Heat dissipation substrate, heat dissipation assembly and light source module

Abstract

The utility model provides a kind of heat dissipation substrate, heat dissipation assembly and light source module, heat dissipation substrate includes heat dissipation substrate body and insulating coating, heat dissipation substrate body has first surface and second surface, second surface and first surface are located at the opposite sides of heat dissipation substrate body respectively, first surface includes coating area and first heat dissipation area, second surface includes second heat dissipation area, first heat dissipation area and second heat dissipation area are used for mounting radiator;Insulating coating is set to coating area, and insulating coating is used for mounting electronic device.Such, relative to the heat dissipation substrate in relevant art, the heat dissipation substrate of the application is by setting first heat dissipation area and coating area on first surface, and insulating coating is set to coating area, it is helpful to reduce the coverage area of insulating coating, so that more surface of heat dissipation substrate can be directly contacted with outside, and then it is helpful to the heat dissipation substrate with more effective heat dissipation area.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat dissipation, and in particular to a heat dissipation substrate, a heat dissipation assembly and a light source module. BACKGROUND

[0002] The heat dissipation substrate can be used for mounting electronic devices and heat sinks, and the heat dissipation substrate can conduct heat of the electronic devices to the heat sinks. In order to facilitate electrical isolation between the heat dissipation substrate and the electronic devices, the heat dissipation substrate can be provided with an insulating coating, and the electronic devices can be arranged on the insulating coating. However, the heat dissipation substrate has poor heat conduction capacity, and the heat of the heat dissipation substrate is not easy to dissipate to the heat sinks through the insulating coating, resulting in poor heat dissipation effect of the heat dissipation substrate. CONTENT

[0003] The heat dissipation substrate, the heat dissipation assembly and the light source module provided by the present application can improve at least one of the above problems.

[0004] The heat dissipation substrate, the heat dissipation assembly and the light source module provided by the present application can improve at least one of the above problems.

[0005] In a first aspect, the present application provides a heat dissipation substrate, which comprises a heat dissipation substrate body and an insulating coating. The heat dissipation substrate body has a first surface and a second surface, and the second surface and the first surface are located on opposite sides of the heat dissipation substrate body. The first surface comprises a coating area and a first heat dissipation area, and the second surface comprises a second heat dissipation area. The first heat dissipation area and the second heat dissipation area are used for mounting heat sinks. The insulating coating is arranged on the coating area, and the insulating coating is used for mounting electronic devices.

[0006] In some embodiments, the first surface comprises a central region and a peripheral region connected to each other, and the peripheral region is arranged around the central region. The first heat dissipation area is the central region and a part of the peripheral region, and the coating area is another part of the peripheral region.

[0007] In some embodiments, the heat dissipation substrate body is provided with a mounting through hole, and the mounting through hole penetrates the first surface and the second surface.

[0008] In some embodiments, the number of mounting through holes is multiple, and the multiple mounting through holes are distributed at intervals.

[0009] In some embodiments, the first heat dissipation area and the coating area are both provided with a mounting through hole.

[0010] In a second aspect, the present application also provides a heat dissipation assembly, which comprises a housing, a heat sink and the heat dissipation substrate of any of the above embodiments. The housing is arranged on the first heat dissipation area, and the heat sink is arranged on the second heat dissipation area.

[0011] In some embodiments, the heat sink comprises a plurality of fins, and two adjacent fins are oppositely and spacedly arranged.

[0012] In a third aspect, the utility model provides a light source module, the light source module comprises electronic device and the heat dissipation component of any of the above embodiments, and the electronic device comprises a light source, and the light source is arranged on the side of the insulating coating away from the heat dissipation substrate body.

[0013] In some embodiments, the housing is provided with a light guide channel, and the light emitted by the light source is emitted to the outside of the housing from the light guide channel.

[0014] In some embodiments, the light source module further comprises an optical element, and the optical element is arranged in the light guide channel, and the light emitted by the light source is emitted to the outside of the housing after passing through the optical element.

