Wafer cleaning device

Abstract

The utility model provides a wafer cleaning device which comprises a support. The support is provided with a first cleaning assembly used for spraying and cleaning the front face and / or the back face of a wafer, a second cleaning assembly used for cleaning the edge of the front face and / or the back face of the wafer, and a wafer driving assembly used for supporting the wafer and driving the wafer to rotate around the normal axis of the wafer. The front and back surfaces of the wafer are vertical to the horizontal ground; the first cleaning assembly comprises a cleaning liquid spraying part and a flexible cleaning part which is arranged on one side of the front surface and / or the back surface of the wafer and is used for being in contact with the wafer and cleaning the wafer; the second cleaning assembly is arranged on the support, and a flexible cleaning head is formed at the contact position of the second cleaning assembly and the edge of the front face and / or the back face of the wafer. The second cleaning assembly further cleans the front and / or back edge of the wafer, solves the problem that the front and / or back edge of the wafer has particle defects due to the fact that the wafer is vertically placed and cleaned, and improves the quality of the wafer.

Description

Technical Field

[0001] This utility model belongs to the field of wafer processing equipment and relates to a wafer cleaning device. Background Technology

[0002] In semiconductor manufacturing, wafers are an important raw material for semiconductor products. Their main component is silicon, and their outer contour is a thin sheet structure, often referred to as silicon wafers. Various circuit element structures can be processed on wafers to ultimately form chips, which realize the functional control of circuits and are indispensable in high-end manufacturing.

[0003] In the wafer grinding process, grinding byproducts remain on the surface of the wafer after grinding, affecting the product yield. Therefore, a cleaning process is needed to remove these byproducts. To achieve satisfactory cleaning results, existing technologies use chemical cleaning methods that employ brushes to clean the rotating wafer. When the cleaning brush contacts particles on the wafer surface, it undergoes elastic deformation, causing grinding byproduct particles to adhere to the brush surface and be ejected as the brush rotates.

[0004] Existing cleaning devices are typically vertically mounted. With each cleaning cycle, the cleaning brushes become increasingly less effective, leading to a buildup of byproducts in the residual cleaning solution. After cleaning, the residual cleaning solution flows downwards along the wafer surface under gravity, eventually accumulating at the edges of the front and / or back sides. This results in particle defects at the edges, making these areas the most susceptible to contamination. Therefore, edge defects are an inherent flaw in vertical cleaning processes, difficult to completely eliminate, and negatively impact yield.

[0005] Currently, the question is how to provide a wafer cleaning device that can effectively reduce defects such as particles on the front and / or back edges of wafers and improve wafer quality.

[0006] It should be noted that the above introduction to the technical background is only for the purpose of providing a clear and complete explanation of the technical solutions of this application and facilitating understanding by those skilled in the art. It should not be assumed that these technical solutions are known to those skilled in the art simply because they have been described in the background section of this application. Utility Model Content

[0007] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide a wafer cleaning device to solve the problem that vertical placement of the wafer during cleaning causes particle defects on the front and / or back edges of the wafer, effectively removing particles from the front and / or back edges of the wafer and improving wafer quality.

[0008] To achieve the above objectives, this utility model provides a wafer cleaning device, which includes a support frame. The support frame is equipped with a first cleaning component for spraying and cleaning the front and / or back sides of a wafer, a second cleaning component for cleaning the edges of the front and back sides of the wafer, and a wafer driving component for supporting the wafer and driving its rotation. The front and back sides of the wafer are perpendicular to the horizontal ground. The first cleaning component includes a cleaning fluid sprayer and a flexible cleaning component located on one side of the front and / or back sides of the wafer for contacting and cleaning the wafer. The second cleaning component is used to further clean the residue on the edges of the front and / or back sides of the wafer after the first cleaning component has completed cleaning, and a flexible cleaning head is formed at the end of the component that contacts the edges of the front and / or back sides of the wafer.

[0009] In one specific embodiment, the second cleaning component is movably connected to the bracket.

