Clamp for clamping molecular beam epitaxy device

Abstract

The embodiment of the utility model provides a clamp for clamping a molecular beam epitaxy device, and relates to the technical field of molecular beam epitaxy, and the clamp comprises a handle part which comprises a first handle and a second handle which are connected at an acute angle; the clamping assembly comprises a first clamping part and a second clamping part, the first clamping part is connected with one end of the first handle, and the second clamping part is connected with one end of the second handle; and the outline of at least one of the first clamping part and the second clamping part is matched with the outline of a workpiece to be clamped. In the embodiment of the invention, the acute angle is formed between the first handle and the second handle, and the first clamping part and the second clamping part are propped against the peripheral contour of the workpiece, so that the fixture can be prevented from touching a part of epitaxial growth of the wafer, and the probability that the wafer is damaged is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of molecular beam epitaxy, and particularly relates to a clamp for clamping a molecular beam epitaxy device. BACKGROUND

[0002] In the related art, molecular beam epitaxy (MBE) is a new technology for growing high-quality crystal thin films on a crystal substrate. In an ultrahigh vacuum condition, vapors generated by heating furnaces containing various required components are collimated into molecular beams or atomic beams through small holes, and then the molecular beams or atomic beams are directly sprayed onto a single crystal substrate at an appropriate temperature. At the same time, the molecular beams are controlled to scan the substrate, so that the molecules or atoms are arranged layer by layer on the substrate to form a thin film. Therefore, the surface of a device wafer produced by the molecular beam epitaxy technology is not allowed to be contaminated or contacted.

[0003] Commonly used tools for taking out a device wafer without contacting the epitaxial surface are mostly vacuum suction pens. However, the vacuum suction pen has the disadvantage of inconvenient movement due to its own reasons. Other convenient moving clamps inevitably have to contact a part of the epitaxial surface for safety. CONTENT OF THE INVENTION

[0004] The present application aims to at least solve one of the technical problems existing in the prior art. To this end, the present application provides a clamp for clamping a molecular beam epitaxy device, which can clamp the device without contacting the epitaxial surface of the device.

[0005] The clamp for clamping a molecular beam epitaxy device provided by the embodiments of the present application comprises:

[0006] The handle part comprises a first handle and a second handle connected at an acute angle.

[0007] The clamping assembly comprises a first clamping part and a second clamping part, the first clamping part is connected to one end of the first handle, and the second clamping part is connected to one end of the second handle.

[0008] At least one of the first clamping part and the second clamping part has a contour matched with a contour of a workpiece to be clamped.

[0009] According to the clamp provided by the embodiments of the present application, the included angle between the first handle and the second handle is 34°.

[0010] According to the clamp provided by the embodiments of the present application, the first clamping part is arranged in a circular arc shape, and the center of the circular arc of the first clamping part is located on a side of the first clamping part close to the second clamping part; and / or, the second clamping part is arranged in a circular arc shape, and the center of the circular arc of the second clamping part is located on a side of the second clamping part close to the first clamping part.

[0011] According to the clamp provided in the embodiment of the present application, the central angle of the profile of the first clamping part is 60°.

[0012] According to the clamp provided in the embodiment of the present application, the central angle of the profile of the second clamping part is 60°.

[0013] According to the clamp provided in the embodiment of the present application, the clamping assembly further comprises a support part, and at least one of the first clamping part and the second clamping part is connected with the support part.

[0014] According to the clamp provided in the embodiment of the present application, one end of the support part is a free end, and the free end is provided with an inclined surface arranged obliquely.

[0015] According to the clamp provided in the embodiment of the present application, the material of the support part is anti-static carbon fiber.

[0016] According to the clamp provided in the embodiment of the present application, the handle part comprises an extension part, one end of the extension part is connected with the joint of the first handle and the second handle, and the other end of the extension part is a free end and extends towards the side away from the clamping assembly.

[0017] According to the molecular beam epitaxy wafer clamp provided in the embodiment of the present application, the first handle and the second handle are made of elastic material.

