Temperature balance control system and test equipment

Abstract

The utility model relates to the technical field of temperature control systems, in particular to a temperature balance control system and test equipment. The temperature balance control system comprises a control module, a control information module and a temperature control module, and the control module is used for temperature control; the control information module is used for controlling associated functional modules and comprises a digital quantity unit and an analog quantity unit; the temperature control module comprises a plurality of heating units and a plurality of refrigerating units, the heating units and the refrigerating units are independently controlled by the control module, and the multiple heating units are matched with one refrigerating unit. According to the temperature balance control system, accurate and active temperature control can be achieved, and then the initiative, efficiency and accuracy of temperature control of the system are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of temperature control systems, in particular to a temperature balance control system and test equipment. BACKGROUND

[0002] A semiconductor tri-temperature handler is a device used for testing and screening semiconductor components, such as chips. It can test the performance of semiconductor devices under different temperature environments to ensure the quality and reliability of products. Tri-temperature handlers usually involve three different temperature ranges for testing, usually high temperature, room temperature and low temperature, which realizes the comprehensive evaluation of the performance of semiconductor components under different working conditions. For example, the heat dissipation capacity of components may be tested under high temperature conditions, or the switching characteristics may be evaluated under low temperature conditions. The performance of semiconductor devices at different temperatures may be significantly different, so tri-temperature sorting can help engineers identify products that may fail under some extreme conditions, ensuring that only high-quality products are shipped. The device is widely used in semiconductor manufacturing, electronic product testing, especially for products with high reliability requirements, such as aerospace, medical equipment and automotive electronics.

[0003] In related technologies, during the test process, semiconductor components are placed in test fixtures, which are connected to test equipment, and the devices are heated or cooled by temperature changing equipment. The test system monitors and records electrical parameters such as current, voltage and power in real time to evaluate the performance of the device. Tri-temperature handlers need to have a high-precision temperature control system to ensure the accuracy and stability of the test temperature. Good automation is also required to achieve automatic loading, testing, data recording and result analysis, improving test efficiency.

[0004] However, the applicant found that the current temperature control system has the following technical problems:

[0005] The refrigeration temperature control of the heat exchange area of the refrigeration equipment in the prior art is relatively passive, resulting in poor precision and low efficiency of temperature control. CONTENT OF THE INVENTION

[0006] Therefore, it is necessary to provide a temperature balance control system and test equipment that can actively and accurately control temperature rise and fall.

[0007] The present application provides a temperature balance control system from the first aspect, comprising:

[0008] A control module for temperature control of the system based on a pre-edited recipe program;

[0009] A control information module connected to the control module, the control information module configured to obtain the control instruction output by the control module and output a corresponding control signal to control the associated function module, the control information module comprising a digital unit and an analog unit;

[0010] A temperature control module connected to the control module, the temperature control module comprising a plurality of heating units and a plurality of refrigeration units, the heating units and the refrigeration units being independently controlled by the control module, a plurality of the heating units cooperating with one of the refrigeration units to achieve temperature control of the associated target carrier.

[0011] In one embodiment, the temperature control module further comprises:

[0012] A temperature controller unit arranged between the control module and the target carrier, configured to control the temperature of the target carrier.

[0013] In one embodiment, the system further comprises:

[0014] A temperature acquisition module arranged between the temperature controller unit and the temperature control module, configured to detect the temperature of the refrigeration unit to monitor the heat dissipation state of the refrigeration unit, the temperature acquisition module comprising a thermocouple.

[0015] In one embodiment, the system further comprises:

[0016] A pressure acquisition module connected to the control module, configured to acquire pressure acquisition information of the refrigeration unit to monitor the pressure state of the refrigeration unit.

[0017] The control module is further configured to prompt an abnormal pressure state of the system when the pressure state of the refrigeration unit is abnormal.

[0018] In one embodiment, the system further comprises:

[0019] A humidity acquisition module connected to the control module, configured to acquire humidity acquisition information of the refrigeration unit to monitor the humidity state of the refrigeration unit.

