Multifunctional chip defect detector
By designing support and adjustment devices and utilizing components such as telescopic rods and lead screws to achieve polarization microscopy imaging, the problem of inaccurate detection results in existing technologies is solved, and the efficiency and image clarity of chip defect detection are improved.
Patent Information
- Application Number
- CN202520232878.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-13
- Publication Date
- 2025-11-28
- Estimated Expiration
- 2035-02-13
AI Technical Summary
Existing technologies do not provide chip defect detectors suitable for fully polarized shortwave infrared imaging technology, resulting in inaccurate detection results.
A multifunctional chip defect detector was designed, comprising a support device and an adjustment device. It utilizes components such as a first telescopic rod and a lead screw in the adjustment device to achieve efficient imaging detection of the chip surface using polarization microscopy, and clamps the chip with a clamping plate to prevent displacement.
It improves the efficiency and image clarity of chip defect detection, ensuring the accuracy and comprehensiveness of the detection results.
Smart Images
Figure CN223611423U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the field of detector, especially a kind of multifunctional chip defect detector. BACKGROUND
[0002] In the semiconductor chip packaging manufacturing process, various defects will inevitably be generated on the surface of the chip, which directly affects the operating efficiency of the chip, and even damages it. Therefore, chip defect detection is a crucial link in the semiconductor manufacturing process, which directly affects the yield and product quality of the chip. With the continuous progress of chip manufacturing technology, defect detection technology is also developing to cope with the increasingly complex manufacturing environment and higher quality requirements.
[0003] Although most semiconductor materials such as silicon, germanium, gallium arsenide and indium phosphide are not transparent in the visible / near-infrared light band, their light transmission performance is relatively good in the short-wave infrared region. Therefore, using short-wave infrared light to irradiate semiconductor material samples can have good application prospects for high-sensitivity semiconductor detection and process research, and most importantly, it is expected to realize internal defect detection of semiconductors. In addition, when infrared light transmits through semiconductor materials, not only the intensity information changes, but also the polarization information changes. Using polarization imaging technology can obtain polarization characteristic images of semiconductors, which contain more information than pure intensity images. Combining short-wave infrared microscopic imaging technology with polarization imaging technology can not only suppress the influence of sample scattered light on imaging quality, improve imaging contrast and spatial resolution, but also obtain the polarization state change of short-wave infrared light passing through semiconductors and further obtain sample microstructure information. Short-wave infrared polarization imaging technology retains the advantages of traditional microscopic imaging technology, and its large amount of information and compatibility characteristics bring new possibilities for the development of chip defect detection technology.
[0004] Although the prior art uses a detection device to detect the surface of the chip, the prior art does not provide a chip defect detector suitable for the advantages of full-polarization short-wave infrared imaging technology. Full-polarization short-wave infrared imaging technology needs to continuously adjust the angle of the chip surface during detection, and if it cannot be corrected in time, the detection result will not be accurate enough. UTILITY MODEL CONTENT
[0005] The utility model aims at solving the shortcomings in the prior art and provides a multifunctional chip defect detector, which can obtain clear images by polarization microscopic imaging through the setting of the supporting device, and can move each position on the chip below the polarization microscopic imaging through the setting of the adjusting device, thereby improving the detection efficiency.
[0006] To achieve the above object, the utility model provides the following technical scheme: A kind of multi-functional chip defect detector, including support device and adjusting device, the adjusting device is arranged at the top of support device, the support device includes support plate, the top middle part of the support plate is fixedly connected with fixed plate on rear side, the front middle part of the fixed plate is fixedly connected with connecting plate on upper position, the top middle part of the connecting plate is fixedly connected with first telescopic link, the movable end of the first telescopic link is fixedly connected with polarized microscopic imaging;
[0007] Through the above technical scheme, by setting support device, by being provided with first telescopic link on connecting plate, the elongation of first telescopic link can be polarized microscopic imaging and be better for the camera detection of chip surface, provide good basis for chip detection, and using the elongation of first telescopic link, polarized microscopic imaging can better obtain clear image.