[0010] In a more specific embodiment, the second cleaning assembly includes a support rod and a cleaning head disposed at the end of the support rod; the support rod is movably connected to the bracket, the movable connection being selected from one or more of hinge, snap-fit, and tenon-mortise connection.

[0011] In one specific embodiment, the shape of the cleaning head is selected from one or more of the following: cylindrical, cubic, cuboid, and elliptical.

[0012] In one specific embodiment, the cleaning head has a plurality of through holes for discharging cleaning fluid.

[0013] In a more specific embodiment, the cleaning head is cylindrical in shape, with the central axis of the cylinder arranged parallel to the front and back sides of the wafer.

[0014] Furthermore, the axial length of the portion of the cleaning head that contacts the wafer is 4-8 cm, such as 4-5 cm, 5-6 cm, 6-7 cm, or 7-8 cm.

[0015] Furthermore, the second cleaning assembly also includes a cleaning head drive source for driving the cleaning head to rotate about its central axis. In some further embodiments, the cleaning head drive source is selected from one or more of a worm gear reducer, a gear rotary drive motor, and a cylinder rotary drive motor.

[0016] In one specific embodiment, the cleaning head includes a PVA brush head, the surface of which is formed with a plurality of second cleaning bumps.

[0017] In a more specific embodiment, the contact surface between any of the second cleaning bumps and the wafer is the cleaning surface, and the size of the cleaning surface of any of the second cleaning bumps is 1 to 4 mm. 2 The distribution density of the second cleaning bump is 20-30 bumps / cm².2 .

[0018] The size of the cleaning surface of the second cleaning protrusion can be 1-2 mm. 2 2-3mm 2 3-4mm 2 .

[0019] The distribution density of the second cleaning bump can be 20-22 bumps / cm². 2 22-24 per cm 2 24-26 per cm 2 26-28 per cm 2 28-30 per cm 2 .

[0020] In one specific embodiment, the cleaning fluid spraying component is a spray rod; the spray rod is provided with a plurality of nozzles for spraying onto the wafer surface.

[0021] In one specific embodiment, with a horizontal ground as a reference, the cleaning fluid sprayer is positioned above the wafer.

[0022] In a more specific embodiment, the nozzle is selected from one or more of a fan-shaped nozzle, a conical nozzle, or a cylindrical nozzle.

[0023] In one specific embodiment, the cleaning component is selected from one or more of a roller brush, a plate brush, and a disc brush.

[0024] In a more specific embodiment, the cleaning component is a roller brush, and a plurality of first cleaning bumps are formed on the surface of the cleaning component. Further, the first cleaning bumps are PVA brush heads, the contact surface between any first cleaning bump and the wafer is the cleaning surface, and the size of the cleaning surface of any first cleaning bump is 1–4 mm. 2 The distribution density of the first cleaning bump is 20-30 bumps / cm². 2 .

[0025] The size of the cleaning surface of the first cleaning protrusion can be 1-2 mm. 2 2-3mm 2 3-4mm 2 .

[0026] For example, the distribution density of the first cleaning bumps can be 20-22 bumps / cm². 2 22-24 per cm 2 24-26 per cm 2 26-28 per cm 2 28-30 per cm 2 .

[0027] In a more specific embodiment, the cleaning element is cylindrical, and the cleaning element further includes a cleaning element drive source for driving the cleaning element to rotate about the central axis of the cylinder.

[0028] In a further embodiment, the cleaning component drive source is selected from one or more of a worm gear reducer, a gear rotary drive motor, and a cylinder rotary drive motor.

[0029] In a more specific embodiment, the axial length of the cleaning element is greater than the diameter of the wafer.

[0030] In one specific embodiment, the wafer cleaning apparatus further includes an external cleaning fluid drive source and a fluid delivery pipeline. The fluid delivery pipeline is in fluid communication with the inlet of the cleaning fluid spraying component and the inlet of the second cleaning component. The external cleaning fluid drive source acts on the fluid delivery pipeline.

[0031] In one specific embodiment, the wafer cleaning apparatus has an openable and closable cleaning enclosure to provide a closed cleaning environment, and the wafer is disposed within the openable and closable cleaning enclosure.