[0020] The control module is further configured to prompt an abnormal humidity state of the system when the humidity state of the refrigeration unit is abnormal.

[0021] In one embodiment, the system further comprises:

[0022] A drying module connected to the control module, the drying module being controlled by the control module to introduce dry gas to dry the refrigeration unit when the refrigeration unit is in the humidity abnormal state.

[0023] In one of the embodiments, the temperature control module further comprises:

[0024] A heating acquisition unit connected to the heating unit to acquire the heating output value of the heating unit.

[0025] The control module is further configured to compare the heating output value with a preset heating instruction value, and adjust the refrigeration instruction value of the refrigeration unit according to the comparison result.

[0026] In one of the embodiments, the temperature control module further comprises:

[0027] An energy valve unit connected to the control information module to adjust the refrigeration output power of the refrigeration unit.

[0028] In one of the embodiments, the system further comprises:

[0029] An ion detection module connected to the control module to acquire ion concentration information of the refrigeration unit to monitor the ion concentration state of the refrigeration unit.

[0030] An ion adjustment module connected to the control module, the ion adjustment module being controlled by the control module to introduce negative ion air flow to neutralize the internal ions of the refrigeration unit when the refrigeration unit is in the ion concentration abnormal state.

[0031] The application provides a test device from a second aspect, comprising a temperature balance control system according to any one of the first aspect.

[0032] The temperature balance control system and the test device can achieve the following beneficial effects by the technical features:

[0033] The application provides a temperature balance control system, comprising a control module, a control information module and a temperature control module, wherein the control module is used for temperature control of the system based on a pre-edited formula program; the control information module is connected with the control module, and is used for obtaining a control instruction output by the control module and outputting a corresponding control signal to control an associated function module; the control information module comprises a digital unit and an analog unit; the temperature control module is connected with the control module, and comprises a plurality of heating units and a plurality of refrigeration units; the heating units and the refrigeration units are independently controlled by the control module; a plurality of the heating units are matched with one of the refrigeration units to realize temperature control of an associated target carrier. In implementation, in the temperature control process, the analog unit can be matched with a pressure sensor and other equipment to realize real-time monitoring of the pressure state of the refrigeration unit, so as to prompt the current abnormal condition of the equipment, and help to improve the safety and stability of the equipment; the digital unit can automatically control a refrigerant energy regulating valve to reduce the refrigeration capacity, so as to realize accurate temperature control, improve the temperature regulation efficiency and stability of the system, and reduce energy waste. On the other hand, by arranging the independently controlled heating units and the refrigeration units in the temperature and control modules, accurate and active temperature control can be realized, and the initiative, efficiency and accuracy of the system temperature control can be improved. BRIEF DESCRIPTION OF DRAWINGS

[0034] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative effort on the basis of these drawings.

[0035] Figure 1 It is a structure schematic diagram of a temperature balance control system in an embodiment of the present application.

[0036] Figure 2 It is a connection schematic diagram of a temperature balance control system in an embodiment of the present application.

[0037] Figure 3 It is a connection schematic diagram of a temperature balance control system in an embodiment of the present application.

[0038] Legend of reference numerals: 100, control module; 200, control information module; 300, temperature control module. DETAILED DESCRIPTION

[0039] For the purpose of clarity, the present application will be described in greater detail below with reference to the accompanying drawings. The embodiments of the present application are illustrated in the drawings. However, the present application can be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and fully convey the scope of the application to those skilled in the art.

[0040] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0041] It should be understood that the terms "first", "second" and so on used herein can be used to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish the first element from another element. For example, without departing from the scope of the present application, a first resistor can be referred to as a second resistor, and similarly, a second resistor can be referred to as a first resistor. The first resistor and the second resistor are both resistors, but they are not the same resistor.

[0042] It should be understood that "connection" in the following embodiments means that the circuits, modules, units, etc. connected to each other have transmission of electrical signals or data.

