LED module, curing light source and curing device

Abstract

The utility model discloses an LED module, a curing light source and a curing device, the LED module comprises a power connection positive electrode and a power connection negative electrode, and at least one first LED chip and at least one second LED chip are arranged in parallel between the power connection positive electrode and the power connection negative electrode; and one of the at least one first LED chip or the at least one second LED chip is connected in series with at least one diode. In the effective forward current range of the LED chips, the IV curve of the diode and the IV curve of the LED chips connected in series are the same in trend, so that the sum of voltages of all parallel circuits is equal, the current difference / current ratio between the parallel circuits under the condition of different currents is reduced, and the service life of the parallel circuits is prolonged. The problem of uneven current distribution caused by different photoelectric characteristics of LED chips in LED chips with different voltage shifts or a mixer circuit is solved, and the proportion of radiation flux is further controlled.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of LED solidification, more particularly to a LED module, a solidification light source and a solidification device. BACKGROUND

[0002] Photocuring technology is widely used in industrial manufacturing, medical and other industries, and different wavelengths of light are used for curing according to different photoinitiators added in the material. In order to ensure the properties of the cured material, two or more photoinitiators are generally added in the material, such as three-proofing glue, composite resin, etc.

[0003] Three-proofing glue is mainly used in electronic manufacturing industry, which needs to use UV-A and UV-C band light for curing. UV-A band is mainly used to cure the bottom of glue, and UV-C band is mainly used to cure the surface of glue. The energy of the two bands should be controlled within a certain range, otherwise wrinkles, surface drying and glue falling off may occur, affecting product quality. Photocuring composite resin is widely used in medical curing and repair fields, and its sensitive wavelength range is between 380-520nm. In clinical application, it is found that some composite resin restorations break and fall off in a short period of time, and insufficient curing of the composite resin is one of the main factors.

[0004] According to the light spectrum absorption intensity diagram of the photoinitiator, the wavelength range covered by the single-band LED module is relatively narrow, and it cannot make the composite resin completely cured, so two or more band LED modules can be used for curing. Since weak light is used for preliminary curing and strong light is used for complete curing during curing, the energy ratio of each band should be maintained within a certain range in weak light and strong light modes. For example, when 380nm and 450nm band LEDs are used together in medical curing applications, the radiation flux ratio of the 380nm band is required to be within 15-25%.

[0005] To achieve the above requirements, the most commonly used control method in the prior art is to control different band LED modules separately, but the cost is high. Another method is to connect the circuits in the middle of different band modules in parallel. However, since the voltage and current variation values of different band LED chips are inconsistent, the radiation flux ratio of one band LED chip will often be too low or too high when the forward current changes, making it difficult to accurately control. UTILITY MODEL CONTENTS

[0006] One of the purposes of the utility model is to overcome the defect that it is difficult to accurately control the radiation flux of different band LED module chips in the prior art, and to provide a LED module that uses the photoelectric properties of diodes to balance the voltages of two circuits, thereby accurately controlling the radiation flux ratio at low cost.

[0007] The utility model discloses another purpose is to provide a kind of solidification light source, utilize lens to improve light efficiency, and then effectively solidify light composite resin.

[0008] The utility model discloses still another purpose is to provide a kind of solidification device, can be through its accurate control the proportion of radiant flux characteristic, make three-proofing glue or light composite resin effectively, completely solidify.

[0009] The utility model discloses technical scheme is: a kind of LED module, including electricity positive pole and electricity negative pole, at least one first LED chip and at least one second LED chip are connected in parallel between electricity positive pole, electricity negative pole, one of the at least one first LED chip or the at least one second LED chip is connected in series with at least one diode.The tendency of the current variation of the diode is similar to the at least one first LED chip or the at least one second LED chip, specifically, the IV curve of diode and the IV curve trend of LED chip are basically identical, so that the voltage sum of each parallel road is equal, thereby reducing the current difference between each parallel road in the case of different current size, overcome the uneven distribution of current caused by the photoelectric characteristic of LED chip in different voltage grade LED chip or mixed wave circuit, and then control the proportion of radiant flux.This technical scheme is single power input, and the driving circuit is less, can realize the proportion of radiant flux with low cost accurate control.The diode can balance the voltage of two circuits, and simultaneously, by the characteristics of diode reverse cut-off, it can also play the role of protecting LED chip from reverse voltage breakdown in circuit.

