Solder recovery equipment

Abstract

The utility model discloses solder recovery equipment which comprises a recovery furnace used for heating a bonding wire; the at least two limiting rollers are arranged in the recovery furnace at intervals, and the roller surface of each limiting roller is provided with a scraping groove used for containing a welding wire; and the air knife is arranged above the recovery furnace, and the air knife is located at the downstream of the limiting roller in the movement direction of the bonding wire. According to the welding flux recovery equipment, the welding wire is wound in the scraping groove of the limiting roller, so that the welding wire is located in the recovery furnace and heated by the recovery furnace, a welding flux layer on the surface of the welding wire is melted into liquid welding flux, the liquid welding flux enters the recovery furnace, and the welding wire abuts against the scraping groove; the inner wall of the scraping groove can enable the solder which is heated to be softened but not completely melted to fall off from the bonding wire, the solder removing efficiency is improved, the air knife can enable the residual liquid solder on the bonding wire discharged from the recovery furnace to be blown into the recovery furnace, and meanwhile the cooling effect on the bonding wire after the solder is removed is achieved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to technical field, specifically about a solder recovery equipment. BACKGROUND

[0002] The solder wire is a kind of welding component applied to the connection between photovoltaic module cell, in order to facilitate the welding of solder wire, solder wire surface will be plated with metal tin layer, in the process of solder wire tinning, product defect will be caused due to equipment failure or staff operation error etc., for example, tin bead is formed on the surface of solder wire product, leading to product scrap, the existing scrap solder wire processing method is usually directly sold as waste.

[0003] With the solder wire diameter more and more thin, wire diameter is finally reduced to about 0.18mm from 0.35mm, solder wire processing difficulty also gradually increases, leading to the increase of defective rate, due to the low unit price of waste sale, leading to the further increase of cost loss.

[0004] The information disclosed in this BACKGROUND section is only for the purpose of increasing the understanding of the background of the present utility model and should not be regarded as an acknowledgement or any form of suggestion that this information forms prior art that is publicly known. CONTENT OF UTILITY MODEL

[0005] The utility model aims at providing a solder recovery equipment, which can effectively remove solder on solder wire and recover, reduce the loss caused by product scrap.

[0006] In order to achieve the above-mentioned purpose, the technical scheme provided by a specific embodiment of the utility model is as follows: a solder recovery equipment, comprising:

[0007] Recovery furnace is used for heating solder wire;

[0008] At least two limiting rollers are spaced apart in the recovery furnace, and a scraping groove for accommodating solder wire is arranged on the roller surface of each limiting roller;

[0009] Air knife is arranged above the recovery furnace, and the air knife is located downstream of the limiting roller along the movement direction of the solder wire.

[0010] In one or more embodiments of the utility model, the solder recovery equipment includes a feeding rack arranged upstream of the limiting roller along the movement direction of the solder wire, and the feeding rack is used for placing solder wire.

[0011] In one or more embodiments of the utility model, a guide roller for winding solder wire is arranged between the limiting roller and the feeding rack along the movement direction of the solder wire, and the guide roller is distributed in parallel with the limiting roller.

[0012] In one or more embodiments of the utility model, the placing part is provided with a plurality of placing parts for placing the bonding wire, the roller surface of the guide roller is provided with a plurality of guide grooves for winding the bonding wire, the roller surface of each limiting roller is provided with a plurality of scraping grooves, the number of guide grooves is greater than or equal to the number of placing parts, the number of scraping grooves is greater than or equal to the number of placing parts, and the bonding wire placed on each placing part is wound on the corresponding scraping groove through the corresponding guide groove.

[0013] In one or more embodiments of the utility model, the solder recovery equipment includes a cooling mechanism arranged downstream of the air knife along the movement direction of the bonding wire, and the cooling mechanism is used for cooling the bonding wire after the solder is removed.

[0014] In one or more embodiments of the utility model, the solder recovery equipment includes a cooling mechanism arranged downstream of the air knife along the movement direction of the bonding wire, and the cooling mechanism is used for cooling the bonding wire after the solder is removed.

[0015] In one or more embodiments of the utility model, the recovery furnace has a working cavity for containing and heating the solder, and the recovery furnace is further provided with a liquid outlet communicating with the working cavity.

