Four-channel single-laser micro-ring 56G chip

Abstract

The utility model relates to the technical field of silicon light modulation chips, and particularly discloses a four-channel single-laser micro-ring 56G chip. Comprising a light input port, a first light output port, a second light output port, a third light output port, a fourth light output port, a first optical splitter, a second optical splitter, a third optical splitter, a fourth optical splitter, a first micro-ring modulator, a second micro-ring modulator, a third micro-ring modulator, a fourth micro-ring modulator, a fifth optical splitter, a sixth optical splitter and a seventh optical splitter. According to the technical scheme, the optical module comprises a first optical splitter, a second optical splitter, an eighth optical splitter, a first photodiode, a second photodiode, a third photodiode, a fourth photodiode and a fifth photodiode, so that the problems that in the prior art, four independent DFB or EML lasers are generally used in an optical module above 4 * 100 G, and the application cost and the packaging cost are high in the scheme are solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of silicon optical modulation chips, in particular to a four-channel single-laser micro-ring 56G chip. BACKGROUND

[0002] The existing 4x100G or above optical modules generally use four separate DFB or EML lasers, and this scheme has the problems of high application cost and high packaging cost. SUMMARY

[0003] The purpose of the present application is to provide a four-channel single-laser micro-ring 56G chip to solve the problem that the existing 4x100G or above optical modules generally use four separate DFB or EML lasers, and this scheme has the problems of high application cost and high packaging cost.

[0004] To achieve the above-mentioned purpose, the embodiments of the present application provide a four-channel single-laser micro-ring 56G chip, which comprises an optical input port, a first optical output port, a second optical output port, a third optical output port, a fourth optical output port, a first optical splitter, a second optical splitter, a third optical splitter, a fourth optical splitter, a first micro-ring modulator, a second micro-ring modulator, a third micro-ring modulator, a fourth micro-ring modulator, a fifth optical splitter, a sixth optical splitter, a seventh optical splitter, an eighth optical splitter, a first photodiode, a second photodiode, a third photodiode, a fourth photodiode, and a fifth photodiode, wherein

[0005] The optical input port is connected with the optical input end of the first optical splitter, the first optical output end of the first optical splitter is connected with the optical input end of the first photodiode, and the second optical output end of the first optical splitter is connected with the optical input end of the second optical splitter;

[0006] The first optical output end of the second optical splitter is connected with the optical input end of the third optical splitter, and the second optical output end of the second optical splitter is connected with the optical input end of the fourth optical splitter;

[0007] The first optical output end of the third optical splitter is connected with the optical input end of the first micro-ring modulator, and the second optical output end of the third optical splitter is connected with the optical input end of the second micro-ring modulator;

[0008] The first optical output end of the fourth optical splitter is connected with the optical input end of the third micro-ring modulator, and the second optical output end of the fourth optical splitter is connected with the optical input end of the fourth micro-ring modulator;

[0009] The optical output end of the first micro-ring modulator is connected with the optical input end of the fifth optical splitter, the first optical output end of the fifth optical splitter is connected with the optical input end of the second photodiode, and the second optical output end of the fifth optical splitter is connected with the first optical output port.

[0010] The light output end of the second micro-ring modulator is connected with the light input end of the sixth optical splitter, the first light output end of the sixth optical splitter is connected with the light input end of the third photodiode, and the second light output end of the sixth optical splitter is connected with the second light output port;

[0011] The light output end of the third micro-ring modulator is connected with the light input end of the seventh optical splitter, the first light output end of the seventh optical splitter is connected with the light input end of the fourth photodiode, and the second light output end of the seventh optical splitter is connected with the third light output port;

[0012] The light output end of the fourth micro-ring modulator is connected with the light input end of the eighth optical splitter, the first light output end of the eighth optical splitter is connected with the light input end of the fifth photodiode, and the second light output end of the eighth optical splitter is connected with the fourth light output port;

[0013] The first optical splitter is a 5% to 95% one-to-two optical power splitting device, wherein the first light output end of the first optical splitter outputs 5% of the input light wave energy, and the second light output end of the first optical splitter outputs 95% of the input light wave energy;

[0014] The second optical splitter, the third optical splitter, and the fourth optical splitter are 50% to 50% one-to-two optical power splitting devices, wherein the first light output end and the second light output end of the second optical splitter, the third optical splitter, and the fourth optical splitter respectively output 50% of the input light wave energy.

