Deburring tool for wafer clamping positioning column

Abstract

The deburring tool comprises a positioning bottom plate and a pressing plate, the positioning bottom plate is of a hollow annular structure and comprises a bottom ring and a bracket ring, a plurality of calabash-shaped positioning holes are evenly and annularly formed in the circumferential direction of the bottom ring, a plurality of threaded connection bottom holes are evenly distributed in the bottom ring, and the bracket ring is connected with the bottom ring. The diameter of the bracket ring is smaller than that of the bottom ring, the bracket ring is overlapped below the bottom ring, a part of the bracket ring is spatially overlapped with the position of the gourd-shaped positioning hole, and a bracket groove is formed in the overlapped position; the pressing plate is also of a hollow annular structure and comprises a pressing ring and a positioning ring, the outer diameter of the positioning ring is matched with the inner diameter of the bottom ring, threaded connection upper holes corresponding to the threaded connection bottom holes in a one-to-one mode are formed in the pressing ring, and the radius of the pressing ring is larger than the distance from the top end of the gourd-shaped positioning hole to the circle center of the bottom ring. By means of the mode, the deburring efficiency of the wafer clamping positioning column can be improved, and secondary scratches are reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip processing equipment field, especially a kind of deburring tool for wafer clamping positioning column. BACKGROUND

[0002] PFA material has excellent mechanical properties and strong corrosion resistance and surface has the characteristics of self-lubricating, so it is often processed into various parts and widely used in semiconductor industry, but due to the characteristics of plastic material itself, in actual injection molding processing, the edge of PFA material part and the gate are prone to produce residual material, form barb, because semiconductor industry has high requirement on product precision, so the burr needs to be removed to meet the use requirement. But in actual deburring, for smaller parts, it is not easy to hold when deburring by hand, and the deburring efficiency is low and the yield is low, so dry ice or liquid nitrogen deburring machine is usually used to remove burr, but because wafer clamping positioning column is not only small in size but also irregular in shape, it is not easy to fix when deburring by deburring machine, and it is inconvenient for on-site personnel to operate, which can cause secondary scratches and other problems, so a special deburring tool needs to be made to meet the processing requirements of such high-precision parts. SUMMARY

[0003] The technical problem solved by the utility model is to provide a deburring tool for wafer clamping positioning column, which can improve the efficiency of deburring the wafer clamping positioning column and reduce secondary scratches.

[0004] To solve the above technical problems, the utility model adopts one technical scheme, which provides a deburring tool for wafer clamping positioning column, the wafer clamping positioning column is provided with a convex column structure and an irregular outer contour, the deburring tool is made of PTFE material and comprises a positioning base plate and a pressing plate, the positioning base plate is made of PTEF, the pressing plate is made of PVC, and the positioning base plate and the pressing plate are connected through fastening screws, the positioning base plate is a hollow ring structure and comprises a bottom ring and a support ring, a plurality of gourd-shaped positioning holes matched with the contour of the wafer clamping positioning column are uniformly arranged around the bottom ring, a plurality of threaded connection bottom holes are also uniformly arranged on the bottom ring, the diameter of the support ring is smaller than that of the bottom ring, the support ring is overlapped below the bottom ring, part of the gourd-shaped positioning holes is overlapped in space, the overlapped position is provided with a support groove matched with the shape of the bottom position of the wafer clamping positioning column, the support groove and the gourd-shaped positioning hole are combined into a complete wafer clamping positioning column fixing seat, the part of the gourd-shaped positioning hole not overlapped constitutes a convex column structure avoiding position of the wafer clamping positioning column, the pressing plate is also a hollow ring structure and comprises a pressing ring and a positioning ring, the outer diameter of the positioning ring is matched with the inner diameter of the bottom ring, the pressing ring is provided with threaded connection upper holes corresponding to the threaded connection bottom holes one by one, the radius of the pressing ring is greater than the distance from the top end of the gourd-shaped positioning hole to the center of the bottom ring, when the positioning base plate and the pressing plate are connected together through fastening screws, the outer edge of the pressing ring is just covered on the inner side end of the gourd-shaped positioning hole arranged around the bottom ring.

[0005] In a preferred embodiment of the utility model, the outer diameter of the positioning ring is 3‰-5‰ less than the inner diameter of the bottom ring.

[0006] In a preferred embodiment of the utility model, the thickness of the support ring is greater than the convex column structure of the wafer clamping positioning column.

[0007] In a preferred embodiment of the utility model, the part of the support ring overlapped with the gourd-shaped positioning hole comprises a position between the inner side end of the long axis of the gourd-shaped positioning hole and 1 / 4-1 / 2 of the long axis.

