Electroplating device

Abstract

The utility model discloses an electroplating device, which relates to the technical field of electroplating devices, and comprises a first cylinder body, the second cylinder body is provided with a bubble isolating groove and a copper dissolving groove, the bubble isolating groove and the copper dissolving groove are arranged along a first direction, the bubble isolating groove is communicated with the first cylinder body, the bubble isolating groove is provided with a bubble isolating plate, the bubble isolating groove is provided with a first overflow port, and the first overflow port is communicated with the bubble isolating groove and the copper dissolving groove; the copper powder adding device is arranged on the second cylinder body; the circulating device comprises a driving assembly and a circulating pipe, and the driving assembly is sequentially communicated with the copper dissolving tank and the first cylinder body through the circulating pipe to form a circulating loop; the technical scheme provided by the utility model has the technical effects that bubble isolation is completed in the second cylinder body, copper ions are added into the electrolyte, and the electrolyte is fully stirred in the copper dissolving tank, so that the stability of the concentration of the electrolyte is ensured, and the reject ratio of electroplated products is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to electroplating device technical field, especially in kind of electroplating device. BACKGROUND

[0002] In the electroplating related technology, the electrolyte in the electroplating tank of electroplating device after a period of electroplating use, the cation concentration in electrolyte will reduce, to ensure that electrolyte can continuously meet the demand of normal electroplating operation, need to supplement copper ion to electrolyte. However, the existing electroplating device adds copper powder to the electroplating tank, and the copper powder and electrolyte do not react fully, resulting in unstable concentration of electrolyte, causing electroplating problem, making the high failure rate of electroplating products. SUMMARY

[0003] The utility model discloses a kind of electroplating devices, to reduce the failure rate of electroplating product.

[0004] To achieve the above object, the electroplating device provided by the utility model, including first cylinder, for electrolyte containment;Second cylinder, with bubble separation groove and copper dissolving groove for containing electrolyte, the bubble separation groove and the copper dissolving groove are arranged along the first direction, the bubble separation groove is communicated with the first cylinder, the bubble separation groove is equipped with bubble separation plate, the bubble separation plate is used to block the bubble of electrolyte liquid level, the bubble separation groove has first overflow port, the first overflow port is communicated with the bubble separation groove and the copper dissolving groove, to overflow electrolyte in the bubble separation groove to the copper dissolving groove;Copper powder adding device, be equipped in the second cylinder, the copper powder adding device is used to add copper powder to the copper dissolving groove;And circulating device, including drive assembly and circulation pipe, the drive assembly is communicated with the copper dissolving groove and the first cylinder in sequence by the circulation pipe and constitutes circulating loop, the drive assembly is used to drive electrolyte after adding copper powder in the copper dissolving groove along the circulating loop.

[0005] In an embodiment, the second cylinder includes a cylinder body and a first partition plate, the cylinder body has a containing groove, the first partition plate is arranged in the containing groove to separate the containing groove into the bubble separation groove and the copper dissolving groove, the first partition plate has the first overflow port, and the cylinder body and the first partition plate are an integral structure.

[0006] In an embodiment, the second cylinder further includes a second partition plate, the second partition plate is arranged in the bubble separation groove, the bubble separation plate and the second partition plate are arranged in the first direction, the bubble separation plate is above the second partition plate, and a liquid passing channel is formed between the bubble separation plate and the second partition plate, and the liquid passing channel is used for containing electrolyte.

[0007] In an embodiment, the second partition plates are arranged in a plurality, and the bubble separation plates are arranged in a plurality. The plurality of second partition plates are arranged in the bubble separation groove along the first direction. The plurality of bubble separation plates are arranged in the bubble separation groove along the first direction. The second partition plates are arranged between two adjacent bubble separation plates. The liquid passing channels are formed between a bubble separation plate and a second partition plate. The liquid passing channels are connected to each other. The liquid passing channels are arranged in a meandering manner.

[0008] In an embodiment, the second cylinder further comprises a plurality of third partition plates. The plurality of third partition plates are arranged in the copper dissolving groove along the first direction. The copper dissolving groove is divided into a plurality of copper dissolving sections by the plurality of third partition plates.