[0015] Optionally, the light input port, the first light output port, the second light output port, the third light output port, and the fourth light output port are all edge couplers arranged on a chip.

[0016] Optionally, the bias voltage end of the first micro-ring modulator is connected with the BIAS1+ end and the BIAS1- end arranged on the chip respectively, the bias voltage end of the second micro-ring modulator is connected with the BIAS2+ end and the BIAS2- end arranged on the chip respectively, the bias voltage end of the third micro-ring modulator is connected with the BIAS3+ end and the BIAS3- end arranged on the chip respectively, and the bias voltage end of the fourth micro-ring modulator is connected with the BIAS4+ end and the BIAS4- end arranged on the chip respectively.

[0017] Optionally, the two electrical modulation signal input ends of the first micro-ring modulator are connected to the RF1P and RF1N ports provided on the chip, the two electrical modulation signal input ends of the second micro-ring modulator are connected to the RF2P and RF2N ports provided on the chip, the two electrical modulation signal input ends of the third micro-ring modulator are connected to the RF3P and RF3N ports provided on the chip, and the two electrical modulation signal input ends of the fourth micro-ring modulator are connected to the RF4P and RF4N ports provided on the chip.

[0018] Optionally, the two voltage ends of the first micro-ring modulator are connected to the VPN1 and VDD1 ports provided on the chip, the two voltage ends of the second micro-ring modulator are connected to the VPN2 and VDD2 ports provided on the chip, the two voltage ends of the third micro-ring modulator are connected to the VPN3 and VDD3 ports provided on the chip, and the two voltage ends of the fourth micro-ring modulator are connected to the VPN4 and VDD4 ports provided on the chip.

[0019] Optionally, the fifth, sixth, seventh, and eighth optical splitters are 5%-95% 1-to-2 optical power splitting devices, wherein the first optical output ends of the fifth, sixth, seventh, and eighth optical splitters output 5% of the input optical wave energy and input into the light input ends of the second, third, fourth, and fifth photodiodes, respectively, and the second optical output ends of the fifth, sixth, seventh, and eighth optical splitters output 95% of the input optical wave energy and input into the first, second, third, and fourth optical output ports, respectively.

[0020] Optionally, the two electrical output ends of the first photodiode are connected to the IPD1+ and IPD1- ports provided on the chip, respectively.

[0021] The two electrical output ends of the second photodiode are connected to the OPD1+ and OPD1- ports provided on the chip, respectively, the two electrical output ends of the third photodiode are connected to the OPD2+ and OPD2- ports provided on the chip, respectively, the two electrical output ends of the fourth photodiode are connected to the OPD3+ and OPD3- ports provided on the chip, respectively, and the two electrical output ends of the fifth photodiode are connected to the OPD4+ and OPD4- ports provided on the chip, respectively.

[0022] The embodiments of the present application have the following advantages:

[0023] Compared with existing technologies, the 4x56G baud rate silicon photonic modulation chip based on micro-ring modulation technology provided by the above technical solution includes a four-channel high-bandwidth micro-ring modulator and a corresponding monitoring optical power photodiode. At the same time, it adopts an ultra-low loss end-face coupler design, which can support four modulation signals simultaneously using a single external light source. Thus, it can achieve a more integrated solution by using a smaller-sized micro-ring modulator, replacing the single-channel laser solution and reducing the application cost of optical modules. Attached Figure Description

[0024] To more clearly illustrate the embodiments of this application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are merely exemplary, and those skilled in the art can derive other embodiments based on the provided drawings without creative effort.

[0025] Figure 1 A circuit structure block diagram of a four-channel single-laser microring 56G chip provided for at least one embodiment of this application. Detailed Implementation

[0026] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0027] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Unless otherwise expressly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal communication of two elements. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0028] In addition, the technical features involved in the different embodiments of the present application described below can be combined with each other as long as there is no conflict.