[0016] In one or more embodiments of the utility model, the liquid outlet is provided with a solder mold, and the solder mold includes a mold main body and a containing groove formed on the mold main body.

[0017] In one or more embodiments of the utility model, the solder recovery equipment further includes a displacement mechanism for moving the solder mold, the displacement mechanism includes a driving unit and a moving table connected with each other, the driving unit is used for driving the moving table to move, and the solder mold is arranged on the moving table.

[0018] In one or more embodiments of the utility model, the air knife is a flat mouth air knife, and the air knives are arranged around the outer periphery of the bonding wire.

[0019] Compared with the prior art, the solder recovery equipment of the utility model can make the bonding wire be wound in the scraping groove of the limiting roller, so that the solder layer on the bonding wire is melted into liquid solder in the recovery furnace, the bonding wire is abutted on the scraping groove, the inner wall of the scraping groove can also make the solder that is heated and softened but not completely melted fall off from the bonding wire, the efficiency of removing the solder is improved, the air knife can blow the residual liquid solder on the bonding wire out of the recovery furnace into the recovery furnace, and the air knife also has a cooling effect on the bonding wire after the solder is removed. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to make the technical personnel in the art better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by the person skilled in the art without creative labor should belong to the protection scope of the present application.

[0021] Figure 1 Figure 2 is a partial structural schematic view of the solder recovery equipment in an embodiment of the present application;

[0022] Figure 2 Figure 3 is a perspective view of the limiting roller in an embodiment of the present application;

[0023] Figure 3 Figure 4 is a perspective view of the solder mold in an embodiment of the present application;

[0024] Figure 4 Figure 5 is a schematic view of the displacement mechanism in an embodiment of the present application.

[0025] Main figure mark explanation:

[0026] 1, recovery furnace; 11, working cavity; 12, liquid outlet; 2, limiting roller; 21, scraping groove; 3, air knife; 4, discharging rack; 41, placing part; 5, guide roller; 6, cooling mechanism; 7, material passing roller; 8, solder mold; 81, mold main body; 82, containing groove; 9, displacement mechanism; 91, driving unit; 92, moving table; 93, guide rail; a, solder wire. DETAILED DESCRIPTION

[0027] In order to make the technical personnel in the art better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by the person skilled in the art without creative labor should belong to the protection scope of the present application.

[0028] As described in the background, the solder wire is generally made of copper or copper-aluminum alloy as wire, and then a layer of solder layer is plated on the surface of the wire, so as to facilitate the welding of the solder wire and the battery or other devices. Since the wire diameter of the solder wire is getting thinner and thinner, the yield in the preparation process is high, and a lot of scrapped solder wires will be formed, such as solder beads (such as tin beads) on the surface of the solder wire.

[0029] For the convenience of understanding, the solder recovery equipment of the present application is described below by taking the solder of the metal tin as the solder wire a. Of course, the solder recovery equipment of the present application can also recover other solders.

[0030] As shown in Figure 1 and 2 The solder recovery equipment of an embodiment of the present application comprises a recovery furnace 1, a limiting roller 2 and an air knife 3. The recovery furnace 1 is used for heating the solder wire a. At least two limiting rollers 2 are arranged in the recovery furnace 1 at intervals. Each limiting roller 2 is provided with a scraping groove 21 on the roller surface for accommodating the solder wire a. The air knife 3 is arranged above the recovery furnace 1 and is located downstream of the limiting roller 2 along the movement direction of the solder wire a.

[0031] It can be understood that, by winding the solder wire a in the scraping groove 21 of the limiting roller 2, the solder wire a is located in the recovery furnace 1 and is heated by the recovery furnace 1, so that the tin layer and tin beads and other solid tins on the surface of the solder wire a are melted into tin liquid and enter the recovery furnace 1. The solder wire a abuts against the scraping groove 21, and the inner wall of the scraping groove 21 can also make the metal tin that is heated and softened but not completely melted fall off from the solder wire a, thereby improving the tin removal efficiency. The air knife 3 can blow the residual tin liquid on the solder wire a coming out of the recovery furnace 1 back into the recovery furnace 1, and also plays a cooling role on the solder wire a after the tin removal.

