Four-channel single-laser MZI56G chip

By designing a four-channel single-laser MZI56G chip and using an ultra-low-loss end-face coupler, the high cost of optical modules in existing technologies has been solved, achieving cost reduction and performance improvement.

CN223584188UActive Publication Date: 2025-11-21YUNNAN DETONG TECH CO LTD
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Patent Information

Application Number
CN202423216286.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-25
Publication Date
2025-11-21
Estimated Expiration
2034-12-25

AI Technical Summary

Technical Problem

Existing 4x100G and above optical modules use four separate DFB or EML lasers, resulting in high application and packaging costs.

Method used

Employing the four-channel single-laser MZI56G chip, including components such as optical input ports, beam splitters, and MZI optoelectronic modulators, and using an ultra-low-loss end-face coupler design, it supports four modulation signals with a single external light source.

Benefits of technology

This reduces the application and packaging costs of optical modules while improving their performance.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of silicon light modulation chips, and particularly discloses a four-channel single-laser MZI56G chip. Comprising a light input port, a first light output port, a second light output port, a third light output port, a fourth light output port, a first optical splitter, a second optical splitter, a third optical splitter, a fourth optical splitter, a first MZI photoelectric modulator, a second MZI photoelectric modulator, a third MZI photoelectric modulator, a fourth MZI photoelectric modulator, a fifth optical splitter, a sixth optical splitter and a seventh optical splitter. According to the technical scheme, the optical module comprises a first optical splitter, a second optical splitter, an eighth optical splitter, a first photodiode, a second photodiode, a third photodiode, a fourth photodiode and a fifth photodiode, so that the problems that in the prior art, four independent DFB or EML lasers are generally used in an optical module above 4 * 100 G, and the application cost and the packaging cost are high in the scheme are solved.
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Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of silicon optical modulation chips, in particular to a four-channel single-laser MZI56G chip. BACKGROUND

[0002] The existing 4x100G and above optical modules generally use four separate DFB or EML lasers, and this scheme has the problems of high application cost and high packaging cost. SUMMARY

[0003] The present application aims to provide a four-channel single-laser MZI56G chip to solve the problem that the existing 4x100G and above optical modules generally use four separate DFB or EML lasers, and this scheme has the problems of high application cost and high packaging cost.

[0004] To achieve the above-mentioned purpose, the embodiments of the present application provide a four-channel single-laser MZI56G chip, which comprises an optical input port, a first optical output port, a second optical output port, a third optical output port, a fourth optical output port, a first optical splitter, a second optical splitter, a third optical splitter, a fourth optical splitter, a first MZI optoelectronic modulator, a second MZI optoelectronic modulator, a third MZI optoelectronic modulator, a fourth MZI optoelectronic modulator, a fifth optical splitter, a sixth optical splitter, a seventh optical splitter, an eighth optical splitter, a first photodiode, a second photodiode, a third photodiode, a fourth photodiode, and a fifth photodiode, wherein

[0005] The optical input port is connected with the optical input end of the first optical splitter, the first optical output end of the first optical splitter is connected with the optical input end of the first photodiode, and the second optical output end of the first optical splitter is connected with the optical input end of the second optical splitter;

[0006] The first optical output end of the second optical splitter is connected with the optical input end of the third optical splitter, and the second optical output end of the second optical splitter is connected with the optical input end of the fourth optical splitter;

[0007] The first optical output end of the third optical splitter is connected with the optical input end of the first MZI optoelectronic modulator, and the second optical output end of the third optical splitter is connected with the optical input end of the second MZI optoelectronic modulator;

[0008] The first optical output end of the fourth optical splitter is connected with the optical input end of the third MZI optoelectronic modulator, and the second optical output end of the fourth optical splitter is connected with the optical input end of the fourth MZI optoelectronic modulator;

[0009] The optical output end of the first MZI photoelectric modulator is connected with the optical input end of the fifth optical splitter, the first optical output end of the fifth optical splitter is connected with the optical input end of the second photoelectric diode, and the second optical output end of the fifth optical splitter is connected with the first optical output port;