[0010] Further, the number of first LED chips is m, m is greater than or equal to 1, and when m is greater than or equal to 2, the m first LED chips are connected in parallel. By connecting multiple first LED chips in parallel, the light output power of the LED module can be significantly improved to meet the demand for higher light intensity. At the same time, since the connection is in parallel, when one of the chips fails, the other chips can still work normally, improving the stability and reliability of the entire module.

[0011] Further, the first LED chip is a UV-A chip, a UV-B chip, a UV-C chip, or a combination thereof.

[0012] Further, the number of second LED chips is n, n is greater than or equal to 1, and when n is greater than or equal to 2, the n second LED chips are connected in parallel. Similar to the first LED chip, by connecting multiple second LED chips in parallel, the light output power of the LED module can be further improved to meet more extensive curing needs.

[0013] Further, the second LED chip is a UV-A chip, a UV-B chip, a UV-C chip, or a combination thereof.

[0014] Further, the diode is a Schottky diode or a zener diode, which is advantageous for optimizing the performance of the circuit, because the Schottky diode has a lower forward voltage drop and a fast switching speed, which can more effectively balance the circuit voltage, reduce energy loss, and improve the efficiency of the circuit.

[0015] The technical scheme of the utility model further includes a curing light source, the curing light source includes a bottom plate, a lens and the above-mentioned LED module, the LED module is fixedly arranged on one surface of the bottom plate, the lens covers the LED module and is fixedly connected with the bottom plate, the lens is provided with a cavity on the side close to the LED module, and the LED module is arranged in the cavity. The lens provided with the cavity can reduce the light-emitting angle on the premise that the external size is unchanged (i.e. compared with the lens of the same size and shape without the cavity), and the light-emitting efficiency is improved.

[0016] Further, the R angle value of the surface directly above the projection area of the LED module is greater than 6mm. As known, the greater the R angle, the closer the surface is to a plane. The greater R angle value makes the lens surface closer to a plane, which is advantageous for reducing the scattering and distortion of the light beam and improving the quality of the light beam. In this way, the light composite resin can receive a light beam of higher quality, which helps to improve the uniformity and accuracy of the curing effect.

[0017] Further, the height H of the cavity is greater than 2 times the height h of the LED module and is not greater than (H'-0.2mm), wherein H' is the height of the lens. The height of the cavity is set within a reasonable range, which can provide sufficient space for the LED module, helps to dissipate heat, and avoids interference with the lens, and can ensure that the light path design between the lens and the LED module is reasonable and reduces light loss.

[0018] The technical scheme of the utility model further includes a curing device, the curing device includes a power supply, a controller and the above-mentioned curing light source, wherein the curing light source is electrically connected with the power supply, the controller is in communication connection with the curing light source, and the controller is configured to be able to at least control the power-on state of the curing light source.

[0019] Compared with the prior art, the utility model has the beneficial effects that:

[0020] By connecting the diode in series in the at least one LED chip, the current ratio of the LED chips of different wave bands can be controlled within a certain range under different current sizes by using the characteristic that the IV curve of the diode is basically consistent with the IV curve trend of the LED chip, so that the proportion of the radiation flux of different wave bands can be accurately controlled; meanwhile, the diode has the characteristic of reverse cut-off, and can play a role in protecting the LED chip from reverse voltage breakdown in the circuit.

[0021] The lens design provided with the cavity can optimize the light beam distribution, so that the light composite resin can receive more concentrated light energy, thereby improving the light output efficiency, and being beneficial to improving the curing effect and curing quality. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 A circuit schematic diagram of the LED module is disclosed in the utility model;

[0023] Figure 2 A cross-sectional schematic diagram of the curing light source is disclosed in the utility model;

[0024] Figure 3 A whole structure schematic diagram of the curing device is disclosed in the utility model;

[0025] Figure 4 A change trend diagram of the resistance of the LED chip with current change.

[0026] IN THE DRAWINGS:

[0027] 101-Positive electrode; 102-Negative electrode; 103-First LED chip; 104-Second LED chip; 105-Diode;

[0028] 111-Base plate; 112-Lens; 113-Cavity;

[0029] 100-Power supply; 200-Controller. DETAILED DESCRIPTION

[0030] The utility model will be further described below in combination with specific implementation manners. Among them, the drawings are only used for example description, and cannot be understood as the limitation of the patent; in order to better illustrate the embodiment, some components of the drawings will be omitted, enlarged or reduced, and the size of actual product is not represented; for those skilled in the art, it is understandable that some well-known structures and their description in the drawings can be omitted.

