High-viscosity traceless adhesive tape for electronic products
By introducing a transparent substrate, an insulating layer, a residue-free dispensing layer, and a high-temperature resistant layer into the tape, the problems of traditional tape being difficult to remove and leaving residues are solved, achieving easy removal and safety of high-adhesion residue-free tape.
Patent Information
- Application Number
- CN202423219151.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-26
- Publication Date
- 2025-11-28
- Estimated Expiration
- 2034-12-26
AI Technical Summary
Traditional tape is difficult to remove after being applied to the surface of electronic products, or it may leave glue residue, affecting the appearance and normal operation.
A high-adhesion, residue-free tape has been designed, comprising a transparent substrate layer, an insulating layer, a residue-free dispensing layer, and a high-temperature resistant layer. The residue-free dispensing layer reduces the contact area, the high-temperature resistant layer increases heat resistance, and the insulating layer provides safety.
This technology enables easy removal of the tape without leaving any residue, improving the appearance and safety of electronic products and preventing residual adhesive from affecting equipment operation.
Smart Images
Figure CN223607214U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of adhesive tape, more particularly to a high-adhesion traceless adhesive tape for electronic products. BACKGROUND
[0002] With the rapid development and wide application of electronic products, higher and higher requirements are put forward for adhesive tapes used for the assembly, fixing and decoration of electronic products. In the manufacturing and use of many electronic products, a kind of adhesive tape is needed, which can provide high enough adhesion to ensure the firm fixing of parts, and can leave no residual glue and damage the pasted surface when removed.
[0003] After the traditional adhesive tape is pasted on the surface of an electronic product (such as a plastic shell, a glass screen, a metal frame, etc.), it is often difficult to remove or leaves traces of glue when removed. These residual glue may affect the appearance of the electronic product, and even may enter the internal part of the electronic device, affecting its normal operation. For example, in the process of repairing a mobile phone screen, if the adhesive tape used to fix the screen leaves glue on the frame or screen, it may interfere with the bonding effect of the new screen, reduce the display quality, or cause touch insensitivity and other problems. SUMMARY
[0004] In order to overcome the above-mentioned defects of the prior art, the utility model provides a high-adhesion traceless adhesive tape for electronic products to solve the problems existing in the above background art.
[0005] The utility model provides the following technical scheme: a high-adhesion traceless adhesive tape for electronic products, comprising an adhesive tape body, characterized in that: the adhesive tape body comprises a transparent substrate layer, a back adhesive layer is arranged at the bottom of the transparent substrate layer, the back adhesive layer comprises an insulating layer, a traceless dispensing layer and a high-temperature-resistant layer, and the insulating layer, the traceless dispensing layer and the high-temperature-resistant layer are sequentially arranged and arrayed at the bottom of the transparent substrate layer.
[0006] As a further scheme of the utility model, the traceless dispensing layer is located between the insulating layer and the high-temperature-resistant layer.
[0007] As a further scheme of the utility model, the adhesive tape body further comprises a lifting part, and the lifting part is integrally formed on one side of the transparent substrate layer.
[0008] As a further scheme of the utility model, a crease is arranged between the lifting part and the transparent substrate layer.
[0009] As a further scheme of the utility model, the transparent substrate layer is made of PVC material, the insulating layer is made of polyimide film, and the high-temperature-resistant layer is made of refractory material.
[0010] As a further scheme of the utility model, the transparent substrate layer further comprises a PVC base layer, and an antistatic layer is bonded to the upper surface of the PVC base layer.
[0011] The utility model discloses technical effects and advantages:
[0012] The utility model discloses through being equipped with traceless dispensing of glue layer and high temperature resistance layer, through traceless dispensing of glue layer, the adhesive tape is adhered on the frame and screen, and traceless dispensing of glue layer can reduce the contact area of glue, avoids the trace of glue point to remain on the frame and screen, and high temperature resistance layer can increase the high temperature resistance effect of adhesive tape simultaneously, thereby reducing the heat quantity of adhesive tape, improve the use effect of adhesive tape.
[0013] The utility model discloses through being equipped with insulation layer, when the adhesive tape is adhered on the frame and screen, insulation layer can insulate adhesive tape, thereby avoiding the current transmission to adhesive tape and causing the harm to human body, improved the security that adhesive tape used. DRAWINGS
[0014] Figure 1 It is the upper side three-dimensional structure schematic diagram of the utility model embodiment one.
[0015] Figure 2 It is the bottom side three-dimensional structure schematic diagram of the utility model embodiment one.
[0016] Figure 3 It is the partial section structure schematic diagram of the utility model embodiment one.
[0017] Figure 4 It is the transparent substrate layer amplification structure schematic diagram of the utility model embodiment two.