[0018] From the above technical solutions, the embodiments of the present application have at least the following beneficial effects:

[0019] In the clamp for clamping a molecular beam epitaxy device provided in the embodiments of the present application, the first handle and the second handle are arranged at an acute angle, and a clamping space is formed between the first handle and the second handle, and the clamping space is used to accommodate a wafer. In this way, when clamping the wafer, an acting force can be applied to the first handle and the second handle, so that the first clamping part and the second clamping part are folded and jointly clamp the wafer. The profile of at least one of the first clamping part and the second clamping part matches the partial profile of the workpiece to be clamped, which can increase the contact area of the clamp and the workpiece to be clamped, thereby reducing the situation that the workpiece falls off. At the same time, the first clamping part and the second clamping part abut against the outer peripheral profile of the workpiece, which can avoid the clamp from touching the part not grown epitaxially on the wafer, thereby reducing the probability that the wafer is damaged. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0021] Figure 1 Fig. 1 shows a schematic diagram of an overall structure of a clamp for clamping a molecular beam epitaxy device according to an embodiment of the present application;

[0022] Figure 2 Fig. 2 shows a schematic diagram of a bottom view of a clamp for clamping a molecular beam epitaxy device according to an embodiment of the present application;

[0023] Figure 3 Fig. 3 shows a schematic diagram of a clamping assembly in a clamp for clamping a molecular beam epitaxy device according to an embodiment of the present application;

[0024] Figure 4 Fig. 4 shows a schematic diagram of a clamp for clamping a molecular beam epitaxy device according to an embodiment of the present application.

[0025] Reference signs:

[0026] 110, first handle; 120, second handle; 130, clamping space; 140, extension; 141, free end;

[0027] 210, first clamping part; 220, second clamping part; 230, support part; 231, inclined surface. DETAILED DESCRIPTION

[0028] The technical solutions in the embodiments of the present application will be apparently and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0029] Reference is made to Figures 1 to 3 Fig. 1, which shows that an embodiment of the present application discloses a clamp for clamping a molecular beam epitaxy device, which comprises a handle part and a clamping assembly.

[0030] Specifically, the handle part comprises a first handle 110 and a second handle 120 which are connected to each other at an acute angle; the clamping assembly comprises a first clamping part 210 and a second clamping part 220, the first clamping part 210 is connected to one end of the first handle 110, and the second clamping part 220 is connected to the second handle 120, and the profile of at least one of the first clamping part 210 and the second clamping part 220 matches the profile of a part of a workpiece to be clamped.

[0031] In the clamp, the first clamping part and the second clamping part are arranged at an acute angle, and the first handle 110 and the second handle 120 form a clamping space 130 for placing the workpiece to be clamped.

[0032] The clamp of the embodiment of the present application is used for clamping a molecular beam epitaxy device wafer. It should be understood that the clamp can also be used for clamping other workpieces, which is not limited herein.

[0033] In the clamp for clamping a molecular beam epitaxy device provided by the embodiment of the present application, the first handle 110 and the second handle 120 are arranged at an acute angle, and a clamping space 130 is formed between the first handle 110 and the second handle 120, which is used for accommodating and clamping the wafer. In this way, when the wafer is clamped, the first clamping part 210 and the second clamping part 220 can be folded and clamped together by applying a force to the first handle 110 and the second handle 120.

[0034] In the clamp for clamping a molecular beam epitaxy device provided by the embodiment of the present application, the first handle 110 and the second handle 120 are arranged at an acute angle, and a clamping space 130 is formed between the first handle 110 and the second handle 120, which is used for accommodating and clamping the wafer. In this way, when the wafer is clamped, the first clamping part 210 and the second clamping part 220 can be folded and clamped together by applying a force to the first handle 110 and the second handle 120.

[0035] In a possible implementation, the part of the first clamping part 210 in contact with the workpiece matches the outer peripheral contour of the workpiece, that is, the part of the first clamping part 210 in contact with the workpiece is designed in profile with the contour of the workpiece. In this way, the contact area between the first clamping part 210 and the workpiece can be increased, thereby improving the stability of clamping the workpiece.

[0036] In another possible implementation, the part of the second clamping part 220 in contact with the workpiece matches the outer peripheral contour of the workpiece, that is, the part of the second clamping part 220 in contact with the workpiece is designed in profile with the contour of the workpiece. In this way, the contact area between the second clamping part 220 and the workpiece can be increased, thereby improving the stability of clamping the workpiece.

[0037] In the embodiment, as shown in Figures 1 to 3 The part of the first clamping part 210 in contact with the workpiece matches the outer peripheral contour of the workpiece, and the part of the second clamping part 220 in contact with the workpiece matches the outer peripheral contour of the workpiece, which can increase the contact area between the second clamping part 220 and the workpiece, thereby improving the stability of clamping the workpiece.

[0038] It should be understood that in the embodiment of the present application, as shown in Figure 2 The included angle β of the first handle 110 and the second handle 120 can be selected according to the diameter of the workpiece to be clamped and the length of the first handle 110 and the second handle 120.

[0039] For example, as shown in Figure 4As shown, the included angle between the first handle 110 and the second handle 120 is 34°.

