Wafer cutting machine for semiconductor chip processing

Abstract

The utility model relates to the technical field of mechanical processing devices, and discloses a wafer cutting machine for semiconductor chip processing, which comprises a cutter, a sliding rail is fixedly connected to the top end in the cutter, a sliding block is slidably connected to the outside of the sliding rail, a hydraulic cylinder is fixedly connected to the bottom of the sliding block, and the hydraulic cylinder is fixedly connected to the top end of the cutter. The driving end of the hydraulic cylinder is fixedly connected with a providing shell, the rear end of the left side of the providing shell is fixedly connected with a motor, the driving end of the motor is fixedly connected with a driving wheel, the driving wheel is sleeved with a conveying belt, and the front end of the interior of the providing shell is rotationally connected with a driven wheel; and a plurality of connecting blocks are fixedly connected to the outer portion of the conveying belt, and a movable plate is slidably connected to the bottom end of the interior of the supply shell. According to the utility model, the maneuverability is greatly improved when the wafer is cut, the position can be adjusted at will, the processing requirements of chips with different shapes and sizes can be easily met, the leftover material of the wafer is greatly reduced, and the material utilization rate is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to mechanical processing device technical field especially relates to wafer cutting machine of semiconductor chip processing. BACKGROUND

[0002] Semiconductor chip is a kind of micro electronic device that integrates integrated circuit (IC) on semiconductor material (such as silicon) wafer. It is the core component of modern electronic equipment, can realize signal processing, storage, operation and many other functions. Chip contains a large number of transistors and other electronic components, is manufactured through fine photolithography process, and is widely used in mobile phones, computers, automobiles and many other fields.

[0003] Wafer cutting machine basic structure mainly includes cutting tool and tool holder, workbench and wafer fixing device, transmission system, control system. Tool and tool holder cut wafer through high-speed rotation;Workbench and fixing device ensure that wafer is stable;Transmission system transmits power to drive cutting;Control system commands each component to work, guarantees cutting accuracy.

[0004] In the prior art, the flexibility of the cutting head of part of wafer cutting machines is greatly reduced during use, only fixed position and shape can be cut, and the wafer utilization rate will decrease, because it is difficult to cut complex patterns accurately, resulting in material waste and increased cost. Therefore, the wafer cutting machine for semiconductor chip processing is proposed to solve the above problems. UTILITY MODEL CONTENT

[0005] In order to make up for the above shortcomings, the wafer cutting machine for semiconductor chip processing is provided to improve the problem that the flexibility of the cutting head to chip cutting in the prior art cannot be improved.

[0006] In order to achieve the above purpose, the utility model adopts the following technical scheme:

[0007] Wafer cutting machine for semiconductor chip processing, including cutter, the inside top of the cutter is fixedly connected with slide rail, the outside of the slide rail is slidably connected with sliding block, the bottom of the sliding block is fixedly connected with hydraulic cylinder, the driving end of the hydraulic cylinder is fixedly connected with providing shell, the left side rear end of the providing shell is fixedly connected with motor, the driving end of the motor is fixedly connected with driving wheel, the outside of the driving wheel is sleeved with transmission belt, the inside front end of the providing shell is rotatably connected with driven wheel, the outside of the transmission belt is fixedly connected with a plurality of connecting blocks, the inside bottom of the providing shell is slidably connected with moving plate, the top of the moving plate is fixedly connected with a plurality of passive blocks, the bottom of the moving plate is fixedly connected with cutting head, the inside of the cutter is fixedly connected with clamping assembly for positioning chip;

[0008] As a further description of the above technical scheme:

[0009] The other end of the transmission belt is sleeved outside the driven wheel, and the outside of the passive block is in contact with the outside of the connecting block;

[0010] As further description of the above technical solution:

[0011] The left and right ends of the shell are fixedly connected with telescopic plates, and the far ends of the two telescopic plates are fixedly connected with sliding blocks;

[0012] As further description of the above technical solution:

[0013] The left and right ends of the inside of the cutter are provided with sliding grooves, and the outside of the sliding block is slidingly connected in the inside of the sliding groove;

[0014] As further description of the above technical solution:

[0015] The clamping assembly comprises a workbench, the outside of the workbench is fixedly connected in the inside of the cutter, the top of the workbench is rotatably connected with two connecting rods, and the top of the two connecting rods is fixedly connected with clamping blocks;

[0016] As further description of the above technical solution:

[0017] The left and right ends of the top of the workbench are slidingly connected with rubber plates, and the outside of the two clamping blocks is slidingly connected in the inside of the rubber plate;

[0018] As further description of the above technical solution:

[0019] The left and right ends of the top of the workbench are provided with limiting grooves, the inside of the limiting groove is fixedly connected with a supporting column, the outside of the supporting column is sleeved with a spring, the outside of the supporting column is slidingly connected with a displacement block, and the top of the displacement block is fixedly connected with the bottom of the rubber plate;

[0020] As further description of the above technical solution:

[0021] The front end of the cutter is rotatably connected with a box door, and the right bottom of the cutter is fixedly connected with a heat dissipation hole.

