Photoresist spraying device

Abstract

The utility model relates to a photoresist spraying device, and belongs to the technical field of semiconductor industry chip manufacturing. The photoresist spraying device comprises a spraying mechanism; the spraying mechanism comprises an injection assembly used for providing photoresist and conveying the photoresist to the bubble discharging assembly; the bubble discharging assembly is connected with the injection assembly and is used for receiving the photoresist from the injection assembly and removing bubbles in the photoresist; the mechanical arm spraying assembly is connected with the bubble discharging assembly and is used for accurately spraying the photoresist subjected to bubble removal onto a wafer substrate; and the driving assembly drives the mechanical arm spraying assembly and is used for changing the position and the height of a spraying head on the mechanical arm spraying assembly. According to the device disclosed by the utility model, accurate quantitative conveying of photoresist is realized, and meanwhile, foam can be efficiently discharged, so that the subsequent spin coating quality and the quality of a product are ensured.

Description

TECHNICAL FIELD

[0001] The utility model relates to the chip manufacturing technology field in semiconductor industry especially photoresist spouts device. BACKGROUND

[0002] With the development of chip manufacturing technology in semiconductor industry, photoresist uniform glue technology appears, and the characteristics of this technology are that photoresist needs to be accurately quantitatively dropped to the center of wafer substrate, the conveying mode, bubble removing effect and accuracy of dropping position all have important influence on the quality of final uniform glue technology and product quality. Further, the automation demand for photoresist conveying and glue discharging process and related conveying and dropping device are introduced.

[0003] In the related art, a diaphragm pump or N2 pressure supply assembly is used to realize the extrusion of photoresist, and the photoresist is conveyed to a buffer for bubble removal, and finally the photoresist stored in the buffer is output to a nozzle to complete the conveying and coating. This way uses N2 as a pressure power to adjust the pressure to control the extrusion and flow of photoresist, and uses the combination of a buffer tank and a filter to remove bubbles, and also uses the cooperation of a diaphragm and a driving part to ensure the accurate spouting of photoresist.

[0004] However, the above photoresist conveying and dropping method has the following problems: first, using a diaphragm pump or a pressure tank type glue pump to convey photoresist results in limited flexibility of glue output, and the structure of the pump is complex, difficult to maintain and high in cost; second, using a filter for bubble removal operation increases the complexity of the device, and the bubble removal effect is not ideal; finally, this method does not involve the design of a fixed-point accurate dropping system from the nozzle of the glue discharging pipe to the wafer substrate, and the automation degree is insufficient, which is difficult to adapt to large-scale and large-batch efficient production needs. UTILITY MODEL CONTENTS

[0005] In view of the above-mentioned shortcomings in the existing production technology, the present application provides a photoresist spouting device to realize accurate and quantitative conveying of photoresist, and efficient bubble removal to effectively ensure the subsequent uniform glue quality and product quality.

[0006] The technical solution adopted by the utility model is as follows:

[0007] A photoresist spouting device, comprising a spraying mechanism;

[0008] The spouting mechanism comprises:

[0009] An injection assembly for providing photoresist and conveying it to a bubble removing assembly;

[0010] The bubble removing assembly is connected to the injection assembly and is used to receive photoresist from the injection assembly and remove bubbles therein;

[0011] A mechanical arm spouting assembly is connected to the bubble removing assembly, and is used to accurately spout the bubble-removed photoresist onto the wafer substrate.

[0012] A driving assembly is used to drive the mechanical arm spouting assembly, so as to change the position and height of the spouting head on the mechanical arm spouting assembly.

[0013] In one of the embodiments, the injection assembly comprises a gel cavity, a piston is arranged on the gel cavity, the piston is opposite to the gel cavity, and a driving member is arranged on the other side of the piston, the piston and the driving member cooperatively form a driving cavity; an injection inlet and an injection outlet are arranged on the bottom of the gel cavity respectively; the piston reciprocates in the driving cavity, so as to change the pressure of the photoresist in the injection assembly, thereby realizing the injection and ejection processes of the photoresist.

[0014] In one of the embodiments, the injection assembly further comprises a reversing valve, the reversing valve is arranged on the bottom of the gel cavity and is located on the flow path of the photoresist, and is used to switch the flow direction of the photoresist during the injection and ejection processes.

