Image sensor packaging structure

Abstract

The utility model discloses an image sensor packaging structure, which belongs to the field of image sensor packaging, and is characterized in that light-transmitting fillers are filled in a light-transmitting cavity, so that the use of a glass cover plate is avoided, the structure of a signal sensing part of a sensing area is stable, and the reliability of the image sensor packaging structure is improved. A good sensing function can be realized even in a bumpy environment; according to the image sensor, the non-light-transmitting cavity is filled with the non-light-transmitting filler, so that the use of a non-light-transmitting cover plate is avoided, the problem of light leakage can be well solved in a bumpy environment, and the use effect and the product quality of the image sensor are further improved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of semiconductor packaging, especially relates to an image sensor packaging structure. BACKGROUND

[0002] Image sensors are electronic devices that convert light signals into electrical signals, enabling image capture and processing. They play an important role in a variety of devices and applications. When image sensors are put into practical application, they need to be packaged. The packaging of image sensors is a complex and precise process, aiming to protect the sensors from physical damage and environmental influences while ensuring their electrical and optical performance.

[0003] In the prior art, glass covers are essential for sensing image signals during packaging. However, in complex and bumpy environments, the glass covers are prone to falling off due to the point bonding between the glass covers and the substrate, affecting the use of the entire image sensor.

[0004] In addition, to further protect the sensing effect of the image sensor, the non-transparent cover is used to cover the part outside the sensing area to prevent light leakage. However, the non-transparent cover is also prone to falling off in complex and bumpy environments, affecting the use of the image sensor. INVENTION CONTENTS

[0005] To solve the problems in the related art, the image sensor packaging structure can solve the problem that the image sensor cannot be used due to the falling off of the glass cover in complex and bumpy environments in the prior art. It also solves the problem that light leakage affects the use of the image sensor due to the falling off of the non-transparent cover in complex and bumpy environments in the prior art.

[0006] The technical solution is as follows:

[0007] An image sensor packaging structure, the structure comprising: a substrate, the substrate comprising a top surface and a bottom surface, the top surface being oppositely arranged with the bottom surface; an image sensor fixedly arranged on the top surface; wherein the image sensor comprises a sensing area for receiving a sensing signal, one side of the image sensor containing the sensing area being an upper surface of the image sensor, and an opposite side of the image sensor being a lower surface; an isolation plate fixedly arranged on the upper surface of the image sensor and surrounding the outside of the sensing area; the inside of the isolation plate and the upper surface of the image sensor forming a light-transmitting cavity; an electric lead electrically connecting the substrate and the image sensor, and the electric lead being distributed on the outside of the isolation plate; a side wrapping plate, the side wrapping plate being arranged around the boundary of the substrate; the inside of the side wrapping plate, the top surface and the outside of the isolation plate forming a non-light-transmitting cavity; a non-light-transmitting filler, the non-light-transmitting filler being filled in the non-light-transmitting cavity, wherein the non-light-transmitting filler covers the electric lead; and a light-transmitting filler, the light-transmitting filler being filled in the light-transmitting cavity.

[0008] The technical scheme has the beneficial effects that the non-light-transmitting filler is filled to surround the side of the sensing area, the light irradiated on the area outside the sensing area is blocked, and the problem of optical sensing effect reduction due to light leakage is avoided.

[0009] Further, the non-light-transmitting filler is black non-light-transmitting filling glue.

[0010] The use of black non-light-transmitting filling glue can maximize the absorption of light and improve the optical sensing accuracy.

[0011] Further, the light-transmitting filler is light-transmitting filling glue with a light-transmitting rate of not less than 90% after solidification.

[0012] Further, the isolation plate is made of non-light-transmitting material.

[0013] The isolation plate is made of non-light-transmitting material, which can further block the light irradiated on the area outside the sensing area, and make the light-proof property of the side of the sensing area better.