[0022] The utility model has the advantages of the following:

[0023] 1、In the utility model, the sliding block can move outside the sliding rail, so that the sliding block can drive the shell to move, the connecting block can drive the passive block to move, and the moving plate can be driven, so that the mobility of wafer cutting is greatly increased, the position can be adjusted at will, different shape and size chips can be easily processed, wafer corner waste is greatly reduced, and material utilization is improved.

[0024] 2. The utility model discloses a chip is put into the rubber board, and the rubber board can drive displacement block to extrude spring, realizes can guarantee the stability of chip in cutting etc. Processing process, prevents its displacement because of cutting force, vibration etc. Factor, thereby ensures cutting accuracy, avoids chip loose, splashes in high -speed operation equipment, guarantees processing smoothly. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 It is the three -dimensional schematic view of wafer cutting machine of semiconductor chip processing that the utility model provides;

[0026] Figure 2 It is the structure schematic view of telescopic board of wafer cutting machine of semiconductor chip processing that the utility model provides;

[0027] Figure 3 It is the structure schematic view of connecting block of wafer cutting machine of semiconductor chip processing that the utility model provides;

[0028] Figure 4 It is the structure schematic view of displacement block of wafer cutting machine of semiconductor chip processing that the utility model provides.

[0029] LEGEND:

[0030] 1, cutting machine;2, box door;3, heat dissipation hole;4, slide rail;5, sliding block;6, hydraulic cylinder;7, provide shell;8, motor;9, driving wheel;10, transmission belt;11, driven wheel;12, connecting block;13, moving plate;14, passive block;15, cutting head;16, telescopic board;17, sliding block;18, slide groove;19, work table;20, link rod;21, clamping block;22, rubber board;23, limit groove;24, support column;25, spring;26, displacement block. DETAILED DESCRIPTION

[0031] The technical scheme in the embodiments of the utility model will be described clearly and completely below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the utility model.

[0032] REFERENCE Figures 1 to 3The utility model provides a kind of wafer cutting machine of semiconductor chip processing: the utility model discloses a cutting device 1, cutting device 1 as core main body, provide safe and stable closed environment for internal structure, the front end of cutting device 1 is rotatably connected with box door 2, fan box door 2 opening and closing operation is very smooth, before every processing task starts, operator can easily put the wafer to be cut into it, the right side bottom of cutting device 1 is fixedly connected with heat dissipation hole 3, heat dissipation hole 3 guarantees the key structure of equipment stable operation, the inside top of cutting device 1 is fixedly connected with slide rail 4, the outside of slide rail 4 is slidably connected with sliding block 5, sliding block 5 can freely slide outside slide rail 4, the bottom of sliding block 5 is fixedly connected with hydraulic cylinder 6, when sliding block 5 in the process of moving can drive hydraulic cylinder 6 to move, the drive end of hydraulic cylinder 6 is fixedly connected with providing shell 7, by starting hydraulic cylinder 6 can drive providing shell 7 to move up and down.

[0033] The left side rear end of providing shell 7 is fixedly connected with motor 8, the drive end of motor 8 is fixedly connected with driving wheel 9, motor 8 can drive driving wheel 9 to rotate, the outside of driving wheel 9 is equipped with transmission belt 10, when driving wheel 9 in the process of rotating can drive transmission belt 10 to operate, the inside front end of providing shell 7 is rotatably connected with driven wheel 11, providing shell 7 can limit driven wheel 11, the other end of transmission belt 10 is equipped outside driven wheel 11, by transmission belt 10 can be power transmission on driving wheel 9 to driven wheel 11, the outside of transmission belt 10 is fixedly connected with a plurality of connecting blocks 12, when transmission belt 10 in the process of operating can drive the connecting block 12 outside it to move.