[0008] Further, the adjusting device includes a second mounting bracket, a second motor is fixedly connected to the middle part of one side of the second mounting bracket, a first screw rod is rotatably connected to the middle part of the inner side wall of the second mounting bracket, first limit rods are fixedly connected to both sides of the inner side wall of the second mounting bracket, first sliding blocks are threadedly connected to the side walls of the first limit rods, a first mounting bracket is fixedly connected to the top end of the first sliding block, a first motor is fixedly connected to the middle part of the front end of the first mounting bracket, a second screw rod is rotatably connected to the middle part of the inner side wall of the first mounting bracket, second limit rods are fixedly connected to both sides of the inner side wall of the first mounting bracket, a second sliding block is threadedly connected to the side wall of the second screw rod, a third motor is fixedly connected to the top end of the second sliding block, a placement table is rotatably connected to the top end of the third motor, a second telescopic link is fixedly connected to one side of the placement table, a clamping plate is fixedly connected to the movable end of the second telescopic link, and the second mounting bracket is fixedly connected to the top end of the support plate on the front side;
[0009] Through the above technical scheme, by setting adjusting device, using the first screw rod in the second mounting bracket and the second screw rod in the first mounting bracket, the position of the placement table can be adjusted, so that the device as a whole can move each position on the chip to the lower side of the polarized microscopic imaging, and the detection efficiency is improved.
[0010] Further, the first telescopic link fixed end is fixedly connected to the top middle part of the connecting plate;
[0011] Through the above technical scheme, the first telescopic link is effectively fixed.
[0012] Further, the output end of the second motor penetrates one side of the second mounting bracket and is fixedly connected to one end of the first screw rod;
[0013] Through the above technical scheme, the first screw rod is effectively driven to rotate.
[0014] Further, the first sliding block is in sliding connection with the side walls of two first limiting rods.
[0015] Through the above technical scheme, the stability of the first sliding block during movement is effectively improved.
[0016] Further, the output end of the first motor is fixedly connected with one end of the second screw rod through the first mounting frame.
[0017] Through the above technical scheme, the second screw rod is effectively driven to rotate.
[0018] Further, the second sliding block is in sliding connection with the side walls of two second limiting rods.
[0019] Through the above technical scheme, the stability of the second sliding block during movement is effectively improved.
[0020] Further, the output end of the third motor is fixedly connected with the middle part of the bottom end of the placement table.
[0021] Through the above technical scheme, the placement table is effectively driven to rotate.
[0022] The utility model overcomes the defects of prior art and has the following beneficial effects:
[0023] 1. In the utility model, the first telescopic rod is arranged on the connecting plate, the extension of the first telescopic rod can better detect the chip surface through polarization microscopic imaging, and the extension of the first telescopic rod can make polarization microscopic imaging better obtain a clear image.
[0024] 2. In the utility model, the position of the placement table can be adjusted by the first screw rod in the second mounting frame and the second screw rod in the first mounting frame, the device as a whole can move each position on the chip to the lower side of polarization microscopic imaging, and the detection efficiency is improved.
[0025] 3. In the utility model, the third motor is arranged on the second sliding block, the second sliding block is driven to rotate by the first limiting rod, each angle on the chip surface can be detected, and the extension of the second telescopic rod can make the clamping plate clamp the chip to avoid deviation during detection. DRAWINGS
[0026] Figure 1 A perspective view of a multifunctional chip defect detector is provided for the utility model;
[0027] Figure 2 Another perspective view of a multifunctional chip defect detector is provided for the utility model;
[0028] Figure 3 A front view of a multifunctional chip defect detector is provided in the utility model.
[0029] Figure 4 A side view of a multifunctional chip defect detector is provided in the utility model.
