Computing device

Abstract

The embodiment of the utility model provides a computing device which comprises a cabinet, a plurality of servers, a power supply module and a power supply busbar, and the plurality of servers, the power supply module and the power supply busbar are all arranged in the cabinet. The power supply module is used for supplying power to the server, the power supply busbar comprises a busbar assembly and a liquid cooling pipe, the busbar assembly comprises a conductive power strip, one end of the conductive power strip is connected to the power supply module, the other end of the conductive power strip is connected to the server through a connector and used for transmitting electric energy of the power supply module to the server, and part of the liquid cooling pipe is arranged on the conductive power strip. An internal pipeline of the liquid cooling pipe forms a liquid cooling channel, two ends of the liquid cooling pipe are provided with a liquid inlet end and a liquid outlet end which are communicated with the liquid cooling channel, the liquid inlet end is used for allowing a liquid cooling working medium to enter the liquid cooling channel, and the liquid outlet end is used for allowing the liquid cooling working medium to flow out of the liquid cooling channel so as to dissipate heat of the busbar assembly. According to the computing device provided by the embodiment of the invention, the problem that the volume, weight and manufacturing cost of the computing device are increased for heat dissipation is solved.

Description

TECHNICAL FIELD

[0001] Embodiments of the present application relate to the technical field of computing devices, and particularly relate to a computing device. BACKGROUND

[0002] With the increasing demand for information and communication technology in modern society, data centers have also developed rapidly, and thus the information and communication technology (ICT) equipment in the data centers gradually develops from low density to high density. The high-density ICT equipment generates a large amount of heat during operation, and therefore the data center needs to set up a cooling system to ensure the normal operation of the ICT equipment in the data center.

[0003] In the related art, a data center includes a plurality of cabinets, a plurality of server nodes are arranged in the cabinets, the plurality of server nodes are stacked in the cabinets along a vertical direction, and a power supply busbar is arranged in the cabinet. The power supply busbar can be connected with a power supply module, and the plurality of server nodes can be electrically connected to the power supply busbar through connectors, respectively, so as to supply power to the server nodes by the power supply busbar. With the increase of the power of the cabinet, the carrying capacity of the power supply busbar is also increasing, which can easily lead to the increase of the temperature of the power supply busbar. Therefore, the power supply busbar needs to be provided with a heat dissipation service.

[0004] However, in order to achieve the heat dissipation of the power supply busbar, the volume and weight of the cabinet are finally increased in the related art, and the manufacturing cost is also increased. Utility model content

[0005] Embodiments of the present application provide a computing device, which realizes effective heat dissipation of the power supply busbar while ensuring that the volume and weight of the computing device are small.

[0006] Embodiments of the present application provide a computing device, which includes a cabinet, a plurality of servers, a power supply module and a power supply busbar. The plurality of servers, the power supply module and the power supply busbar are arranged in the cabinet. The power supply module is used to supply power to the servers. The power supply busbar includes a busbar assembly and a liquid cooling pipe. The busbar assembly includes a conductive power strip. One end of the conductive power strip is connected to the power supply module, and the other end is connected to the server through a connector, for transmitting the power of the power supply module to the server. Part of the liquid cooling pipe is arranged on the conductive power strip. An internal pipeline of the liquid cooling pipe forms a liquid cooling channel. Two ends of the liquid cooling pipe are provided with a liquid inlet end and a liquid outlet end which are in communication with the liquid cooling channel. The liquid inlet end is used for allowing a liquid cooling medium to enter the liquid cooling channel, and the liquid outlet end is used for allowing the liquid cooling medium to flow out of the liquid cooling channel, so as to dissipate heat of the busbar assembly.

[0007] The computing device provided by the embodiment of the present application can effectively reduce the structural complexity of the computing device, avoid increasing the manufacturing cost and volume of the computing device, by arranging the liquid cooling pipe, and circulating the liquid cooling medium in the liquid cooling pipe, on the basis of meeting the heat dissipation of the busbar assembly.

[0008] In a possible implementation, the liquid inlet end and the liquid outlet end extend outward from both ends of the conductive power strip along the length direction of the conductive power strip. The middle part of the liquid cooling pipe can be arranged on the conductive power strip along the length direction of the conductive power strip, so as to dissipate heat from the entire conductive power strip.

[0009] In a possible implementation, the number of liquid cooling pipes is multiple, and each liquid cooling pipe is arranged near the connection position of the conductive power strip and the connector. The connection position of the conductive power strip and the connector is prone to heat generation, and the liquid cooling pipe can be flexibly arranged according to different temperature regions on the conductive power strip, without the need to arrange the liquid cooling pipe on the entire conductive power strip, thereby effectively reducing the cost.

