Air pumping and supplying adjusting device for plasma surface treatment of flexible circuit board
By incorporating gas extraction and supply regulation components into the plasma processing equipment, the problem of uneven gas distribution was solved, resulting in more uniform gas flow and improved plasma processing performance of flexible circuit boards.
Patent Information
- Application Number
- CN202423108507.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-16
- Publication Date
- 2025-11-28
- Estimated Expiration
- 2034-12-16
AI Technical Summary
Existing plasma processing equipment cannot flexibly adjust the gas extraction and delivery processes, resulting in uneven gas distribution within the reaction chamber and affecting the plasma processing effect on flexible circuit boards.
A gas extraction and delivery regulating device for plasma surface treatment of flexible circuit boards was designed. By setting gas extraction and delivery regulating components on the sealed cover, and using the sealing plates on the gas extraction plate and the delivery plate to regulate the gas flow direction and volume, the uniformity of gas distribution can be achieved.
The plasma treatment effect on the surface of flexible circuit boards was improved by adjusting the gas flow direction and volume, making the air ionization process more uniform and improving the treatment effect.
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Figure CN223612364U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to plasma surface treatment device technical field, especially in kind of flexible circuit board plasma surface treatment pumping and delivering gas adjusting device. BACKGROUND
[0002] Plasma processing is to process the surface of flexible circuit board by plasma, which is usually applied in the industry of circuit board, mobile phone touch screen and glass, etc. The "active" components of plasma include ions, electrons, active groups, excited state nuclides (metastable state), photons, etc. Atmospheric plasma processing is to process the surface of substrate by using the properties of these active components, so as to modify the surface of the board, increase the surface tension and improve the daoyin value.
[0003] At present, the existing plasma processing equipment usually includes a shell, the shell has a reaction chamber, the top and bottom of the reaction chamber are respectively provided with an upper plate and a lower plate, and the plasma processing device works by creating and maintaining a near-vacuum state in the reaction chamber, uniformly inputting gas into the reaction chamber, and inputting appropriate radio frequency between the upper plate and the lower plate to activate the gas, and then generating and maintaining a plasma environment on the surface of the workpiece to realize the plasma processing of the surface of the flexible circuit board. However, the existing plasma processing equipment cannot flexibly adjust the process of pumping and delivering gas, which leads to uneven distribution of gas in the reaction chamber, thereby affecting the plasma processing effect of the flexible circuit board, and improvement is necessary. SUMMARY
[0004] The utility model aims at providing a kind of flexible circuit board plasma surface treatment pumping and delivering gas adjusting device, its advantage is simple structure, adjustment is convenient.
[0005] The above technical purpose of the utility model is realized by the following technical scheme: a kind of flexible circuit board plasma surface treatment pumping and delivering gas adjusting device, including lower base and upper base;Lower base is fixedly connected with lower plate, upper base is slidably connected with the closed cover for abutting the lower base based on the guiding sliding component assembly, reaction chamber is formed between the closed cover and the lower base, the closed cover top is fixedly connected with the upper plate matched with the lower plate, the closed cover both sides are respectively fixedly connected with pumping and delivering gas adjusting assembly and pumping and delivering gas adjusting assembly.
[0006] The utility model is further provided as follows: the pumping and delivering gas adjusting assembly includes pumping pipe fixedly connected to the closed cover and pumping plate fixedly connected to the inner wall of the closed cover, a plurality of pumping holes are uniformly arranged on the pumping plate, and the first closing plate based on the pumping hole of the closed part is arranged between the pumping plate and the inner wall of the closed cover to change the pumping flow direction in the reaction chamber.
[0007] The utility model further sets up: the air extraction board includes the connecting portion that abuts and fits the inner wall of closed cover and is locked and fixedly connected on the inner wall of closed cover, and the air extraction part is fixedly connected on the connecting portion and abuts and fits the top surface of closed cover, the air extraction hole is set up on the air extraction part, the first closed plate can be movably arranged between the air extraction part and the closed cover.
[0008] The utility model further sets up: the air supply adjusting assembly includes the air supply pipe of fixed connection on the closed cover and the air supply plate of fixed connection on the closed cover, the air supply groove and the air supply mouth that communicate the air supply pipe are set up on the air supply plate, the air supply adjusting plate is locked and fixedly connected on the air supply plate, a plurality of air supply adjusting holes of unequal size are evenly seted up on the air supply adjusting plate, the second closed plate is locked and connected on the air supply adjusting plate based on the locking adjusting assembly based on the air supply adjusting hole of closed part thereby adjusting the air supply flow direction in the reaction chamber.
[0009] The utility model further sets up: the locking adjusting assembly includes a plurality of locking holes that are evenly spaced apart on the air supply adjusting plate along the horizontal direction and locking adjusting grooves that are set up on the second closed plate along the vertical direction, locking connection is realized between the locking hole and the locking adjusting groove based on the locking bolt.
[0010] The utility model further sets up: the guide sliding assembly includes a plurality of guide sliding shafts that are fixedly connected on the lower base along the vertical direction and guide sliding sleeves that are fixedly connected on the closed cover and cooperate with the guide sliding shaft, the upper base is fixedly connected with the lifting cylinder that drives the closed cover to move along the vertical direction.