[0029] The embodiment of the present application provides a four-channel single-laser micro-ring 56G chip, referring to Figure 1 , comprising:

[0030] an optical input port, a first optical output port, a second optical output port, a third optical output port, a fourth optical output port, a first optical splitter, a second optical splitter, a third optical splitter, a fourth optical splitter, a first micro-ring modulator, a second micro-ring modulator, a third micro-ring modulator, a fourth micro-ring modulator, a fifth optical splitter, a sixth optical splitter, a seventh optical splitter, an eighth optical splitter, a first photodiode, a second photodiode, a third photodiode, a fourth photodiode, and a fifth photodiode, wherein

[0031] the optical input port is connected with an optical input end of the first optical splitter, a first optical output end of the first optical splitter is connected with an optical input end of the first photodiode, and a second optical output end of the first optical splitter is connected with an optical input end of the second optical splitter;

[0032] a first optical output end of the second optical splitter is connected with an optical input end of the third optical splitter, and a second optical output end of the second optical splitter is connected with an optical input end of the fourth optical splitter;

[0033] a first optical output end of the third optical splitter is connected with an optical input end of the first micro-ring modulator, and a second optical output end of the third optical splitter is connected with an optical input end of the second micro-ring modulator;

[0034] a first optical output end of the fourth optical splitter is connected with an optical input end of the third micro-ring modulator, and a second optical output end of the fourth optical splitter is connected with an optical input end of the fourth micro-ring modulator;

[0035] an optical output end of the first micro-ring modulator is connected with an optical input end of the fifth optical splitter, a first optical output end of the fifth optical splitter is connected with an optical input end of the second photodiode, and a second optical output end of the fifth optical splitter is connected with the first optical output port;

[0036] an optical output end of the second micro-ring modulator is connected with an optical input end of the sixth optical splitter, a first optical output end of the sixth optical splitter is connected with an optical input end of the third photodiode, and a second optical output end of the sixth optical splitter is connected with the second optical output port;

[0037] The optical output end of the third micro-ring modulator is connected with the optical input end of the seventh optical splitter, the first optical output end of the seventh optical splitter is connected with the optical input end of the fourth photoelectric diode, and the second optical output end of the seventh optical splitter is connected with the third optical output port;

[0038] The optical output end of the fourth micro-ring modulator is connected with the optical input end of the eighth optical splitter, the first optical output end of the eighth optical splitter is connected with the optical input end of the fifth photoelectric diode, and the second optical output end of the eighth optical splitter is connected with the fourth optical output port;

[0039] The first optical splitter is a 5% to 95% one-to-two optical power splitting device, wherein the first optical output end of the first optical splitter outputs 5% of the input optical wave energy, and the second optical output end of the first optical splitter outputs 95% of the input optical wave energy.

[0040] The second optical splitter, the third optical splitter and the fourth optical splitter are 50% to 50% one-to-two optical power splitting devices, wherein the first optical output end and the second optical output end of the second optical splitter, the third optical splitter and the fourth optical splitter respectively output 50% of the input optical wave energy.

[0041] Specifically, the first optical splitter is a 5% to 95% one-to-two optical power splitting device, wherein the first optical output end of the first optical splitter outputs 5% of the input optical wave energy and inputs into the optical power monitoring first photoelectric diode, and the second optical output end of the first optical splitter outputs 95% of the input optical wave energy and inputs into the second optical splitter.

[0042] In some embodiments, the optical input port, the first optical output port, the second optical output port, the third optical output port and the fourth optical output port are all edge couplers arranged on a chip.

[0043] Specifically, the optical input port provides two edge couplers for the input of a local oscillator, which are respectively input into the first optical splitter. The first optical output port, the second optical output port, the third optical output port and the fourth optical output port provide four edge couplers for eight-channel output.

[0044] Specifically, in the first optical splitter, the second optical splitter, the third optical splitter and the fourth optical splitter, Figure 1In the specific embodiment, the light input port is I1, the first light output port is O1, the second light output port is O2, the third light output port is O3, the fourth light output port is O4, the first optical splitter is BSI1, the second optical splitter is BS1, the third optical splitter is BS2, the fourth optical splitter is BS3, the first photodiode is MPDI1, the second photodiode is MPD1O, the third photodiode is MPD2O, the fourth photodiode is MPD3O, the fifth photodiode is MPD4O, the fifth optical splitter is BSO1, the sixth optical splitter is BSO2, the seventh optical splitter is BSO3, and the eighth optical splitter is BSO4.