[0032] In one specific embodiment, the cleaning fluid is selected from one or more of DHF cleaning fluid, APM(SC-1) cleaning fluid, and Clean100 hydrocarbon-based cleaning agent.

[0033] In one specific embodiment, the wafer driving assembly includes a wafer driving source and a motion conductor for transmitting rotational motion and supporting the wafer.

[0034] In a more specific embodiment, the wafer drive source is selected from one or more of a worm gear reducer, a gear rotary drive motor, a cylinder rotary drive motor, and a direct drive motor.

[0035] In a more specific embodiment, the motion transmission element is selected from one or more of a robotic arm and a transmission roller.

[0036] In a more specific embodiment, the motion conductor is formed with a protrusion extending along the wafer center direction for limiting axial wobble of the wafer.

[0037] In a further embodiment, the motion transmission element is a transmission roller.

[0038] As described above, the wafer cleaning device of this utility model has the following beneficial effects:

[0039] 1) The wafer cleaning apparatus described in this application includes a second cleaning component for cleaning the front and / or back edges of a wafer. After the first cleaning component completes cleaning, the second cleaning component further cleans the edges of the wafer to remove particulate impurities that are concentrated on the front and / or back edges of the wafer due to vertical placement, thereby improving wafer quality.

[0040] 2) The wafer cleaning apparatus described in this application integrates a first cleaning component and a second cleaning component, enabling wafer cleaning to be completed within the same apparatus, thereby improving the cleaning efficiency and quality of the wafer.

[0041] 3) The components of the wafer cleaning apparatus described in this application have simple structures, are easy to industrialize, and reduce wafer cleaning costs.

[0042] 4) In the wafer cleaning apparatus described in this application, the second cleaning component is hinged to the support, and the connection angle is adjustable to accommodate wafers of different sizes. Attached Figure Description

[0043] Figure 1 The diagram shown is a structural schematic of the wafer cleaning device provided by this utility model.

[0044] Figure 2 The diagram shows a partial structural schematic of the edge of the front and / or back side of the wafer cleaned according to this invention.

[0045] Explanation of reference numerals in the attached figures

[0046] 10 Support, 20 First cleaning assembly, 21 Cleaning fluid sprayer, 211 Nozzle, 22 Cleaning component, 221 First cleaning bump, 30 Second cleaning assembly, 31 Cleaning head, 311 Second cleaning bump, 40 Wafer drive assembly, 41 Motion transmission component, 42 Protrusion section, 50 Wafer, 51 Edge of the front and / or back side of the wafer. Detailed Implementation

[0047] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model.

[0048] Please see Figures 1-2This embodiment provides a wafer cleaning apparatus. It should be understood that the structures, proportions, sizes, etc., illustrated in the accompanying drawings are merely for illustrative purposes and to aid those skilled in the art, and are not intended to limit the scope of this invention. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effectiveness and purpose of this invention, should still fall within the scope of the disclosed technical content. Furthermore, the terms "upper," "lower," "left," "right," "middle," and "one" used in this specification are merely for clarity and are not intended to limit the scope of this invention. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this invention.

[0049] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0050] See Figures 1-2 This embodiment provides a wafer cleaning apparatus, which includes a support 10. The support 10 is equipped with a first cleaning component 20 for spraying and cleaning the front and back surfaces of a wafer, a second cleaning component 30 for cleaning the edges of the front and / or back surfaces of the wafer, and a wafer drive component 40 for supporting the wafer and driving its rotation. The front and back surfaces of the wafer are perpendicular to a horizontal surface. The first cleaning component 20 includes a cleaning fluid sprayer 21 and a flexible cleaning component 22 disposed on one side of the front and / or back surface of the wafer for contacting and cleaning the wafer. The second cleaning component 30 is used to further clean the residual particles on the edges of the front and / or back surfaces of the wafer after the first cleaning component 20 has completed cleaning. A flexible cleaning head 31 is formed at the end of the second cleaning component 30 that contacts the edges of the front and / or back surfaces of the wafer. After the first cleaning component 20 completes cleaning, the second cleaning component 30 further cleans the edges of the front and / or back surfaces of the wafer, removing particulate impurities concentrated on the edges of the front and / or back surfaces due to vertical placement, thereby improving wafer quality.