[0032] Among them, the scraping groove 21 accommodating the solder wire a can be understood as that the solder wire a is wound on the scraping groove 21 of the limiting roller 2. The scraping groove 21 is arranged along the axial direction of the axial surface of the limiting roller 2, that is, the scraping groove 21 can be an annular groove. The winding can be understood as partial winding, that is, the solder wire a only contacts part of the peripheral surface of the limiting roller 2 and does not wind one round of the peripheral direction of the limiting roller 2. The winding can also be at least one round of winding along the peripheral direction.

[0033] The recovery furnace 1 contains tin liquid, and the at least two limiting rollers 2 are immersed in the tin liquid of the recovery furnace 1. The solder wire a is wound in the scraping groove 21, so as to ensure that the solder wire a between the two limiting rollers 2 is immersed in the tin liquid. The recovery furnace 1 heats the tin liquid therein, and the heated tin liquid fully wraps the solder wire a, so as to heat the tin layer and / or tin beads on the surface of the solder wire a, thereby melting them into liquid and containing them in the tin liquid in the recovery furnace 1, that is, removing and recovering the tin on the surface of the solder wire a. The recovered tin can be used as raw material for preparing the solder wire a or other purposes, thereby reducing the loss caused by the scrap of the solder wire a.

[0034] In the embodiment, the temperature in the recovery furnace 1 can be controlled at 245-250°C, which is suitable for melting the large tin beads on the surface of the solder wire a. The length of the recovery furnace 1 (which can also be considered as the length of the solder wire a immersed in the tin liquid in the recovery furnace 1) is proportional to the tin stripping speed. The faster the tin stripping speed, the longer the length of the solder wire a immersed in the tin liquid in the recovery furnace 1. For example, when the length of the solder wire a in the tin liquid in the recovery furnace 1 is about 2 m (the temperature of the tin liquid in the recovery furnace 1 is 245-250°C), the tin stripping speed can reach about 160 m / min, and the tin material (tin layer and tin beads) on the solder wire a can be completely melted. It can be understood that when other solders are recovered, the temperature and length in the recovery furnace 1 can be adjusted according to the properties of the solder.

[0035] The solder recovery device can further include a frame (not shown in the figure), and the limiting roller 2 can be rotatably connected to the frame or the recovery furnace 1, and the air knife 3 can be connected to the frame or the recovery furnace 1. The limiting roller 2 can move up and down relative to the recovery furnace 1. Such arrangement is mainly to facilitate the installation of the solder wire a and the limiting roller 2. That is, before installation, the limiting roller 2 can be located above the liquid level of the tin liquid in the recovery furnace 1. When the installation of the solder wire a and the limiting roller 2 is completed, the limiting roller 2 is controlled to descend so that the limiting roller 2 with the solder wire a is immersed in the tin liquid in the recovery furnace 1. The up-and-down movement can be achieved by a common air cylinder, electric cylinder or motor and common components.

[0036] Preferably, the air knife 3 is a flat-mouthed air knife 3, and a plurality of air knives 3 are arranged around the outer periphery of the solder wire a. The flat-mouthed air knife 3 can increase the blowing range. The width of the air outlet of the flat-mouthed air knife 3 can be 2-3 mm, for example, as shown in Figure 1 The two air knives 3 can be oppositely arranged on the two sides of the solder wire a, and the distance between the two air knives 3 is 2-3 mm. The angle between the air outlet direction of the two air knives 3 and the horizontal plane is controlled to be 55-60°, which can maximize the blowing of the tin on the solder wire a passing through the recovery furnace 1. The gas blown by the air knife 3 is nitrogen, which can reduce the oxidation of the tin during the blowing process and maximize the recovery of the tin.

[0037] As shown in Figure 1 Along the movement direction of the solder wire a, the solder recovery device includes a feeding rack 4 arranged upstream of the limiting roller 2. The feeding rack 4 is used to place the solder wire a.

[0038] Further, a guide roller 5 for winding the solder wire a is arranged between the limiting roller 2 and the feeding rack 4 along the movement direction of the solder wire a. The guide roller 5 changes the movement track of the solder wire a and adjusts the feeding angle between the solder wire a and the limiting roller 2. The guide roller 5 and the limiting roller 2 are parallelly distributed, that is, the axial direction of the guide roller 5 and the axial direction of the limiting roller 2 are parallel to each other.