[0040] In some embodiments of the present application, referring to Figures 1 to 3 , the first clamping portion 210 is arranged in a circular arc shape, and the center of the circle of the first clamping portion 210 is located on the side of the first clamping portion 210 close to the second clamping portion 220. Specifically, the profile of the workpiece is circular, and the radius of the circular arc portion of the first clamping portion 210 is equal to the radius of the workpiece. In this way, the inner wall surface of the first clamping portion 210 can be fitted with the outer peripheral wall surface of the workpiece, thereby improving the stability of clamping.

[0041] In some embodiments of the present application, referring to Figures 1 to 3 , the second clamping portion 220 is arranged in a circular arc shape, and the center of the circle of the second clamping portion 220 is located on the side of the second clamping portion 220 close to the first clamping portion 210. Specifically, the profile of the workpiece is circular, and the radius of the circular arc portion of the second clamping portion 220 is equal to the radius of the workpiece. In this way, the inner wall surface of the second clamping portion 220 can be fitted with the outer peripheral wall surface of the workpiece, thereby improving the stability of clamping.

[0042] In some embodiments of the present application, the central angle of the profile of the first clamping portion 210 is 60°. That is, the arc length of the first clamping portion 210 is 1 / 6 of the entire circumference. In this way, the first clamping portion 210 is in an open shape, which facilitates clamping of the workpiece.

[0043] In some embodiments of the present application, the central angle of the profile of the second clamping portion 220 is 60°. That is, the arc length of the second clamping portion 220 is 1 / 6 of the entire circumference. In this way, the second clamping portion 220 is in an open shape, which facilitates clamping of the workpiece.

[0044] In some embodiments of the present application, referring to Figures 1 to 3 , the clamping assembly further comprises a support portion 230, and at least one of the first clamping portion 210 and the second clamping portion 220 is connected with the support portion 230. In this way, the support portion 230 can be used to hold up the workpiece, thereby reducing the probability of the workpiece falling.

[0045] In one embodiment, please continue to refer to Figures 1 to 3 , the first clamping portion 210 is connected with the support portion 230, and the support portion 230 is arranged on the side of the first clamping portion 210 close to the second handle 120. When clamping the workpiece, the support portion 230 is at least partially located below the workpiece to hold up the workpiece.

[0046] In one possible embodiment, referring to Figures 1 to 3The second clamping part 220 is connected with a support part 230, which is arranged on the side of the second clamping part 220 close to the first handle 110. When clamping the workpiece, the support part 230 is at least partially located below the workpiece to hold up the workpiece.

[0047] Of course, the first clamping part 210 and the second clamping part 220 can also be provided with the support part 230 simultaneously.

[0048] In some embodiments of the present application, referring to Figures 1 to 3 The support part 230 has a free end 141, and the free end 141 is provided with an inclined surface 231 arranged obliquely. In this way, the workpiece can be guided to move onto the support part 230 under the guidance of the inclined surface 231 during clamping of the workpiece.

[0049] In some embodiments of the present application, the material of the support part 230 is anti-static carbon fiber.

[0050] In some embodiments of the present application, the first handle 110 and the second handle 120 are arranged symmetrically. Further, the first clamping part 210 and the second clamping part 220 are also arranged symmetrically.

[0051] In some embodiments of the present application, referring to Figures 1 to 3 The handle part comprises an extension part 140, one end of the extension part 140 is connected with the joint of the first handle 110 and the second handle 120, and the other end of the extension part 140 is a free end 141 and extends towards the side away from the clamping space 130.

[0052] In some embodiments of the present application, referring to Figures 1 to 3 One end of the extension part 140 is connected with the joint of the first handle 110 and the second handle 120, and the other end of the extension part 140 extends along the symmetry axis of the first handle 110 and the second handle 120 towards the direction away from the clamping assembly.

[0053] In some embodiments of the present application, the first handle 110 and the second handle 120 are made of elastic material. When no workpiece is clamped, the clamping space 130 enclosed by the first clamping part 210 and the second clamping part 220 is larger than the size of the workpiece to be clamped; when the workpiece is clamped, the first handle 110 and the second handle 120 are folded by applying a force to the first handle 110 and the second handle 120, so as to drive the first clamping part 210 and the second clamping part 220 to fold and clamp the workpiece; after use, the force for folding the first handle 110 and the second handle 120 is removed, and under the restoring force of the first handle 110 and the second handle 120, the spacing between the first clamping part 210 and the second clamping part 220 is increased, and the workpiece is released.

[0054] The clamp for clamping a molecular beam epitaxy device according to the embodiments of the present application will be described in detail below with reference to a specific embodiment. It should be noted that the following embodiment is only an exemplary description and should not be construed as a limitation on the embodiments of the present application.