[0031] The same or similar reference signs in the drawings of the embodiments of the present application correspond to the same or similar components; in the description of the present application, it is understood that if the terms "front", "back", "left", "right" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, they are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore the terms describing the positional relationship in the drawings are only used for exemplary description, and cannot be understood as a limitation on the present patent, for those skilled in the art, the specific meanings of the above terms can be understood according to the specific circumstances. In addition, the description of "first", "second" and the like in the present application is only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implying the number of the indicated technical features. Therefore, the features limited by "first" and "second" can explicitly or implicitly include at least one of the features.

[0032] Embodiment 1

[0033] The present embodiment provides an LED module, referring to Figure 1 , the LED module comprises a power connection positive electrode 101 and a power connection negative electrode 102, and at least one first LED chip 103 and at least one second LED chip 104 are connected in parallel between the power connection positive electrode 101 and the power connection negative electrode 102. Wherein, the number of first LED chips 103 is m, m is greater than or equal to 1, and m first LED chips 103 are connected in parallel. By connecting multiple first LED chips 103 in parallel, the light output power of the LED module can be significantly improved, meeting the demand for higher light intensity. At the same time, due to the parallel connection, when one of the first LED chips 103 fails, the other first LED chips 103 can still work normally, improving the stability and reliability of the whole module.

[0034] Similarly, the number of the second LED chips 104 is n, n is greater than or equal to 1, and the n second LED chips 104 are connected in parallel. In the embodiment, m = 1 and n = 3, that is, the LED module described in the embodiment includes one first LED chip 103 and three second LED chips 104. In other embodiments, m and n can refer to other values, for example, 2, 3, 4, 5, etc. The first LED chip 103 and the second LED chip 104 are only different in the wavelength band of the chip. For example, the first LED chip 103 can be a UV-A chip, and the second LED chip 104 can be a UV-C chip. Specifically, in the embodiment, the wavelength band of the first LED chip 103 is 380 nm, and the wavelength band of the second LED chip 104 is 450 nm. Of course, in other embodiments, the first LED chip 103 and the second LED chip 104 can also refer to LED chips with different powers, sizes, light colors, or other different characteristics.

[0035] In the embodiment, the sub-circuit formed by the second LED chips 104 in parallel is connected in series with a diode 105. The trend of the current change of the diode 105 is similar to that of the at least one second LED chip 104, specifically, the IV curve of the diode 105 is basically consistent with the IV curve of the second LED chip 104, so as to control the current ratio of the second LED chip 104 within a certain range under different current sizes, overcome the problem of uneven current distribution in the mixing circuit due to the different photoelectric characteristics of the LED chips, and further control the proportion of the radiant flux.

[0036] Of course, in other embodiments, the diode 105 can also be connected in series on the sub-circuit formed by the m first LED chips 103 in parallel, and the connection mode is the same as described above, which will not be described here.

[0037] The number of the diode 105 is not limited, which can be one or multiple. The diode 105 is a Schottky diode, which has a lower forward voltage drop and a fast switching speed, can more effectively balance the circuit voltage, reduce energy loss, and improve the circuit efficiency. In other embodiments, the diode 105 can also be a zener diode, which can provide a stable voltage in the circuit, ensure the stable operation of the LED chip under different current conditions, and further improve the performance and reliability of the LED module.

[0038] Comparative Example 1

[0039] The composition of the comparative example 1 is similar to that of the example 1, including one first LED chip 103 with a wavelength of 380 nm and three second LED chips 104 with a wavelength of 450 nm in parallel, and the difference is that the diode 105 is replaced by a conventional resistor with a resistance R = 0.2 Ω and fixed.

[0040] The example 1 and the comparative example 1 are respectively connected to a driving power supply, the current flowing through the LED module is adjusted to be 500 mA, 1000 mA, 1500 mA and 2500 mA, and the proportion of the radiation flux of the 380 nm wavelength is measured correspondingly. To ensure the reliability of the test data, each LED module is tested 3 times under the condition of the same current size. The test results are shown in Table 1.