[0015] In one of the embodiments, the bubble removing assembly comprises a bubble removing cavity, a bubble removing inlet, a bubble removing outlet and an exhaust port, the bubbles in the photoresist rise to the exhaust port and are removed after the photoresist enters the bubble removing cavity from the bubble removing inlet, and the bubble-removed photoresist flows out from the bubble removing outlet.

[0016] In one of the embodiments, the bubble removing assembly further comprises a three-way valve and a solenoid valve, the solenoid valve is in communication with one of the ports of the three-way valve, and the remaining ports of the three-way valve are in communication with an exhaust pipe.

[0017] In one of the embodiments, a liquid level sensor is further arranged on the communication path between the solenoid valve and the three-way valve, and is used to detect the liquid level of the photoresist.

[0018] In one of the embodiments, the mechanical arm spouting assembly further comprises a back suction valve, one end of the back suction valve is in communication with the injection pipe and the air inlet pipe, the other end of the back suction valve is in communication with the ejection pipe and the air outlet pipe, and the back suction valve is used to perform back suction operation on the photoresist in the spouting head and prevent the excess photoresist from being mistakenly dripped on the wafer substrate.

[0019] In one of the embodiments, a first throttle valve and a second throttle valve are further arranged, the first throttle valve is arranged on the air inlet pipe, the second throttle valve is arranged on the air outlet pipe, the first throttle valve and the second throttle valve are in communication with a gas source valve through the three-way valve, and are used to adjust the pressure difference between the two ends of the back suction valve.

[0020] In one of the embodiments, the structure of the spitting head comprises a spitting head body, on which a plurality of glue pipe mounting holes are provided for fixing the glue outlet pipe and completing the fixed-point and fixed-quantity spitting of the photoresist.

[0021] In one of the embodiments, the driving assembly comprises a lifting motor and a swing motor; the output shaft of the lifting motor is fixed with a swing motor mounting seat at the top of the output direction, and the swing motor is assembled on the swing motor mounting seat; the output end of the swing motor drives the rotating rod to swing, the rotating rod drives the mechanical swing arm to swing through the adapter block; the spitting head is driven to rotate through another adapter block at the end position of the mechanical swing arm; the spitting head is changed in position in the vertical height by the lifting motor, and the spitting head is changed in position in the horizontal plane by the swing motor.

[0022] The beneficial effects of the utility model are as follows:

[0023] The utility model discloses compact structure, reasonable, convenient operation, and the injection assembly supply amount can be accurately controlled through the driving part, effectively improves the precision of gluing quantity, and the flexibility of extruding glue is stronger, and the movement distance of piston part can be controlled through the adjustment driving part, can be realized in the target design total amount range's fraction controlled drop glue, improves the uniformity of glue process flexibility and production efficiency;

[0024] The utility model also includes the following advantages:

[0025] (1) the bubble discharge device structure is reasonable, and the cost is low, can realize convenient and efficient bubble discharge, and the photoresist of different viscosity types has very good bubble discharge effect: the photoresist of big viscosity provides negative pressure and realizes rapid bubble discharge, and the photoresist of lower viscosity directly utilizes the density difference of bubble and glue solution to realize gas-liquid separation, realizes simple and rapid bubble removal, and the bubble discharge device structure design is simple, does not need filter assembly, and the material can be widely adapted, and operation is more convenient and fast;

[0026] (2) the mechanical arm spitting assembly precision positioning drop glue point, cooperates back suction valve, can effectively control the glue solution back suction at the nozzle, prevents the redundant glue solution from being misdropped on the wafer substrate, and the degree of automation is high, and through the mechanical arm spitting assembly, large batch automatic and efficient production can be realized. BRIEF DESCRIPTION OF DRAWINGS

[0027] Figure 1 It is the external overall structure schematic diagram of the utility model.

[0028] Figure 2 It is the system structure principle schematic diagram of the spitting mechanism of the utility model.

[0029] Figure 3 It is the structure schematic diagram of the driving assembly in the spitting mechanism of the utility model.