[0043] It should be understood that "at least one" means one or more, and "multiple" means two or more. "At least part of the element" means part or all of the element.

[0044] As used herein, the singular forms "a", "an" and "the" can also include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the term "comprise / comprising" or "have / having" specifies the presence of stated features, integers, steps, operations, components, parts, or combinations thereof, but does not exclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof. At the same time, the term "and / or" used in the specification includes any and all combinations of the related listed items.

[0045] The present application is made by the inventors based on the recognition and research of the following problems:

[0046] In the related art, during testing, semiconductor elements are placed in a test fixture, which is connected to a test device, and the device is heated or cooled by a temperature changing device. The test system monitors and records electrical parameters such as current, voltage and power in real time to evaluate the performance of the device. The three-temperature sorting machine needs to have a high-precision temperature control system to ensure the accuracy and stability of the test temperature. It also needs to have good automation functions to realize automatic loading, testing, data recording and result analysis, and improve the testing efficiency.

[0047] However, the applicant finds that the current temperature control system has the following technical problems:

[0048] The refrigeration temperature control of the heat exchange area of the refrigeration device in the prior art is relatively passive, resulting in poor precision and low efficiency of temperature control.

[0049] Based on this, the embodiments of the present application provide a temperature balance control system and a test device.

[0050] In one embodiment, as shown in Figure 1 and Figure 2 A temperature balance control system is provided, including a control module 100, a temperature control module 300, and a control information module 200, wherein:

[0051] The control module 100 is used to control the temperature of the system based on a pre-edited recipe program;

[0052] The control information module 200 is connected to the control module 100, and the control information module 200 is used to obtain the control instructions output by the control module 100 and output corresponding control signals to control the associated function modules. The control information module 200 includes a digital unit and an analog unit.

[0053] The temperature control module 300 is connected to the control module 100, and the temperature control module 300 includes a plurality of heating units and a plurality of refrigeration units. The heating units and the refrigeration units are independently controlled by the control module 100. A plurality of heating units cooperate with one refrigeration unit to realize temperature control of the associated target carrier.

[0054] Exemplarily, an independent temperature detection device can be arranged in each target carrier. The temperature detection device can be connected to the control module 100 and can independently and accurately detect the environmental temperature of each target carrier. The temperature detection device can be a temperature measurement probe, a thermocouple, etc.

[0055] By implementing the above-mentioned temperature balance control system, the following beneficial effects can be achieved:

[0056] The application provides a temperature balance control system, comprising a control module 100, a control information module 200 and a temperature control module 300, wherein the control module 100 is used for temperature control of the system based on a pre-edited formula program; the control information module 200 is connected with the control module 100, the control information module 200 is used for obtaining a control instruction output by the control module 100 and outputting a corresponding control signal to control an associated function module, the control information module 200 comprises a digital unit and an analog unit; the temperature control module 300 is connected with the control module 100, the temperature control module 300 comprises a plurality of heating units and a plurality of refrigeration units, the heating units and the refrigeration units are independently controlled by the control module 100, a plurality of the heating units are matched with one of the refrigeration units to realize temperature control of an associated target carrier. In the implementation, in the temperature control process, the analog unit can be matched with a pressure sensor and other equipment to realize real-time monitoring of the pressure state of the refrigeration unit, so as to prompt the current abnormal situation of the equipment, which is helpful to improve the safety and stability of the equipment; the digital unit can automatically control a refrigerant energy regulating valve to reduce the refrigeration capacity, so as to realize accurate temperature control, improve the temperature regulation efficiency and stability of the system and reduce energy waste. On the other hand, by arranging the independently controlled heating units and the refrigeration units in the temperature control module 300, accurate and active temperature control can be realized, and the initiative, efficiency and accuracy of the system temperature control are improved.

[0057] In one of the embodiments, the temperature control module 300 further comprises:

[0058] A temperature controller unit is arranged between the control module 100 and the target carrier and is used for temperature control of the target carrier.