[0010] The optical output end of the second MZI photoelectric modulator is connected with the optical input end of the sixth optical splitter, the first optical output end of the sixth optical splitter is connected with the optical input end of the third photoelectric diode, and the second optical output end of the sixth optical splitter is connected with the second optical output port;

[0011] The optical output end of the third MZI photoelectric modulator is connected with the optical input end of the seventh optical splitter, the first optical output end of the seventh optical splitter is connected with the optical input end of the fourth photoelectric diode, and the second optical output end of the seventh optical splitter is connected with the third optical output port;

[0012] The optical output end of the fourth MZI photoelectric modulator is connected with the optical input end of the eighth optical splitter, the first optical output end of the eighth optical splitter is connected with the optical input end of the fifth photoelectric diode, and the second optical output end of the eighth optical splitter is connected with the fourth optical output port;

[0013] The first optical splitter is a 5% to 95% one-to-two optical power splitting device, wherein the first optical output end of the first optical splitter outputs 5% of the input optical wave energy, and the second optical output end of the first optical splitter outputs 95% of the input optical wave energy.

[0014] The second optical splitter, the third optical splitter and the fourth optical splitter are 50% to 50% one-to-two optical power splitting devices, wherein the first optical output end and the second optical output end of the second optical splitter, the third optical splitter and the fourth optical splitter respectively output 50% of the input optical wave energy.

[0015] Optionally, the optical input port, the first optical output port, the second optical output port, the third optical output port and the fourth optical output port are all edge couplers arranged on a chip.

[0016] Optionally, the two electrical modulation signal input ends of the first MZI photoelectric modulator are respectively connected with a radio frequency port RF1P and a radio frequency port RF1N arranged on the chip, the two electrical modulation signal input ends of the second MZI photoelectric modulator are respectively connected with a radio frequency port RF2P and a radio frequency port RF2N arranged on the chip, the two electrical modulation signal input ends of the third MZI photoelectric modulator are respectively connected with a radio frequency port RF3P and a radio frequency port RF3N arranged on the chip, and the two electrical modulation signal input ends of the fourth MZI photoelectric modulator are respectively connected with a radio frequency port RF4P and a radio frequency port RF4N arranged on the chip.

[0017] Optionally, the two voltage terminals of the first MZI optoelectronic modulator are connected to the VPN1 terminal and the VDD1 terminal provided on the chip respectively, the two voltage terminals of the second MZI optoelectric modulator are connected to the VPN2 terminal and the VDD2 terminal provided on the chip respectively, the two voltage terminals of the third MZI optoelectric modulator are connected to the VPN3 terminal and the VDD3 terminal provided on the chip respectively, and the two voltage terminals of the fourth MZI optoelectric modulator are connected to the VPN4 terminal and the VDD4 terminal provided on the chip respectively.

[0018] Optionally, the fifth splitter, the sixth splitter, the seventh splitter and the eighth splitter are 5% to 95% one-to-two optical power splitting devices, wherein the first optical output terminal of the fifth splitter, the sixth splitter, the seventh splitter and the eighth splitter outputs 5% of the input optical wave energy and inputs into the light input terminal of the second photodiode, the third photodiode, the fourth photodiode and the fifth photodiode respectively, and the second optical output terminal of the fifth splitter, the sixth splitter, the seventh splitter and the eighth splitter outputs 95% of the input optical wave energy and inputs into the first optical output port, the second optical output port, the third optical output port and the fourth optical output port respectively.

[0019] Optionally, the two electrical output terminals of the first photodiode are connected to the IPD1+ terminal and the IPD1- terminal provided on the chip respectively.

[0020] The two electrical output terminals of the second photodiode are connected to the OPD1+ terminal and the OPD1- terminal provided on the chip respectively, the two electrical output terminals of the third photodiode are connected to the OPD2+ terminal and the OPD2- terminal provided on the chip respectively, the two electrical output terminals of the fourth photodiode are connected to the OPD3+ terminal and the OPD3- terminal provided on the chip respectively, and the two electrical output terminals of the fifth photodiode are connected to the OPD4+ terminal and the OPD4- terminal provided on the chip respectively.