[0030] 1. The glue uniformity machine; 2. The spout mechanism;

[0031] 21. The injection assembly; 22. The bubble discharge assembly; 23. The mechanical arm spout assembly; 24. The driving assembly;

[0032] 211. The piston; 212. The driving part; 213. The injection inlet; 214. The injection outlet; 215. The reversing valve; 216. The driving cavity; 217. The glue cavity;

[0033] 221. The bubble discharge cavity; 222. The bubble discharge inlet; 223. The bubble discharge outlet; 224. The exhaust port; 225. The first three-way valve; 226. The liquid level sensor; 227. The electromagnetic valve;

[0034] 231. The mechanical swing arm; 232. The spout head; 233. The back suction valve; 234. The first throttle valve; 235. The second throttle valve; 236. The glue inlet pipe; 237. The air inlet pipe; 238. The glue outlet pipe; 239. The air outlet pipe; 2310. The second three-way valve; 2311. The gas source valve;

[0035] 23201. The spout head body; 23202. The glue pipe mounting hole;

[0036] 241. The lifting motor; 242. The lifting motor output shaft; 243. The swing motor mounting seat; 244. The swing motor; 245. The rotating rod; 246. The first adapter block; 247. The assembly fixing block; 248. The second adapter block; 249. The sheet metal shell. DETAILED DESCRIPTION

[0037] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific embodiments of the present application will be described in detail below in combination with the drawings. In the following description, a large number of specific details are set forth in order to fully understand the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the spirit of the present application, so the present application is not limited to the specific embodiments disclosed below.

[0038] In the description of the present application, it should be understood that if these terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0039] In addition, the terms "first", "second", and the like, if any, are used herein for descriptive purposes only and should not be construed as indicating or implying relative importance or identifying the number of the indicated technical features. Thus, a feature defined with "first" or "second" can explicitly or implicitly include at least one of the features. In the description of the present application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise explicitly specified and limited.

[0040] In the present application, unless otherwise explicitly specified and limited, if the terms "mounting", "connecting", "connecting", "fixing" and the like appear, these terms should be interpreted broadly. For example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0041] In the present application, unless otherwise explicitly specified and limited, if the first feature is described as "on" or "under" the second feature, etc., it can mean that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature "above", "above" and "above" the second feature can be the first feature directly above or obliquely above the second feature, or it can only mean that the first feature is higher than the second feature in horizontal height. The first feature "below", "below" and "below" the second feature can be the first feature directly below or obliquely below the second feature, or it can only mean that the first feature is lower than the second feature in horizontal height.

[0042] It should be noted that if an element is referred to as "fixed to" or "disposed on" another element, it can be directly on another element or there can be a middle element. If an element is considered to be "connected" to another element, it can be directly connected to another element or there can be a middle element. If present, the terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used in the present application are for illustrative purposes only and do not represent the only implementation.

[0043] Referring to Figure 1 , Figure 1 An external structure schematic diagram of a photoresist spraying device in an embodiment of the present application is shown.

[0044] The photoresist spraying device provided by the embodiment of the present application is used for being assembled in the glue spreading machine 1, and aims to realize accurate quantitative delivery and efficient bubble removal of the photoresist, so as to ensure the subsequent glue spreading quality and product quality.

[0045] The photoresist spraying device of the embodiment comprises a spraying mechanism 2;

[0046] The spraying mechanism 2 is arranged on one side of the glue spreading machine 1, and the glue spreading machine 1 is used for fixing a wafer substrate and spin coating the photoresist dropped thereon.

[0047] The spraying mechanism 2 further comprises an injection assembly 21, a bubble removal assembly 22, a mechanical arm spraying assembly 23 and a driving assembly 24.

[0048] In combination with Figure 2 , Figure 2 The system structure principle schematic diagram of the spraying mechanism 2 in the embodiment of the present application is shown.

[0049] The injection assembly 21 is responsible for providing the photoresist and delivering the photoresist to the bubble removal assembly 22. Specifically, the injection assembly 21 comprises a glue cavity 217, a piston member 211 and a driving member 212. The piston member 211 is installed inside the glue cavity 217, and the driving member 212 is arranged on the other side of the piston member 211, and the two members together constitute a driving cavity 216. The bottom of the glue cavity 217 is respectively provided with an injection inlet 213 and an injection outlet 214. When the driving member 212 is started, the piston member 211 reciprocates in the driving cavity 216, changes the pressure of the photoresist in the glue cavity 217, realizes the cycle process that the photoresist is sucked into the glue cavity 217 from the injection inlet 213 and then is discharged from the injection outlet 214;

[0050] Further, in order to ensure the accurate control of the flow of the photoresist, the injection assembly 21 is also provided with a reversing valve 215, which is located at the bottom of the glue cavity 217 and on the flow path of the photoresist. The reversing valve 215 is responsible for switching the flow direction of the photoresist during the processes of sucking in and discharging, so as to ensure that the photoresist can smoothly flow along the predetermined path.