[0008] In a preferred embodiment of the utility model, the part of the pressing ring pressed on the inner side end of the gourd-shaped positioning hole comprises a position between the inner side end of the long axis of the gourd-shaped positioning hole and 1.5-3mm.

[0009] In a preferred embodiment of the utility model, the threaded connection bottom holes are 3-8 in total, and the number of the threaded connection upper holes is the same as that of the threaded connection bottom holes.

[0010] The utility model discloses a beneficial effect is: the utility model discloses a special tool developed according to wafer clamping positioning column deburring, through using this tool, on one hand, wafer clamping positioning column is placed on the annular tool base plate as a whole, and the product is not easy to produce secondary scratch, on the other hand, the wafer clamping positioning column positioning seat on this tool is according to the wafer clamping positioning column's outer contour profiling positioning, and the position of the burr is avoided to facilitate the burr treatment, and the bottom is equipped with the support structure, and the top is equipped with the pressing plate, so that the wafer clamping positioning column wafer clamping positioning column does not jump out when being processed under the liquid nitrogen or dry ice condition shot blasting treatment, in addition, when using this tool, a plurality of wafer clamping positioning columns can be handled simultaneously, and the overall efficiency is improved significantly. BRIEF DESCRIPTION OF DRAWINGS

[0011] Figure 1 It is the three-dimensional assembly structure schematic diagram of a preferable embodiment of the utility model;

[0012] Figure 2 It is the three-dimensional structure schematic diagram of the tool base plate in the shown embodiment;

[0013] Figure 3 It is the overhead side view and cross section structure schematic diagram of the tool base plate in the shown embodiment;

[0014] Figure 4 It is the overhead and side view structure schematic diagram of the pressing plate in the shown embodiment;

[0015] Figure 5 It is the structure schematic diagram of the corresponding wafer positioning clamping positioning column in the shown embodiment;

[0016] The marks of various components in the drawings are as follows:

[0017] 1. Positioning base plate, 2. Pressing plate, 3. Fastening screw, 4. Wafer clamping positioning column;

[0018] 101. Bottom ring, 102. Holder ring, 103. Gourd-shaped positioning hole, 104. Threaded connection bottom hole;

[0019] 201. Pressing ring, 202. Positioning ring, 203. Threaded connection upper hole. DETAILED DESCRIPTION

[0020] The preferable embodiment of the utility model is described in detail below in combination with the drawings, so that the advantages and characteristics of the utility model can be more easily understood by the person skilled in the art, and the protection scope of the utility model is more clearly and explicitly defined.

[0021] Please refer to Figures 1 to 4 The utility model embodiment includes:

[0022] A deburring tool for wafer clamping positioning column 4, the wafer clamping positioning column 4 is provided with convex column structure and irregular outer contour, the deburring tool comprises: positioning base plate 1 and pressing plate 2, the positioning base plate 1 is made of PTEF, the pressing plate 2 is made of PVC, the positioning base plate 1 and the pressing plate 2 are connected by fastening screw; The positioning base plate 1 is hollow ring structure, including bottom ring 101 and support ring 102, the inner ring diameter of the bottom ring 101 is 260mm, the outer diameter is 330mm, 38 gourd-shaped positioning holes 103 matched with the contour of the wafer clamping positioning column are uniformly arranged around the bottom ring 101, 6 threaded connection holes 104 are also uniformly arranged on the bottom ring 101, the support ring 102 is overlapped below the bottom ring, the outer diameter of the support ring 102 is 298mm, which is less than the outer diameter of the bottom ring 101, part of the support ring 102 and the position of the gourd-shaped positioning hole 103 coincide in space, the part of the support ring 102 and the gourd-shaped positioning hole 103 coinciding in space includes the position from the inside end of the long axis of the gourd-shaped positioning hole 103 to 1 / 4-1 / 2 of the long axis, the actual length of the long axis of the gourd-shaped positioning hole 103 is about 21.3mm, and in actual implementation, the length of the coincident part is generally about 7.2mm, the part of the support ring 102 and the gourd-shaped positioning hole 103 coinciding in space is provided with a support groove matched with the shape of the bottom position of the wafer clamping positioning column 4, the support groove and the gourd-shaped positioning hole 103 together form a complete wafer clamping positioning column fixing seat, the part of the gourd-shaped positioning hole 103 not coinciding constitutes the convex column structure avoiding position of the wafer clamping positioning column 4;