[0021] The embodiments of the present application have the following advantages:

[0022] Compared with the prior art, the above technical solution provides a 4x56G baud rate silicon optical modulation chip based on MZI technology, which includes four-channel high-bandwidth MZI optoelectric modulators and corresponding monitoring optical power photodiodes, and uses an ultra-low-loss end face coupler design, so that a single external light source can be used to support four modulation signals, thereby reducing the application cost and packaging cost of the optical module. BRIEF DESCRIPTION OF DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the accompanying drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced. Obviously, the accompanying drawings in the following description are only exemplary, and for those skilled in the art, other drawings can be obtained from the provided drawings without creative labor.

[0024] Figure 1 A circuit structure block diagram of a four-channel single-laser MZI 56G chip provided for at least one embodiment of the present application. DETAILED DESCRIPTION

[0025] The embodiments of the present application are described below by specific specific embodiments, and those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in the specification. Obviously, the described embodiments are part of the embodiments of the present application, not all. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0026] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third" are only for the purpose of description, and cannot be understood as indicating or implying relative importance. Unless otherwise specified and limited, the terms "set", "mount", "connected", "connected" should be interpreted broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the communication between two elements inside. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0027] In addition, the technical features involved in different embodiments of the present application described below can be combined with each other as long as there is no conflict between them.

[0028] The embodiments of the present application provide a four-channel single-laser MZI 56G chip, referring to Figure 1 , comprising:

[0029] the optical input port, the first optical output port, the second optical output port, the third optical output port, the fourth optical output port, the first optical splitter, the second optical splitter, the third optical splitter, the fourth optical splitter, the first MZI electro-optical modulator, the second MZI electro-optical modulator, the third MZI electro-optical modulator, the fourth MZI electro-optical modulator, the fifth optical splitter, the sixth optical splitter, the seventh optical splitter, the eighth optical splitter, the first photodiode, the second photodiode, the third photodiode, the fourth photodiode, the fifth photodiode, wherein

[0030] the optical input port is connected to an optical input of the first optical splitter, a first optical output of the first optical splitter is connected to an optical input of the first photodiode, and a second optical output of the first optical splitter is connected to an optical input of the second optical splitter;

[0031] a first optical output of the second optical splitter is connected to an optical input of the third optical splitter, and a second optical output of the second optical splitter is connected to an optical input of the fourth optical splitter;

[0032] a first optical output of the third optical splitter is connected to an optical input of the first MZI electro-optical modulator, and a second optical output of the third optical splitter is connected to an optical input of the second MZI electro-optical modulator;

[0033] a first optical output of the fourth optical splitter is connected to an optical input of the third MZI electro-optical modulator, and a second optical output of the fourth optical splitter is connected to an optical input of the fourth MZI electro-optical modulator;

[0034] an optical output of the first MZI electro-optical modulator is connected to an optical input of the fifth optical splitter, a first optical output of the fifth optical splitter is connected to an optical input of the second photodiode, and a second optical output of the fifth optical splitter is connected to the first optical output port;

[0035] an optical output of the second MZI electro-optical modulator is connected to an optical input of the sixth optical splitter, a first optical output of the sixth optical splitter is connected to an optical input of the third photodiode, and a second optical output of the sixth optical splitter is connected to the second optical output port;

[0036] an optical output of the third MZI electro-optical modulator is connected to an optical input of the seventh optical splitter, a first optical output of the seventh optical splitter is connected to an optical input of the fourth photodiode, and a second optical output of the seventh optical splitter is connected to the third optical output port;

[0037] The optical output terminal of the fourth MZI opto-modulator is connected to the optical input terminal of the eighth beam splitter, the first optical output terminal of the eighth beam splitter is connected to the optical input terminal of the fifth photodiode, and the second optical output terminal of the eighth beam splitter is connected to the fourth optical output port.

[0038] The first beam splitter is a 5% to 95% one-to-two optical power beam splitter, wherein the first optical output terminal of the first beam splitter outputs 5% of the input optical wave energy, and the second optical output terminal of the first beam splitter outputs 95% of the input optical wave energy.