[0009] In an embodiment, the circulating pipe comprises a first liquid inlet pipe and a first liquid outlet pipe. The driving assembly comprises a stirring pump. The first liquid inlet pipe and the first liquid outlet pipe are connected to the stirring pump. The circulating pipe further comprises a second liquid inlet pipe and a second liquid outlet pipe. The second liquid inlet pipe is connected to the first liquid inlet pipe. The second liquid outlet pipe is connected to the first liquid outlet pipe. The second liquid inlet pipe and the second liquid outlet pipe are connected to the copper dissolving groove.

[0010] In an embodiment, the second liquid outlet pipe comprises a plurality of straight sections and a plurality of bends. Two adjacent straight sections are connected by a bend. The plurality of straight sections are arranged along the circumference of the copper dissolving groove. The straight sections are connected to the second liquid inlet pipe. The plurality of straight sections are connected to the copper dissolving groove.

[0011] In an embodiment, the second liquid outlet pipe is arranged at the bottom of the copper dissolving groove. The straight sections are provided with a plurality of liquid discharge holes. The plurality of liquid discharge holes are arranged along the circumference of the straight sections. The liquid discharge holes are used to spray electrolyte towards the copper dissolving groove.

[0012] In an embodiment, the driving assembly further comprises a water pump. The circulating pipe comprises a third liquid inlet pipe and a third liquid outlet pipe. The water pump is connected to the side of the copper dissolving groove away from the bubble separation groove through the third liquid inlet pipe. The water pump is connected to the first cylinder through the third liquid outlet pipe.

[0013] In an embodiment, the electroplating device further comprises a fourth liquid inlet pipe. The second cylinder is provided with a transition groove. The transition groove is connected to the first cylinder through the fourth liquid inlet pipe. The transition groove is provided with a second overflow port on one side. The second overflow port connects the transition groove and the bubble separation groove.

[0014] The technical scheme of the utility model discloses a second cylinder body has the bubble separation groove and the copper dissolving groove, and electrolyte is transported from the first cylinder body to the second cylinder body, and the bubble on the electrolyte liquid level is blocked by the bubble separation plate of the bubble separation groove, and then the electrolyte overflows to the copper powder adding device, and after the copper powder adding device supplements the copper powder into the electrolyte, the driving assembly drives the electrolyte to flow in the copper dissolving groove through the circulating pipe, and then the electrolyte is fully stirred in the copper dissolving groove, and then the copper powder is quickly dissolved into the electrolyte and transported to the first cylinder body through the circulating pipe, and the bubble separation and the copper ion adding into the electrolyte are completed in the second cylinder body, the electrolyte is fully stirred in the copper dissolving groove, and then the stability of the electrolyte concentration supplied into the first cylinder body is ensured, and then the defective rate of the electroplating product is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0015] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the following will briefly introduce the drawings needed to be used in the embodiment or the prior art description, and obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can be obtained from the structure shown in the drawings without creative labor.

[0016] Figure 1 The structure schematic diagram of the electroplating device embodiment provided by the utility model.

[0017] Explanation of reference numerals:

[0018] 1, the first cylinder body, 2, the second cylinder body, 21, the bubble separation groove, 211, the bubble separation plate, 212, the first overflow port, 22, the copper dissolving groove, 221, the copper dissolving section, 24, the first partition plate, 25, the third partition plate, 26, the transition groove, 261, the second overflow port, 3, the copper powder adding device, 4, the circulating device, 41, the driving assembly, 411, the stirring pump, 412, the water pump, 42, the circulating pipe, 421, the first liquid inlet pipe, 422, the first liquid outlet pipe, 423, the second liquid inlet pipe, 424, the second liquid outlet pipe, 4241, the straight section, 4242, the elbow, 425, the third liquid inlet pipe, 426, the third liquid outlet pipe, 5, the fourth liquid inlet pipe.

[0019] The realization, functional characteristics and advantages of the utility model will be further explained by combining with the embodiments and referring to the drawings. DETAILED DESCRIPTION

[0020] Clearly and completely describe the technical scheme in the embodiments of the utility model with reference to the drawings in the embodiments of the utility model, obviously, the described embodiments are only a part of the embodiments of the utility model, and not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the ordinary skilled in the art without creative labor belong to the scope of protection of the utility model.