[0039] In the embodiment, the feeding rack 4 is provided with a plurality of placement portions 41 for placing the bonding wires a, the roller surfaces of the guide rollers 5 are provided with a plurality of guide grooves (not shown in the figure), and the roller surfaces of each limiting roller 2 are provided with a plurality of scraping grooves 21 for winding the bonding wires a. The number of the guide grooves is greater than or equal to the number of the placement portions 41, and the number of the scraping grooves 21 is greater than or equal to the number of the placement portions 41. Each bonding wire a placed on each placement portion 41 is wound on the corresponding scraping groove 21 through the corresponding guide groove. Specifically, the placement portion 41 is a rod, and a plurality of wound bonding wires a are rotatably sleeved on the plurality of placement portions 41. One wound bonding wire a can be placed on each placement portion 41, that is, a plurality of bonding wires a can be desmutted at one time. One bonding wire a can be wound in each scraping groove 21, and one bonding wire a can be wound on each guide groove on the guide roller 5. The cooperation of the one-to-one corresponding placement portion 41, scraping groove 21 and guide groove plays a role in positioning and limiting the bonding wire a, avoiding the problem of broken wires caused by the mutual crossing and winding of a plurality of bonding wires a during the desmutting process. The structure of the guide groove is similar to that of the scraping groove 21.

[0040] In a specific application scenario, the feeding rack 4 has three placement portions 41, each of which is placed with a wound bonding wire a. The number of the guide grooves and the scraping grooves 21 is three. The bonding wire a on the first placement portion 41 is wound on the leftmost scraping groove 21 of the limiting roller 2 through the leftmost guide groove of the guide roller 5. The bonding wire a on the second placement portion 41 is wound on the middle scraping groove 21 of the limiting roller 2 through the middle guide groove of the guide roller 5. The bonding wire a on the third placement portion 41 is wound on the rightmost scraping groove 21 of the limiting roller 2 through the rightmost guide groove of the guide roller 5. That is, the guide groove and the scraping groove 21 wound by the same bonding wire a correspond to the positions of the guide roller 5 and the limiting roller 2, thereby avoiding the problem of broken wires caused by mutual crossing and winding.

[0041] In another specific application scenario, the feeding rack 4 has three placement portions 41, each of which is placed with a wound bonding wire a. The number of the guide grooves and the scraping grooves 21 is four. The bonding wire a on the first placement portion 41 is wound on the leftmost scraping groove 21 of the limiting roller 2 through the leftmost guide groove of the guide roller 5. The bonding wire a on the second placement portion 41 is wound on the second leftmost scraping groove 21 of the limiting roller 2 through the second leftmost guide groove of the guide roller 5. The bonding wire a on the third placement portion 41 is wound on the third leftmost scraping groove 21 of the limiting roller 2 through the third leftmost guide groove of the guide roller 5. The rightmost guide groove of the guide roller 5 and the rightmost scraping groove 21 of the limiting roller 2 are empty for standby. When the guide groove or the scraping groove 21 of the guide roller 5 or the limiting roller 2 is damaged, the rightmost guide groove of the guide roller 5 and the rightmost scraping groove 21 of the limiting roller 2 can replace the damaged guide groove and scraping groove 21.

[0042] AsFigure 1 As shown, the solder recovery device along the movement direction of the solder wire a includes a cooling mechanism 6 arranged downstream of the air knife 3, for cooling the solder wire a after tin removal. The cooling mechanism 6 cools the solder wire a after tin removal, specifically, the cooling mechanism 6 can be a cooling air slot structure, in addition to the cooling effect, it can further blow off the tin from the solder wire a, and can also ensure that the tin after winding does not adhere to the structure behind, avoiding complex equipment cleaning problems. The cooling mechanism 6 can be connected to the frame.

[0043] Further, the solder recovery device along the movement direction of the solder wire a includes a passing roller 7 arranged downstream of the cooling device, the passing roller 7 is arranged in parallel with the limiting roller 2, that is, the axial direction of the passing roller 7 is parallel to the axial direction of the limiting roller 2. The passing roller 7 can be rotatably connected to the frame, mainly to change the movement trajectory of the solder wire a. The passing roller 7 can also be provided with a groove for containing and limiting, which is also to avoid the mutual crossing and winding of multiple solder wires a during tin removal.