[0045] Specifically, the first photodiode is used for optical power monitoring of the input channel.

[0046] Specifically, the second photodiode, the third photodiode, the fourth photodiode, and the fifth photodiode are used for optical power monitoring of the four output channels.

[0047] In some embodiments, the bias voltage terminals of the first micro-ring modulator are respectively connected to the BIAS1+ terminal and the BIAS1- terminal provided on the chip, the bias voltage terminals of the second micro-ring modulator are respectively connected to the BIAS2+ terminal and the BIAS2- terminal provided on the chip, the bias voltage terminals of the third micro-ring modulator are respectively connected to the BIAS3+ terminal and the BIAS3- terminal provided on the chip, and the bias voltage terminals of the fourth micro-ring modulator are respectively connected to the BIAS4+ terminal and the BIAS4- terminal provided on the chip.

[0048] In some embodiments, the two electrical modulation signal input terminals of the first micro-ring modulator are respectively connected to the RF1P and RF1N radio frequency ports provided on the chip, the two electrical modulation signal input terminals of the second micro-ring modulator are respectively connected to the RF2P and RF2N radio frequency ports provided on the chip, the two electrical modulation signal input terminals of the third micro-ring modulator are respectively connected to the RF3P and RF3N radio frequency ports provided on the chip, and the two electrical modulation signal input terminals of the fourth micro-ring modulator are respectively connected to the RF4P and RF4N radio frequency ports provided on the chip.

[0049] Specifically, the first micro-ring modulator, the second micro-ring modulator, the third micro-ring modulator, and the fourth micro-ring modulator are respectively Figure 1 Micro-Ring Modulator1-4 (Micro-Ring Modulator: micro-ring modulator) in the specific embodiment, a single micro-ring modulator modulates the differential radio frequency electrical signal input from the radio frequency port (RF1P / RF1N-RF4P / RF4N) to the output end optical signal wavelength of the third optical splitter and the fourth optical splitter by intensity modulation. The radio frequency input provides four pairs of radio frequency driving signal pads for the four-channel modulator, which works in differential mode (P / N).

[0050] In some embodiments, the two voltage terminals of the first micro-ring modulator are respectively connected to the VPN1 terminal and the VDD1 terminal arranged on the chip, the two voltage terminals of the second micro-ring modulator are respectively connected to the VPN2 terminal and the VDD2 terminal arranged on the chip, the two voltage terminals of the third micro-ring modulator are respectively connected to the VPN3 terminal and the VDD3 terminal arranged on the chip, and the two voltage terminals of the fourth micro-ring modulator are respectively connected to the VPN4 terminal and the VDD4 terminal arranged on the chip.

[0051] Specifically, VDD is an external input DC voltage input to the DC bias terminal of the micro-ring modulator, and VPN is an external input DC voltage input to the high-frequency PN junction of the micro-ring modulator.

[0052] In some embodiments, the fifth splitter, the sixth splitter, the seventh splitter, and the eighth splitter are 5% to 95% one-to-two optical power splitting devices, wherein the first optical output terminals of the fifth splitter, the sixth splitter, the seventh splitter, and the eighth splitter output 5% of the input optical wave energy and input to the light input terminals of the second photodiode, the third photodiode, the fourth photodiode, and the fifth photodiode, respectively, and the second optical output terminals of the fifth splitter, the sixth splitter, the seventh splitter, and the eighth splitter output 95% of the input optical wave energy and input to the first optical output port, the second optical output port, the third optical output port, and the fourth optical output port, respectively.

[0053] In some embodiments, the two electrical output terminals of the first photodiode are respectively connected to the IPD1+ terminal and the IPD1- terminal arranged on the chip.