[0014] Further, the structure further comprises a rib plate, the rib plate being arranged in the non-light-transmitting cavity, a first end of the rib plate being connected to the inner side wall of the side wrapping plate, and a second end of the rib plate being connected to the outer side wall of the isolation plate.

[0015] The rib plate can effectively improve the structural strength of the non-light-transmitting filler after solidification, and protect the structure from being damaged due to external force.

[0016] Further, the rib plate has a cross section in the shape of inverted T.

[0017] The utility model discloses beneficial effects:

[0018] This utility model patent avoids the use of a glass cover by filling the light-transmitting cavity with a light-transmitting filler, thus ensuring the structural stability of the sensing signal part of the sensing area and enabling good sensing function even in bumpy environments. By filling the non-light-transmitting cavity with a non-light-transmitting filler, the use of a non-light-transmitting cover is avoided, which effectively solves the light leakage problem in bumpy environments, thereby further improving the performance and product quality of the image sensor. Attached Figure Description

[0019] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0020] Fig. 1 This is a schematic diagram of the overall structure of this utility model;

[0021] Fig. 2 This is a cross-sectional view of the present invention.

[0022] Figs. 1-2 Includes: 1. substrate; 2. side cladding plate; 3. isolation plate; 4. image sensor; 5. electrical leads; 6. stiffener; 7. non-transparent cavity; 8. transparent cavity. Detailed Implementation

[0023] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0024] like Figs. 1-2 As shown:

[0025] The application provides an image sensor packaging structure, which comprises a substrate 1, a top surface and a bottom surface of the substrate 1 are oppositely arranged, an image sensor 4 is fixedly arranged on the top surface, wherein the image sensor 4 comprises a sensing area for receiving a sensing signal, one surface of the image sensor 4 containing the sensing area is an upper surface of the image sensor 4, and an opposite surface of the image sensor 4 to the upper surface is a lower surface, a separation plate 3 is fixed on the upper surface of the image sensor 4 and surrounds the outside of the sensing area, the inside of the separation plate 3 and the upper surface of the image sensor 4 form a light-transmitting cavity 8, an electric lead 5 electrically connected with the substrate 1 and the image sensor 4 is distributed on the outside of the separation plate 3, a side cover plate 2 is arranged around the boundary of the substrate 1, the inside of the side cover plate 2, the top surface and the outside of the separation plate 3 form a non-light-transmitting cavity 7, and a non-light-transmitting filler fills the non-light-transmitting cavity 7, wherein the non-light-transmitting filler covers the electric lead 5, and a light-transmitting filler fills the light-transmitting cavity 8. According to the image sensor packaging structure, the light-transmitting filler is filled in the light-transmitting cavity, so that the glass cover plate is avoided, the sensing signal part structure of the sensing area is stable, and good sensing function can be realized even in a bumpy environment; the non-light-transmitting filler is filled in the non-light-transmitting area, the side of the sensing area is surrounded, light irradiated on the area outside the sensing area is blocked, and the problem that the optical sensing effect is reduced due to light leakage is avoided. The non-light-transmitting filler is filled, the side of the sensing area is surrounded, light irradiated on the area outside the sensing area is blocked, and the problem that the optical sensing effect is reduced due to light leakage is avoided. Since the electric lead 5 needs to be packaged and fixed, the electric lead 5 is arranged in the non-light-transmitting cavity 7, the non-light-transmitting filler is solidified to stabilize the electric lead 5, and foreign matters in the outside can also be prevented from damaging the electric lead 5.

[0026] In a possible embodiment, the non-light-transmitting filler is black non-light-transmitting filler glue. A black object not only absorbs visible light, but also absorbs electromagnetic radiation of other wavelengths, such as microwaves and radio waves. Therefore, the use of black filler glue can maximize light absorption and reduce reflection, further improving optical sensing accuracy.

[0027] In a possible embodiment, the light-transmitting filler is light-transmitting filler glue with a light-transmitting rate of not less than 90% after solidification. The higher the light-transmitting rate of the light-transmitting filler glue, the higher the sensing accuracy of the image sensor 4. High-transmitting epoxy resin or high-transmitting UV glue can be selected during packaging, so that the sensing performance of the image sensor 4 is not reduced after the filler glue is solidified, and the image sensor 4 can be maximally protected.

