High-power equipment capable of efficiently dissipating heat

Abstract

The utility model discloses a high-efficiency heat dissipation high-power device which comprises a device box body and a high-power device installed in the device box body, a heat dissipation plate is installed on the device box body and located below the high-power device, and a bottom plate is installed at the bottom of the device box body. A water flow channel is formed between the bottom plate and the equipment box body, and the cooling fins of the cooling plate face the water flow channel. The heat dissipation plate is arranged at the bottom of the equipment box body, the water flow channel is formed between the equipment box body and the bottom plate, the heat dissipation fins of the heat dissipation plate are located on the upper portion of the water flow channel, the heat dissipation plate and the water flow channel are arranged below the high-power device, heat dissipation design only aims at the area of the high-power device, and the design requirements for miniaturization and light weight of equipment are met; the equipment box body is milled by a 6063 aluminum material with high heat dissipation, the whole heat dissipation plate is milled by a red copper material with higher heat dissipation, and the high heat conductivity of copper is utilized to effectively perform targeted heat dissipation on the power device, so that the cost and the processing difficulty are greatly reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to high -power equipment heat dissipation technical field, concretely relates to a high -efficient heat dissipation's high -power equipment. BACKGROUND

[0002] High -power equipment such as more than 100KW power supply project or generator controller class project, equipment inside often needs various electrical control board or IGBT drive board, even if whole machine efficiency is enough high, when outputting such big power, often also accompanied by big power loss, single heat dissipation module heat consumption is as high as 1500W-2000W, especially IGBT class power module heat is especially serious, in the present stage, when the integration is so high, more is the requirement of equipment miniaturization and light weight. It is very necessary to select smaller size, high density energy consumption power device for the miniaturization of equipment, then how to effectively dissipate heat in limited size such high heat flux, excessive heat generation of power device, ordinary fan forced air cooling can not solve the problem.

[0003] Conventional this kind of high -power output project often means that the equipment of larger size, inside through parallel power consumption device, increase more power device, average share power consumption, reach the heat flux density of single device, again stack high speed fan and increase the number of fan, reach the required heat dissipation air volume, even if adopting liquid cooling, if not the heat dissipation flow passage design of pertinence, the heat dissipation of power device of such small unit area, such high power consumption also becomes very difficult. UTILITY MODEL CONTENTS

[0004] The technical problem to be solved by the utility model lies in: how to solve the heat problem of high heat consumption high -power device.

[0005] To solve the above technical problem, the utility model provides the following technical scheme:

[0006] A kind of high -efficient heat dissipation's high -power equipment, including equipment box and the high -power device of installation in equipment box interior, the bottom plate is installed in the bottom of the equipment box and the high -power device is located below, water flow passage is formed between the bottom plate and the equipment box, and the fin of the heat dissipation plate is towards the water flow passage.

[0007] The utility model is through the bottom of equipment box setting heat dissipation plate, forms water flow passage between equipment box and bottom plate, and the fin of heat dissipation plate is located in the upper position of water flow passage, heat dissipation plate and water flow passage are arranged below high -power device, only the heat dissipation design of high -power device area meets the miniaturization and light weight design requirement of equipment.

[0008] As a further scheme of the utility model: the bottom of equipment box body is provided with a convex, a heat dissipation plate mounting groove for mounting heat dissipation plate is formed in the convex; a sealing groove is formed in the side of heat dissipation plate and heat dissipation plate mounting groove, and a sealing ring is mounted in the sealing groove.

[0009] As a further scheme of the utility model: the lower portion of heat dissipation plate mounting groove is connected with sunken plate, the sunken plate is located directly below heat dissipation plate, and a convex is formed when water flow passes between sunken plate and heat dissipation plate.

[0010] As a further scheme of the utility model: the both ends of equipment box body front panel are connected with water inlet tower joint and water outlet tower joint respectively, and the water inlet tower joint and water outlet tower joint are communicated with water flow channel.

[0011] As a further scheme of the utility model: the bottom of equipment box body and above bottom plate is also provided with several guide vanes, and the several guide vanes are located in water flow channel.

[0012] As a further scheme of the utility model: the front face of equipment box body is provided with several electric device interfaces.

[0013] As a further scheme of the utility model: the equipment box body is made of 6063 aluminum material.

[0014] As a further scheme of the utility model: the heat dissipation plate is made of red copper material.

[0015] As a further scheme of the utility model: the heat dissipation fins of heat dissipation plate are provided with several groups, and the several groups of heat dissipation fins are arranged in staggered mode.

[0016] Compared with the prior art, the utility model has the advantages of:

[0017] Firstly, the application forms water flow channel between equipment box body and bottom plate by arranging heat dissipation plate on the bottom of equipment box body, the heat dissipation fins of heat dissipation plate are located at the upper position of water flow channel, the heat dissipation plate and water flow channel are arranged below high-power device, only the heat dissipation design for high-power device area is arranged, and the miniaturization and light weight design requirements of equipment are met.