[0039] The second, third, and fourth beam splitters are 50% to 50% one-to-two optical power splitting devices, wherein the first and second optical output terminals of the second, third, and fourth beam splitters each output 50% of the input optical wave energy.

[0040] Specifically, the first beam splitter is a 5% to 95% one-to-two optical power beam splitter, wherein the first optical output terminal of the first beam splitter outputs 5% of the input optical wave energy and inputs it to the first photodiode for optical power monitoring, and the second optical output terminal of the first beam splitter outputs 95% of the input optical wave energy and inputs it to the second beam splitter.

[0041] In some embodiments, the optical input port, the first optical output port, the second optical output port, the third optical output port, and the fourth optical output port are all edge couplers disposed on the chip.

[0042] Specifically, the optical input port provides two edge couplers for the input of the local oscillator, which are respectively input to the first optical splitter. The first, second, third, and fourth optical output ports provide four edge couplers for the eight-channel output.

[0043] Specifically, in Figure 1 In this configuration, the optical input port is I1, the first optical output port is O1, the second optical output port is O2, the third optical output port is O3, the fourth optical output port is O4, the first beam splitter is BSI1, the second beam splitter is BS1, the third beam splitter is BS2, the fourth beam splitter is BS3, the first photodiode is MPDI1, the second photodiode is MPD10, the third photodiode is MPD20, the fourth photodiode is MPD30, the fifth photodiode is MPD40, the fifth beam splitter is BSO1, the sixth beam splitter is BSO2, the seventh beam splitter is BSO3, and the eighth beam splitter is BSO4.

[0044] Specifically, the first photodiode is used for monitoring the optical power of the input channel.

[0045] Specifically, the second photodiode, the third photodiode, the fourth photodiode, and the fifth photodiode are used for light power monitoring of four output channels.

[0046] In some embodiments, the two electrical modulation signal input ends of the first MZI optoelectronic modulator are respectively connected to the radio frequency port RF1P and the radio frequency port RF1N arranged on the chip, the two electrical modulation signal input ends of the second MZI optoelectronic modulator are respectively connected to the radio frequency port RF2P and the radio frequency port RF2N arranged on the chip, the two electrical modulation signal input ends of the third MZI optoelectronic modulator are respectively connected to the radio frequency port RF3P and the radio frequency port RF3N arranged on the chip, and the two electrical modulation signal input ends of the fourth MZI optoelectronic modulator are respectively connected to the radio frequency port RF4P and the radio frequency port RF4N arranged on the chip.

[0047] Specifically, the first MZI optoelectronic modulator, the second MZI optoelectronic modulator, the third MZI optoelectronic modulator, and the fourth MZI optoelectronic modulator are respectively MZI modulator1-4 (MZI modulator: MZI optoelectronic modulator, i.e., Mach-Zehnder interferometric modulator) in Figure 1

[0048] In some embodiments, the two voltage ends of the first MZI optoelectronic modulator are respectively connected to the VPN1 end and the VDD1 end arranged on the chip, the two voltage ends of the second MZI optoelectronic modulator are respectively connected to the VPN2 end and the VDD2 end arranged on the chip, the two voltage ends of the third MZI optoelectronic modulator are respectively connected to the VPN3 end and the VDD3 end arranged on the chip, and the two voltage ends of the fourth MZI optoelectronic modulator are respectively connected to the VPN4 end and the VDD4 end arranged on the chip.

[0049] Specifically, VDD is an external input direct current voltage input to the direct current bias end of the Mach-Zehnder interferometric modulator, and VPN is an external input direct current voltage input to the PN junction of the high-frequency part of the Mach-Zehnder interferometric modulator.

[0050] ​In some embodiments, the fifth optical splitter, the sixth optical splitter, the seventh optical splitter and the eighth optical splitter are 5% to 95% one-to-two optical power splitting devices, wherein the first optical output end of the fifth optical splitter, the sixth optical splitter, the seventh optical splitter and the eighth optical splitter outputs 5% of the input optical wave energy and inputs into the light input end of the second photodiode, the third photodiode, the fourth photodiode and the fifth photodiode respectively, and the second optical output end of the fifth optical splitter, the sixth optical splitter, the seventh optical splitter and the eighth optical splitter outputs 95% of the input optical wave energy and inputs into the first optical output port, the second optical output port, the third optical output port and the fourth optical output port respectively.