[0030] Legend:
[0031] Supporting device (1);Supporting plate (101);Fixed plate (102);Connecting plate (103);First telescopic rod (104);Polarization microscopic imaging (105);Adjusting device (2);First mounting bracket (201);First motor (202);First sliding block (203);First limit rod (204);Second mounting bracket (205);Second motor (206);First screw rod (207);Placing table (208);Second screw rod (209);Clamp plate (2010);Second telescopic rod (2011);Second sliding block (2012);Second limit rod (2013);Third motor (2014). Specific implementation
[0032] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.
[0033] Reference Figures 1-4 The utility model provides an embodiment: a multifunctional chip defect detector, including supporting device 1 and adjusting device 2, adjusting device 2 sets up at the top of supporting device 1, and supporting device 1 includes supporting plate 101, and the top middle part of supporting plate 101 is fixedly connected with fixed plate 102 on the rear side, and the front end middle part of fixed plate 102 is fixedly connected with connecting plate 103 on the upper position, and the top middle part of connecting plate 103 is fixedly connected with first telescopic rod 104, and the movable end of first telescopic rod 104 is fixedly connected with polarization microscopic imaging 105, by setting up supporting device 1, by setting up first telescopic rod 104 on connecting plate 103, the elongation of first telescopic rod 104 can make polarization microscopic imaging 105 better camera detection to chip surface, provides good basis for chip detection, and by the elongation of first telescopic rod 104, polarization microscopic imaging 105 can better obtain clear image.
[0034] The fixed end of first telescopic rod 104 is fixedly connected with the top middle part of connecting plate 103.
[0035] The adjusting device 2 comprises a second mounting frame 205, one side of the second mounting frame 205 is fixedly connected with a second motor 206 in the middle, the first lead screw 207 is rotatably connected to the inner side wall of the second mounting frame 205 in the middle, the first limiting rod 204 is fixedly connected to the inner side wall of the second mounting frame 205 on both sides, the first limiting rod 204 is threadedly connected with the first sliding block 203 on the side wall, the first mounting frame 201 is fixedly connected to the first motor 202 on the front end in the middle, the second lead screw 209 is rotatably connected to the inner side wall of the first mounting frame 201 in the middle, the second limiting rod 2013 is fixedly connected to the inner side wall of the first mounting frame 201 on both sides, the second sliding block 2012 is threadedly connected with the third motor 2014 on the top end, the placing table 208 is rotatably connected to the third motor 2014 on the top end, the second telescopic rod 2011 is fixedly connected to the clamping plate 2010 on the movable end, the second mounting frame 205 is fixedly connected to the top of the supporting plate 101 on the front side, by setting the adjusting device 2, the first lead screw 207 in the second mounting frame 205 and the second lead screw 209 in the first mounting frame 201 can be used to adjust the position of the placing table 208, so that the device as a whole can move each position on the chip below the polarized light microscopic imaging 105, and the detection efficiency is improved.
[0036] The output end of the second motor 206 is fixedly connected with one end of the first lead screw 207 through the second mounting frame 205 on one side, the first sliding block 203 is slidably connected with the side wall of the two first limiting rods 204, the output end of the first motor 202 is fixedly connected with one end of the second lead screw 209 through the first mounting frame 201, the second sliding block 2012 is slidably connected with the side wall of the two second limiting rods 2013, the output end of the third motor 2014 is fixedly connected with the bottom of the placing table 208 in the middle, by setting the third motor 2014 on the second sliding block 2012, the second sliding block 2012 is driven to rotate by the first limiting rod 204, the angles of the surface of the chip can be detected, and the clamping plate 2010 can clamp the chip by the elongation of the second telescopic rod 2011, so that the deviation in the detection process is avoided.
