Supporting piece for wafer drying groove and wafer drying device

Abstract

The utility model provides a wafer drying groove supporting member and a wafer drying device, the supporting member comprises a supporting leg and a main body connected with the supporting leg, the main body is provided with a supporting groove for supporting a wafer, and the main body is also provided with a diversion channel which is communicated with the supporting groove and penetrates through the main body. According to the utility model, the diversion channel communicated with the supporting groove is arranged on the supporting piece, so that pollutants falling from the wafer are prevented from being accumulated in the supporting groove, the cleaning degree of the wafer in the drying process is improved, and the yield of the wafer is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor equipment especially relates to wafer drying groove's support spare and wafer drying device. BACKGROUND

[0002] In semiconductor manufacturing, chemical mechanical polishing (CMP) is a key process that globally planarizes wafer surface through the synergistic effect of chemical corrosion and mechanical grinding. In the chemical mechanical polishing process, the wafer surface will adsorb particles or organic matter and other pollutants to produce a large number of defects, which need to be removed by post-processing technology. With the continuous progress of semiconductor technology, the cleanliness of the wafer surface is also increasingly high, especially, the tiny particles that did not cause problems before are causing a variety of adverse reactions, therefore, the chemical mechanical polishing process and the post-processing technology both need to ensure that no particles and other by-products adhere to the wafer surface.

[0003] The post-processing technology generally consists of cleaning and drying to provide a smooth and clean wafer surface. In the drying tank based on the Marangoni effect, a support member with a crescent groove is generally used to support the wafer. When the drying tank filled with deionized water receives the wafer transferred by the mechanical hand, the wafer will be guided into the crescent groove of the support member. Then, through the driving force, the support member is swung from the vertical state to the inclined position. Subsequently, the wafer is lifted up and pushed into the isopropanol cleaning area. Since isopropanol has hydrophilic properties, it forms a certain surface tension, i.e., the Marangoni effect, which removes the water on the wafer surface through the Marangoni force to achieve the drying effect. Because the crescent groove of the support member is prone to accumulate pollutants dropped from the wafer after a long time of drying process, the pollutants are transferred to the wafer, causing the edge of the wafer to be prone to produce point or strip defects, thereby affecting the yield of the wafer.

[0004] Therefore, it is necessary to develop a wafer support member that supports the wafer and is not prone to accumulate pollutants. INVENTION CONTENTS

[0005] The utility model discloses a kind of wafer drying groove's support spare and wafer drying device, by being provided with the flow guide passage that is communicated with support groove on support member, avoid that support groove is accumulated by wafer dropped pollutant, improve the cleanliness of wafer during drying process, to improve wafer yield in this way.

[0006] The utility model provides a kind of wafer drying groove's support spare, the support member includes support leg and the main body connected with support leg, the main body is equipped with the support groove for supporting wafer, the main body is also equipped with the flow guide passage that is communicated with the support groove and penetrates the main body.

[0007] Preferably, the flow guide passage is a circular hole, an elliptical hole, or an arc-shaped groove.

[0008] Preferably, the inner wall of the flow guide channel is a smooth hydrophobic surface.

[0009] Preferably, the channel wall of the support groove is uniformly distributed with a plurality of the flow guide channels, and / or the groove bottom of the support groove is uniformly distributed with a plurality of the flow guide channels.

[0010] Preferably, the channel wall and the groove bottom of the support groove are both provided with the flow guide channels, and the inner diameter of the flow guide channel located on the channel wall is greater than that of the flow guide channel located on the groove bottom.

[0011] Preferably, in the length direction of the support groove, the channel wall of the support groove and the groove bottom of the support groove are respectively and uniformly distributed with six flow guide channels.

[0012] Preferably, in the length direction of the support groove, the support groove is arc-shaped.

[0013] Preferably, the width of the support groove gradually decreases from the groove opening to the groove bottom.

[0014] Preferably, the support member is made of polyether ether ketone material.

[0015] The utility model also provides a wafer drying device based on marangoni effect, it includes drying groove, as any one of above described support spare and with support spare link drive support spare swing drive component, support spare is placed in the tank cavity of drying groove, drive cylinder, rotating rod and two magnets are included to drive component, rotating rod rotation sets up in the tank cavity of drying groove and support leg of support spare is clamped on rotating rod, first magnet is placed in the tank cavity of drying groove and is connected with rotating rod, second magnet is placed outside drying groove with drive cylinder and second magnet is connected with drive cylinder, under the driving of drive cylinder make second magnet with first magnet interact through magnetic force, to drive rotating rod rotation and make support spare swing.

[0016] The wafer drying groove support member and the wafer drying device based on marangoni effect have the beneficial effects that: by setting the flow guide channel on the main body, the flow guide channel penetrates the main body and communicates the support groove with the outside of the main body, realizes that the pollutants in the support groove flow with the cleaning liquid in the drying groove and are discharged in turn, avoids accumulation in the support groove to cause adhesion on the edge of the wafer, improves the cleanliness of the wafer in the drying process, and improves the wafer yield; on the other hand, the flow guide channel is set on the main body, and the weight of the main body can be reduced. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 It is shown as the perspective view of the wafer drying groove support member of the utility model.