[0021] It should be noted that if the embodiments of the utility model involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement condition, etc. between the components in a certain posture, and if the certain posture changes, the directional indications also change accordingly.

[0022] In addition, if the embodiments of the utility model involve descriptions such as "first", "second", etc., the descriptions of "first", "second", etc. are only for description purposes and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of indicated technical features. Therefore, the features limited by "first", "second" can explicitly or implicitly include at least one feature. In addition, if "and / or" or "and / or" appears throughout the text, it means that the three parallel schemes are included, for example, "A and / or B" includes A scheme, or B scheme, or A and B simultaneously satisfy the scheme. In addition, the technical schemes of each embodiment can be combined with each other, but it must be based on the realization of the ordinary skilled in the art, when the combination of technical schemes appears contradictory or unachievable, it should be considered that the combination of technical schemes does not exist, and is not within the protection scope required by the utility model.

[0023] The utility model provides a kind of electroplating device.

[0024] Please refer to Figure 1In an embodiment of the utility model, this electroplating device includes first cylinder body 1, second cylinder body 2, copper powder adding device 3 and circulating device 4, first cylinder body 1 is used for the electrolyte accommodation, second cylinder body 2 has the bubble trap groove 21 and the copper dissolving groove 22 for accommodating electrolyte, the bubble trap groove 21 and the copper dissolving groove 22 along the first direction arrangement setting, the bubble trap groove 21 with first cylinder body 1 is communicated, the bubble trap groove 21 is equipped with bubble trap plate 211, the bubble trap plate 211 is used for blocking electrolyte liquid level bubble, the bubble trap groove 21 has first overflow port 212, first overflow port 212 communicates bubble trap groove 21 with copper dissolving groove 22, to be used for the overflow of electrolyte in bubble trap groove 21 to copper dissolving groove 22, copper powder adding device 3 is located at second cylinder body 2, copper powder adding device 3 is used to add copper powder to copper dissolving groove 22, circulating device 4 includes drive assembly 41 and circulating pipe 42, drive assembly 41 is communicated with copper dissolving groove 22 and first cylinder body 1 in sequence through circulating pipe 42 and constitutes circulating loop, drive assembly 41 is used to drive the electrolyte after adding copper powder in copper dissolving groove 22 along circulating loop flow.

[0025] The technical scheme of the utility model discloses through adopting the bubble trap groove 21 and the copper dissolving groove 22 in the second cylinder body 2, the electrolyte is transported from the first cylinder body 1 to the second cylinder body 2, and the bubble on the electrolyte liquid level is blocked by the bubble trap plate 211 of the bubble trap groove 21, the electrolyte is overflowed to the copper powder adding device 3, after copper powder adding device 3 supplements copper powder to the electrolyte, drive assembly 41 drives the electrolyte to flow in the copper dissolving groove 22 through circulating pipe 42, and then makes the electrolyte fully stir in the copper dissolving groove 22, and then makes the copper powder quickly dissolve to the electrolyte, and is transported to the first cylinder body 1 through circulating pipe 42, by completing the bubble and adding copper ion to the electrolyte in the second cylinder body 2, the electrolyte fully stirs in the copper dissolving groove 22, and then guarantees the stability of electrolyte concentration subsequently supplied to the first cylinder body 1, and then reduces the bad rate of electroplated product.