[0034] The inside bottom of providing shell 7 is slidably connected with moving plate 13, moving plate 13 can slide inside providing shell 7, to this to drive subsequent workpiece, the top of moving plate 13 is fixedly connected with a plurality of passive blocks 14, the outside of passive block 14 is contacted with the outside of connecting block 12, by connecting block 12 and passive block 14 mutual contact, so that connecting block 12 in the process of moving can drive passive block 14 to move, in turn can let moving plate 13 be driven, the bottom of moving plate 13 is fixedly connected with cutting head 15, but moving plate 13 in the process of moving can drive the cutting head 15 of bottom to move, so that cutting head 15 can move flexibly in front and back, left and right.

[0035] The left and right ends of providing shell 7 are fixedly connected with telescopic plate 16, telescopic plate 16 can provide support point for providing shell 7, the far end of two telescopic plates 16 is fixedly connected with sliding block 17, sliding block 17 can keep the stability of telescopic plate 16, the inside left and right ends of cutting device 1 are all provided with slide groove 18, the outside of sliding block 17 is slidably connected in the inside of slide groove 18, by slide groove 18 can limit sliding block 17, so that providing shell 7 can guarantee stability in the process of moving down.

[0036] Referring to Figure 4 The inside of the cutter 1 is fixedly connected with a clamping assembly for positioning the chip, the clamping assembly comprises a workbench 19, the outside of the workbench 19 is fixedly connected to the inside of the cutter 1, the workbench 19 can provide a mounting point for the subsequent workpiece, the top of the workbench 19 is rotatably connected with two link rods 20, the link rod 20 can rotate on the top of the workbench 19, the top of the link rod 20 is fixedly connected with a clamping block 21 on both sides, the clamping block 21 can be used in cooperation with the subsequent workpiece, the top of the workbench 19 is slidably connected with a rubber plate 22 on both sides, the rubber plate 22 is a workpiece that can position the chip, because the material of the rubber will not damage the chip, the outside of the two clamping blocks 21 is slidably connected to the inside of the rubber plate 22, the clamping block 21 can ensure the stability of the rubber plate 22 during movement, the top of the workbench 19 is provided with a limiting groove 23 on both sides, the limiting groove 23 can provide a mounting point for the subsequent workpiece, the inside of the limiting groove 23 is fixedly connected with a supporting column 24, the outside of the supporting column 24 is sleeved with a spring 25, the limiting groove 23 can provide a workpiece for the spring 25 to absorb the extrusion force, the outside of the supporting column 24 is slidably connected with a displacement block 26, and the displacement block 26 can slide on the outside of the supporting column 24, the top of the displacement block 26 is fixedly connected to the bottom of the rubber plate 22, when the chip is placed in the inside of the rubber plate 22, the rubber plate 22 can be self-adapted to the chip, when the two rubber plates 22 move, the displacement block 26 can be driven to move, so that the displacement block 26 can extrude the spring 25, so that the spring 25 is deformed to generate potential energy, and the spring 25 can position the chip through the elastic force.

[0037] Working principle: the cutter 1 as a whole frame, the inside top rail 4 provides a basis for the subsequent component movement, the slider 5 can slide smoothly on the slide rail 4, and the hydraulic cylinder 6 connected to the bottom of the slider 5 plays a key role. The hydraulic cylinder 6 can be extended or retracted according to instructions, driving the connected providing shell 7 to move up and down, accurately adjusting the cutting height.

[0038] The inside of the providing shell 7 is constructed meticulously, after the motor 8 at the left rear end is started, the driving wheel 9 at the driving end begins to rotate, and power is transmitted to the driven wheel 11 at the front end through the transmission belt 10, forming a stable transmission system. A plurality of connecting blocks 12 are evenly distributed on the transmission belt 10 and are in close contact with a plurality of passive blocks 14 at the bottom of the moving plate 13. When the transmission system is running, the connecting blocks 12 push the passive blocks 14, prompting the moving plate 13 to slide smoothly inside the providing shell 7, and then driving the cutting head 15 to realize accurate displacement in the front-back direction, so as to move forward and backward, left and right, providing great flexibility for subsequent cutting of chips.

[0039] Meanwhile, the extension plates 16 and sliding blocks 17 at both ends of the shell 7 are matched with the sliding grooves 18 at both ends inside the cutter 1, so as to guarantee the stability and accuracy of the shell 7 when moving in the left-right direction, and make the cutting head 15 move flexibly in all directions to meet the cutting requirements of the wafer at different positions.