[0018] Secondly, the heat dissipation plate is higher than bottom plate by a height, when water flow passes, the trend is upward, advection, and downward, the heat dissipation fins arranged in staggered mode are only reserved with a certain gap from bottom sunken plate, the local water inlet and outlet space is reduced, the fluid flow velocity in high-power device area is increased, and the local heat dissipation capacity is further increased.

[0019] Finally, the device box body of the application is milled by using 6063 aluminum material with high heat dissipation, and the heat dissipation plate is milled by using red copper with higher heat dissipation, so that the power device is effectively and specifically cooled by the high thermal conductivity of copper, and the cost and processing difficulty are greatly reduced by the differentiated material selection. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 It is an exploded view of the high-power equipment with efficient heat dissipation of the embodiment of the application;

[0021] Figure 2 It is a structural schematic view of the high-power equipment with efficient heat dissipation of the embodiment of the application;

[0022] Figure 3 It is a bottom structural schematic view of the device box body and the bottom plate of the embodiment of the application;

[0023] Figure 4 It is a structural schematic view of the heat dissipation plate of the embodiment of the application;

[0024] Figure 5 It is a structural schematic view of the device box body of the embodiment of the application;

[0025] Figure 6 It is a bottom structural schematic view of the device box body of the embodiment of the application;

[0026] Figure 7 It is a partial sectional view of the high-power equipment with efficient heat dissipation of the embodiment of the application;

[0027] Figure 8 It is a water flow channel side flow speed simulation distribution cloud chart of the embodiment of the application;

[0028] Figure 9 It is a heat dissipation plate plane flow speed simulation distribution cloud chart of the embodiment of the application;

[0029] Figure 10 It is a water flow channel plane flow speed simulation distribution cloud chart of the embodiment of the application;

[0030] Figure 11 It is a high-power device bottom plate simulation temperature distribution cloud chart of the embodiment of the application;

[0031] Figure 12 It is a glycol aqueous solution simulation temperature distribution cloud chart of the embodiment of the application;

[0032] BRIEF DESCRIPTION OF DRAWINGS

[0033] 1, high-power device; 2, heat sink; 21, sealing groove; 22, heat sink fin; 3, equipment box body; 31, heat sink mounting groove body; 32, sunken plate; 33, water outlet; 34, electrical device interface; 35, water inlet; 36, flow guide fin; 4, bottom plate; 5, water inlet spire joint; 6, water outlet spire joint. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical scheme and advantages of the embodiments of the present application more clear, the technical scheme of the embodiments of the present application will be described clearly and completely below in conjunction with the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0035] Referring to Figure 1 and Figure 2 , a high-efficiency heat dissipation high-power device includes a high-power device 1, a heat sink 2, an equipment box body 3, a bottom plate 4, a water inlet spire joint 5, and a water outlet spire joint 6. The high-power device 1 is installed inside the equipment box body 3, the heat sink 2 is installed on the bottom wall of the equipment box body 3, the bottom plate 4 is brazed on the bottom of the equipment box body 3, the water inlet spire joint 5 and the water outlet spire joint 6 are installed on the front panel of the equipment box body 3, and a flow channel is arranged between the bottom of the equipment box body 3 and the bottom plate 4.

[0036] Referring to Figure 1 , the high-power device 1 is a high-density energy consumption power device.

[0037] Referring to Figure 4 , the heat sink 2 is entirely milled from red copper, and the high thermal conductivity of copper is used to effectively dissipate heat for the power device. The heat sink 2 and one side of the equipment box body 3 are provided with a plurality of misaligned cylindrical heat sink fins 22. The side of the equipment box body 3 installed and located outside the plurality of cylindrical heat sink fins 22 is provided with a sealing groove 21. A sealing ring is pressed in the sealing groove and connected and locked with the equipment box body 3 through a ring of screws to ensure the integrity and sealing of the flow channel and prevent water in the subsequent flow channel from overflowing from here.

[0038] Referring to Figure 5 and Figure 6, the device box body 3 is a rectangular frame structure as a whole, and is made of 6063 aluminum material as a whole, and the front panel of the device box body 3 is provided with an electrical device interface 34 for connecting various plug-in electrical connectors, which is used for electrical connection between the inside and outside of the device box body 3; the water inlet 35 and the water outlet 33 are respectively arranged on the two sides of the front panel of the device box body 3, wherein the water inlet 35 is connected with the water inlet jewel joint 5 by winding, and the water outlet 33 is connected with the water outlet jewel joint 6 by winding.

[0039] Further, the bottom wall of the device box body 3 is provided with a convex protrusion, and a heat dissipation mounting groove 31 is arranged in the protrusion, which is used for connecting the heat dissipation plate 2, wherein the bottom of the protrusion is connected with a sunken plate 32, and the sunken plate 32 is located directly below the heat dissipation plate 2, and the heat dissipation fins 22 on the heat dissipation plate 2 are spaced apart from the sunken plate 32 by a certain gap; a flow channel is arranged between the bottom of the device box body 3 and the bottom plate 4, wherein the heat dissipation fins 22 are located in the flow channel, and a plurality of cylindrical or thin-tooth-shaped flow guide vanes 36 are arranged on the bottom of the device box body 3 and above the bottom plate 4, and the plurality of flow guide vanes 36 are located in the water flow channel; one end of the flow channel is communicated with the water inlet, and the other end is communicated with the water outlet, and the bottom of the sunken plate 32 and the bottom of the cylindrical or thin-tooth-shaped flow guide vane 36 are arranged on the same horizontal plane, so that the water flow channel forms a convex setting between the sunken plate 32 and the heat dissipation plate 2.