[0018] Figure 2 A side view of the support member for the wafer drying groove of the present application is shown.

[0019] Figure 3 A partial structure schematic view of the wafer drying device of the present application is shown. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical scheme and advantages of the embodiments of the present application more clear, the technical scheme in the embodiments of the present application will be described clearly and completely below. Obviously, the described embodiments are some embodiments of the present application, but not all the embodiments of the present application. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application. Unless otherwise defined, the technical terms or scientific terms used herein should be understood as the common meanings understood by those skilled in the art to which the present application belongs. The similar words such as "comprise" used herein mean that the elements or objects before the words cover the elements or objects listed after the words and their equivalents, and do not exclude other elements or objects.

[0021] The embodiments of the present application provide a support member for a wafer drying groove, as shown in Figure 1 and Figure 2 , the support member comprises a support leg 2 and a main body 1 connected with the support leg 2, the main body 1 is provided with a support groove 101 for supporting a wafer, and the main body 1 is further provided with a flow guide channel 102 which is in communication with the support groove 101 and penetrates the main body 1. The present application sets the flow guide channel 102 which is in communication with the support groove 101 on the support member, and the flow guide channel 102 penetrates the main body 1, so that the cleaning liquid in the wafer drying groove can flow through the support groove 101, carry the pollutants falling from the wafer in the support groove 101 and discharge them from the flow guide channel 102, improve the cleanliness of the wafer during the drying process, and thus improve the wafer yield. In addition, the setting of the flow guide channel 102 reduces the weight of the support member, and light weight design can be realized.

[0022] For the convenience of description, in the present embodiment, the groove depth direction of the support groove 101 is consistent with the extension direction of the support leg 2, that is, the X direction in Figure 2 , the groove width direction of the support groove 101 is consistent with the thickness direction of the main body 1, and the groove length direction of the support groove 101 is the extension direction thereof in the length direction of the main body, that is, the Y direction in Figure 2 , the groove length direction of the support groove 101 is perpendicular to the groove depth direction and the groove width direction.

[0023] As an embodiment, the flow guide channel 102 is a round hole, an oval hole, a square hole, an arc-shaped slot, or other irregular holes. In an embodiment, the arc-shaped slot can extend from the slot opening of the support groove 101 to the groove bottom, that is, it penetrates the main body 1 in the groove depth direction of the support groove 101 and in the groove width direction of the support groove 101. The support member of this embodiment is used in a wafer drying groove with uninterrupted circulating cleaning liquid. In this embodiment, the cleaning liquid can be plasma water or deionized water. The cleaning liquid enters the support groove 101 through the flow guide channel 102, so that the contaminants falling from the wafer in the support groove 101 are carried away by the flow of the cleaning liquid. The setting direction and shape of the flow guide channel 102 are preferably selected to reduce water flow disturbance and fluid resistance in a circulating water environment, such as a round hole. The round hole has good fluid dynamics advantages, which can reduce turbulent flow and water dynamic noise. The symmetry and low resistance characteristics of the round hole help to improve the efficiency of water flow. In addition, the round hole is easy to process, and the stress distribution is uniform, which will not affect the structural strength of the support member due to the setting of the round hole.

[0024] The inner wall of the flow guide channel 102 described above is a smooth hydrophobic surface, which is more conducive to the flow of the cleaning liquid and avoids the attachment of contaminants.

[0025] As an embodiment, a plurality of flow guide channels 102 are uniformly distributed on the groove wall of the support groove 101, that is, they penetrate the main body in the groove width direction, and the inside of the support groove 101 is connected with the outside of the main body, which is convenient for the cleaning liquid in the wafer drying groove to enter the support groove 101 or flow out of the support groove 101. More preferably, the flow guide channel 102 communicates with the space inside the bottom of the support groove 101, that is, the position of the flow guide channel 102 on the groove wall is located on the side of the support groove 101 close to the groove bottom, which is convenient for the liquid flow at the groove bottom of the support groove 101 and avoids the accumulation of contaminants at the groove bottom. In another embodiment, a plurality of flow guide channels 102 are uniformly distributed on the groove bottom of the support groove 101, that is, the flow guide channels 102 are arranged in the groove depth direction of the support groove 101 to penetrate the groove bottom of the support groove 101. This embodiment is more conducive to the flow of liquid at the bottom of the support groove.

[0026] As a preferred embodiment, the flow guide channels 102 are provided on the groove wall and the groove bottom of the support groove 101, and the inner diameter of the flow guide channel on the groove wall is greater than that on the groove bottom. The extension direction of the flow guide channel on the groove wall and the extension direction of the flow guide channel on the groove bottom can be perpendicular to each other. The flow guide channel 102 on the groove wall is convenient for fluid to enter the support groove 101, and the flow guide channel 102 on the groove bottom is convenient for discharge, which further facilitates the discharge of contaminants falling into the support groove.