[0010] In a possible implementation, the busbar assembly further includes a cover plate, the conductive power strip is provided with a receiving groove, and part of the liquid cooling pipe is arranged in the receiving groove. The cover plate is arranged on the receiving groove to fix the liquid cooling pipe in the receiving groove. By arranging the receiving groove, the liquid cooling pipe can be arranged in the receiving groove, and the receiving groove provides a space for the liquid cooling pipe, avoiding direct arrangement of the liquid cooling pipe on the surface of the conductive power strip, avoiding increase in the size of the conductive power strip, and avoiding exposure of part of the liquid cooling pipe, thereby protecting the liquid cooling pipe.

[0011] In a possible implementation, a gap is formed between the outer wall of the liquid cooling pipe and the receiving groove, and the gap is filled with thermal conductive silicone grease. Arranging the thermal conductive silicone grease between the liquid cooling pipe and the conductive power strip can increase the heat conduction efficiency and facilitate rapid heat transfer from the conductive power strip to the liquid cooling pipe.

[0012] In a possible implementation, the conductive power strip is further provided with a sink groove in communication with the receiving groove at a position corresponding to the receiving groove, and the cover plate is adapted to the sink groove. The sink groove provides a space for the cover plate, so as to avoid increase in the volume of the conductive power strip in space.

[0013] In a possible implementation, the liquid cooling pipe is a straight pipe or a curved pipe with multiple bending parts. Therefore, different shapes of liquid cooling pipes can be selected according to different needs. When the liquid cooling pipe needs to be convenient to manufacture, a straight liquid cooling pipe is selected. When the liquid cooling pipe needs to be more flexible to arrange on the conductive power strip, a curved liquid cooling pipe can be selected.

[0014] In a possible implementation, the liquid cooling pipe is a polyethylene pipe or a fluoroplastic pipe, and the pressure resistance of the liquid cooling pipe is greater than or equal to 1.5 MPa. The polyethylene pipe or the fluoroplastic pipe has high strength and can support the circulation of liquid cooling medium with high pressure.

[0015] In a possible implementation, the number of busbar assemblies is two, the two busbar assemblies are a first electrode busbar assembly and a second electrode busbar assembly, and the first electrode busbar assembly and the second electrode busbar assembly are arranged side by side and insulated from each other; the liquid cooling pipe includes a first liquid cooling pipe and a second liquid cooling pipe; a portion of the first liquid cooling pipe is arranged in the first electrode busbar assembly, and two ends of the first liquid cooling pipe form a liquid inlet end and a liquid outlet end, respectively; and a portion of the second liquid cooling pipe is arranged in the second electrode busbar assembly, and two ends of the second liquid cooling pipe form a liquid inlet end and a liquid outlet end, respectively. By arranging two busbar assemblies, the two busbar assemblies can cooperate to supply power to the server, so that the structure of the power supply busbar is flexible and not bulky, and the liquid cooling pipe is arranged on the two busbar assemblies to increase the heat dissipation effect of the power supply busbar.

[0016] In a possible implementation, one of the first electrode busbar assembly and the second electrode busbar assembly is a positive busbar, and the other is a negative busbar; the positive busbar includes a positive fixed end and a positive contact end, and the negative busbar includes a negative fixed end and a negative contact end; surfaces of the positive contact end and the negative contact end are plated with silver, and surfaces of the positive fixed end and the negative fixed end are plated with nickel. The positive contact end and the negative contact end are combined to form a power terminal of the busbar assembly, and the positive fixed end and the negative fixed end are used to be fixedly connected to the case to fix the positions of the first electrode busbar assembly and the second electrode busbar assembly, facilitating the connection of the power terminal and the connector.

[0017] In a possible implementation, the power supply busbar further includes an insulating member located between the first electrode busbar assembly and the second electrode busbar assembly. The insulating member is located between the first electrode busbar assembly and the second electrode busbar assembly, and can effectively insulate the first electrode busbar assembly and the second electrode busbar assembly.

[0018] In a possible implementation, the power supply busbar further includes a housing, the busbar assemblies are arranged in the housing, the liquid inlet end and the liquid outlet end are located outside the housing, and the housing is provided with a plurality of heat dissipation holes. The housing can provide a support structure for the busbar assemblies, and at the same time, the housing can protect the busbar assemblies from being damaged, the heat dissipation holes can provide a ventilation structure for the busbar assemblies arranged on the fixed portions, and the ventilation and heat dissipation of the busbar assemblies are facilitated.

[0019] In a possible implementation, the housing includes a connecting portion and a fixed portion arranged at intervals on the connecting portion, and the busbar assemblies are connected to opposite ends of the two fixed portions. By arranging the fixed portions at intervals, the two busbar assemblies can be connected to different fixed portions, facilitating the insulation between the two busbar assemblies. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 is a structural schematic diagram of a computing device provided by an embodiment of the present application;

[0021] Figure 2 is a structural schematic diagram of the connector and the power supply busbar when connected, provided by an embodiment of the present application;

[0022] Figure 3 is a cross-sectional view of the power supply busbar, provided by an embodiment of the present application;

[0023] Figure 4 is a first exploded view of the power supply busbar, provided by an embodiment of the present application;

[0024] Figure 5 is a second exploded view of the power supply busbar, provided by an embodiment of the present application;

[0025] Figure 6 is a third exploded view of the power supply busbar, provided by an embodiment of the present application;

[0026] Figure 7 is a fourth exploded view of the power supply busbar, provided by an embodiment of the present application;

[0027] Figure 8 is a side view of the power supply busbar, provided by an embodiment of the present application;

[0028] Figure 9 is a fifth exploded view of the power supply busbar, provided by an embodiment of the present application.