[0023] The pressing plate 2 is also a hollow annular structure, comprising a pressing ring 201 and a positioning ring 202, the outer diameter of the positioning ring 202 matches the inner diameter of the bottom ring 101, and is smaller than the inner diameter of the bottom ring 101 by 3‰-5‰, in actual implementation, the outer diameter of the positioning ring 202 is 259mm, which is smaller than the inner diameter of the bottom ring 101 by about 1mm, so that the pressing plate 2 can be quickly aligned when installed. The pressing ring 201 is provided with six threaded connection upper holes 203 corresponding to the threaded connection bottom holes 104 one by one, the diameter of the pressing ring 201 is 288mm, and the radius is greater than the distance from the top end of the gourd-shaped positioning hole 103 to the center of the bottom ring 101, so that when the positioning bottom plate 1 and the pressing plate 2 are connected together through the fastening screw 3, the outer edge of the pressing ring 201 is just covered on the inner side end of the gourd-shaped positioning hole 103 arranged on the bottom ring 101. The part of the pressing ring 201 pressed on the inner side end of the gourd-shaped positioning hole 103 comprises a position with a length of 1.5-3mm from the inner side end of the long axis of the gourd-shaped positioning hole 103. Actually, the long axis of the gourd-shaped positioning hole 103 is about 21.3mm, and the actual design pressing length is about 2.2mm, so that on the one hand, the pressure on the wafer clamping positioning column 4 is prevented from jumping out accidentally when shot blasting, and at the same time, the maximum possible exposure of the surface to be processed is prevented, and the remaining burrs are prevented.

[0024] The thickness of the supporting seat ring 102 is greater than the convex column structure of the wafer clamping positioning column 4, so that after installation, the convex column structure on the wafer clamping positioning column 4 is suspended as a whole, and secondary scratching is not caused.

[0025] The above only describes the embodiments of the present application, and does not limit the patent range of the present application, and any equivalent structure or equivalent process transformation, or direct or indirect application in other related technical fields, is also included in the patent protection range of the present application.

Claims

1. A deburring tool for a wafer clamping positioning column, the wafer clamping positioning column being provided with a convex column structure and an irregular outer contour, characterized in that, The deburring tool comprises a positioning base plate made of PTEF and a pressing plate made of PVC, and the positioning base plate and the pressing plate are connected by fastening screws; The positioning base plate is a hollow ring structure comprising a bottom ring and a supporting ring, the bottom ring is circumferentially and uniformly provided with a plurality of gourd-shaped positioning holes matched with the profile of the wafer clamping positioning column, and the bottom ring is also uniformly provided with a plurality of threaded connection bottom holes, the supporting ring has a smaller diameter than the bottom ring, the supporting ring is overlapped below the bottom ring, and part of the gourd-shaped positioning holes is spatially overlapped with the supporting ring, the overlapped position is provided with a supporting groove matched with the shape of the bottom position of the wafer clamping positioning column, and the supporting groove and the gourd-shaped positioning hole together form a complete wafer clamping positioning column fixing seat, and the part of the gourd-shaped positioning hole not overlapped constitutes an avoidance position of the convex column structure of the wafer clamping positioning column; The pressing plate is also a hollow ring structure comprising a pressing ring and a positioning ring, the outer diameter of the positioning ring is matched with the inner diameter of the bottom ring, the pressing ring is provided with a threaded connection upper hole corresponding to the threaded connection bottom hole, the radius of the pressing ring is greater than the distance from the top end of the gourd-shaped positioning hole to the center of the bottom ring, and when the positioning base plate and the pressing plate are connected together by fastening screws, the outer edge of the pressing ring is just covered on the inner side end of the gourd-shaped positioning hole arranged on the bottom ring.

2. The burring tool for wafer chuck positioning columns according to claim 1, characterized by, The outer diameter of the positioning ring is 3‰-5‰ smaller than the inner diameter of the bottom ring.

3. The burring tool for wafer chucking positioning columns according to claim 1, characterized in that, The thickness of the supporting ring is greater than the convex column structure of the wafer clamping positioning column.

4. The burring tool for wafer chuck positioning columns according to claim 1, characterized by The part of the supporting ring overlapped with the gourd-shaped positioning hole comprises a position between 1 / 4-1 / 2 of the length of the inner side end of the long axis of the gourd-shaped positioning hole.

5. The burring tool for wafer chuck positioning columns according to claim 1, characterized by The part of the pressing ring outer edge pressed on the inner side end of the gourd-shaped positioning hole comprises a position between 1.5-3mm of the length of the inner side end of the long axis of the gourd-shaped positioning hole.

6. The burring tool for wafer chuck positioning columns according to claim 1, characterized by The threaded connection bottom hole has 3-8, and the number of threaded connection upper holes is the same as that of threaded connection bottom holes.

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