[0027] In the embodiment, the support groove 101 is arc-shaped in the length direction of the support groove 101, which facilitates supporting the wafer and reduces the contact area with the wafer, and only the edge of the wafer is in contact with the support groove. The width of the support groove gradually decreases from the groove opening to the groove bottom, and the cross section is V-shaped, which further facilitates supporting the wafer.

[0028] In the length direction of the support groove, six flow guide channels are evenly distributed on the groove wall of the support groove 101 and the groove bottom of the support groove 101, respectively, to ensure that the cleaning liquid enters and flows out from each position in the length direction of the support groove, fully flushes the support groove, and better discharges the pollutants. The number of flow guide channels needs to remain stable to maintain the structural strength of the support member. The middle region of the main body 1 is provided with a groove, which is used for lifting the lifting mechanism located at the groove bottom in the wafer drying device to lift the wafer in the support groove 101; all flow guide channels are symmetrically distributed on both sides of the groove to ensure the structural strength of the support member.

[0029] In the embodiment, the flow guide channels are provided, which can reduce the accumulation of pollutants in the support groove during the wafer production process without reducing the mechanical strength of the support member; on the other hand, the overall weight of the structural member can be reduced, and the service life can be prolonged without frequent replacement due to the absence of pollutant accumulation. The support member is made of polyether ether ketone material, which can improve the wear resistance and corrosion resistance of the support member.

[0030] The utility model also provides a kind of wafer drying device based on marangoni effect, see Figure 3 As shown in the figure, it includes drying groove 200, support member 100 as described above, and drive assembly connected with support member 100 to drive support member 100 to swing, support member 100 is placed in the cavity of drying groove 200, drive assembly includes drive cylinder 300, rotating rod and two magnets, rotating rod is rotationally arranged in the cavity of drying groove 200 and the support leg of support member 100 is clamped on the rotating rod, first magnet 500 is placed in the cavity of drying groove 200 and connected with rotating rod, second magnet 400 is placed outside drying groove 200 and connected with drive cylinder 300, and second magnet 400 moves relative to first magnet under the driving of drive cylinder 300 (the movement direction is as shown by the arrow in the figure). Figure 3The second magnet 400 and the first magnet 500 are attracted to each other by magnetic force, so as to drive the rotating rod to rotate and make the support 200 swing. In the drying tank of the embodiment, there is a cleaning liquid such as deionized water or plasma water, and the support 100 is provided with a flow guide channel to facilitate the deionized water to enter the support groove and be discharged. The flow guide channel reduces the weight of the support, and facilitates the driving assembly to drive the support to swing to the inclined position, so as to perform the subsequent wafer lifting and lifting process. The wafer drying process of the embodiment is as follows: the drying tank is filled with deionized water, the wafer is transferred by the robot and introduced into the support, the driving assembly is actuated to make the rotating rod rotate, so as to make the support swing from the vertical state to the inclined position, then the wafer is lifted and lifted until it is pushed into the isopropanol cleaning area. Since isopropanol has hydrophilicity, a certain surface tension is formed, that is, the Marangoni effect is formed, the water on the surface of the wafer is taken away by the Marangoni force to achieve the drying effect; during the period, the deionized water can enter the support groove through the flow guide channel, and carry the pollutants falling from the wafer in the support groove to be discharged, so as to avoid the accumulation of pollutants in the support groove.

[0031] Although the embodiments of the present application are described in detail above, it is obvious for those skilled in the art that various modifications and changes can be made to the embodiments. However, it should be understood that such modifications and changes are within the scope and spirit of the present application described in the claims. Moreover, the present application described herein can have other embodiments, and can be implemented or realized in various ways.

Claims

1. A support member for a wafer drying slot, characterized by: The support comprises a support leg and a main body connected with the support leg, the main body is provided with a support groove for supporting a wafer, and the main body is further provided with a flow guide channel which is communicated with the support groove and penetrates through the main body.

2. Support according to claim 1, characterized in that: The flow guide channel is a round hole, an oval hole or an arc-shaped groove.

3. The support of claim 1, wherein: The inner wall of the flow guide channel is a smooth hydrophobic surface.

4. The support of claim 1, wherein: The groove wall of the support groove is uniformly provided with a plurality of flow guide channels, and / or the groove bottom of the support groove is uniformly provided with a plurality of flow guide channels.

5. Support according to claim 4, characterized in that: The groove wall and the groove bottom of the support groove are both provided with the flow guide channels, and the inner diameter of the flow guide channel located on the groove wall is greater than that of the flow guide channel located on the groove bottom.

6. Support according to claim 4, characterized in that: In the length direction of the support groove, six flow guide channels are uniformly distributed on the groove wall and the groove bottom of the support groove, respectively.

7. The support of claim 1, wherein: In the length direction of the support groove, the support groove is arc-shaped.

8. The support of claim 1, wherein: The width of the support groove gradually decreases from the groove opening to the groove bottom.

9. The support of claim 1, wherein: The support is made of polyether ether ketone material.

10. A wafer drying apparatus characterized by comprising: The support comprises a support leg and a main body connected with the support leg, the main body is provided with a support groove for supporting a wafer, and the main body is further provided with a flow guide channel which is communicated with the support groove and penetrates through the main body.

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