[0029] Legend of reference signs:

[0030] 10, power supply busbar;

[0031] 11, shell; 111, connecting part; 112, fixing part; 113, heat dissipation hole;

[0032] 12, busbar assembly; 121, conductive busbar; 1211, accommodating groove; 1212, sink groove; 122, cover plate; 123, power supply terminal;

[0033] 13, first electrode busbar assembly; 131, positive fixed end; 132, positive contact end;

[0034] 14, second electrode busbar assembly; 141, negative fixed end; 142, negative contact end;

[0035] 15, insulating piece;

[0036] 16, liquid cooling pipe; 161, liquid cooling channel; 162, liquid inlet end; 163, liquid outlet end;

[0037] 17, first liquid cooling pipe; 18, second liquid cooling pipe;

[0038] 20, case; 30, server; 40, connector; 41, connecting joint; 50, power supply module; 60, liquid supply conduit. Detailed Implementation

[0039] This application provides a computing device, such as a rack server, which mainly includes a chassis and multiple servers mounted on the chassis. A power supply busbar can be connected to an external power source, and the multiple servers can be electrically connected to the power supply busbar via connectors, thereby enabling the power supply busbar to supply power to the multiple servers.

[0040] In this embodiment, the power supply busbar has a good heat dissipation effect, which enables it to effectively dissipate heat when the current carrying capacity is increasing. It does not need to increase the volume of the power supply busbar for heat dissipation, and can reduce the weight without increasing the weight while ensuring heat dissipation, thereby reducing the cost and installation difficulty.

[0041] The computing device provided in the embodiments of this application will be described in detail below through specific implementation methods.

[0042] Figure 1 This is a schematic diagram of the structure of the computing device provided in the embodiments of this application. Figure 2 This is a schematic diagram of the connection between the connector and the power supply bus provided in the embodiment of this application.

[0043] See Figure 1 and Figure 2 As shown, this application embodiment provides a computing device, which includes a chassis 20, multiple servers 30, a power supply module 50, and a power supply busbar 10. The chassis 20 serves as the overall framework of the computing device and can provide support and installation environment for the various structural components of the computing device. The multiple servers 30, the power supply module 50, and the power supply busbar 10 can all be installed inside the chassis 20.

[0044] The power supply module 50 provides electrical energy, and the power supply bus 10 can be connected between the power supply module 50 and the server 30 to guide the electrical energy of the power supply module 50 to the server 30 to power the server 30. It should be noted that the server 30 is connected to a connector 40, which has a connection joint 41. The server 30 is connected to the power supply bus 10 through the connection joint 41 of the connector 40.

[0045] In some feasible implementations, a liquid supply conduit 60 is also provided on the chassis of the computing device, and a liquid cooling device is installed inside the server 30. The liquid supply conduit 60 is connected to the liquid cooling device, and is used to deliver liquid cooling fluid to the server's liquid cooling device for heat dissipation. The liquid cooling fluid in the computing device can be provided by a liquid cooling system, which includes a liquid supply device and a heat exchange device. The liquid supply device is connected to the liquid supply conduit 60 to provide liquid cooling fluid to the liquid supply conduit 60.

[0046] For example, the liquid cooling system inside the computing device for providing the liquid cooling medium for the server heat dissipation is a CDU (Coolant Distribution Unit), and the liquid cooling medium provided by the liquid cooling system is an electrically conductive medium, such as 75% water + 25% glycol.

[0047] Figure 3 is a sectional view of the power supply busbar provided by an embodiment of the present application, Figure 4 is a first exploded view of the power supply busbar provided by an embodiment of the present application, Figure 5 is a second exploded view of the power supply busbar provided by an embodiment of the present application, Figure 6 is a third exploded view of the power supply busbar provided by an embodiment of the present application.

[0048] The power supply busbar of the embodiment of the present application includes a busbar assembly 12 and a liquid cooling pipe 16. One end of the busbar assembly 12 can be electrically connected to a power supply module 50, and the other end of the busbar assembly 12 can be electrically connected to a connector 40, for transmitting electric energy to the server 30 through the connector 40.

[0049] The liquid cooling pipe 16 of the embodiment of the present application is arranged on the busbar assembly 12, and can dissipate heat from the busbar assembly 12 by conveying the liquid cooling medium in the interior of the liquid cooling pipe 16.