[0015] Compared with the heat dissipation substrate in the related art, the heat dissipation substrate of the present application is provided with the first heat dissipation region and the coating region on the first surface, and the insulating coating is arranged in the coating region, which helps to reduce the coverage area of the insulating coating, so that more surfaces of the heat dissipation substrate can be directly contacted with the outside, thereby helping the heat dissipation substrate to have more effective heat dissipation area. In addition, the first heat dissipation region and the second heat dissipation region can simultaneously dissipate heat, thereby helping to improve the heat conduction efficiency of the entire heat dissipation substrate. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0017] Figure 1 The structure schematic diagram of the heat dissipation substrate provided by the utility model embodiment is shown.

[0018] Figure 2 The structure schematic diagram of the heat dissipation substrate provided by the utility model embodiment is shown. Figure 1 The structure schematic diagram of the heat dissipation substrate provided by the utility model embodiment is shown.

[0019] Figure 3 The structure schematic diagram of the heat dissipation substrate provided by the utility model embodiment is shown. Figure 1 The structure schematic diagram of the heat dissipation substrate provided by the utility model embodiment is shown.

[0020] Figure 4 The structure schematic diagram of the heat dissipation component provided by the utility model embodiment is shown.

[0021] Figure 5 The structure schematic diagram of the light source module provided by the utility model embodiment is shown.

[0022] EXPLANATION OF REFERENCE NUMBERS:

[0023] heat dissipation substrate 10, heat dissipation assembly 20, light source module 30, heat dissipation substrate body 100, first surface 110, coating area 111, first heat dissipation area 112, central area 113, peripheral area 114, second surface 120, second heat dissipation area 121, mounting through hole 130, insulating coating 200, heat sink 300, heat dissipation fin 310, electronic device 400, light source 410, shell 500, light guide through hole 510, optical element 600. DETAILED DESCRIPTION

[0024] In order to make the personnel in the technical field better understand the technical scheme of the present application, the technical scheme in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by the person skilled in the art without creative labor are within the scope of protection of the present application.

[0025] The technical scheme in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application.

[0026] Please refer to Figures 1 to 5 The embodiments of the present application provide a heat dissipation substrate 10, which comprises a heat dissipation substrate body 100 and an insulating coating 200. The heat dissipation substrate body 100 has a first surface 110 and a second surface 120. The second surface 120 and the first surface 110 are located on opposite sides of the heat dissipation substrate body 100, respectively. The first surface 110 comprises a coating area 111 and a first heat dissipation area 112. The second surface 120 comprises a second heat dissipation area 121. The first heat dissipation area 112 and the second heat dissipation area 121 are used for mounting a heat sink 300. The insulating coating 200 is arranged on the coating area 111. The insulating coating 200 is used for mounting an electronic device 400. Thus, compared with the heat dissipation substrate in the related art, the heat dissipation substrate 10 of the present application is provided with the first heat dissipation area 112 and the coating area 111 on the first surface 110, and the insulating coating 200 is arranged on the coating area 111, which helps to reduce the coverage area of the insulating coating 200, so that more surfaces of the heat dissipation substrate 10 can be directly contacted with the outside, thereby helping the heat dissipation substrate 10 to have more effective heat dissipation area.

[0027] In addition, the first heat dissipation area 112 and the second heat dissipation area 121 can simultaneously dissipate heat, thereby helping to improve the efficiency of conduction heat dissipation of the entire heat dissipation substrate 10.

[0028] In some embodiments, the first surface 110 comprises a central region 113 and a peripheral region 114 connected to each other, the peripheral region 114 is arranged around the central region 113; the first heat dissipation region 112 is the central region 113 and a part of the peripheral region 114, and the coating region 111 is another part of the peripheral region 114. In this way, the central region 113 as the first heat dissipation region 112 can concentrate the heat from the heat source (such as electronic components, etc.) and conduct it. In addition, a part of the peripheral region 114 also serves as the first heat dissipation region 112, which can further disperse the heat, ensure the uniform distribution of heat on the entire heat dissipation substrate 10, reduce the formation of local hot spots, and improve the heat dissipation efficiency.

[0029] Please refer to Figures 1 to 3 In some embodiments, the heat dissipation substrate body 100 is provided with a mounting through hole 130, which penetrates the first surface 110 and the second surface 120. The position of the mounting through hole 130 can be designed according to the actual situation. The cross section of the mounting through hole 130 can be circular, triangular or square, etc. In this way, the mounting through hole 130 can be used to install a fixing screw or other connecting member, which facilitates the assembly of the heat dissipation substrate 10 and other components.