[0054] The two electrical output terminals of the second photodiode are respectively connected to the OPD1+ terminal and the OPD1- terminal arranged on the chip, the two electrical output terminals of the third photodiode are respectively connected to the OPD2+ terminal and the OPD2- terminal arranged on the chip, the two electrical output terminals of the fourth photodiode are respectively connected to the OPD3+ terminal and the OPD3- terminal arranged on the chip, and the two electrical output terminals of the fifth photodiode are respectively connected to the OPD4+ terminal and the OPD4- terminal arranged on the chip.

[0055] In summary, compared with the prior art, the 4x56G baud rate silicon optical modulation chip based on micro-ring modulation technology provided in the application includes four-channel high-bandwidth micro-ring modulators and corresponding monitoring optical power photodiodes, and an end-face coupler design with ultra-low loss is adopted, which can use a single external light source to simultaneously support four modulation signals, thereby using a smaller micro-ring modulator to realize a higher integration solution, replacing a single-laser solution and reducing the application cost of an optical module.

[0056] Note that, unless otherwise explicitly stated, all features disclosed in this specification (including any appended claims, abstract, and drawings) may be replaced by alternative features for achieving the same, equivalent, or similar purpose. Therefore, unless explicitly stated otherwise, each disclosed feature is merely one example of a set of equivalent or similar features. Where used, "further," "preferably," "even further," and "more preferably" are simple starting points for describing another embodiment based on the foregoing embodiments, the combination of which with the foregoing embodiments constitutes the complete configuration of another embodiment. Any combination of several "further," "preferably," "even further," or "more preferably" settings following the same embodiment constitutes yet another embodiment.

[0057] In the implementation of functions and steps, the corresponding functions and steps in the various embodiments may occur in a different order than those shown. For example, two consecutive functions and steps may actually be executed or implemented substantially in parallel, and they may sometimes be executed or implemented in reverse order, depending on the functions involved.

[0058] Although this application has been described in detail above with general descriptions and specific embodiments, some modifications or improvements can be made to it, which will be obvious to those skilled in the art. Therefore, all such modifications or improvements made without departing from the spirit of this application fall within the scope of protection claimed in this application.

Claims

1. A four-channel single-laser micro-ring 56G chip, characterized in that, comprises: an optical input port, a first optical output port, a second optical output port, a third optical output port, a fourth optical output port, a first optical splitter, a second optical splitter, a third optical splitter, a fourth optical splitter, a first micro-ring modulator, a second micro-ring modulator, a third micro-ring modulator, a fourth micro-ring modulator, a fifth optical splitter, a sixth optical splitter, a seventh optical splitter, an eighth optical splitter, a first photodiode, a second photodiode, a third photodiode, a fourth photodiode, a fifth photodiode, wherein the optical input port is connected to an optical input end of the first optical splitter, a first optical output end of the first optical splitter is connected to an optical input end of the first photodiode, and a second optical output end of the first optical splitter is connected to an optical input end of the second optical splitter; a first optical output end of the second optical splitter is connected to an optical input end of the third optical splitter, and a second optical output end of the second optical splitter is connected to an optical input end of the fourth optical splitter; a first optical output end of the third optical splitter is connected to an optical input end of the first micro-ring modulator, and a second optical output end of the third optical splitter is connected to an optical input end of the second micro-ring modulator; a first optical output end of the fourth optical splitter is connected to an optical input end of the third micro-ring modulator, and a second optical output end of the fourth optical splitter is connected to an optical input end of the fourth micro-ring modulator; an optical output end of the first micro-ring modulator is connected to an optical input end of the fifth optical splitter, a first optical output end of the fifth optical splitter is connected to an optical input end of the second photodiode, and a second optical output end of the fifth optical splitter is connected to the first optical output port; an optical output end of the second micro-ring modulator is connected to an optical input end of the sixth optical splitter, a first optical output end of the sixth optical splitter is connected to an optical input end of the third photodiode, and a second optical output end of the sixth optical splitter is connected to the second optical output port; an optical output end of the third micro-ring modulator is connected to an optical input end of the seventh optical splitter, a first optical output end of the seventh optical splitter is connected to an optical input end of the fourth photodiode, and a second optical output end of the seventh optical splitter is connected to the third optical output port; an optical output end of the fourth micro-ring modulator is connected to an optical input end of the eighth optical splitter, a first optical output end of the eighth optical splitter is connected to an optical input end of the fifth photodiode, and a second optical output end of the eighth optical splitter is connected to the fourth optical output port; the first optical splitter is a 5% to 95% one-to-two optical power splitting device, wherein the first optical output end of the first optical splitter outputs 5% of the input optical wave energy, and the second optical output end of the first optical splitter outputs 95% of the input optical wave energy; the second optical splitter, the third optical splitter, and the fourth optical splitter are 50% to 50% one-to-two optical power splitting devices, wherein the first optical output end and the second optical output end of the second optical splitter, the third optical splitter, and the fourth optical splitter respectively output 50% of the input optical wave energy.