[0050] Specifically, referring to Figure 4 In some implementable manners, the interior of the liquid cooling pipe 16 forms a liquid cooling channel 161, both ends of the liquid cooling pipe 16 are open and communicate with the interior of the liquid cooling pipe 16, and the two ends of the liquid cooling pipe 16 form a liquid inlet end 162 and a liquid outlet end 163, respectively. The liquid cooling medium can flow into the liquid cooling pipe 16 through one end of the liquid cooling pipe 16 and flow out through the other end of the liquid cooling pipe 16.

[0051] When the busbar assembly 12 is connected to the connector 40, the busbar assembly 12 can transmit the electric energy of the power supply module 50 to the connector 40. During the transmission of the electric energy, heat is more likely to be generated near the position where the busbar assembly 12 is connected to the connector 40. These heat generation areas of the busbar assembly 12 are the heat dissipation areas of the busbar assembly 12. The part of the liquid cooling pipe 16 between the liquid inlet end 162 and the liquid outlet end 163 is arranged in the heat dissipation area of the busbar assembly 12. When the liquid cooling medium flows in the liquid cooling pipe 16, the liquid cooling medium can take away the heat of the heat dissipation area of the busbar assembly 12, so as to dissipate heat from the busbar assembly 12.

[0052] It should be noted that the part of the liquid cooling pipe 16 can be arranged in the busbar assembly 12 by embedding, or can be directly fixed in the busbar assembly 12 by a fixing structure. The specific arrangement manner is not limited.

[0053] In some possible implementation manners, in the embodiment of the present application, the liquid cooling system for providing the liquid cooling medium for the server cooling can be directly provided with the liquid cooling medium for the liquid cooling pipe, for example, the liquid supply conduit 60 can also be in communication with the liquid inlet end 162 of the liquid cooling pipe 16, so that the liquid supply device can provide the liquid cooling medium for the liquid cooling pipe 16, and the heat exchange device can be in communication with the liquid outlet end 163 of the liquid cooling pipe, so that the liquid cooling channel 161 of the liquid cooling pipe forms a circulation loop with the liquid supply device and the heat exchange device.

[0054] In the embodiment of the present application, the liquid cooling pipe 16 is arranged in the busbar assembly 12, and the liquid cooling pipe 16 has the liquid cooling channel 161, the liquid inlet end 162 and the liquid outlet end 163 in communication, the liquid cooling medium can be input into the liquid cooling channel 161 through the liquid inlet end 162, and the liquid cooling medium in the liquid cooling channel 161 can flow out from the liquid outlet end 163, so that a liquid cooling circulation flow channel is formed between the liquid cooling channel 161, the liquid inlet end 162 and the liquid outlet end 163, so that the liquid cooling medium can continuously enter the busbar assembly 12 from the outside, and the liquid cooling medium can continuously cool the busbar assembly 12 when circulating in the liquid cooling channel 161, thereby increasing the cooling effect of the busbar assembly 12. In the present application, the liquid cooling pipe 16 is arranged, and the liquid cooling medium flows in the liquid cooling pipe 16, so as to avoid direct contact with the busbar assembly 12. Therefore, the liquid cooling medium required for cooling the busbar assembly 12 in the present application can be directly provided by the liquid cooling system for providing the server 30 with cooling in the computing device, without the need to increase the additional liquid cooling system. On the basis of meeting the cooling of the busbar assembly 12, the structural complexity of the computing device is effectively reduced, and the manufacturing cost and volume of the computing device are avoided to be increased.

[0055] In addition, the liquid cooling medium is used to cool the busbar assembly 12 in the present application, without the need to increase the surface area of the busbar assembly 12 to increase the cooling effect, so as to reduce the volume and weight of the busbar assembly 12, reduce the manufacturing cost thereof, and facilitate the assembly and installation of the busbar assembly 12 in the case.

[0056] It should be noted that the temperature of different positions of the busbar assembly 12 is different according to the actual situation. For example, if part of the busbar assembly 12 is connected with the server 30 and the other part is not connected with the server 30, the temperature of the position connected with the server 30 is higher than that of the position not connected with the server 30. In this way, the temperature of different positions of the busbar assembly 12 is different according to whether the server 30 is connected and the number of the server 30 connected. The temperature of the position connected with the server 30 is relatively higher than that of the position not connected with the server 30, and the temperature of the position connected with more servers 30 is higher than that of the position connected with less servers 30. Therefore, in order to reasonably dissipate heat for the busbar assembly 12, at least the liquid cooling channel 161 needs to be arranged at the position with higher temperature, so as to dissipate heat for the high-temperature area of the busbar assembly 12, so as to realize the local heat dissipation effect of the busbar assembly 12. Of course, in order to ensure that the temperature of the busbar assembly 12 is low, the liquid cooling channel 161 can also be arranged at the position with lower temperature.

