Jig for wafer surface defect detection
By designing a fixture with a base without graduation markings and a perforated top cover, the problem of misjudgment in wafer surface defect detection was solved, enabling accurate positioning of wafer defects and product location, and improving product stability.
Patent Information
- Application Number
- CN202422875956.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-25
- Publication Date
- 2025-11-25
- Estimated Expiration
- 2034-11-25
AI Technical Summary
Existing wafer surface defect detection technologies suffer from discrepancies between the cutout cover area and the actual usable area of the wafer, leading to misjudgments. Furthermore, the defect identification is inaccurate and cannot be matched one-to-one with the finished product, affecting the assessment of product performance.
Design a fixture that includes a base without graduation markings and a perforated top cover. The base has circular and rectangular grooves for placing the wafer, and is positioned using a microscope scale to ensure accurate location of defects.
Without altering existing production conditions, by optimizing the upper and lower cover structures through fixtures, the wafer defects can be accurately located and their corresponding positions on the product can be identified in a timely manner, thereby improving product stability.
Smart Images
Figure CN223597552U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of wafer surface defect detection technology, and specifically relates to a fixture for wafer surface defect detection. Background Technology
[0002] When inspecting defects such as particles, contamination, and scratches on the wafer surface, a 12-grid base (with ruler) and a circular hollowed-out top cover are used. Each part of the 12-grid area is photographed, and the obtained photos are used to determine the condition of the wafer surface, which serves as a reference for the production of downstream products.
[0003] The existing technology has the following technical problems: First, there is a discrepancy between the hollowed-out cover area and the actual usable area of the wafer, which can lead to misjudgment; second, the defects visible in the 12-grid layout may not fall within the effective area of the chip; third, the judgment of each defect only roughly shows its location and cannot be matched one by one with the finished product, resulting in the failure to identify product defects in a timely manner, which affects the performance judgment. Utility Model Content
[0004] In order to overcome the shortcomings of existing wafer inspection technologies, such as deviations and the inability to correspond one-to-one with finished products, this utility model proposes a fixture for detecting defects on wafer surfaces.
[0005] The technical solution adopted by this utility model to solve its technical problem is:
[0006] A fixture for detecting defects on the surface of a wafer includes a base and a top cover.
[0007] The base is placed on the microscope platform, the wafer to be inspected is placed on the upper side of the base, and the top cover is placed on the upper side of the wafer to be inspected.
[0008] The base has no markings, and the top cover has a perforated design.
[0009] The aforementioned fixture for detecting defects on the surface of wafers has a flat base with a circular groove at the center of its upper side. The circular groove is used to place the wafer to be inspected, and its shape and size match the wafer to be inspected. The bottom surface of the base is square.
[0010] The aforementioned fixture for detecting defects on the surface of wafers has a rectangular groove on the upper side of the base. One end of the rectangular groove is located inside the circular groove, and the other end is located inside the top surface of the base. The depth of the rectangular groove is greater than the depth of the circular groove. The rectangular groove is used for placing and removing the wafer to be inspected.
[0011] The fixture described above for detecting defects on the surface of wafers has a flat top cover with a square perimeter, the length of which is the same as the bottom surface of the base.
[0012] The bar-shaped hollow is located at the center of the upper cover.
[0013] The utility model discloses the beneficial effect is:
[0014] A kind of for wafer surface defect detection's fixture, under the prerequisite that not needing to change existing production condition, only upper and lower cover are optimized, microscope scale size is accurately positioned, i.e. positioning wafer defect and product corresponding position, timely identifying the influence of defect to product performance test, improve product stability. BRIEF DESCRIPTION OF DRAWINGS
[0015] Figure 1 It is the base structure schematic diagram of the utility model embodiment for placing wafer to be inspected;
[0016] Figure 2 It is the upper cover structure schematic diagram of the utility model embodiment.
[0017] Reference signs: 1. base, 2. upper cover, 3. rectangular groove, 4. circular groove, 5. bar-shaped hollow. DETAILED DESCRIPTION
[0018] The utility model will be further detailed in connection with the drawings and specific embodiment.
[0019] Example one
[0020] A kind of for wafer surface defect detection's fixture, designs a base 1 without scale mark+bar-shaped hollow upper cover 2, base 1 as shown in Figure 1 As shown in Figure 2 More accurate for inspection area, and can be positioned according to scale, in combination with product design size, accurately positioning defect specific location, reject defective product in time, improve product stability.
[0021] A kind of for wafer surface defect detection's fixture, when wafer inspection, first, base is placed on microscope, simultaneously, wafer to be inspected is placed on base, surface is swept clean, cover upper cover, by moving microscope scale, take a certain number of photos, determine wafer surface quality.If need to locate accurate position, according to scale size and product specification, can locate the accurate distribution of bad.
Claims
1. A jig for wafer surface defect detection, characterized by, The base (1), the upper cover (2); The base (1) is placed on the microscope platform, and the wafer to be inspected is placed on the upper side of the base (1), and the upper cover (2) is placed on the upper side of the wafer to be inspected; The base (1) is not marked with a scale, and the upper cover (2) is provided with a bar-shaped hollow (5).
2. The wafer surface defect detection jig according to claim 1, wherein The base (1) is a flat plate, and a circular groove (4) is arranged at the center of the upper side of the base (1), the circular groove (4) is used for placing the wafer to be inspected, the shape and size of the circular groove (4) match the wafer to be inspected, and the bottom surface of the base (1) is a square.
3. The wafer surface defect detection jig according to claim 2, wherein The upper side of the base (1) is provided with a rectangular groove (3), one end of the rectangular groove (3) is located in the circular groove (4), the other end is located in the top surface of the base (1), the depth of the rectangular groove (3) is greater than the depth of the circular groove (4), and the rectangular groove (3) is used for placing and taking out the wafer to be inspected.
4. The wafer surface defect detection jig according to claim 1, wherein The upper cover (2) is a flat plate, and the four sides form a square, and the length of the square is the same as the bottom surface of the base (1); The bar-shaped hollow (5) is located at the center of the upper cover (2).