[0026] In the embodiment, the first cylinder 1 can be provided with a plating main cylinder, and the first cylinder 1 can be used for storing electrolyte and carrying out plating process on a workpiece. The second cylinder 2 can be provided as a sub-cylinder, and the second cylinder 2 can be used for eliminating bubbles on the electrolyte and supplementing copper ions to the electrolyte to be supplemented. The bottom of the bubble separation groove 21 is communicated with the first cylinder 1 through a pipeline, and the bubble separation groove 21 and the copper dissolving groove 22 are arranged along the first direction, so that the electrolyte can overflow from the bubble separation groove 21 to the copper dissolving groove 22 in sequence, so that the electrolyte in the bubble separation groove 21 is blocked by the bubble separation plate 211 to separate the bubbles on the surface of the electrolyte, thereby reducing the content of the bubbles in the electrolyte overflowing into the copper dissolving groove 22. The bubble separation plate 211 can be arranged on the top wall of the bubble separation groove 21. When the electrolyte gradually fills the entire bubble separation groove 21 from the bottom of the bubble separation groove 21, the bubbles on the surface of the electrolyte are blocked by the bubble separation plate 211 to the side of the bubble separation plate 211 away from the copper dissolving groove 22, thereby reducing the content of the bubbles in the electrolyte overflowing into the copper dissolving groove 22, thereby reducing the influence of the bubbles in the electrolyte on the quality of the plating product. In order to make the electrolyte in the bubble separation groove 21 overflow into the copper dissolving groove 22 more conveniently, the side of the bubble separation groove 21 close to the copper dissolving groove 22 has a first overflow port 212, and the electrolyte overflows from the bubble separation groove 21 to the copper dissolving groove 22 through the first overflow port 212. It should be noted that overflow refers to the phenomenon that the liquid exceeds the capacity of a specific container and flows out of the container.

[0027] In the embodiment, in order to facilitate the supplement of copper ions into the electrolyte, the copper powder adding device 3 is arranged on the side of the copper dissolving groove 22 close to the bubble separation groove 21, so that the electrolyte just after the bubbles are eliminated can be added with copper powder in time, thereby improving the dissolution efficiency of the copper powder in the electrolyte. In order to further improve the dissolution efficiency of the copper powder in the electrolyte, the driving assembly 41 is communicated with the copper dissolving groove 22 and the first cylinder 1 in sequence through the circulation pipe 42 to form a circulation loop, and the driving assembly 41 drives the electrolyte after the copper powder is added in the copper dissolving groove 22 to flow in the copper dissolving groove 22 and the circulation pipe 42 multiple times under the cooperation of the copper dissolving groove 22 and the circulation pipe 42, so that the copper powder is more fully dissolved in the electrolyte, thereby ensuring the stability of the concentration of the electrolyte, and thereby reducing the defective rate of the plating product. After the electrolyte flows in the copper dissolving groove 22 multiple times, the electrolyte is conveyed along the circulation loop into the first cylinder 1, thereby ensuring the concentration of the electrolyte in the first cylinder 1.

[0028] As shown in Figure 1 The second cylinder 2 includes a cylinder body and a first partition plate 24, the cylinder body has a containing groove, and the first partition plate 24 is arranged in the containing groove to separate the containing groove into the bubble separation groove 21 and the copper dissolving groove 22. The first partition plate 24 has the first overflow port 212, and the cylinder body and the first partition plate 24 are an integral structure.

[0029] In the embodiment, the first partition plate 24 is arranged in the containing groove to divide the containing groove into the bubble separation groove 21 and the copper dissolving groove 22, the cylinder body and the first partition plate 24 are integrated, the bubble separation groove 21 and the copper dissolving groove 22 are arranged in the second cylinder body 2, and thus the area occupied by the electroplating device is reduced. The electrolyte in the bubble separation groove 21 flows into the copper dissolving groove 22, and thus the problem that the electrolyte is left in the pipeline when the electrolyte is circulated through the pipeline between the bubble separation groove 21 and the copper dissolving groove 22 is avoided, and the influence of the residual electrolyte on the overall concentration of the electrolyte is prevented.

[0030] As shown in Figure 1 , the second cylinder body 2 further comprises a second partition plate, the second partition plate is arranged in the bubble separation groove 21, the bubble separation plate 211 and the second partition plate are arranged in the first direction, the bubble separation plate 211 is above the second partition plate, and a liquid passing channel is formed between the bubble separation plate 211 and the second partition plate, and the liquid passing channel is used for containing electrolyte.

[0031] In the embodiment, the bubble separation plate 211 is arranged at the top of the bubble separation groove 21, the second partition plate is arranged at the bottom wall of the bubble separation groove 21, and the bubble separation plate 211 and the second partition plate are arranged in the first direction to form a liquid passing channel between the bubble separation plate 211 and the second partition plate. When the electrolyte flows through the liquid passing channel, the bubble separation plate 211 can block the bubbles on the surface of the electrolyte to the other side away from the copper dissolving groove 22, and thus the bubble separation plate 211 can more conveniently eliminate the bubbles on the surface of the electrolyte, and further block the bubbles of the electrolyte from flowing into the copper dissolving groove 22.