[0051] In this application, the edge 51 of the front and / or back side of the wafer refers to an annular region concentric with the wafer 50. The annular region is located at the edge of the front and back sides of the wafer and has a width of 4 to 8 cm.

[0052] In a like Figure 2In the specific embodiment shown, the edge 51 of the front and / or back side of the wafer is a shaded annular region concentric with the wafer 50, and the width of the annular region is 6 cm.

[0053] In a specific embodiment, such as Figure 1 As shown, the second cleaning component 30 is movably connected to the bracket 10. In a more specific embodiment, such as Figure 1 As shown, the second cleaning assembly 30 includes a support rod and a cleaning head 31 disposed at the end of the support rod; the support rod is movably connected to the bracket 10, and the movable connection is selected from one or more of hinge, snap-fit, and tenon-mortise connection. In a... Figure 1 In the specific embodiment shown, the second cleaning component 30 is hinged to the support 10 and rotates around a point on the support 10 to adjust the position of the cleaning head 31. When the first cleaning component 20 is cleaning, mechanical control causes the support rod to rotate around a point on the support 10, moving the cleaning head 31 away from the wafer until it is no longer in contact with the wafer. When the first cleaning component 20 finishes cleaning, mechanical control causes the support rod to rotate around a point on the support 10, moving the cleaning head 31 closer to the wafer until it contacts and cleans the wafer. This simultaneously achieves contact and cleaning with the edges of wafers of different sizes and / or different edge positions of the same wafer.

[0054] In a specific implementation example, such as Figure 1 As shown, the shape of the cleaning head 31 is selected from one or more of the following: cylindrical, cubic, cuboid, and elliptical. In a more specific embodiment, as... Figure 1 As shown, the cleaning head 31 is cylindrical in shape, and its central axis is parallel to both the front and back surfaces of the wafer. Further, the axial length of the portion of the cleaning head 31 that contacts the wafer is 4–8 cm. For example, it can be 4–5 cm, 5–6 cm, 6–7 cm, or 7–8 cm.

[0055] In a like Figure 1 In the specific embodiment shown, the axial length of the portion of the cleaning head 31 that contacts the wafer is 6 cm.

[0056] In a specific implementation example, such as Figure 1 As shown, the wafer is 12 inches in size.

[0057] In a specific implementation example, such as Figure 1 As shown, the cleaning surface of the cleaning head 31 that contacts the wafer is a smooth arc surface to reduce scratches or physical damage to the wafer surface when in contact with it.

[0058] In a specific implementation example, such as Figure 1As shown, the cleaning head 31 has several through holes for discharging cleaning fluid. The cleaning fluid discharged from the through holes adheres to the cleaning head 31, thereby further improving the cleaning efficiency of the second cleaning assembly 30.

[0059] In a specific implementation example, such as Figure 1 As shown, the cleaning head 31 includes a PVA brush head, the surface of which is formed with a plurality of second cleaning protrusions 311. In a more specific embodiment, as... Figure 1 As shown, the contact surface between any of the second cleaning bumps 311 and the wafer is the cleaning surface, and the distribution density of the second cleaning bumps 311 is 20-30 bumps / cm. 2 In a specific implementation example, such as Figure 1 As shown, the size of the cleaning surface of any of the second cleaning protrusions 311 is 1-4 mm. 2 The size of the cleaning surface of the second cleaning protrusion 311 can be 1-2 mm. 2 2-3mm 2 3-4mm 2 The distribution density of the second cleaning bump 311 can be 20-22 bumps / cm². 2 22-24 per cm 2 24-26 per cm 2 26-28 per cm 2 28-30 per cm 2 In a situation like Figure 1 In the specific embodiment shown, the size of the cleaning surface of the second cleaning bump 311 is 2mm. 2 The quantity is 22 per cm. 2 .