[0044] Specifically, after the solder wire a passes through the passing roller 7, it can be connected with a traction mechanism (not shown in the figure), so as to control the movement speed of the solder wire a in the entire solder recovery device. For example, the traction mechanism can be a material collecting shaft driven by a motor, so as to realize the winding of the solder wire a after tin removal.

[0045] As shown in Figure 1 The recovery furnace 1 has a working cavity 11 for containing and heating tin liquid, and the recovery furnace 1 is further provided with a liquid outlet 12 communicating with the working cavity 11. The tin liquid is placed in the working cavity 11, and the height of the liquid outlet 12 is higher than the original tin liquid level in the recovery furnace 1. After a certain amount of solder wire a is treated for tin removal, the tin liquid in the working cavity 11 will increase, causing the tin liquid level to rise. When the tin liquid level in the working cavity 11 is level with the height of the liquid outlet 12, the tin liquid will flow out of the liquid outlet 12 and be transferred to a designated area, so as to ensure that the tin liquid does not overflow from the top opening of the working cavity 11, and at the same time, the manual tin scooping step is removed, improving the efficiency.

[0046] Further, the liquid outlet 12 is provided with a solder mold 8, which includes a mold body 81 and a containing groove 82 formed on the mold body 81. That is, the tin liquid flowing out of the liquid outlet 12 will directly flow into the containing groove 82 on the mold body 81, and the tin liquid will cool and solidify after moving away from the heat source, and the solder mold 8 can form a tin material with a specified shape, such as a tin rod. It is convenient for the recovery and reuse of the tin material. Specifically, the solder mold 8 can be designed as a template for a single tin rod 1 kg, with the same weight as the purchased new tin material, which is convenient for use in other normal production.

[0047] Further, as shown in Figure 4As shown, the solder recycling equipment also includes a displacement mechanism 9 for moving the solder mold 8. The displacement mechanism 9 includes a drive unit 91 and a moving table 92 connected to each other. The drive unit 91 is used to drive the moving table 92 to move, and the solder mold 8 is disposed on the moving table 92.

[0048] like Figure 3 As shown, in this embodiment, the solder mold 8 may have multiple receiving tanks 82. When one of the receiving tanks 82 of the solder mold 8 (the receiving tank 82 located at the outlet 12) is filled with molten solder, the drive unit 91 drives the moving stage 92 and the solder mold 8 placed on the moving stage 92 to move through the transmission component, so that the receiving tank 82 filled with molten solder in the solder mold 8 moves out of the outlet 12 and the empty receiving tank 82 moves to the outlet 12, thereby realizing the continuous and automated process of molten solder recycling.

[0049] In other embodiments, multiple solder molds 8 and / or drive units 91 connected to multiple mobile stages 92 can be placed on the mobile stage 92. That is, when the solder mold 8 is full of molten solder, the drive unit 91 drives the mobile stage 92 and the solder mold 8 placed on the mobile stage 92 to move through the transmission component, so that the solder mold 8 filled with molten solder moves out from below the outlet 12, and the empty solder mold 8 moves to below the outlet 12. This can also realize the continuous and automated recycling of molten solder.

[0050] Specifically, the drive unit 91 can be a common electric cylinder or motor, and the moving stage 92 is connected to the output end of the drive unit 91.

[0051] Furthermore, such as Figure 4 As shown, the displacement mechanism 9 may also include a guide rail 93, with the moving stage 92 slidably connected to the guide rail 93. The guide rail 93 serves to limit the movement direction of the moving stage 92. The displacement mechanism 9 may also include a timer or a host computer, which is connected to the drive unit 91 to time and control the start of the drive unit 91, thus facilitating the automation of the entire device.

[0052] The specific operation process of the solder recycling equipment of this utility model can be as follows:

[0053] Take a shaft welding line a, its sleeve is set on the placement part 41 on the material rack 4 and is fastened with the nut butt welding shaft. Thread, take the welding line a head of the welding line a, from one guide groove in the guide roller 5, through and wrap through the lower part of a group of scraping grooves 21 in one of the two limiting rollers 2, after coming out from the recovery furnace 1, pass through the center of the air knife 3 (if deviated, it may cause the welding line a to scratch the air knife 3, resulting in poor blowing effect of the air knife 3), then cool through the cooling mechanism 6, and finally pass through the material roller 7 and be wound up, the welding line a head is fixed on the material collecting shaft with the adhesive tape. The above is the threading process of one welding line a, the second, the third and the rest are threaded according to the same process. During the threading process, it needs to be noted that each welding line a needs to select the corresponding scraping groove 21 and guide groove on the same side when threading through the guide roller 5 and the limiting roller 2, otherwise the welding line a will cross between the guide roller 5 and the limiting roller 2, resulting in broken line during operation. After all the welding lines a are threaded, the threading is checked.