[0032] As shown in Figure 1 , the second partition plate is arranged in multiple, the bubble separation plate 211 is arranged in multiple, multiple second partition plates are arranged in the first direction in the bubble separation groove 21, multiple bubble separation plates 211 are arranged in the first direction in the bubble separation groove 21, the second partition plate is inserted between two adjacent bubble separation plates 211, a liquid passing channel is formed between the bubble separation plate 211 and the second partition plate, multiple liquid passing channels are connected to each other, and multiple liquid passing channels are arranged in a detour.

[0033] In the embodiment, the second partition plates and the bubble separating plates 211 are both provided in plurality, two adjacent bubble separating plates 211 are provided with the second partition plates, so that the plurality of second partition plates and the plurality of bubble separating plates 211 form a plurality of liquid passing channels in communication with each other, and the electrolyte can pass through the plurality of bubble separating plates 211 for multiple times of bubble separation when flowing in the bubble separating groove 21, so as to further prevent the bubbles of the electrolyte from flowing into the copper dissolving groove 22. In order to facilitate the plurality of bubble separating plates 211 to sequentially separate the bubbles of the electrolyte, the plurality of liquid passing channels are arranged in a detour manner, so that the electrolyte flowing from one liquid passing channel to the next liquid passing channel is separated by the bubble separating plates 211.

[0034] As shown in Figure 1 The circulating pipe 42 comprises a first liquid inlet pipe 421 and a first liquid outlet pipe 422, the driving assembly 41 comprises a stirring pump 411, the first liquid inlet pipe 421 and the first liquid outlet pipe 422 are in communication with the stirring pump 411, the circulating pipe 42 further comprises a second liquid inlet pipe 423 and a second liquid outlet pipe 424, the second liquid inlet pipe 423 is in communication with the first liquid inlet pipe 421, the second liquid outlet pipe 424 is in communication with the first liquid outlet pipe 422, and the second liquid inlet pipe 423 and the second liquid outlet pipe 424 are both in communication with the copper dissolving groove 22.

[0035] In the embodiment, under the driving of the stirring pump 411, the electrolyte in the copper dissolving groove 22 is sequentially drawn into the stirring pump 411 through the second liquid inlet pipe 423 and the first liquid inlet pipe 421, and the electrolyte is sequentially conveyed into the copper dissolving groove 22 through the stirring pump 411, the first liquid outlet pipe 422 and the second liquid outlet pipe 424. By driving the electrolyte to flow in the copper dissolving groove 22 multiple times through the stirring pump 411, the electrolyte in the copper dissolving groove 22 is fully stirred, so as to improve the dissolution speed of the copper powder in the electrolyte, improve the stability of the electrolyte concentration, and reduce the defective rate of the electroplated product.

[0036] As shown in Figure 1 The second cylinder body 2 further comprises a plurality of third partition plates 25, and the plurality of third partition plates 25 are arranged along the first direction and are arranged in the copper dissolving groove 22, and the copper dissolving groove 22 is divided into a plurality of copper dissolving sections 221 by the plurality of second bubble separating plates 211.

[0037] In the embodiment, the copper dissolving tank 22 is divided into multiple copper dissolving sections 221 by multiple second bubble separating plates 211, and the multiple copper dissolving sections 221 are communicated with each other, so that the electrolyte can flow between the multiple copper dissolving sections 221 more conveniently. The second inlet pipe 423 and the second outlet pipe 424 can be arranged in each copper dissolving section 221, so that the electrolyte in each copper dissolving section 221 can be stirred, and the copper powder in the copper dissolving tank 22 can be dissolved into the electrolyte more fully. The multiple second inlet pipes 423 and the multiple second outlet pipes 424 can be communicated with the first inlet pipe 421 and the first outlet pipe 422 respectively, so that the stirring efficiency of the electrolyte in the copper dissolving tank 22 is improved.

[0038] As shown in Figure 1 The second outlet pipe 424 includes multiple straight sections 4241 and multiple bends 4242. Adjacent two straight sections 4241 are communicated through the bends 4242. The multiple straight sections 4241 are arranged along the circumference of the copper dissolving tank 22. The straight sections 4241 are communicated with the second inlet pipe 423. The multiple straight sections 4241 are communicated with the copper dissolving tank 22.