[0041] Table 1 Proportion of radiation flux of 380 nm wavelength

[0042]

[0043] In the comparative example, the voltage and current variation values of the LED chips of different wavelengths are inconsistent, and the reference Figure 4 ,

[0044] As the current increases, the resistance (R1) of the first LED chip 103 decreases, and the resistance (R2) of the second LED chip 104 also decreases, so it can be concluded that the ratio of decreases as the current increases. In combination with the calculation formula of the current , it can be known that the ratio of increases as the current increases, wherein I1 is the current flowing through the sub-circuit formed by the first LED chip 103, and I2 is the current flowing through the sub-circuit formed by the second LED chip 104.

[0045] In the test, when the current gradually increases from 500 mA to 2500 mA, the proportion of the radiation flux of the 380 nm wavelength of the first LED chip 103 in the LED module disclosed in the comparative example rapidly increases from about 4.8% to about 36%, which is far beyond the requirement of the proportion of the radiation flux of the LED chip of a specific wavelength in the actual curing application (for example, in the medical curing application, the proportion of the radiation flux of the 380 nm wavelength is required to be within 15-25%). Since the curing needs to be initially cured with weak light (i.e. small current) and then completely cured with strong light (i.e. large current), it is required that the proportion of the radiation flux of each wavelength should be kept within a certain range in the weak light and strong light modes. The LED module disclosed in the comparative example obviously does not meet the requirement.

[0046] Under the same test conditions, the proportion of the radiant flux of the first LED chip 103 in the 380 nm waveband in the LED module disclosed in Embodiment 1 increases steadily from about 15% to about 25%, indicating that the proportion of the radiant flux of each waveband remains in the range of 15-25% under weak light and strong light modes. Embodiment 1 can overcome the problem of uneven current distribution in the mixing circuit caused by the different photoelectric properties of the LED chips, thereby controlling the proportion of the radiant flux and facilitating complete curing of the light-curing resin.

[0047] In addition, this embodiment has a single power input and fewer driving circuits, and can accurately control the proportion of the radiant flux at low cost. The diode 105 can balance the voltage of the two circuits, and at the same time, by using the reverse blocking property of the diode, it can also protect the LED chips from reverse voltage breakdown in the circuit.

[0048] Of course, it should be understood by those skilled in the art that the LED module disclosed in Embodiment 1 can not only be applied in the field of light resin curing, but also be applied in the curing of three-proofing glue and other light-curing glues. In particular, different wavebands of UV light are used to cure the bottom and surface of the glue respectively, so as to avoid abnormal situations such as wrinkling, surface drying and glue falling off.

[0049] Embodiment 2

[0050] As shown in Figure 2 Embodiment 1 provides a curing light source, which comprises a bottom plate 111, a lens 112 and an LED module. The LED module comprises a power connection positive electrode 101 and a power connection negative electrode 102, and 1 first LED chip 103 and 3 second LED chips 104 are arranged in parallel between the power connection positive electrode 101 and the power connection negative electrode 102. The sub-circuit formed by the second LED chips 104 is connected in series with a diode 105. The LED module is fixedly arranged on the top surface of the bottom plate 111, and the lens 112 covers the LED module and is fixedly connected with the bottom plate 111. The lens 112 is provided with a cavity 113 near the side close to the LED module, and the LED module is arranged in the cavity 113. The lens 112 provided with the cavity 113 can reduce the light-emitting angle under the premise that the external size is unchanged (i.e. compared with the lens 112 of the same size and shape without the cavity 113), thereby improving the light-emitting efficiency.

[0051] The R angle of the surface directly above the projection area of the LED module is 6mm. The greater the R angle, the closer the surface is to a plane. Of course, it is foreseeable that in other embodiments, the R angle can also be other values greater than 6mm, such as 7mm, 8mm or more. A larger R angle value makes the lens surface closer to a plane, which is beneficial to reducing the scattering and distortion of the light beam and improving the quality of the light beam. In this way, the light-cured resin can receive a higher quality light beam, which helps to improve the uniformity and accuracy of the curing effect.

[0052] In this embodiment, the height H of the cavity 113 is 1.43mm, the height h of the LED module is 0.5mm, and the height H' of the lens 112 is 4.40mm. Among them, the height H' of the lens 112 and the height h of the LED module can be adjusted according to actual conditions in other embodiments, but it should be noted that in all embodiments based on the idea of the present application, the height H of the cavity 113 is greater than 2 times the height h of the LED module, and is not greater than (H'-0.2mm), and is maintained within this height range.