[0060] The PVA brush head is soft and highly elastic, with a porous surface. During the cleaning process, it undergoes slight deformation when squeezed against the wafer, without causing scratches or physical damage to the wafer surface. It can effectively absorb cleaning fluid and, through its porous structure and shape design, adsorb or brush away tiny particles and contaminants on the wafer surface.

[0061] In one specific embodiment, the cleaning head 31 may not include a through hole for discharging cleaning fluid, and may rely solely on the uneven design of the surface of the second cleaning bump 311 to remove tiny particles and contaminants from the wafer surface.

[0062] It should be noted that the number and position of the second cleaning components 30 can be arbitrarily selected, as long as they achieve the effect of contacting and cleaning the edges of the front and / or back sides of the wafer. For example, the number of the second cleaning components 30 can be 2, 3, 4, 5, 6, or 7.

[0063] In a like Figures 1-2 In the specific embodiment shown, the second cleaning component 30 is located on the side close to the front side of the wafer, and there are two second cleaning components 30. The second cleaning component 30 is located on the support in the lower region of the wafer, and the cleaning head 31 is cylindrical in shape, with the axis of the cylinder being parallel to the radial direction of the wafer 50.

[0064] In a more specific embodiment, such as Figures 1-2 As shown, the second cleaning assembly 30 also includes a cleaning head drive source for driving the cleaning head 31 to rotate about the central axis of the cylinder. In some further embodiments, the cleaning head drive source is selected from one or more of a worm gear reducer, a gear rotary drive motor, a cylinder rotary drive motor, and a stepper motor. Figures 1-2 As shown, the cleaning head drive source causes the cleaning head 31 to rotate around the central axis of the cylinder, further improving the cleaning efficiency.

[0065] It should be noted that the cleaning head drive source can be a drive source that only drives the cleaning head 31 to rotate; when the support rod is fixedly connected to the cleaning head 31, it can also be a drive source that drives the support rod and the cleaning head 31 to rotate together.

[0066] In a like Figure 1 In the specific embodiment shown, the cleaning head 31 is sleeved outside the support rod, and the driving source of the cleaning head is a stepper motor and is located between the cleaning head 31 and the support rod.

[0067] In a specific embodiment, such as Figure 1 As shown, the cleaning fluid spraying component 21 is a spraying rod; the spraying rod is provided with a plurality of nozzles 211 for spraying onto the wafer surface. The number of cleaning fluid spraying components 21 can be 1, 2, 3, or 4.

[0068] In a specific embodiment, such as Figure 1 As shown, with a horizontal ground as a reference, the cleaning fluid sprayer 21 is positioned above the wafer. The cleaning fluid sprayer 21, positioned above the wafer, sprays the cleaning fluid onto the wafer surface from top to bottom. The cleaning fluid flows downwards along the wafer surface due to gravity, achieving a more convenient and comprehensive cleaning of the entire wafer surface.

[0069] It should be noted that the cleaning fluid spraying element 21 can also be located around or below the wafer, as long as the cleaning fluid can cover the wafer surface.

[0070] In a more specific embodiment, such as Figure 1 As shown, the nozzle 211 is selected from one or more of a fan-shaped nozzle, a conical nozzle, or a cylindrical nozzle.

[0071] In one specific embodiment, the number of nozzles 211 can be 2, 3, 4, 5, 6, or 7.

[0072] In a like Figure 1 In the specific embodiment shown, the cleaning fluid sprayed from the nozzle 211 is fan-shaped, and the water jets of the cleaning fluid sprayed from each nozzle 211 overlap to achieve comprehensive cleaning of the wafer surface.