[0039] In the embodiment, the adjacent two straight sections 4241 are communicated through the bends 4242, so that the second outlet pipe 424 can be arranged in the copper dissolving tank 22 more conveniently. The multiple straight sections 4241 are arranged along the circumference of the copper dissolving tank 22. The multiple straight sections 4241 are communicated with the copper dissolving tank 22, so that the total length of the second outlet pipe 424 is increased, the area of the second outlet pipe 424 and the copper dissolving tank 22 is increased, and the stirring efficiency of the electrolyte is improved.

[0040] In the embodiment, the second outlet pipe 424 is arranged at the bottom of the copper dissolving tank 22. The straight sections 4241 are provided with multiple liquid discharge holes. The multiple liquid discharge holes are arranged along the circumference of the straight sections 4241. The liquid discharge holes are used for spraying the electrolyte to the copper dissolving tank 22. The straight sections 4241 are communicated with the copper dissolving tank 22 through the liquid discharge holes. The multiple liquid discharge holes are arranged along the circumference of the straight sections 4241, so that the electrolyte is sprayed to the copper dissolving tank 22 under the driving of the driving assembly 41, the electrolyte in the copper dissolving tank 22 is circulated, and the electrolyte in the copper dissolving tank 22 is stirred fully. The second outlet pipe 424 is arranged at the bottom of the copper dissolving tank 22, so that the electrolyte in the second cylinder 2 is stirred in the circulation mode from bottom to top, and the bubbles in the second cylinder 2 are reduced.

[0041] As shown in Figure 1As shown, the driving assembly 41 further comprises a water pump 412, the circulating pipe 42 comprises a third liquid inlet pipe 425 and a third liquid outlet pipe 426, the water pump 412 is communicated with one side of the copper dissolving tank 22 away from the bubble separating tank 21 through the third liquid inlet pipe 425, and the water pump 412 is communicated with the first cylinder body 1 through the third liquid outlet pipe 426.

[0042] In the embodiment, the water pump 412 is communicated with one side of the copper dissolving tank 22 away from the bubble separating tank 21 through the third liquid inlet pipe 425, so that the electrolyte in the copper dissolving tank 22 can be timely delivered into the first cylinder body 1 after being fully stirred, thereby ensuring the concentration of the electrolyte in the first cylinder body 1 and the quality of the electroplated product.

[0043] As shown, Figure 1 The electroplating device further comprises a fourth liquid inlet pipe 5, the second cylinder body 2 is provided with a transition tank 26, the transition tank 26 is communicated with the first cylinder body 1 through the fourth liquid inlet pipe 5, one side of the transition tank 26 is provided with a second overflow port 261, and the second overflow port 261 communicates the transition tank 26 with the bubble separating tank 21.

[0044] In the embodiment, the transition tank 26 is arranged in the second cylinder body 2, and a filter layer can be arranged in the transition tank 26, so that the electrolyte after electroplating is filtered, thereby avoiding impurities generated in the electroplating process from flowing into the bubble separating tank 21 and the copper dissolving tank 22. The second overflow port 261 is arranged to communicate the transition tank 26 with the bubble separating tank 21, so that the electrolyte in the transition tank 26 can overflow into the bubble separating tank 21, thereby more conveniently controlling the liquid level of the transition tank 26 and the bubble separating tank 21, and more conveniently controlling the volume of the electrolyte entering the copper dissolving tank 22. The filter layer can be provided with a filter screen, so that impurities generated in the electroplating process are blocked in the transition tank 26.

[0045] The above merely illustrates the exemplary embodiments of the present application, and does not limit the patent scope of the present application, and any equivalent structural transformation or direct / indirect application in other related technical fields based on the technical concept of the present application and the contents of the present application specification and drawings are included in the patent protection scope of the present application.