[0059] In the embodiment, the temperature controller is used for realizing temperature control of the system, which is helpful to improve the efficiency and sensitivity of the temperature control.

[0060] In one of the embodiments, as shown in Figure 3 The system further comprises:

[0061] A temperature acquisition module is arranged between the temperature controller unit and the temperature control module 300 and is used for detecting the temperature of the refrigeration unit to realize monitoring of the heat dissipation state of the refrigeration unit, and the temperature acquisition module comprises a thermocouple.

[0062] In the embodiment, the temperature acquisition module is arranged in the system, so that the temperature of the refrigeration unit can be detected, and the accuracy of the temperature control is improved.

[0063] In one of the embodiments, as shown in Figure 3As shown, the system further comprises:

[0064] The pressure acquisition module is connected with the control module 100, and is configured to acquire pressure acquisition information of the refrigeration unit, so as to monitor the pressure state of the refrigeration unit.

[0065] The control module 100 is further configured to prompt an abnormal pressure state of the system when the pressure state of the refrigeration unit is abnormal.

[0066] In this embodiment, the system comprises a pressure acquisition module, which acquires the pressure of the refrigeration unit, so as to master the working state of the refrigeration unit and improve the stability and safety of system control.

[0067] In one of the embodiments, as shown in Figure 3 The system further comprises:

[0068] The humidity acquisition module is connected with the control module 100, and is configured to acquire humidity acquisition information of the refrigeration unit, so as to monitor the humidity state of the refrigeration unit.

[0069] The control module 100 is further configured to prompt an abnormal humidity state of the system when the humidity state of the refrigeration unit is abnormal.

[0070] In this embodiment, the system further comprises a humidity acquisition module, which monitors the humidity state of the system, so as to improve the stability and safety of system control and reduce the possibility of negative situations such as frost and condensation in the refrigeration unit.

[0071] In one of the embodiments, the system further comprises:

[0072] The drying module is connected with the control module 100, and is controlled by the control module 100, and is configured to introduce dry gas to dry the refrigeration unit when the refrigeration unit is in an abnormal humidity state.

[0073] In this embodiment, the system further comprises a drying module, which helps to intervene in the abnormal humidity state of the system, and restores the refrigeration unit to normal by dry gas, so as to improve the stability of the system.

[0074] In one of the embodiments, the temperature control module 300 further comprises:

[0075] The heating acquisition unit is connected with the heating unit, and is configured to acquire the heating output value of the heating unit.

[0076] The control module 100 is also configured to compare the heating output value with a preset heating instruction value, and adjust a refrigeration instruction value of the refrigeration unit according to a comparison result.

[0077] In the embodiment, the temperature control module 300 further comprises a heating acquisition unit, which is configured to acquire the output of the heating unit, and further determine the refrigeration power of the refrigeration unit, so as to improve the energy utilization efficiency of the system control.

[0078] In one of the embodiments, the temperature control module 300 further comprises:

[0079] An energy valve unit, which is connected to the control information module 200, and is configured to adjust the refrigeration output power of the refrigeration unit.

[0080] In the embodiment, the temperature control module 300 further comprises an energy valve unit, which is configured to stepless control the output of the refrigeration unit, so as to further improve the precision and flexibility of the temperature control.

[0081] In one of the embodiments, as shown in Figure 3 The system further comprises:

[0082] An ion detection module, which is connected to the control module 100, and is configured to acquire ion concentration information of the refrigeration unit, so as to monitor the ion concentration state of the refrigeration unit.

[0083] An ion adjustment module, which is connected to the control module 100, and is controlled by the control module 100, and is configured to introduce a negative ion airflow when the refrigeration unit is in an abnormal ion concentration state, so as to neutralize the internal ions of the refrigeration unit.

[0084] In the embodiment, the system further comprises an ion detection module, which is configured to control the ion concentration in the refrigeration unit, so as to improve the stability and safety of the system control.

[0085] Based on the same aspect, the application further provides a test device, which comprises the temperature balance control system according to any one of the above embodiments.