[0073] In a specific embodiment, such as Figure 1 As shown, the cleaning component 22 is selected from one or more of a roller brush, a plate brush, and a disc brush. In a more specific embodiment, as... Figure 1 As shown, the cleaning component 22 is a PVA roller brush, and a plurality of first cleaning protrusions 221 are formed on the surface of the cleaning component 22. Further, in a... Figure 1 In the specific embodiment shown, the contact surface between any of the first cleaning bumps 221 and the wafer is the cleaning surface, and the size of the cleaning surface of any of the first cleaning bumps 221 is 1-4 mm. 2 The distribution density of the first cleaning bumps 221 is 20-30 per cm. 2 The size of the cleaning surface of the first cleaning protrusion 221 can be 1-2 mm. 2 2-3mm 2 3-4mm 2 For example, the distribution density of the first cleaning bumps 221 can be 20-22 per cm. 2 22-24 per cm 2 24-26 per cm 2 26-28 per cm 2 28-30 per cm 2 In a situation like Figure 1 In the specific embodiment shown, the size of the cleaning surface of the first cleaning bump 221 is 2mm. 2 The quantity is 22 per cm. 2 PVA roller brushes are soft and highly elastic, with a porous surface structure. During the cleaning process, they deform slightly when pressed against the wafer, without causing scratches or physical damage to the wafer surface. They can effectively absorb cleaning fluid and, through their porous structure and shape design, adsorb or brush away tiny particles and contaminants on the wafer surface.

[0074] It should be noted that the shape and size of the first cleaning bump and / or the second cleaning bump can be arbitrarily selected, as long as they are flexible bumps that will not wear down the wafer and can remove contaminants from the wafer surface.

[0075] In a more specific embodiment, such as Figure 1As shown, the cleaning component 22 is cylindrical, and the cleaning component 22 further includes a cleaning component drive source for driving the cleaning component 22 to rotate about the central axis of the cylinder. Further, the cleaning component drive source is selected from one or more of a worm gear reducer, a gear rotary drive motor, and a cylinder rotary drive motor. In a... Figure 1 In the specific embodiment shown, the driving source for the cleaning component is a worm gear reducer. In a more specific embodiment, such as Figure 1 As shown, the axial length of the cleaning component is greater than the diameter of the wafer.

[0076] The cleaning element 22 can be positioned at any location on the support 10, as long as it can contact both the front and back sides of the wafer to form a cleaning surface. In a... Figure 1 In the specific embodiment shown, the central axis of the cleaning component 22 is parallel to the horizontal ground and is located in the same plane as a diameter of the wafer, so as to maximize contact with the wafer and improve cleaning efficiency.

[0077] In a specific embodiment, such as Figure 1 As shown, the wafer cleaning apparatus further includes an external cleaning fluid drive source and a fluid delivery pipeline. The fluid delivery pipeline is in fluid communication with the inlet of the cleaning fluid spraying element 21 and the inlet of the second cleaning assembly 30. The external cleaning fluid drive source acts on the fluid delivery pipeline. The external cleaning fluid drive source delivers cleaning fluid to the cleaning fluid spraying element 21 and the second cleaning assembly 30 through the fluid delivery pipeline, and controls the hydraulic pressure within the fluid delivery pipeline to achieve controllable wafer cleaning force.

[0078] In a specific embodiment, such as Figure 1 As shown, the wafer cleaning apparatus has an openable and closable cleaning enclosure to provide a closed cleaning environment, within which the wafer is placed. The openable and closable cleaning enclosure ensures that the entire wafer cleaning process is sealed, preventing contamination from the outside environment.

[0079] In a specific embodiment, such as Figure 1 As shown, the cleaning solution is selected from one or more of DHF cleaning solution, APM (SC-1) cleaning solution, and Clean100 hydrocarbon-based cleaning agent. In a specific embodiment, as... Figure 1 As shown, the wafer driving assembly 40 includes a wafer driving source and a motion transmission element 41 for transmitting rotational motion and supporting the wafer.

[0080] It should be noted that the wafer driving assembly 40 described in this application only needs to be able to achieve the effect of driving the wafer to rotate, and its quantity, driving source, and type of motion transmission component can be arbitrarily selected. In a specific example... Figure 1In the embodiment shown, there are three wafer driving components 40, one of which is located on the vertical line between the center of the wafer and the horizontal ground, and the other two wafer driving components are symmetrically located below the wafer with the vertical line between the center of the wafer and the horizontal ground as the axis of symmetry.