[0040] Water enters from the water inlet of the flow channel, then enters the area of the cylindrical or thin-tooth-shaped flow guide vane 36, and then enters between the heat dissipation plate 2 and the sunken plate 32, because the heat dissipation plate 2 is higher than the sunken plate 32 and the flow guide vane 3 has a certain height, so the water flow has a trend of rising, flowing horizontally and descending (see Figure 7 ), and then the water flow enters another area of the cylindrical or thin-tooth-shaped flow guide vane 36 and is discharged from the water outlet.

[0041] Referring to Figure 3 , the bottom plate 4 is integrally brazed to achieve sealing and form a complete flow channel; the bottom plate 4 is installed on the bottom of the device box body 3 and can fix the sunken plate 32, the flow guide vane 36 and the heat dissipation fin 22 in the water flow channel.

[0042] The specific operation principle of the present application is as follows:

[0043] When the device needs to be cooled, water is introduced from the water inlet jewel joint 5, then enters the area of the cylindrical or thin-tooth-shaped flow guide vane 36, and then enters between the heat dissipation plate 2 and the sunken plate 32, because the heat dissipation plate 2 is higher than the sunken plate 32 and the flow guide vane 3 has a certain height, so the water flow has a trend of rising, flowing horizontally and descending (see Figure 7The water flows into the area of the guide vane 36 again, and then is discharged from the water outlet spigot 6, so that the heat dissipation of the high-power device 1 can be realized.

[0044] The application can solve the heat problem of the device for the high-power device with a heat consumption of 1500W-2000W of a single heat module.

[0045] Figure 8 The flow channel side flow velocity simulation distribution cloud map, Figure 9 The heat sink plane flow velocity simulation distribution cloud map, Figure 10 The flow channel plane flow velocity simulation distribution cloud map, Figure 8 , Figure 9 and Figure 10 It can be seen from the above that the water flow velocity is relatively uniform, and the flow channel design is reasonable. Figure 11 The high-power device bottom plate simulation temperature distribution cloud map, Figure 12 The simulation temperature distribution cloud map of the added ethylene glycol aqueous solution, Figure 11 and Figure 12 It can be seen from the above that the flow channel design is reasonable and effective for the heat simulation treatment of the power device and the fluid aqueous solution.

[0046] The above examples are only used to illustrate the technical solutions of the application, rather than limit them; although the application has been described in detail with reference to the foregoing examples, those skilled in the art should understand that the technical solutions recorded in the foregoing examples can be modified, or some technical features can be replaced equivalently; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the application.

Claims

1. A high-power device with high heat dissipation, comprising a device box (3) and a high-power device (1) installed inside the device box (3), characterized in that, The device box (3) is provided with a heat dissipation plate (2) above and below the high-power device (1), the bottom of the device box (3) is provided with a bottom plate (4), a water flow channel is formed between the bottom plate (4) and the device box (3), and the fins (22) of the heat dissipation plate (2) face the water flow channel.

2. The high-power device of claim 1, wherein: The bottom of the device box (3) is provided with a protrusion, and a heat dissipation plate mounting groove (31) for mounting the heat dissipation plate (2) is formed in the protrusion. The side of the heat dissipation plate (2) mounted with the heat dissipation plate mounting groove (31) is provided with a sealing groove (21), and a sealing ring is mounted in the sealing groove (21).

3. The high-power device of claim 2, wherein: The heat dissipation plate mounting groove (31) is connected with a sunken plate (32) below, the sunken plate (32) is located directly below the heat dissipation plate (2), and the water flow channel forms a convex section when passing between the sunken plate (32) and the heat dissipation plate (2).

4. The high-power device of claim 1, wherein: The front panel of the device box (3) is connected with a water inlet tower joint (5) and a water outlet tower joint (6) at both ends, respectively, and the water inlet tower joint (5) and the water outlet tower joint (6) are communicated with the water flow channel.

5. The high-power device of claim 1, wherein: The bottom of the device box (3) is further provided with a plurality of guide vanes (36) above the bottom plate (4), and the plurality of guide vanes (36) are located in the water flow channel.

6. The high-power device of claim 1, wherein: The front panel of the device box (3) is provided with a plurality of electrical device interfaces (34).

7. The high-power device of claim 1, wherein: The device box (3) is made of 6063 aluminum material.

8. The high-power device of claim 1, wherein: The heat dissipation plate (2) is made of red copper material.

9. The high-power device of claim 1, wherein: The fins (22) of the heat dissipation plate (2) are provided with a plurality of groups, and the plurality of groups of fins (22) are arranged in a staggered manner.

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