[0051] The bubble removal assembly 22 is connected with the injection assembly 21, and the main function is to receive the photoresist from the injection assembly 21 and remove the bubbles therein. Specifically, the bubble removal assembly 22 comprises a bubble removal cavity 221, a bubble removal inlet 222, a bubble removal outlet 223 and an exhaust port 224. After the photoresist flows into the bubble removal cavity 221 from the bubble removal inlet 222, the bubbles will rise to the exhaust port 224 and be discharged due to the smaller density of the bubbles than the photoresist, and the photoresist after removing the bubbles will flow out from the bubble removal outlet 223;

[0052] Further, in order to optimize the bubble-removing effect, the bubble-removing assembly 22 further integrates a first three-way valve 225, a solenoid valve 227 and a liquid level sensor 226. The solenoid valve 227 is connected with one port of the first three-way valve 225, and the remaining ports of the first three-way valve 225 are connected with an exhaust pipe; the liquid level sensor 226 is arranged on the passage between the solenoid valve 227 and the first three-way valve 225, for monitoring the liquid level of the photoresist in real time; when the photoresist reaches the liquid level sensor 226, the liquid level sensor 226 will send a signal to trigger the solenoid valve 227 to close, so as to avoid the photoresist flowing out.

[0053] Specifically, when the bubble-removing inlet 222 flows into the bubble-removing cavity 221, the gas in the photoresist will separate and gather above the bubble-removing cavity 221 due to the density difference with the photoresist. The top of the bubble-removing cavity 221 of the bubble-removing device is provided with an exhaust port 224, an exhaust pipe can be installed and controlled by the solenoid valve 227, and the exhaust port 224 is opened after the gas gathers, and the gas is discharged through the exhaust pipe;

[0054] Further specifically, in the embodiment, the liquid level sensor 226 is arranged between the first three-way valve 225 and the solenoid valve 227, and when the photoresist reaches the liquid level sensor 226, the liquid level sensor 226 sends a control signal, and at this time, the solenoid valve 227 is closed to prevent the photoresist from flowing out.

[0055] Among them, the mechanical arm spitting assembly 23 is responsible for accurately spitting the photoresist after bubble removal to the wafer substrate. Specifically, the mechanical arm spitting assembly 23 includes a mechanical swing arm 231, a spitting head 232 and a back suction valve 233; the spitting head 232 is fixed at the end of the mechanical swing arm 231, and a plurality of glue pipe mounting holes 23202 are arranged on the spitting head 232 for fixing the glue outlet pipe 238, so as to ensure that the photoresist can be spit in a fixed point and a fixed amount; the back suction valve 233 is connected with the glue inlet pipe 236 and the air inlet pipe 237, and the glue outlet pipe 238 and the air outlet pipe 239. Before spitting the photoresist, the back suction valve 233 performs back suction operation on the photoresist in the spitting head 232, which effectively prevents the excess photoresist from being mistakenly dropped on the wafer substrate.

[0056] Specifically, the above back suction operation is as follows:

[0057] Before formal dropping of glue, the preset of back suction amount needs to be carried out, the back suction valve 233 is opened, and the photoresist glue solution flows out from the spout head 232 due to the gravity; the gas source valve 2311 is opened, the first gas source is connected, and the first throttle valve 234 and the second throttle valve 235 are adjusted to control the flow of the first gas source, until the photoresist glue solution reaches the target back suction amount at the spout head 232, and then the gas flow of the first throttle valve 234 and the second throttle valve 235 is fixed; the mechanical swing arm 231 is moved to the center of the wafer substrate, and the formal dropping of glue is started; the injection assembly 21 stops when the target glue injection amount is reached, at this time, the back suction valve 233 is opened due to the pressure difference, and the glue solution in the spout head 232 is immediately back suctioned according to the preset back suction amount, so as to stop dropping.