[0051] In some embodiments, the two electrical output ends of the first photodiode are connected to the IPD1+ end and the IPD1- end respectively arranged on the chip.

[0052] The two electrical output ends of the second photodiode are connected to the OPD1+ end and the OPD1- end respectively arranged on the chip, the two electrical output ends of the third photodiode are connected to the OPD2+ end and the OPD2- end respectively arranged on the chip, the two electrical output ends of the fourth photodiode are connected to the OPD3+ end and the OPD3- end respectively arranged on the chip, and the two electrical output ends of the fifth photodiode are connected to the OPD4+ end and the OPD4- end respectively arranged on the chip.

[0053] In summary, compared with the prior art, the 4x56G baud rate silicon optical modulation chip based on MZI technology provided by the present application includes a four-channel high-bandwidth MZI optical-electric modulator and a corresponding monitoring optical power photodiode, and an end face coupler design with ultra-low loss is adopted, so that a single external light source can be used to support four modulation signals, and the application cost and packaging cost of the optical module are reduced.

[0054] Note that all features disclosed in the specification, including any accompanying claims, abstract, and drawings, can be replaced by alternative features serving the same, equivalent or similar purpose, unless expressly stated otherwise. Therefore, each disclosed feature is only one example of a group of equivalent or similar features, unless expressly stated otherwise. Further, more preferably, even more preferably, and most preferably are simple beginnings of another embodiment described on the basis of the preceding embodiment, the content of the further, more preferably, even more preferably, or most preferably trailing the preceding embodiment is combined with the preceding embodiment as a complete configuration of another embodiment. The combination of several further, more preferably, even more preferably, or most preferably settings trailing the same embodiment can form another embodiment.

[0055] In the implementation of the functions and steps, the corresponding functions and steps in various embodiments can also occur in a different order than shown. For example, two consecutive functions and steps can actually be performed or implemented substantially in parallel, or they can sometimes be performed or implemented in reverse order, depending on the functions involved.

[0056] Although the present application has been described in detail with general description and specific embodiments above, some modifications or improvements can be made on the basis of the present application, which is obvious to those skilled in the art. Therefore, these modifications or improvements made on the basis of not deviating from the spirit of the present application, all belong to the scope of the present application claimed.

Claims

1. A four-channel single-laser MZI 56G chip, characterized by, Comprising: a light input port, a first light output port, a second light output port, a third light output port, a fourth light output port, a first optical splitter, a second optical splitter, a third optical splitter, a fourth optical splitter, a first MZI electro-optical modulator, a second MZI electro-optical modulator, a third MZI electro-optical modulator, a fourth MZI electro-optical modulator, a fifth optical splitter, a sixth optical splitter, a seventh optical splitter, an eighth optical splitter, a first photodiode, a second photodiode, a third photodiode, a fourth photodiode, a fifth photodiode, wherein the light input port is connected to the light input end of the first optical splitter, the first light output end of the first optical splitter is connected to the light input end of the first photodiode, and the second light output end of the first optical splitter is connected to the light input end of the second optical splitter; the first light output end of the second optical splitter is connected to the light input end of the third optical splitter, and the second light output end of the second optical splitter is connected to the light input end of the fourth optical splitter; the first light output end of the third optical splitter is connected to the light input end of the first MZI electro-optical modulator, and the second light output end of the third optical splitter is connected to the light input end of the second MZI electro-optical modulator; the first light output end of the fourth optical splitter is connected to the light input end of the third MZI electro-optical modulator, and the second light output end of the fourth optical splitter is connected to the light input end of the fourth MZI electro-optical modulator; the light output end of the first MZI electro-optical modulator is connected to the light input end of the fifth optical splitter, the first light output end of the fifth optical splitter is connected to the light input end of the second photodiode, and the second light output end of the fifth optical splitter is connected to the first light output port; the light output end of the second MZI electro-optical modulator is connected to the light input end of the sixth optical splitter, the first light output end of the sixth optical splitter is connected to the light input end of the third photodiode, and the second light output end of the sixth optical splitter is connected to the second light output port; the light output end of the third MZI electro-optical modulator is connected to the light input end of the seventh optical splitter, the first light output end of the seventh optical splitter is connected to the light input end of the fourth photodiode, and the second light output end of the seventh optical splitter is connected to the third light output port; the light output end of the fourth MZI electro-optical modulator is connected to the light input end of the eighth optical splitter, the first light output end of the eighth optical splitter is connected to the light input end of the fifth photodiode, and the second light output end of the eighth optical splitter is connected to the fourth light output port; the first optical splitter is a 5% to 95% one-to-two optical power splitting device, wherein the first light output end of the first optical splitter outputs 5% of the input light wave energy, and the second light output end of the first optical splitter outputs 95% of the input light wave energy; the second optical splitter, the third optical splitter, and the fourth optical splitter are 50% to 50% one-to-two optical power splitting devices, wherein the first light output end and the second light output end of the second optical splitter, the third optical splitter, and the fourth optical splitter respectively output 50% of the input light wave energy.