[0030] In addition, the presence of the mounting through hole 130 helps to reduce the material usage of the heat dissipation substrate 10, thereby helping to reduce the overall weight of the heat dissipation substrate 10, and helping to reduce the manufacturing cost of the heat dissipation substrate 10.

[0031] Moreover, the mounting through hole 130 helps to alleviate the stress concentration of the heat dissipation substrate 10 caused by temperature, thereby helping to reduce the risk of deformation of the heat dissipation substrate 10.

[0032] In some embodiments, the number of mounting through holes 130 is multiple, and the multiple mounting through holes 130 are distributed at intervals. The multiple mounting through holes 130 can be arranged in an array; or the multiple mounting through holes 130 can be arranged irregularly. In this way, the multiple mounting through holes 130 can be used to install a fixing screw or other connecting member, which facilitates the assembly of the heat dissipation substrate 10 and other components, thereby facilitating the stability and firmness of the connection between the heat dissipation substrate 10 and other components.

[0033] In addition, the multiple mounting through holes 130 further help to reduce the material usage of the heat dissipation substrate 10, thereby further helping to reduce the overall weight of the heat dissipation substrate 10, and further helping to reduce the manufacturing cost of the heat dissipation substrate 10.

[0034] In some embodiments, the first heat dissipation region 112 and the coating region 111 are both provided with mounting through holes 130. In this way, the mounting through holes 130 are provided on the first heat dissipation region 112 and the coating region 111, which helps to provide multiple-point fixation for the connection between the heat dissipation substrate 10 and other components, thereby increasing the stability and firmness of the connection between the heat dissipation substrate 10 and other components.

[0035] In some embodiments, the color of the first heat dissipation region 112 is different from the color of the insulating coating 200. In this way, since the color of the first heat dissipation region 112 is different from the color of the insulating coating 200, the user can distinguish the position of the first heat dissipation region 112 and the position of the coating region 111 by the different colors, which helps the user to quickly identify the functional regions during assembly, maintenance and inspection, thereby helping to improve the user's work efficiency.

[0036] In some embodiments, the color of the second heat dissipation region 121 is different from the color of the insulating coating 200. In this way, since the color of the second heat dissipation region 121 is different from the color of the insulating coating 200, the user can distinguish the position of the first surface 110 and the position of the second surface 120 by distinguishing the color of the second heat dissipation region 121 and the color of the insulating coating 200, thereby helping the user to quickly install the electronic device 400 and the heat sink 300 at the specified position.

[0037] In some embodiments, the insulating coating 200 can be provided on the heat dissipation substrate body 100 in various ways, for example, the insulating coating 200 can be provided on the heat dissipation substrate body 100 by spraying; for another example, the insulating coating 200 can be provided on the heat dissipation substrate body 100 by printing.

[0038] In some embodiments, the insulating coating 200 can be a silicone coating, which can be manufactured by using silicone. The silicone coating has a low coefficient of thermal expansion, which makes the silicone coating well matched with most metal substrates (such as the heat dissipation substrate body 100), thereby helping to reduce the stress concentration and deformation of the silicone coating caused by temperature changes.

[0039] In some embodiments, the insulating coating 200 can be an epoxy coating, which can be manufactured by using epoxy. The epoxy coating has good wear resistance and scratch resistance, which makes the epoxy coating not easy to be physically damaged.

[0040] In some embodiments, the insulating coating 200 can be a polyurethane coating, which can be manufactured by using polyurethane. The polyurethane coating has a high dielectric strength, which can provide reliable electrical isolation to prevent the direct conduction of electric current through the heat dissipation substrate 10, thereby avoiding short circuit and other electrical faults.

[0041] In some embodiments, the insulating coating 200 can be an acrylic coating, which can be made of acrylic resin. The acrylic coating has a high dielectric strength, which can provide reliable electrical isolation to prevent direct conduction of current through the heat dissipation substrate 10, avoiding short circuit and other electrical faults.

[0042] In some embodiments, the insulating coating 200 can be a polyimide coating, which can be made of polyimide. The polyimide coating has a high dielectric strength, which can provide reliable electrical isolation to prevent direct conduction of current through the heat dissipation substrate 10, avoiding short circuit and other electrical faults.

