the retaining ring is one annular side of the retaining ring, and the calibration disc is closer to the target side of the retaining ring relative to the carrier disc. A detection seat is arranged on the support column away from the end surface of the calibration disc, and a first end of the detection seat is opposite to the target side of the retaining ring.
9. The apparatus of claim 8, wherein, The detection seat is magnetically attracted to the support column away from the end surface of the calibration disc. A second end of the detection seat is rotationally connected to the support column, and the second end of the detection seat is used to rotate relative to the support column under the extrusion of the first end of the detection seat by the retaining ring when the end surface of the support column away from the calibration disc is located in the space surrounded by the retaining ring during the movement of the carrier disc driven by the translation driving element.