[0040] For chip positioning, the clamping assembly is crucial, and the workbench 19 is stably fixed in the cutter 1. By placing the chip into the inside of the two rubber plates 22, the rubber plates 22 can push the connecting rod 20 to rotate. The clamping blocks 21 on both sides of the top of the connecting rod 20 are matched with the rubber plates 22, the rubber plates 22 slide outward under force, and in the limiting groove 23, the spring 25 sleeved on the supporting column 24 is compressed, so that the spring 25 deforms and generates potential energy. The spring 25 can push the displacement block 26 to displace together with the rubber plate 22. By the elastic force of the spring 25, the rubber plate 22 is tightly attached to the chip, avoiding the chip from shaking and displacing during the cutting process, and ensuring the cutting accuracy.

[0041] During the cutting operation, the wafer is first placed on the workbench 19 and fixed by the clamping assembly. The cutting head 15 is driven by the hydraulic cylinder 6, the motor 8 and the related transmission structure to accurately reach the wafer cutting position, and then high-speed rotation is implemented for cutting. During the cutting process, the heat dissipation hole 3 at the right bottom of the cutter 1 continuously dissipates heat to ensure stable operation of the equipment.

[0042] Finally, it should be pointed out that the above description is only the preferred embodiment of the present application and is not used to limit the present application. Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions recorded in the foregoing embodiments or make equivalent replacements to some technical features. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. Wafer cutting machine for the processing of semiconductor chips, comprising a cutting device (1), characterized in that: The inner top end of the cutter (1) is fixedly connected with a sliding rail (4), the outer side of the sliding rail (4) is slidably connected with a sliding block (5), the bottom of the sliding block (5) is fixedly connected with a hydraulic cylinder (6), the driving end of the hydraulic cylinder (6) is fixedly connected with a providing shell (7), the left side rear end of the providing shell (7) is fixedly connected with a motor (8), the driving end of the motor (8) is fixedly connected with a driving wheel (9), the outer side of the driving wheel (9) is sleeved with a transmission belt (10), the inner front end of the providing shell (7) is rotatably connected with a driven wheel (11), the outer side of the transmission belt (10) is fixedly connected with a plurality of connecting blocks (12), the inner bottom end of the providing shell (7) is slidably connected with a moving plate (13), the top of the moving plate (13) is fixedly connected with a plurality of passive blocks (14), the bottom of the moving plate (13) is fixedly connected with a cutting head (15), and the inner side of the cutter (1) is fixedly connected with a clamping assembly for positioning the chip.

2. The wafer saw for semiconductor chip processing of claim 1, wherein: The other end of the transmission belt (10) is sleeved on the outer side of the driven wheel (11), and the outer side of the passive block (14) is in contact with the outer side of the connecting block (12).

3. The wafer saw for semiconductor chip processing of claim 1, wherein: The left and right ends of the providing shell (7) are fixedly connected with telescopic plates (16), and the far ends of the two telescopic plates (16) are fixedly connected with sliding blocks (17).

4. The wafer saw for semiconductor chip processing of claim 3, wherein: The left and right ends of the cutter (1) are both provided with sliding grooves (18), and the outer side of the sliding block (17) is slidably connected in the inner side of the sliding groove (18).

5. The wafer saw for semiconductor chip processing of claim 1, wherein: The clamping assembly comprises a workbench (19), the outer side of the workbench (19) is fixedly connected in the inner side of the cutter (1), the top of the workbench (19) is rotatably connected with two link rods (20), and the top of the left and right sides of the link rod (20) is fixedly connected with a clamping block (21).

6. The wafer saw for semiconductor chip processing of claim 5, wherein: The top of the workbench (19) is slidably connected with rubber plates (22), and the outer side of the two clamping blocks (21) is slidably connected in the inner side of the rubber plate (22).

7. The wafer saw for semiconductor chip processing of claim 6, wherein: The top of the workbench (19) is provided with limiting grooves (23), the inner side of the limiting groove (23) is fixedly connected with a supporting column (24), the outer side of the supporting column (24) is sleeved with a spring (25), the outer side of the supporting column (24) is slidably connected with a displacement block (26), and the top of the displacement block (26) is fixedly connected with the bottom of the rubber plate (22).

8. The wafer saw for semiconductor chip processing of claim 1, wherein: The front end of the cutter (1) is rotatably connected with a box door (2), and the right bottom of the cutter (1) is fixedly connected with a heat dissipation hole (3).

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