[0086] It can be understood that the above-mentioned temperature balance control system and test device can also adopt other forms, and are not limited to the forms mentioned in the above embodiments, as long as they can achieve the function of actively and accurately controlling temperature rising and falling.

[0087] In the description of the specification, the description of the terms "some embodiments", "other embodiments", etc. means that the particular feature, structure, material, or characteristic being described is included in at least one embodiment or example of the application. The illustrative descriptions in this specification are not necessarily to be construed as indicating that all embodiments or examples of the application include the described feature, structure, material or characteristic.

[0088] The technical features of the above-described embodiments can be combined in any manner, and for brevity, not all possible combinations of the technical features in the above-described embodiments are described, but it should be considered that any combination of the technical features is within the scope of the present application as long as the combination does not result in a contradiction.

[0089] The above-described embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, but it should not be understood as a limitation on the scope of the present application. It should be noted that for those skilled in the art, some modifications and improvements can be made without departing from the concept of the present application, and these are within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the appended claims.

Claims

1. A temperature balance control system, characterized in that, include: The control module is used to control the system temperature based on a pre-edited recipe program; A control information module is connected to the control module. The control information module is used to acquire the control commands output by the control module and output corresponding control signals to control the associated functional modules. The control information module includes digital quantity units and analog quantity units. A temperature control module is connected to the control module. The temperature control module includes several heating units and several cooling units. The heating units and the cooling units are independently controlled by the control module. Multiple heating units cooperate with one cooling unit to achieve temperature control of the associated target vehicle.

2. The temperature balance control system according to claim 1, characterized in that, The temperature control module also includes: A temperature controller unit is located between the control module and the target vehicle, and is used to control the temperature of the target vehicle.

3. A temperature balance control system according to claim 2, characterized in that, The system also includes: A temperature acquisition module is located between the temperature controller unit and the temperature control module, and is used to detect the temperature of the refrigeration unit in order to monitor the heat dissipation status of the refrigeration unit. The temperature acquisition module includes a thermocouple.

4. A temperature balance control system according to claim 1, characterized in that, The system also includes: A pressure acquisition module, connected to the control module, is used to acquire pressure information of the refrigeration unit in order to monitor the pressure status of the refrigeration unit. The control module is also used to indicate the abnormal pressure status of the system when the pressure status of the refrigeration unit is abnormal.

5. A temperature balance control system according to claim 1, characterized in that, The system also includes: A humidity acquisition module, connected to the control module, is used to acquire humidity information of the refrigeration unit in order to monitor the humidity status of the refrigeration unit. The control module is also used to indicate an abnormal humidity status in the system when the humidity status of the refrigeration unit is abnormal.

6. A temperature balance control system according to claim 5, characterized in that, The system also includes: A drying module, connected to the control module, is controlled by the control module and is used to introduce drying gas to dry the refrigeration unit when the refrigeration unit is in an abnormal humidity state.

7. A temperature balance control system according to claim 1, characterized in that, The temperature control module also includes: A heating acquisition unit, connected to the heating unit, is used to acquire the heating output value of the heating unit; The control module shown is also used to compare the heating output value with a preset heating command value, and adjust the cooling command value of the cooling unit according to the comparison result.

8. A temperature balance control system according to claim 7, characterized in that, The temperature control module also includes: An energy valve unit, which is connected to the control information module, is used to adjust the cooling output power of the refrigeration unit.

9. A temperature balance control system according to claim 1, characterized in that, The system also includes: An ion detection module, connected to the control module, is used to collect ion concentration information of the refrigeration unit in order to monitor the ion concentration state of the refrigeration unit. An ion regulation module is connected to the control module and is controlled by the control module. The ion regulation module is used to introduce a negative ion airflow when the refrigeration unit is in an abnormal ion concentration state, so as to neutralize the ions inside the refrigeration unit.

10. A testing device, characterized in that, Including a temperature balance control system according to any one of claims 1-9.

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