[0081] In a more specific implementation example, such as Figure 1 As shown, the wafer drive source is selected from one or more of the following: worm gear reducer, gear rotary drive motor, cylinder rotary drive motor, and direct drive motor. In a... Figure 1 In the specific embodiment shown, the wafer drive source is a worm gear reducer.

[0082] In a more specific implementation example, such as Figure 1 As shown, the motion transmission element 41 is selected from one or more of a robotic arm and a transmission roller. In a further embodiment, as... Figure 1 As shown, the motion transmission component 41 is a transmission roller. With a horizontal ground as a reference, the transmission roller is positioned below the wafer, perpendicular to the wafer surface, and supports the wafer. In a... Figure 1 In the specific embodiment shown, the transmission roller rotates counterclockwise as indicated by the movement arrow, driving and causing the wafer to rotate clockwise as indicated by the movement arrow.

[0083] In a more specific implementation example, such as Figure 1 As shown, the motion conductor 41 has a protruding section 42 extending along the center of the wafer for limiting axial wobble. The shape and size of the protruding section 42 can be arbitrarily chosen, as long as it can effectively limit the axial wobble of the wafer. In a... Figure 1 In the specific embodiment shown, the protrusions 42 are formed on both sides of the wafer, and the distance between them and the wafer approaches 0, such as 1mm, 2mm, or 3mm. In a... Figure 1 In the specific embodiment shown, the protruding segment 42 is circular.

[0084] In a like Figures 1-2 The wafer cleaning apparatus comprises the following steps in its specific operation method for cleaning wafers:

[0085] 1) Open the openable cleaning and sealing chamber and place the wafer vertically on the motion transmission component 41 of the wafer drive assembly 40 so that the protrusion 42 limits the axial movement of the wafer;

[0086] 2) Control the position of the cleaning component 22 so that its cleaning surface contacts the wafer;

[0087] 3) Simultaneously start the external cleaning fluid drive source, the cleaning component drive source and the wafer drive source, so that the nozzle 221 on the cleaning fluid spraying component 21 sprays out a fan-shaped cleaning fluid jet onto the wafer surface; the cleaning component 22 rotates along its own axis and the wafer rotates around its normal axis, which, together with the sprayed cleaning fluid, causes the first cleaning bump 221 to carry away or brush away particulate impurities on the wafer surface.

[0088] 4) After completing the initial cleaning of the wafer surface, turn off the external cleaning fluid drive source, cleaning component drive source and wafer drive source, and adjust the hinge angle between the second cleaning component 40 and the support 10 so that the cleaning head 31 of the second cleaning component 30 contacts the edge of the front and back of the wafer until the axial length of the part of the cleaning head 31 in contact with the wafer is 6cm.

[0089] 5) Start the wafer drive source, cleaning head drive source and external cleaning fluid drive source, so that the wafer rotates around its normal axis and the cleaning head 31 rotates around its own central axis. The cleaning fluid flowing out from the through hole of the cleaning head 31 causes the second cleaning bump 311 to carry away or brush away the particulate impurities on the front and / or back edges of the wafer, thus completing the cleaning of the front and / or back edges of the wafer.

[0090] This invention effectively overcomes the various shortcomings of the prior art and has high industrial application value.

[0091] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A wafer cleaning apparatus, characterized in that, The wafer cleaning apparatus includes: a support (10), on which a first cleaning component (20) for spraying and cleaning the front and / or back sides of the wafer, a second cleaning component (30) for cleaning the edges of the front and / or back sides of the wafer, and a wafer driving component (40) for supporting the wafer and driving the wafer to rotate about its normal axis are provided; the front and back sides of the wafer are perpendicular to the horizontal ground; the first cleaning component (20) includes a cleaning liquid spraying component (21) and a flexible cleaning component (22) disposed on one side of the front and / or back sides of the wafer for contacting and cleaning the wafer; the second cleaning component (30) is used to further clean the residue on the front and / or back edges of the wafer after the first cleaning component (20) has completed cleaning, and a flexible cleaning head (31) is formed at the end of the second cleaning component (30) where it contacts the edges of the front and / or back sides of the wafer.