[0053] Comparative Example 2

[0054] The difference between Comparative Example 2 and Example 2 is that the lens 112 is not provided with a cavity 113.

[0055] Example 2 and Comparative Example 2 are respectively connected to the same power supply, and the power supply is turned on to light up the LED chip. The illumination angle and light efficiency are measured at a distance of 25cm from the LED chip. The measurement results are shown in Table 2.

[0056] Table 2 Comparison of illumination angle and light efficiency

[0057] Example 2 Comparative Example 2 Illumination angle 50° 38° Light efficiency 83.60％ 88.90％

[0058] As can be seen from the test results, under the premise that the external size of the lens 112 remains unchanged, the lens 112 of Example 2 with the cavity 113 reduces the light-emitting angle of the LED chip and at the same time improves the light efficiency. In this way, the light-cured resin can receive a higher quality light beam, which helps to improve the uniformity and accuracy of the curing effect, and also reduces light loss and improves energy conversion efficiency.

[0059] Example 3

[0060] Reference Figure 3The embodiment provides a curing device, which comprises a power supply 100, a controller 200 and a curing light source as described in the embodiment 2, the curing light source is electrically connected with the power supply 100, specifically, the positive and negative poles of the LED module in the curing light source are respectively electrically connected with the positive and negative poles of the power supply 100. The controller 200 is in communication connection with the curing light source, and the controller 200 is configured to be capable of at least controlling the power-on state of the curing light source. In some other embodiments, the controller 200 can also be configured to control the power-on time of the curing light source, to be capable of starting / closing the curing light source in a timing mode, or to be capable of dynamically adjusting the input voltage of the curing light source, so that the curing light source can be randomly switched between a weak light mode and a strong light mode.

[0061] In the specific contents of the above specific embodiments, any inconsistent combination of technical features can be combined, in order to make the description simple, all possible combinations of the above technical features are not described, however, as long as the combination of the technical features does not exist, it should be considered that it is within the scope of the present application.

[0062] Obviously, the above embodiments of the present application are only examples for clearly illustrating the present application, and are not intended to limit the embodiments of the present application. For ordinary skilled in the art, on the basis of the above description, other different forms of changes or variations can be made. Here, it is not necessary and impossible to enumerate all the embodiments. Any modification, equivalent replacement and improvement within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. An LED module comprising a power-connection anode and a power-connection cathode, characterized in that, At least one first LED chip and at least one second LED chip are arranged in parallel between the power connection positive electrode and the power connection negative electrode, one of the at least one first LED chip or the at least one second LED chip is in series with at least one diode.

2. The LED module of claim 1, wherein, The number of the first LED chips is m, m is greater than or equal to 1, and when m is greater than or equal to 2, the m first LED chips are arranged in parallel.

3. The LED module of claim 2, wherein, The first LED chip is a UV-A chip, a UV-B chip, a UV-C chip, or a combination thereof.

4. The LED module of claim 1, wherein, The number of the second LED chips is n, n is greater than or equal to 1, and when n is greater than or equal to 2, the n second LED chips are arranged in parallel.

5. The LED module of claim 4, wherein, The second LED chip is a UV-A chip, a UV-B chip, a UV-C chip, or a combination thereof.

6. The LED module of claim 1, wherein, The diode is a Schottky diode or a zener diode.

7. A curing light source characterized by, The LED module according to any one of claims 1-6 is fixedly arranged on one surface of the bottom plate, the lens covers the LED module and is fixedly connected with the bottom plate, a cavity is arranged on the side of the lens close to the LED module, and the LED module is arranged in the cavity.

8. The curing light source of claim 7, wherein, The R-angle value of the surface directly above the projection area of the LED module is greater than 6 mm.

9. The curing light source of claim 8, wherein, The height H of the cavity is greater than 2 times the height h of the LED module, and is not greater than (H'-0.2 mm), wherein H' is the height of the lens.

10. A curing device characterized by comprising: The curing light source according to any one of claims 7-9 is electrically connected with the power supply, the controller is communicatively connected with the curing light source, and the controller is configured to at least control the power-on state of the curing light source.

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