[0018] The drawing mark is: 1, adhesive tape body;2, pull department;3, crease;4, back adhesive layer;5, transparent substrate layer;6, insulation layer;7, traceless dispensing of glue layer;8, high temperature resistance layer;9, antistatic layer;10, PVC base layer. DETAILED DESCRIPTION
[0019] The technical scheme in the utility model will be described below in a clear and complete manner with reference to the drawings in the utility model, and additionally, the form of each structure described in the following implementation manner is only an example, and the utility model is not limited to each structure described in the following implementation manner, and all other implementation manners obtained by the person skilled in the art without making creative labor belong to the range of protection of the utility model. EMBODIMENT
[0020] REFERENCE Figures 1-3The utility model provides a kind of high-stick traceless adhesive tape for electronic product, including adhesive tape body 1, adhesive tape body 1 includes transparent substrate layer 5, the bottom of transparent substrate layer 5 is equipped with back adhesive layer 4, back adhesive layer 4 includes insulating layer 6, traceless dispensing layer 7 and high temperature resistant layer 8, insulating layer 6, traceless dispensing layer 7 and high temperature resistant layer 8 are sequentially arranged array distribution in the bottom of transparent substrate layer 5, make insulating layer 6, traceless dispensing layer 7 and high temperature resistant layer 8 sequentially arranged array distribution in the bottom of transparent substrate layer 5 form back adhesive layer 4, traceless dispensing layer 7 can reduce the contact area of glue, avoid glue point to remain trace on frame and screen, while high temperature resistant layer 8 can increase the high temperature resistant effect of adhesive tape, to reduce the heat quantity of adhesive tape, improve the use effect of adhesive tape.
[0021] In the utility model, traceless dispensing layer 7 is located between insulating layer 6 and high temperature resistant layer 8, adhesive tape body 1 further includes lifting portion 2, lifting portion 2 is integrally formed on one side of transparent substrate layer 5, and crease 3 is arranged between lifting portion 2 and transparent substrate layer 5; transparent substrate layer 5 is made of PVC material; insulating layer 6 is made of polyimide film; high temperature resistant layer 8 is made of refractory material; the refractory material of the embodiment is polytetrafluoroethylene; insulating layer 6 can insulate the adhesive tape, thereby avoiding the current transmission to the adhesive tape to cause harm to the human body, and improving the safety of the adhesive tape in use.
[0022] The working principle of the embodiment is as follows: in use, the polyimide film is cut into multiple square pieces and adhered to the bottom of the transparent substrate layer 5 to form the insulating layer 6; then the traceless glue is dispensed on the bottom of the transparent substrate layer 5 to form the traceless dispensing layer 7; then the refractory material is cut into multiple square pieces and adhered to the bottom of the transparent substrate layer 5 to form the high temperature resistant layer 8; the insulating layer 6, the traceless dispensing layer 7 and the high temperature resistant layer 8 are sequentially arranged and arrayed on the bottom of the transparent substrate layer 5 to form the back adhesive layer 4; the traceless dispensing layer 7 can reduce the contact area of the glue, avoid the glue point to remain trace on the frame and the screen, and simultaneously the high temperature resistant layer 8 can increase the high temperature resistant effect of the adhesive tape, thereby reducing the heat quantity of the adhesive tape and improving the use effect of the adhesive tape. Embodiment
[0023] Reference Figure 4 The utility model provides a kind of high-stick traceless adhesive tape for electronic product, and transparent substrate layer 5 further includes PVC base layer 10, the upper surface of PVC base layer 10 is bonded with antistatic layer 9, and the material of antistatic layer 9 is transparent PVC flame-retardant antistatic film.
[0024] The working principle of the embodiment is as follows: the transparent PVC flame-retardant antistatic film is glued on the upper surface of the PVC base layer 10 to form the antistatic layer 9; the transparent PVC flame-retardant antistatic film can avoid static electricity on the surface of the transparent substrate layer 5, and simultaneously can avoid the transparent substrate layer 5 from burning, thereby improving the use effect of the transparent substrate layer 5.
[0025] Finally, it should be noted that in the description of the present application, it should be noted that unless otherwise specified and limited, the terms "mounting", "connection", "connection" should be broadly understood, which can be mechanical connection or electrical connection, or the internal communication of two elements, or direct connection, "up", "down", "left", "right" and the like are only used to indicate the relative positional relationship, when the absolute position of the described object changes, the relative positional relationship may change;
[0026] The utility model discloses the embodiment in the drawing, only relate to the structure of the embodiment of the present disclosure, other structures can refer to the usual design, under the condition of not conflicting, the same embodiment and different embodiments of the utility model can be combined with each other.
Claims
1. A high-tack, residue-free adhesive tape for electronic products, comprising a tape body (1), characterized in that: The adhesive tape body (1) comprises a transparent base material layer (5), the bottom of the transparent base material layer (5) is provided with a back adhesive layer (4), the back adhesive layer (4) comprises an insulation layer (6), a traceless dispensing layer (7) and a high-temperature-resistant layer (8), and the insulation layer (6), the traceless dispensing layer (7) and the high-temperature-resistant layer (8) are sequentially arranged and arrayed at the bottom of the transparent base material layer (5).
2. The high-tack, linerless adhesive tape for electronic products according to claim 1, characterized in that: The traceless dispensing layer (7) is located between the insulation layer (6) and the high-temperature-resistant layer (8).
3. The high tack adhesive tape for electronic products according to claim 1, characterized in that: The adhesive tape body (1) further comprises a pulling part (2), and the pulling part (2) is integrally formed on one side of the transparent base material layer (5).
4. The high-tack, linerless adhesive tape for electronic products according to claim 3, characterized in that: A crease (3) is arranged between the pulling part (2) and the transparent base material layer (5).
5. The high-tack, linerless adhesive tape for electronic products according to claim 2, characterized in that: The transparent base material layer (5) is made of PVC material, the insulation layer (6) is made of polyimide film, and the high-temperature-resistant layer (8) is made of refractory material.
6. The high-tack, linerless adhesive tape for electronic products according to claim 1, characterized in that: The transparent base material layer (5) further comprises a PVC base layer (10), and an anti-static layer (9) is bonded to the upper surface of the PVC base layer (10).