2. The wafer cleaning apparatus according to claim 1, characterized in that: The second cleaning component (30) is movably connected to the bracket (10); And / or, the shape of the cleaning head (31) is selected from one or more of the following: cylindrical, cubic, cuboid, and elliptical. And / or, the cleaning head (31) has a plurality of through holes for discharging cleaning fluid; And / or, the cleaning head (31) includes a PVA brush head, the surface of which is formed with a plurality of second cleaning bumps (311).

3. The wafer cleaning apparatus according to claim 2, characterized in that, The second cleaning assembly (30) includes a support rod and a cleaning head (31) disposed at the end of the support rod; the support rod is movably connected to the bracket (10), and the movable connection is selected from one or more of hinge, snap-fit, and tenon-mortise connection; And / or, the cleaning head (31) is cylindrical in shape, and the central axis of the cylinder is arranged parallel to the front and back of the wafer; And / or, the distribution density of the second cleaning bumps (311) is 20-30 per cm. 2 .

4. The wafer cleaning apparatus according to claim 3, characterized in that, The second cleaning assembly (30) also includes a cleaning head drive source for driving the cleaning head (31) to rotate about its central axis; And / or, the axial length of the portion of the cleaning head (31) that contacts the wafer is 4 to 8 cm.

5. The wafer cleaning apparatus according to claim 1, characterized in that: The cleaning fluid spraying component (21) is a spray bar; The spray bar is equipped with several nozzles (211) for spraying onto the wafer surface; And / or, with a horizontal ground reference, the cleaning fluid sprayer (21) is positioned above the wafer; And / or, the cleaning component (22) is selected from one or more of a roller brush, a plate brush, and a disc brush.

6. The wafer cleaning apparatus according to claim 5, characterized in that: The nozzle (211) is selected from one or more of a fan-shaped nozzle, a conical nozzle, or a cylindrical nozzle; And / or, the cleaning element (22) is a roller brush, and a plurality of first cleaning protrusions (221) are formed on the surface of the cleaning element (22); and / or, the cleaning element (211) is cylindrical, and the cleaning element (22) further includes a cleaning element drive source for driving the cleaning element (22) to rotate about the central axis of the cylinder; And / or, the axial length of the cleaning element (22) is greater than the diameter of the wafer.

7. The wafer cleaning apparatus according to claim 6, characterized in that: The first cleaning bump (221) is a PVA brush head, and the distribution density of the first cleaning bump (221) is 20-30 bumps / cm. 2 ; And / or, the cleaning component drive source is selected from one or more of a worm gear reducer, a gear rotary drive motor, and a cylinder rotary drive motor.

8. The wafer cleaning apparatus according to claim 1, characterized in that: The wafer cleaning device also includes an external cleaning fluid drive source and a liquid delivery pipeline. The liquid delivery pipeline is in fluid communication with the inlet of the cleaning fluid spray component (21) and the inlet of the second cleaning component (30). The external cleaning fluid drive source acts on the liquid delivery pipeline. And / or, the wafer cleaning apparatus is provided with an openable and closable cleaning enclosure to provide a closed cleaning environment, wherein the wafer is disposed within the openable and closable cleaning enclosure.

9. The wafer cleaning apparatus according to claim 1, characterized in that: The wafer driving assembly (40) includes a wafer driving source and a motion transmission element (41) for transmitting rotational motion and supporting the wafer.

10. The wafer cleaning apparatus according to claim 9, characterized in that: The wafer drive source is selected from one or more of the following: worm gear reducer, gear rotary drive motor, cylinder rotary drive motor, and direct drive motor; And / or, the motion transmission element (41) is selected from one or more of the following: a robotic arm, a transmission roller; And / or, the motion conductor (41) is formed with a protrusion (42) extending along the wafer center direction for limiting the axial wobbling of the wafer.

Images