2. The four-channel single-laser MZI 56G chip according to claim 1, wherein the optical input port, the first optical output port, the second optical output port, the third optical output port and the fourth optical output port are edge couplers provided on the chip.

3. The four-channel single-laser MZI 56G chip according to claim 1, wherein the two electrical modulation signal input ends of the first MZI electro-optical modulator are respectively connected to a radio frequency port RF1P and a radio frequency port RF1N provided on the chip, the two electrical modulation signal input ends of the second MZI electro-optical modulator are respectively connected to a radio frequency port RF2P and a radio frequency port RF2N provided on the chip, the two electrical modulation signal input ends of the third MZI electro-optical modulator are respectively connected to a radio frequency port RF3P and a radio frequency port RF3N provided on the chip, and the two electrical modulation signal input ends of the fourth MZI electro-optical modulator are respectively connected to a radio frequency port RF4P and a radio frequency port RF4N provided on the chip.

4. The four-channel single-laser MZI 56G chip according to claim 1, wherein the two voltage ends of the first MZI electro-optical modulator are respectively connected to a VPN1 end and a VDD1 end provided on the chip, the two voltage ends of the second MZI electro-optical modulator are respectively connected to a VPN2 end and a VDD2 end provided on the chip, the two voltage ends of the third MZI electro-optical modulator are respectively connected to a VPN3 end and a VDD3 end provided on the chip, and the two voltage ends of the fourth MZI electro-optical modulator are respectively connected to a VPN4 end and a VDD4 end provided on the chip.

5. The four-channel single-laser MZI 56G chip according to claim 1, wherein the fifth splitter, the sixth splitter, the seventh splitter and the eighth splitter are 5% to 95% one-to-two optical power splitting devices, wherein the first optical output end of the fifth splitter, the sixth splitter, the seventh splitter and the eighth splitter outputs 5% of the input optical wave energy and inputs into the light input end of the second photodiode, the third photodiode, the fourth photodiode and the fifth photodiode respectively, and the second optical output end of the fifth splitter, the sixth splitter, the seventh splitter and the eighth splitter outputs 95% of the input optical wave energy and inputs into the first optical output port, the second optical output port, the third optical output port and the fourth optical output port respectively.

6. The four-channel single-laser MZI 56G chip according to claim 1, wherein the two electrical output ends of the first photodiode are respectively connected to an IPD1+ end and an IPD1- end provided on the chip. ​ ​ ​ ​ ​ Two electrical output ends of the second photodiode are connected with OPD1+ and OPD1- set on the chip respectively, two electrical output ends of the third photodiode are connected with OPD2+ and OPD2- set on the chip respectively, two electrical output ends of the fourth photodiode are connected with OPD3+ and OPD3- set on the chip respectively, and two electrical output ends of the fifth photodiode are connected with OPD4+ and OPD4- set on the chip respectively.