[0057] Referring to Figure 4 In the embodiment of the present application, the busbar assembly 12 includes the conductive busbar 121 and the cover plate 122. The conductive busbar 121 is used as the conductive structure of the busbar assembly 12, and is mainly used for transmitting the power of the power supply to the server 30. Therefore, the conductive busbar 121 is the main heat generating structure of the busbar assembly 12. The cover plate 122 can be used as a fixing structure to fix the liquid cooling pipe 16 on the conductive busbar 121. For example, the liquid cooling pipe 16 can be arranged between the conductive busbar 121 and the cover plate 122, and the cover plate 122 can be fixedly connected to the conductive busbar 121 through a clamping structure, a buckling structure or a screw, so as to clamp the liquid cooling pipe 16 between the conductive busbar 121 and the cover plate 122, and fix the position of the liquid cooling pipe 16.

[0058] It is worth mentioning that when the liquid cooling pipe 16 is arranged, the inlet end 162 and the outlet end 163 of the liquid cooling pipe 16 are arranged to extend outward from both ends of the conductive busbar 121 along the length direction of the conductive busbar 121. In this way, the liquid cooling pipe 16 can at least extend along the length direction of the conductive busbar 121, and can dissipate heat for the position of the conductive busbar 121 in the length direction.

[0059] Of course, the inlet end 162 and the outlet end 163 of the liquid cooling pipe 16 can also extend outward on the same side of the conductive busbar 121, or extend outward on the adjacent two sides of the conductive busbar 121, which is not limited herein.

[0060] Referring to Figure 4As shown, in some possible implementation manners, the accommodation groove 1211 can also be formed on the conductive power strip 121, and part of the liquid cooling pipe 16 is accommodated in the accommodation groove 1211, and the cover plate 122 is arranged on the accommodation groove 1211 to fix the liquid cooling pipe 16 in the accommodation groove 1211. The accommodation groove 1211 plays a role of providing space, and the accommodation groove 1211 can reduce the size of the corresponding position of the conductive power strip 121 to provide space for the liquid cooling pipe 16, so that the size of the conductive power strip 121 at the position where the liquid cooling pipe 16 is arranged remains unchanged.

[0061] In addition, when the cover plate 122 is arranged on the accommodation groove 1211, the liquid cooling pipe 16 in the accommodation groove 1211 can be enclosed in the conductive power strip 121, so that the liquid cooling pipe 16 is not exposed to the outside through cooperation of the cover plate 122 and the accommodation groove 1211, and the liquid cooling pipe 16 is protected.

[0062] It should be noted that the size of the accommodation groove 1211 needs to be sufficient to accommodate the liquid cooling pipe 16, and the shape of the accommodation groove 1211 can not be limited, for example, the accommodation groove 1211 can be a square or an irregularly shaped groove.

[0063] In some possible implementation manners, the extension path of the accommodation groove 1211 on the conductive power strip 121 needs to be adapted to the extension path of the liquid cooling pipe 16, and the shape and area of the cross section of the accommodation groove 1211 on the extension path are consistent.

[0064] In some possible implementation manners, the accommodation groove 1211 can be formed only on the conductive power strip 121, or only part of the accommodation groove 1211 structure capable of accommodating the liquid cooling pipe 16 is formed on the conductive power strip 121, and the other part of the accommodation groove 1211 is formed on the cover plate 122. When the cover plate 122 is arranged on the conductive power strip 121, the part of the accommodation groove 1211 structure on the cover plate 122 and the part of the accommodation groove 1211 structure on the conductive power strip 121 form the entire accommodation groove 1211, so that the size of the groove on the conductive power strip 121 can be reduced, and the size required for the groove can be reduced.

[0065] It should be noted that, in order to increase the heat conduction efficiency between the liquid cooling pipe 16 and the conductive power strip 121, a gap can be arranged between the outer wall of the liquid cooling pipe 16 and the accommodation groove 1211, and the gap is filled with heat-conducting silicone grease. The heat-conducting silicone grease arranged between the liquid cooling pipe 16 and the conductive power strip 121 can increase the efficiency of heat propagation.

[0066] In some possible implementation manners, in order to guarantee the integrity of the shape of the conductive busbar 121 and to avoid increasing the size of the conductive busbar 121 in space, the surface of the cover plate 122 needs to be flush with the surface of the conductive busbar 121. For example, a sunken groove 1212 that is in communication with the accommodating groove 1211 can be formed on the conductive busbar 121 at a position corresponding to the accommodating groove 1211, and the shape and size of the sunken groove 1212 are matched with the shape and size of the cover plate 122, so that the cover plate 122 can be fitted into the sunken groove 1212. In this way, by fitting the cover plate 122 into the sunken groove 1212, the sunken groove 1212 functions as a space for the cover plate 122, so that the surface of the cover plate 122 is flush with the surface of the conductive busbar 121, and the size of the conductive busbar 121 in space is not increased.

[0067] Please refer to Figure 4 to Figure 6 As shown in FIG. 1, in some possible implementation manners, the liquid cooling pipe 16 can be a straight pipe or a curved pipe with multiple bending portions. When the liquid cooling pipe 16 is a straight pipe, the liquid inlet end 162 and the liquid outlet end 163 of the liquid cooling pipe 16 are located at two ends in the length direction of the liquid cooling pipe 16, and at this time, the liquid cooling pipe 16 can extend along the length direction of the conductive busbar 121 to cool the position near the liquid cooling pipe 16 on the conductive busbar 121.