[0037] Working principle: the chip to be detected is placed on the placement table 208, the chip is clamped by the clamping plate 2010, the elongation of the second telescopic rod 2011 can make the clamping plate 2010 clamp the chip, and the offset during detection is avoided. By setting the supporting device 1, the first telescopic rod 104 is arranged on the connecting plate 103, the elongation of the first telescopic rod 104 can make the polarization microscopic imaging 105 better image detection on the surface of the chip, and provide a good basis for chip detection. And by using the elongation of the first telescopic rod 104, the polarization microscopic imaging 105 can better obtain a clear image. By setting the adjusting device 2, the first lead screw 207 in the second mounting frame 205 and the second lead screw 209 in the first mounting frame 201 can adjust the position of the placement table 208, so that the device as a whole can move each position on the chip to the lower side of the polarization microscopic imaging 105, improve the detection efficiency, and detect each angle on the surface of the chip by setting the third motor 2014 on the second sliding block 2012. The first limiting rod 204 drives the second sliding block 2012 to rotate.
[0038] Finally, it should be noted that: the above only for the preferred embodiments of the present application, and not for limiting the present application, although the present application has been described in detail with reference to the foregoing embodiments, for those skilled in the art, it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part of the technical features, any modification, equivalent replacement, improvement, etc. within the spirit and principles of the present application, should be included in the protection scope of the present application.
Claims
1. A multi-functional chip defect detector comprising a support device (1) and an adjusting device (2), the adjusting device (2) is arranged at the top end of the support device (1), characterized in that: The supporting device (1) includes a supporting plate (101), the middle part of the top end of the supporting plate (101) is fixedly connected with a fixed plate (102), the middle part of the front end of the fixed plate (102) is fixedly connected with a connecting plate (103), the middle part of the top end of the connecting plate (103) is fixedly connected with a first telescopic rod (104), and the movable end of the first telescopic rod (104) is fixedly connected with a polarized light microscopic imaging (105).
2. The multi-functional chip defect detector according to claim 1, wherein: The adjusting device (2) includes a second mounting frame (205), one side of the middle part of the second mounting frame (205) is fixedly connected with a second motor (206), the inner side wall of the middle part of the second mounting frame (205) is rotatably connected with a first lead screw (207), the inner side walls of the two sides of the second mounting frame (205) are respectively fixedly connected with first limiting rods (204), the side walls of the first limiting rods (204) are threadedly connected with first sliding blocks (203), the top end of the first sliding block (203) is fixedly connected with a first mounting frame (201), the middle part of the front end of the first mounting frame (201) is fixedly connected with a first motor (202), the middle part of the inner side wall of the first mounting frame (201) is rotatably connected with a second lead screw (209), the inner side walls of the two sides of the first mounting frame (201) are respectively fixedly connected with second limiting rods (2013), the side walls of the second lead screw (209) are threadedly connected with second sliding blocks (2012), the top end of the second sliding block (2012) is fixedly connected with a third motor (2014), the top end of the third motor (2014) is rotatably connected with a placing table (208), one side of the placing table (208) is fixedly connected with a second telescopic rod (2011), and the movable end of the second telescopic rod (2011) is fixedly connected with a clamping plate (2010). The top end of the middle part of the first telescopic rod (104) is fixedly connected with the connecting plate (103).
3. The multi-functional chip defect detector according to claim 1, wherein: The fixed end of the first telescopic rod (104) is fixedly connected with the top end of the middle part of the connecting plate (103).
4. The multi-functional chip defect detector according to claim 2, wherein: The output end of the second motor (206) penetrates one side of the second mounting frame (205) and is fixedly connected with one end of the first lead screw (207).
5. The multi-functional chip defect detector according to claim 2, wherein: The first sliding block (203) is slidably connected with the side walls of the two first limiting rods (204).
6. The multi-functional chip defect detector according to claim 2, wherein: The output end of the first motor (202) penetrates the first mounting frame (201) and is fixedly connected with one end of the second lead screw (209).
7. The multi-functional chip defect detector according to claim 2, wherein: The second sliding block (2012) is slidably connected with the side walls of the two second limiting rods (2013).
8. The multi-functional chip defect detector according to claim 2, wherein: The output end of the third motor (2014) is fixedly connected with the middle part of the bottom end of the placing table (208).