[0043] In some embodiments, the insulating coating 200 can be a ceramic coating, which can be made of ceramic. The ceramic coating has a high dielectric strength, which can provide reliable electrical isolation to prevent direct conduction of current through the heat dissipation substrate 10, avoiding short circuit and other electrical faults.

[0044] In some embodiments, the heat dissipation substrate body 100 can be a copper heat dissipation substrate body, which can be made of copper. The copper heat dissipation substrate body has a high thermal conductivity, which can quickly conduct the heat of the electronic device 400 to the heat sink 300.

[0045] In some embodiments, the heat dissipation substrate body 100 can be an aluminum heat dissipation substrate body, which can be made of aluminum. The surface of the aluminum heat dissipation substrate body can naturally form a dense aluminum oxide protective film, which can provide good oxidation and corrosion resistance.

[0046] In some embodiments, the heat dissipation substrate body 100 can be an alloy heat dissipation substrate body, which can be made of alloy materials (such as aluminum alloy, stainless steel, etc.). The alloy heat dissipation substrate body has good mechanical strength and hardness.

[0047] Please refer to Figures 1 to 4 The utility model embodiment further provides a heat dissipation assembly 20, the heat dissipation assembly 20 includes heat dissipation substrate 10, shell 500 and heat sink 300. Shell 500 can be set up in first heat dissipation area 112. Heat sink 300 can be set up in second heat dissipation area 121, wherein, heat sink 300 can be heat pipe radiator, liquid cooling heat sink or copper heat dissipation fin. The area that heat sink 300 contacts with air is larger, and heat dissipation substrate 10 can transmit heat to heat sink 300, thereby helping to reduce the temperature of heat dissipation substrate 10.

[0048] The specific structure of the heat dissipation substrate 10 can refer to the above-mentioned embodiments. Since the heat dissipation assembly 20 adopts all the technical solutions of all the above-mentioned embodiments, it at least has all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be repeated here.

[0049] In some embodiments, the heat sink 300 includes a plurality of heat dissipation fins 310, wherein the number, spacing and shape of the heat dissipation fins 310 can be designed according to specific application requirements. The heat dissipation fins 310 can be metal heat dissipation fins 310, for example, the heat dissipation fins 310 can be made of copper, aluminum or stainless steel and the like. The heat dissipation fins 310 can be ceramic heat dissipation fins 310, for example, the heat dissipation fins 310 can be made of aluminum oxide or silicon carbide and the like.

[0050] Two adjacent heat dissipation fins 310 are oppositely and spacedly arranged. In this way, the gap between the adjacent heat dissipation fins 310 can form heat dissipation channels, and air can flow in these channels to form natural convection, which helps to carry away more heat and thus helps to reduce the temperature of the heat sink 300.

[0051] In addition, the plurality of heat dissipation fins 310 can increase the total surface area of the heat sink 300, thereby helping to increase the area of the heat sink 300 in contact with the air, so that the heat of the heat sink 300 can be quickly conducted to the air.

[0052] Please refer to Figures 1 to 5 The utility model embodiment further provides a light source module 30, for example, the light source module 30 can be a point light source module 30. The light source module 30 can include a heat dissipation assembly 20 and an electronic device 400, and the electronic device 400 includes a light source 410, for example, the light source 410 can be an LED lamp or a laser and the like.

[0053] The light source 410 is arranged on the side of the insulating coating 200 away from the heat dissipation substrate body 100. In this way, the insulating coating 200 can isolate the light source 410 from the heat dissipation substrate body 100, prevent the current from being conducted to other electronic devices 400 through the heat dissipation substrate 10, and thus help to reduce the risk of short circuit of the light source module 30.

[0054] The specific structure of the heat dissipation assembly 20 can refer to the above-mentioned embodiments. Since the light source module 30 adopts all the technical solutions of all the above-mentioned embodiments, it at least has all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be repeated here.

[0055] In some embodiments, the shell 500 can be provided with a light guide channel 510, and the light emitted by the light source 410 can be emitted out of the shell 500 from the light guide channel 510. In this way, the light guide channel 510 can achieve directional lighting, accurately projecting light to the area that needs to be illuminated, improving the targeting and effectiveness of the lighting.