[0055] Referring to Figures 1 to 4 As shown in the drawings, the clamp for clamping a molecular beam epitaxy device according to the embodiments of the present application comprises a handle portion and a clamping portion, and the clamping portion is used to clamp a molecular beam epitaxy device wafer.

[0056] The handle portion comprises a first handle 110 and a second handle 120, the lengths of the first handle 110 and the second handle 120 are 100 mm respectively, the first handle 110 and the second handle 120 are distributed in a triangular shape, the angle between the first handle 110 and the second handle 120 is 34°, and the materials of the first handle 110 and the second handle 120 are stainless steel.

[0057] Further, the clamping portion is left-right symmetrical and openable and closable. Specifically, the clamping portion comprises a first clamping portion 210 and a second clamping portion 220, the first clamping portion 210 and the second clamping portion 220 are 1 / 6 circular arc structures with a radius of 25 mm, the height of the circular arc structure is 5 mm, the inside of the circular arc opening and closing has a support portion 230 for preventing the workpiece from falling, the thickness of the support portion 230 is set to 1 mm, and the edge of the circular arc structure and the support portion 230 is designed to be inclined at a certain angle. The materials of the first clamping portion 210, the second clamping portion 220 and the support portion 230 are anti-static carbon fibers.

[0058] In the above embodiment, the wafer is fixed by the first support portion 230, the second support portion 230 and the support portion 230 in a circular arc shape; the first support portion 230 and the second support portion 230 can prevent the wafer from slipping when clamping the wafer, and the support portion 230 is used to contact the lower side (the side without epitaxial growth) of the wafer to prevent the wafer from falling; the inclination at the edge makes it more convenient, faster and safer to clamp the wafer. In this way, the safety and stability of clamping the wafer can be better guaranteed, and the versatility of the molecular beam epitaxy clamp is greatly improved.

[0059] In the description of the present application, it should be understood that the orientations or positional relationships indicated by the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be construed as a limitation on the present application.

[0060] The terms "first", "second", etc. are used only for the purpose of description, and are not to be interpreted as indicating or implying relative importance or a number of indicated technical features. Thus, features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise specified.

[0061] In the description of the present application, it should be noted that, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connecting" should be understood in a broad sense, for example, can be fixed connection, can also be detachable connection, or integrally connected; can be directly connected, or indirectly connected through an intermediate medium, can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific situation.

[0062] In the description of the present application, specific features, structures, materials or characteristics can be combined in any one or more embodiments or examples in a suitable manner.

Claims

1. A clamp for clamping a molecular beam epitaxy device, characterized in that, The utility model relates to a handle part, a clamping assembly and a clamping device. The handle part comprises a first handle and a second handle connected at an acute angle. The clamping assembly comprises a first clamping part connected to one end of the first handle and a second clamping part connected to one end of the second handle. At least one of the first clamping part and the second clamping part has a contour matching that of a workpiece to be clamped.

2. The gripper for use in a molecular beam epitaxy apparatus according to claim 1, wherein The acute angle between the first handle and the second handle is 34°.

3. The gripper for use in gripping a molecular beam epitaxy apparatus according to claim 1, wherein The first clamping part is in the shape of a circular arc, and the center of the circular arc is located at the side of the first clamping part close to the second clamping part.

4. The gripper for use in a molecular beam epitaxy apparatus according to claim 3, wherein The second clamping part is in the shape of a circular arc, and the center of the circular arc is located at the side of the second clamping part close to the first clamping part.

5. The gripper for use in a molecular beam epitaxy apparatus according to claim 3, wherein The central angle of the contour of the first clamping part is 60°.

6. The gripper for use in a molecular beam epitaxy apparatus according to any one of claims 1 to 5, wherein The central angle of the contour of the second clamping part is 60°.

7. The gripper for use in a molecular beam epitaxy apparatus according to claim 6, wherein The clamping assembly further comprises a support part connected to at least one of the first clamping part and the second clamping part.

8. The gripper for use in a molecular beam epitaxy apparatus according to claim 6, wherein One end of the support part is a free end, and the free end is provided with an inclined surface.

9. The gripper for use in gripping a molecular beam epitaxy apparatus according to claim 1, wherein The material of the support part is anti-static carbon fiber.

10. The gripper for use in gripping a molecular beam epitaxy apparatus according to claim 1, wherein The handle part comprises an extension part, one end of which is connected to the joint of the first handle and the second handle, and the other end of which is a free end extending away from the clamping assembly. The first handle and the second handle are made of elastic material.

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