[0028] In a possible embodiment, the isolation plate 3 is made of non-light-transmitting material. The isolation plate 3 is made of non-light-transmitting material to further block the light from the area outside the sensing area, so that the light-proof property of the sensing area is better.

[0029] In a possible embodiment, the structure further comprises a rib plate 6, which is arranged in the non-light-transmitting cavity 7, the first end of the rib plate 6 is connected to the inner side wall of the side cover plate 2, and the second end of the rib plate 6 is connected to the outer side wall of the isolation plate 3. The rib plate 6 can effectively improve the structural strength of the filling material after the non-light-transmitting filling material is solidified, so as to protect the structure from being damaged due to external force.

[0030] In a possible embodiment, the cross section of the rib plate 6 is a reverse T-shaped structure. On the one hand, the reverse T-shaped structure can reduce the self-weight as much as possible while ensuring the structural strength, and on the other hand, the bottom of the reverse T-shaped structure can be used to cover the components on the substrate 1 and the image sensor 4, so as to further improve the stability of the packaging structure and protect the image sensor 4 from being damaged.

[0031] In summary, the utility model patent fills the light-transmitting filling material in the light-transmitting cavity, so as to avoid using the glass cover plate, so that the sensing signal part of the sensing area is stable in structure, and good sensing function can be realized even in a bumpy environment. The non-light-transmitting filling material is filled in the non-light-transmitting cavity, so as to avoid using the non-light-transmitting cover plate, so that the light leakage problem can be better solved in a bumpy environment, so as to further improve the use effect and product quality of the image sensor.

[0032] Other embodiments of the application will be apparent to those skilled in the art from consideration of the specification and practice of the application disclosed herein. It is intended that the specification and examples be considered as exemplary only, with the true scope and spirit of the application being indicated by the following claims.

[0033] It should be understood that the application is not limited to the precise construction that has been described above and illustrated in the accompanying drawings, and that various modifications and changes can be made by those skilled in the art without departing from the scope of the application. The scope of the application is limited only by the appended claims.

Claims

1. An image sensor package structure, characterized by, The structure comprises: a substrate comprising a top surface and a bottom surface, the top surface being opposite to the bottom surface; an image sensor fixedly arranged on the top surface; wherein the image sensor comprises a sensing area for receiving a sensing signal, a surface of the image sensor comprising the sensing area being an upper surface of the image sensor, and a surface of the image sensor opposite to the upper surface being a lower surface; an isolation plate fixedly arranged on the upper surface of the image sensor and surrounding an outer side of the sensing area; an inner side of the isolation plate and the upper surface of the image sensor forming a light-transmissive cavity; an electric lead electrically connecting the substrate and the image sensor, and the electric lead being distributed on an outer side of the isolation plate; a side wrapping plate arranged around a boundary of the substrate; an inner side of the side wrapping plate, the top surface and an outer side of the isolation plate forming a non-light-transmissive cavity; a non-light-transmissive filler filling the non-light-transmissive cavity, wherein the non-light-transmissive filler covers the electric lead; a light-transmissive filler filling the light-transmissive cavity.

2. The structure of claim 1, wherein The non-light-transmissive filler is black non-light-transmissive filler glue.

3. The structure of claim 1, wherein The light-transmissive filler is light-transmissive filler glue with a light transmittance of not less than 90% after curing.

4. The structure of claim 1, wherein The isolation plate is made of non-light-transmissive material.

5. The structure of claim 1, wherein The structure further comprises a rib plate arranged in the non-light-transmissive cavity, a first end of the rib plate being connected to an inner side wall of the side wrapping plate, and a second end of the rib plate being connected to an outer side wall of the isolation plate.

6. The structure of claim 5, wherein The rib plate has a cross section in the shape of an inverted T.

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