2. The four-channel single-laser micro-ring 56G chip according to claim 1, wherein The light input port, the first light output port, the second light output port, the third light output port and the fourth light output port are all edge couplers arranged on the chip.

3. The four-channel single-laser micro-ring 56G chip according to claim 1, characterized in that, the bias voltage terminals of the first micro-ring modulator are respectively connected to the BIAS1+ terminal and the BIAS1- terminal arranged on the chip, the bias voltage terminals of the second micro-ring modulator are respectively connected to the BIAS2+ terminal and the BIAS2- terminal arranged on the chip, the bias voltage terminals of the third micro-ring modulator are respectively connected to the BIAS3+ terminal and the BIAS3- terminal arranged on the chip, and the bias voltage terminals of the fourth micro-ring modulator are respectively connected to the BIAS4+ terminal and the BIAS4- terminal arranged on the chip.

4. The four-channel single-laser micro-ring 56G chip according to claim 1, characterized in that, the two electric modulation signal input terminals of the first micro-ring modulator are respectively connected to the RF1P terminal and the RF1N terminal arranged on the chip, the two electric modulation signal input terminals of the second micro-ring modulator are respectively connected to the RF2P terminal and the RF2N terminal arranged on the chip, the two electric modulation signal input terminals of the third micro-ring modulator are respectively connected to the RF3P terminal and the RF3N terminal arranged on the chip, and the two electric modulation signal input terminals of the fourth micro-ring modulator are respectively connected to the RF4P terminal and the RF4N terminal arranged on the chip.

5. The four-channel single-laser micro-ring 56G chip according to claim 1, characterized in that, the two voltage terminals of the first micro-ring modulator are respectively connected to the VPN1 terminal and the VDD1 terminal arranged on the chip, the two voltage terminals of the second micro-ring modulator are respectively connected to the VPN2 terminal and the VDD2 terminal arranged on the chip, the two voltage terminals of the third micro-ring modulator are respectively connected to the VPN3 terminal and the VDD3 terminal arranged on the chip, and the two voltage terminals of the fourth micro-ring modulator are respectively connected to the VPN4 terminal and the VDD4 terminal arranged on the chip.

6. The four-channel single-laser micro-ring 56G chip according to claim 1, characterized in that, the fifth splitter, the sixth splitter, the seventh splitter and the eighth splitter are 5% to 95% one-to-two optical power splitting devices, wherein the first light output terminal of the fifth splitter, the sixth splitter, the seventh splitter and the eighth splitter outputs 5% of the input light wave energy and inputs into the light input terminal of the second photodiode, the third photodiode, the fourth photodiode and the fifth photodiode respectively, and the second light output terminal of the fifth splitter, the sixth splitter, the seventh splitter and the eighth splitter outputs 95% of the input light wave energy and inputs into the first light output port, the second light output port, the third light output port and the fourth light output port respectively.

7. The four-channel single-laser micro-ring 56G chip according to claim 1, characterized in that, the two electric output terminals of the first photodiode are respectively connected to the IPD1+ terminal and the IPD1- terminal arranged on the chip. Two electrical output ends of the second photodiode are connected with OPD1+ and OPD1- set on the chip respectively, two electrical output ends of the third photodiode are connected with OPD2+ and OPD2- set on the chip respectively, two electrical output ends of the fourth photodiode are connected with OPD3+ and OPD3- set on the chip respectively, and two electrical output ends of the fifth photodiode are connected with OPD4+ and OPD4- set on the chip respectively.

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