[0054] The limiting roller 2 is controlled to descend, so that the welding line a is immersed in the recovery furnace 1, the winding is started to begin to remove the tin, the tin material flows into the solder mold 8 through the liquid outlet 12 to recover the tin liquid; the solder mold 8 is placed on the displacement mechanism 9, after reaching a certain preset time, that is, when the one containing groove 82 in the solder mold 8 is filled with the tin liquid, the driving unit 91 in the displacement mechanism 9 is started to drive the moving table 92 and the solder mold 8 to move, so that the empty containing groove 82 (without tin liquid) moves to the lower part of the liquid outlet 12 to continue to collect the tin liquid, and the automatic weight separation of the recovered tin material is realized.

[0055] It is obvious for those skilled in the art that the utility model is not limited to the details of the above-mentioned exemplary embodiments, and can be realized in other specific forms without departing from the spirit or basic characteristics of the utility model. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-limiting, the scope of the utility model is defined by the appended claims rather than the above description, and therefore all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the utility model. Any figure reference in the claims should not be regarded as limiting the involved claims.

[0056] In addition, it should be understood that although the present specification is described in terms of embodiments, not every embodiment contains only one independent technical solution, and the description manner of the specification is only for the sake of clarity, those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be properly combined to form other embodiments which can be understood by those skilled in the art.

Claims

1. A solder recovery apparatus characterized by comprising: The application relates to a solder recovery device for recovering solder from a solder wire. The solder recovery device comprises a recovery furnace for heating the solder wire, at least two limiting rollers arranged in the recovery furnace, each of the limiting rollers being provided with a scraping groove for accommodating the solder wire, and an air knife arranged above the recovery furnace and located downstream of the limiting rollers along the movement direction of the solder wire. The solder recovery device comprises a feeding rack arranged upstream of the limiting rollers along the movement direction of the solder wire, the feeding rack being used for placing the solder wire. The solder recovery device comprises guide rollers arranged between the limiting rollers and the feeding rack along the movement direction of the solder wire, the guide rollers being arranged in parallel with the limiting rollers.

2. The solder recovery apparatus according to claim 1, characterized by The feeding rack is provided with a plurality of placing portions for placing the solder wire, the roller surface of the guide rollers is provided with a plurality of guide grooves for winding the solder wire, the roller surface of each of the limiting rollers is provided with a plurality of scraping grooves, the number of the guide grooves is greater than or equal to the number of the placing portions, the number of the scraping grooves is greater than or equal to the number of the placing portions, and the solder wire placed on each of the placing portions is wound on the corresponding scraping groove through the corresponding guide groove.

3. The solder recovery apparatus according to claim 2, characterized by The solder recovery device comprises a cooling mechanism arranged downstream of the air knife along the movement direction of the solder wire, the cooling mechanism being used for cooling the solder wire after the solder is removed.

4. The solder recovery apparatus according to claim 3, characterized by The solder recovery device comprises a passing roller arranged downstream of the cooling mechanism along the movement direction of the solder wire, the passing roller being arranged in parallel with the limiting rollers.

5. The solder recovery apparatus of claim 1, wherein The recovery furnace is provided with a working cavity for accommodating and heating the solder, and the recovery furnace is further provided with a liquid outlet connected with the working cavity.

6. The solder recovery apparatus of claim 1, wherein The solder recovery device further comprises a displacement mechanism for moving the solder mold, the displacement mechanism comprises a driving unit and a moving table connected with each other, the driving unit is used for driving the moving table to move, and the solder mold is arranged on the moving table.

7. The solder recovery apparatus of claim 1, wherein The air knife is a flat air knife, and a plurality of air knives are arranged around the outer periphery of the solder wire.

8. The solder recovery apparatus of claim 7, wherein ​ 9. The solder recovery apparatus of claim 8, wherein ​ 10. The solder recovery apparatus of claim 1, wherein ​

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