[0068] When the liquid cooling pipe 16 is a curved pipe, the relative positions of the liquid inlet end 162 and the liquid outlet end 163 of the liquid cooling pipe 16 are indefinite, and the curved liquid cooling pipe 16 is convenient to arrange in a partial region of the conductive busbar 121, for example, can be arranged at two ends in the length direction of the conductive busbar 121, or can be arranged at any position in the length direction of the conductive busbar 121.

[0069] In addition, the liquid inlet end 162 and the liquid outlet end 163 of the curved liquid cooling pipe 16 can be arranged at two ends in the length direction of the conductive busbar 121, and the bending portions between the liquid inlet end 162 and the liquid outlet end 163 can be distributed along the length direction of the conductive busbar 121 to cool the entire conductive busbar 121.

[0070] Alternatively, the liquid inlet end 162 and the liquid outlet end 163 of the curved liquid cooling pipe 16 can be arranged at two ends in the length direction of the conductive busbar 121, and multiple spaced bending portions are arranged between the liquid inlet end 162 and the liquid outlet end 163, and the adjacent two bending portions are connected, and the positions of the bending portions can be set according to the positions of the regions that need to be cooled on the conductive busbar 121, so as to cool the conductive busbar 121.

[0071] It should be noted that the liquid cooling pipe 16 can be a hard pipe or a hose, and needs to be determined according to actual needs. In the embodiment of the present application, the liquid cooling pipe 16 is a PE (Polyethylene) pipe or a fluoroplastic pipe. In order to ensure the strength of the liquid cooling pipe 16 and avoid the situation that the liquid cooling pipe 16 is broken due to excessive pressure of the flowing liquid cooling medium, the pressure resistance of the liquid cooling pipe 16 is set to be greater than or equal to 1.5 MPa in the embodiment of the present application.

[0072] Figure 7 is a fourth exploded view of the power supply busbar provided by the embodiment of the present application, Figure 8 is a side view of the power supply busbar provided by the embodiment of the present application.

[0073] Referring to Figure 7 In some implementable manners, the number of the busbar assemblies 12 is two, and the two busbar assemblies 12 are respectively a first electrode busbar assembly 13 and a second electrode busbar assembly 14. The first electrode busbar assembly 13 and the second electrode busbar assembly 14 are cooperatively implemented to supply power to the server.

[0074] In order to ensure that the first electrode busbar assembly 13 and the second electrode busbar assembly 14 do not affect each other, the first electrode busbar assembly 13 and the second electrode busbar assembly 14 need to be insulated.

[0075] In order to facilitate combination, the shape and size of the first electrode busbar assembly 13 and the second electrode busbar assembly 14 are set to be consistent or similar. In order to ensure the rationalization of the space occupied by the first electrode busbar assembly 13 and the second electrode busbar assembly 14, the first electrode busbar assembly 13 and the second electrode busbar assembly 14 are arranged side by side, and the length direction of the first electrode busbar assembly 13 and the second electrode busbar assembly 14 is parallel.

[0076] It should be noted that in order to dissipate heat for the first electrode busbar assembly 13 and the second electrode busbar assembly 14, the liquid cooling pipe 16 includes a first liquid cooling pipe 17 and a second liquid cooling pipe 18. Part of the first liquid cooling pipe 17 is arranged in the first electrode busbar assembly 13, and the two ends of the first liquid cooling pipe 17 respectively form a liquid inlet end 162 and a liquid outlet end 163.

[0077] Part of the second liquid cooling pipe 18 is arranged in the second electrode busbar assembly 14, and the two ends of the second liquid cooling pipe 18 respectively form a liquid inlet end 162 and a liquid outlet end 163.

[0078] By respectively arranging the first liquid cooling pipe 17 and the second liquid cooling pipe 18 on the first electrode busbar assembly 13 and the second electrode busbar assembly 14, the first electrode busbar assembly 13 and the second electrode busbar assembly 14 can be respectively cooled.

[0079] In some feasible implementations, the first liquid cooling pipe 17 on the first electrode busbar assembly 13 and the second liquid cooling pipe 18 on the second electrode busbar assembly 14 can be independently configured, so that the first liquid cooling pipe 17 and the second liquid cooling pipe 18 are not connected to each other. In this case, a working fluid supply system is required to provide working fluid for each of the first liquid cooling pipe 17 and the second liquid cooling pipe 18. By configuring the first liquid cooling pipe 17 and the second liquid cooling pipe 18 independently, the two liquid cooling pipes 16 do not affect each other, which facilitates subsequent maintenance and repair work.