[0058] Specifically, the structure of the spout head 232 includes a spout head body 23201, and a plurality of glue pipe mounting holes 23202 are arranged on the spout head body 23201, which are used for completing the fixed-point and fixed-quantity spouting of the photoresist.

[0059] Specifically, in order to accurately control the pressure difference between the two ends of the back suction valve 233, the first throttle valve 234 and the second throttle valve 235 are additionally arranged in the mechanical arm spout assembly 23; the first throttle valve 234 is arranged on the air inlet pipe 237, and the second throttle valve 235 is arranged on the air outlet pipe 239, both of which are connected with the gas source valve 2311 through the second three-way valve 2310, so as to realize the fine adjustment of the pressure difference between the two ends of the back suction valve 233.

[0060] Please refer to Figure 3 , Figure 3 The structure schematic diagram of the driving assembly 24 in the spout mechanism 2 of the utility model is shown.

[0061] The driving assembly 24 is responsible for driving the mechanical arm spout assembly 23 to accurately position and move. The driving assembly 24 includes a lifting motor 241 and a swing motor 244; the top end of the lifting motor output shaft 242 of the lifting motor 241 is fixed with a swing motor mounting seat 243, and the swing motor 244 is mounted on the swing motor mounting seat 243. The output end of the swing motor 244 drives the rotating rod 245 to swing, and the rotating rod 245 drives the mechanical swing arm 231 to swing through the first adapter block 246. The end of the mechanical swing arm 231 drives the spout head 232 to rotate through the second adapter block 248. The position of the spout head 232 in the vertical direction is adjusted through the lifting motor 241, and the swing position of the spout head 232 in the horizontal plane is adjusted through the swing motor 244, so as to realize the accurate spouting of the photoresist.

[0062] In this embodiment, at least one assembly fixing block 247 is arranged on the mechanical swing arm 231, and the assembly fixing block 247 is used for assembling and fixing the back suction device and the glue pipe of the photoresist.

[0063] In the embodiment, the periphery of the driving assembly 24 is further provided with a sheet metal shell 249 for structural protection.

[0064] In summary, the photoresist spraying device of the utility model realizes accurate quantitative delivery, efficient bubble removal and accurate spraying of the photoresist through the syringe assembly 21, the bubble removal assembly 22, the mechanical arm spraying assembly 23 and the driving assembly 24. The whole device is compact and reasonable in structure and easy to operate, which not only improves the accuracy and efficiency of photoresist spraying, but also effectively guarantees the subsequent uniformity of the glue quality and the product quality.

[0065] The technical features of the above-described embodiments can be combined arbitrarily, and to make the description concise, all possible combinations of the technical features in the above-described embodiments are not described, however, as long as the combinations of the technical features do not exist contradictory, they should be considered as the scope of the description.

[0066] The above-described embodiments only express several implementation manners of the application, and the description is more specific and detailed, but it should not be understood as a limitation on the patent application scope. It should be pointed out that for ordinary skilled persons in the art, some modifications and improvements can be made without departing from the concept of the application, and these all belong to the protection scope of the application. Therefore, the patent protection scope of the application should be subject to the appended claims.

Claims

1. A photoresist spitting device, characterized by, The injection mechanism comprises: The injection mechanism comprises: The injection mechanism comprises: The injection mechanism comprises: The injection mechanism comprises: The injection mechanism comprises:

2. The photoresist spitting device of claim 1, wherein The injection mechanism comprises: The injection mechanism comprises: The injection mechanism comprises:

3. The photoresist spitting device of claim 2, wherein The injection mechanism comprises:

4. The photoresist spitting device of claim 1, wherein The injection mechanism comprises:

5. The photoresist spitting device of claim 4, wherein The injection mechanism comprises:

6. The photoresist spitting device of claim 5, wherein The injection mechanism comprises:

7. The photoresist spitting device of claim 1, wherein The injection mechanism comprises: The injection mechanism comprises:

8. The photoresist spitting device of claim 7, wherein The injection mechanism comprises:

9. The photoresist spitting device of claim 1 or 7, wherein The injection mechanism comprises:

10. 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