[0056] In some embodiments, the light source module 30 further comprises an optical element 600, which is arranged in the light guide channel 510, and the light emitted by the light source 410 is emitted out of the shell 500 after passing through the optical element 600.

[0057] For example, the optical element 600 can be a lens or a light guide lamp, so as to effectively collect and guide the light emitted by the light source 410, reduce the scattering and absorption of light during propagation, and ensure that more light can be smoothly emitted out of the shell 500.

[0058] For another example, the optical element 600 can be a diffusion sheet, so as to uniformly distribute the light, avoid the phenomenon of local over-brightness or over-darkness, and improve the lighting effect.

[0059] For another example, the optical element 600 can be a wavelength conversion element, so as to change the spectral properties of the light source 410, and achieve specific light color and spectral distribution.

[0060] In the utility model, unless otherwise explicitly specified or limited, the terms "mounting", "connection" and the like should be understood broadly. For example, it can be fixed connection, detachable connection, or integral connection; it can be mechanical connection; it can be direct connection, or indirect connection through an intermediate medium, or internal communication of two elements, or only surface contact, or surface contact connection through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0061] In addition, the terms "first", "second" and the like are only used for differentiation and description, and cannot be understood as specific or special structures. The description of the term "some embodiments" means that the specific features, structures, materials or characteristics described in combination with the embodiments or examples are contained in at least one embodiment or example of the utility model. In the utility model, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any suitable way in any one or more embodiments or examples. In addition, those skilled in the art can combine and combine the different embodiments or examples described in the utility model and the features of different embodiments or examples without contradiction.

[0062] The above embodiments are only used to illustrate the technical solutions of the utility model, and are not intended to limit the utility model; although the utility model is described in detail with reference to the foregoing embodiments, those skilled in the art should understand that the technical solutions recorded in the foregoing embodiments can still be modified, or some technical features can be replaced equivalently; and these modifications or replacements do not deviate from the spirit and scope of the technical solutions of the utility model, and should be included in the protection scope of the utility model.

Claims

1. A heat dissipating substrate, characterized by, The heat dissipation substrate comprises: a heat dissipation substrate body having a first surface and a second surface, the second surface and the first surface being located at opposite sides of the heat dissipation substrate body respectively, the first surface comprising a coating area and a first heat dissipation area, the second surface comprising a second heat dissipation area, the first heat dissipation area and the second heat dissipation area being used for mounting a heat sink; and an insulating coating provided on the coating area, the insulating coating being used for mounting an electronic device.

2. The heat dissipating substrate according to claim 1, wherein The first surface comprises a central area and a peripheral area connected to each other, the peripheral area being arranged around the central area; the first heat dissipation area is the central area and a part of the peripheral area, and the coating area is another part of the peripheral area.

3. The heat dissipating substrate according to claim 1, wherein The heat dissipation substrate body is provided with mounting through holes penetrating through the first surface and the second surface.

4. The heat dissipating substrate according to claim 3, wherein The number of the mounting through holes is multiple, and the mounting through holes are distributed at intervals.

5. The heat dissipating substrate according to claim 4, wherein The first heat dissipation area and the coating area are both provided with the mounting through holes.

6. A heat dissipating assembly characterized by, The heat dissipation substrate comprises: the heat dissipation substrate according to any one of claims 1 to 5; and a housing and a heat sink, the housing being arranged on the first heat dissipation area, and the heat sink being arranged on the second heat dissipation area.

7. The heat dissipating assembly of claim 6, wherein, The heat sink comprises a plurality of heat dissipation fins, and two adjacent heat dissipation fins are arranged in opposition and at intervals.

8. A light source module, characterized by The heat dissipation assembly comprises: the heat dissipation assembly according to claim 6 or 7; and an electronic device comprising a light source, the light source being arranged on a side of the insulating coating away from the heat dissipation substrate body.

9. The light source module of claim 8, wherein the light source module is configured to be mounted on a printed circuit board (PCB) of a display device. The housing is provided with a light guide channel, and the light emitted by the light source is emitted to the outside of the housing from the light guide channel.

10. The light source module of claim 9, wherein, The light source module further comprises an optical element arranged in the light guide channel, and the light emitted by the light source is emitted to the outside of the housing after passing through the optical element.

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