[0080] Alternatively, please combine Figure 8 As shown, the ends of the first liquid cooling pipe 17 and the second liquid cooling pipe 18 can also be connected, for example, by connecting the outlet end 163 of the first liquid cooling pipe 17 to the inlet end 162 of the second liquid cooling pipe 18. This requires only one liquid supply system. The liquid cooling medium can enter the first liquid cooling pipe 17 through the inlet end 162, and the liquid cooling medium in the first liquid cooling pipe 17 can flow into the second liquid cooling pipe 18, and then flow back to the liquid supply system through the outlet end 163 of the second liquid cooling pipe 18. By connecting the first liquid cooling pipe 17 and the second liquid cooling pipe 18, the number of liquid supply systems can be reduced, which not only reduces the complexity of the structure but also lowers the cost.

[0081] Whether the first liquid cooling pipe 17 and the second liquid cooling pipe 18 need to be connected together depends on the actual needs and is not limited in this embodiment.

[0082] In some feasible implementations, one of the first electrode busbar assembly 13 and the second electrode busbar assembly 14 is a positive busbar and the other is a negative busbar. The positive busbar provides positive power to the server, and the negative busbar provides negative power to the server. In this embodiment, the example of the first electrode busbar assembly 13 being a positive busbar and the second motor busbar assembly 12 being a negative busbar will be described.

[0083] The first electrode busbar assembly 13 includes a positive terminal 131 and a positive contact terminal 132, and the second electrode busbar assembly 14 includes a negative terminal 141 and a negative contact terminal 142. The positive terminal 131 and the negative terminal 141 are used to connect within the chassis 20 to fix the positions of the first electrode busbar assembly 13 and the second motor busbar assembly 12. The positive contact terminal 132 and the negative contact terminal 142 are combined for connection with the connector 40.

[0084] It should be noted that, in order to ensure the stability of the power transmission between the busbar assembly 12 and the connector 40, the surfaces of the positive contact end 132 and the negative contact end 142 are plated with silver to increase the conductivity. The first electrode busbar assembly 13 and the second electrode busbar assembly 12 are usually made of copper, and in order to protect the busbar assembly 12 from corrosion or oxidation, the surfaces of the positive fixed end 131 and the negative fixed end 141 are plated with nickel to protect the positive fixed end 131 and the negative fixed end 141.

[0085] In some possible implementations, the first electrode busbar assembly 13 and the second electrode busbar assembly 14 need to be insulated, and the first electrode busbar assembly 13 and the second electrode busbar assembly 14 can be spaced apart to achieve insulation, or an insulating piece 15 can be arranged between the first electrode busbar assembly 13 and the second electrode busbar assembly 14, so that the first electrode busbar assembly 13 and the second electrode busbar assembly 14 are insulated by the insulating piece 15.

[0086] It should be noted that the insulating piece 15 can be directly inserted into the gap between the first electrode busbar assembly 13 and the second electrode busbar assembly 14, or the first electrode busbar assembly 13 and the second electrode busbar assembly 14 can be fixedly connected to the opposite ends of the insulating piece 15 by fasteners. In the embodiment of the present application, the first electrode busbar assembly 13 and the second electrode busbar assembly 14 are connected to the insulating piece 15 by screws or rivets.

[0087] In some possible implementations, the positive contact end 132 and the negative contact end 142 can be attached to the end of the insulating piece 15, respectively, and the positive contact end 132, the negative contact end 142 and the end of the insulating piece 15 are combined into a connecting end 123 for connecting the connector 40. The connecting end 123 can be connected to the connector 40.

[0088] Specifically, in the embodiment of the present application, the connector 40 is provided with two spaced apart connecting joints 41, the connecting end 123 can be inserted into the gap between the two connecting joints 41, and the positive contact end 132 and the negative contact end 142 are connected to the corresponding connecting joints 41, respectively, to realize the electrical connection between the power supply busbar 10 and the connector 40.

[0089] Figure 9 is a fifth exploded view of the power supply busbar provided by the embodiment of the present application.

[0090] Referring to Figure 2 and Figure 9As shown, the power supply busbar 10 further comprises a housing 11, the busbar assembly 12 is arranged in the housing 11, and the liquid inlet end 162 and the liquid outlet end 163 are located outside the housing 11. The housing 11 can be mounted in the case 20 of the computing device through fasteners. The housing 11 not only provides a support structure for the busbar assembly 12 so that it can be fixed in the case 20, but also provides protection for the busbar assembly 12, so that the busbar assembly 12 is not easily damaged.

[0091] The housing 11 at least comprises a structure capable of connecting the first electrode busbar assembly 13 and the second electrode busbar assembly 12. The first electrode busbar assembly 13 and the second electrode busbar assembly 14 are fixed in relative positions by being connected to the housing 11. It should be noted that, in order to meet the strength requirement, the housing 11 is generally made of metal material. In order to avoid electrical connection between the first electrode busbar assembly 13 and the second electrode busbar assembly 14 through the housing 11, an insulating member 15 needs to be arranged between the first electrode busbar assembly 13 and the housing 11 and between the second electrode busbar assembly 14 and the housing 11, so as to ensure that the first electrode busbar assembly 13 and the second electrode busbar assembly 14 do not contact the housing 11.