Claims

1. An electroplating apparatus, characterized in that, include: The first cylinder is used to contain the electrolyte; The second cylinder has a bubble-blocking tank and a copper-dissolving tank for containing electrolyte. The bubble-blocking tank and the copper-dissolving tank are arranged along a first direction. The bubble-blocking tank is connected to the first cylinder. The bubble-blocking tank is provided with a bubble-blocking plate for blocking air bubbles on the surface of the electrolyte. The bubble-blocking tank has a first overflow port, which is connected to the bubble-blocking tank and the copper-dissolving tank for overflowing the electrolyte in the bubble-blocking tank into the copper-dissolving tank. A copper powder adding device is provided in the second cylinder body, and the copper powder adding device is used to add copper powder into the copper melting tank; as well as The circulation device includes a drive component and a circulation pipe. The drive component is connected to the copper melting tank and the first cylinder in sequence through the circulation pipe to form a circulation loop. The drive component is used to drive the electrolyte after copper powder is added in the copper melting tank to flow along the circulation loop.

2. The electroplating apparatus as described in claim 1, characterized in that, The second cylinder body includes a cylinder body and a first partition plate. The cylinder body has a receiving groove, and the first partition plate is disposed in the receiving groove to divide the receiving groove into the bubble-blocking groove and the copper melting groove. The first partition plate has a first overflow port, and the cylinder body and the first partition plate are an integral structure.

3. The electroplating apparatus as described in claim 1, characterized in that, The second cylinder also includes a second partition plate, which is disposed in the bubble-isolating groove. The bubble-isolating plate and the second partition plate are spaced apart along a first direction. The bubble-isolating plate is located above the second partition plate. A liquid passage is formed between the bubble-isolating plate and the second partition plate, and the liquid passage is used to contain the electrolyte.

4. The electroplating apparatus as described in claim 3, characterized in that, The second partition plate is configured as multiple, the bubble-isolating plate is configured as multiple, the multiple second partition plates are spaced apart along the first direction in the bubble-isolating groove, the multiple bubble-isolating plates are spaced apart along the first direction in the bubble-isolating groove, the second partition plate is interspersed between two adjacent bubble-isolating plates, a liquid passage is formed between one bubble-isolating plate and one second partition plate, the multiple liquid passages are interconnected, and the multiple liquid passages are arranged in a tortuous manner.

5. The electroplating apparatus as described in claim 4, characterized in that, The second cylinder also includes a plurality of third partition plates, which are spaced apart along the first direction in the copper melting tank, and the copper melting tank is divided into multiple copper melting sections by the plurality of third partition plates.

6. The electroplating apparatus as described in claim 1, characterized in that, The circulation pipe includes a first inlet pipe and a first outlet pipe. The drive assembly includes a stirring pump. The first inlet pipe and the first outlet pipe are respectively connected to the stirring pump. The circulation pipe also includes a second inlet pipe and a second outlet pipe. The second inlet pipe is connected to the first inlet pipe, and the second outlet pipe is connected to the first outlet pipe. Both the second inlet pipe and the second outlet pipe are connected to the copper melting tank.

7. The electroplating apparatus as described in claim 6, characterized in that, The second outlet pipe includes multiple straight segments and multiple bends. Two adjacent straight segments are connected through the bends. The multiple straight segments are arranged circumferentially along the copper dissolving tank. The straight segments are connected to the second inlet pipe, and all of the multiple straight segments are connected to the copper dissolving tank.

8. The electroplating apparatus as described in claim 7, characterized in that, The second outlet pipe is located at the bottom of the copper dissolving tank. The straight section is provided with multiple drain holes, which are arranged circumferentially along the straight section. The drain holes are used to spray electrolyte toward the copper dissolving tank.

9. The electroplating apparatus as described in claim 1, characterized in that, The drive assembly also includes a water pump, the circulation pipe includes a third inlet pipe and a third outlet pipe, the water pump is connected to the side of the copper melting tank away from the bubble-isolating tank through the third inlet pipe, and the water pump is connected to the first cylinder through the third outlet pipe.

10. The electroplating apparatus according to any one of claims 1 to 9, characterized in that, The electroplating apparatus further includes a fourth liquid inlet pipe, the second cylinder has a transition groove, the transition groove is connected to the first cylinder through the fourth liquid inlet pipe, and a second overflow port is provided on one side of the transition groove, the second overflow port is connected to the transition groove and the bubble-isolating groove.

Images