[0092] In some possible implementation manners, the housing 11 comprises a connecting portion 111 and two fixing portions 112 arranged at the connecting portion 111 and located on the same side of the connecting portion 111. A three-side-open accommodating space is formed between the two fixing portions 112 and the connecting portion 111. The busbar assembly 12 can be located in the accommodating space. The first electrode busbar assembly 13 and the second electrode busbar assembly 14 are respectively connected to opposite ends of the two fixing portions 112. The insulating member 15 is located between the first electrode busbar assembly 13 and the second electrode busbar assembly 14. The liquid inlet end 162 and the liquid outlet end 163 of the first liquid cooling pipe 17 and the second liquid cooling pipe 18 can respectively extend out of the opposite two openings of the accommodating space. The connecting end 123 of the busbar assembly 12 is arranged close to the other opening of the accommodating space, so as to facilitate connection with the connector 40.

[0093] It should be noted that the housing 11 can also be provided with only one fixing portion 112 connected to the connecting portion 111. The first electrode busbar assembly 13 and the second electrode busbar assembly 14 can be connected to opposite two ends of the fixing portion 112 at the same time. The first electrode busbar assembly 13 and the second electrode busbar assembly 14 are separated from the fixing portion 112 by the insulating member 15.

[0094] In the embodiments of the present application, the busbar assembly 12 is arranged in the accommodating space of the shell 11. In order to ensure the heat dissipation effect of the busbar assembly 12, a plurality of heat dissipation holes 113 can be arranged on the shell 11. The plurality of heat dissipation holes 113 can be arranged on the shell 11 in a matrix manner, and the diameter of the heat dissipation hole 113 can be greater than or equal to 2 mm. By arranging the heat dissipation hole 113 on the shell 11, the ventilation and heat dissipation of the busbar assembly 12 are facilitated.

[0095] In the description of the embodiments of the present application, it should be noted that, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connecting" should be understood in a broad sense, for example, can be fixedly connected, can be indirectly connected through an intermediate medium, can be the communication inside two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0096] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the embodiments of the present application have been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A computing device, comprising: The application relates to a cabinet, a plurality of servers arranged in the cabinet, a power supply module arranged in the cabinet and used for supplying power to the servers, and a computing device arranged in the cabinet and comprising a busbar assembly and a liquid cooling pipe. The liquid inlet end and the liquid outlet end extend outward from both ends of the conductive busbar along the length direction of the conductive busbar. The number of the liquid cooling pipes is plural, and each liquid cooling pipe is arranged near the position where the conductive busbar is connected with the connector. The busbar assembly further comprises a cover plate, the conductive busbar is provided with a containing groove, the liquid cooling pipe is partially contained in the containing groove, and the cover plate is arranged on the containing groove to fix the liquid cooling pipe in the containing groove. The gap between the outer wall of the liquid cooling pipe and the containing groove is filled with heat-conducting silicone grease. The conductive busbar is further provided with a sink groove corresponding to the containing groove and communicating with the containing groove, and the cover plate is adapted to the sink groove.

2. The computing device of claim 1, wherein, The liquid cooling pipe is a polyethylene pipe or a fluoroplastic pipe, and the pressure resistance of the liquid cooling pipe is greater than or equal to 1.5 MPa.

3. The computing device of claim 1, wherein, The number of the busbar assemblies is two, and the two busbar assemblies are a first electrode busbar assembly and a second electrode busbar assembly.

4. The computing device of claim 1, wherein, The liquid cooling pipe comprises a first liquid cooling pipe and a second liquid cooling pipe.

5. The computing device of claim 4, wherein, Part of the first liquid cooling pipe is arranged in the first electrode busbar assembly, and both ends of the first liquid cooling pipe form the liquid inlet end and the liquid outlet end respectively.

6. The computing device of claim 5, wherein, Part of the second liquid cooling pipe is arranged in the second electrode busbar assembly, and both ends of the second liquid cooling pipe form the liquid inlet end and the liquid outlet end respectively.

7. The computing device of any of claims 1-6, wherein, One of the first electrode busbar assembly and the second electrode busbar assembly is a positive busbar, and the other is a negative busbar.

8. The computing device of any of claims 1-6, wherein, The positive busbar comprises a positive fixed end and a positive contact end, the negative busbar further comprises a negative fixed end and a negative contact end, the surface of the positive contact end and the negative contact end is plated with silver, and the surface of the positive fixed end and the negative fixed end is plated with nickel. The application further relates to an outer shell, the busbar assembly is arranged in the outer shell, the liquid inlet end and the liquid outlet end are located outside the outer shell, and the outer shell is provided with a plurality of heat dissipation holes. ​ ​ 9. The computing device of claim 8, wherein, ​ ​ 10. The computing device of any of claims 1-6, wherein, ​ ​

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