[0011] The utility model further sets up: the bottom surface of closed cover is set up with the sealing groove, and the sealing gasket is arranged in the sealing groove.
[0012] In conclusion, the utility model has the following beneficial effects:
[0013] 1. The utility model provides an improved flexible circuit board plasma processing device, which comprises a lower base, an upper base, a lower electrode plate, a guiding sliding assembly, a closed cover, an upper electrode plate, an air suction adjusting assembly and an air supply adjusting assembly. BRIEF DESCRIPTION OF DRAWINGS
[0014] Figure 1 is the structure schematic diagram of the whole of the embodiment;
[0015] Figure 2 is the structure sectional view of the whole of the embodiment;
[0016] Figure 3 is the A part enlarged schematic view of Figure 2 ; is the B part enlarged schematic view of
[0017] Figure 4 ; is the structure schematic diagram of the air suction adjusting assembly of the embodiment; Figure 2
[0018] Figure 5 ; is the structure explosion schematic diagram of the air supply adjusting assembly of the embodiment.
[0019] Figure 6
[0020] Corresponding reference signs: 1, lower base; 2, upper base; 3, lower electrode plate; 4, guiding sliding assembly; 41, guiding sliding shaft; 42, guiding sliding sleeve; 43, lifting air cylinder; 5, closed cover; 51, sealing groove; 52, sealing washer; 6, upper electrode plate; 7, air suction adjusting assembly; 71, air suction pipe; 72, air suction plate; 721, connecting part; 722, air suction part; 73, air suction hole; 74, first sealing plate; 8, air supply adjusting assembly; 81, air supply pipe; 82, air supply plate; 83, air supply groove; 84, air supply port; 85, air supply adjusting plate; 86, air supply adjusting hole; 87, locking adjusting assembly; 871, locking hole; 872, locking adjusting groove; 88, second sealing plate. DETAILED DESCRIPTION
[0021] The utility model is further and specifically described below in combination with the drawings.
[0022] Embodiment:
[0023] Reference Figures 1 to 6 A flexible circuit board plasma surface treatment air pumping and feeding adjusting device, comprising a lower base 1 and an upper base 2, a lower electrode plate 3 is fixedly connected on the lower base 1, and a closed cover 5 for abutting against the lower base 1 is slidingly connected on the upper base 2 based on a guide sliding assembly 4, a reaction chamber is formed between the closed cover 5 and the lower base 1, a sealing groove 51 is formed on the bottom surface of the closed cover 5, a sealing gasket 52 is arranged in the sealing groove 51 to ensure the sealing of the reaction chamber, an upper electrode plate 6 matched with the lower electrode plate 3 is fixedly connected on the top of the closed cover 5, the air in the reaction chamber is ionized by electrifying the upper electrode plate 6 and the lower electrode plate 3 to realize the plasma treatment of the surface of the flexible circuit board placed in the reaction chamber, the air pumping and feeding adjusting assemblies 7 and 8 are fixedly connected on the two sides of the closed cover 5, respectively, the air pumping and feeding directions in the reaction chamber can be changed through the air pumping and feeding adjusting assemblies 7 and 8, so that the ionization effect in the reaction chamber is better to improve the plasma surface treatment effect.
[0024] Reference Figure 3 And Figure 5 Specifically, the air pumping adjusting assembly 7 comprises an air pumping pipe 71 fixedly connected on the closed cover 5 and an air pumping plate 72 lockingly and fixedly connected on the inner wall of the closed cover 5, a plurality of air pumping holes 73 are uniformly arranged on the air pumping plate 72, a first sealing plate 74 for changing the air pumping direction in the reaction chamber based on the closed part air pumping holes 73 is arranged between the air pumping plate 72 and the inner wall of the closed cover 5, the air pumping plate 72 comprises a connecting part 721 abutting and tightly fixed on the inner wall of the closed cover 5, and an air pumping part 722 fixedly connected on the connecting part 721 and abutting the top surface of the closed cover 5, the air pumping holes 73 are arranged on the air pumping part 722, the first sealing plate 74 is movably arranged between the air pumping part 722 and the closed cover 5, the number and position of the closed air pumping holes 73 are adjusted by adjusting the position and number of the first sealing plate 74, so as to adjust the air pumping direction in the reaction chamber, and the air pumping in the reaction chamber is more uniform to improve the plasma treatment effect of the surface of the flexible circuit board.
[0025] Reference Figure 4 And Figure 6, specifically, the air supply adjusting assembly 8 comprises an air supply pipe 81 fixedly connected to the closed cover 5 and an air supply plate 82 fixedly connected to the closed cover 5, the air supply plate 82 is provided with an air supply groove 83 and an air supply opening 84 communicated with the air supply pipe 81, air flows into the air supply opening 84 from the air supply pipe 81 and flows along the direction of the air supply groove 83, the air supply adjusting plate 85 is fixedly connected to the air supply plate 82, a plurality of air supply adjusting holes 86 of different sizes are uniformly arranged on the air supply adjusting plate 85, the sizes of the air supply adjusting holes 86 gradually increase from the middle to the outside, the second closed plate 88 based on the closed part air supply adjusting hole 86 is locked and connected to the air supply adjusting plate 85 based on the locking adjusting assembly 87, the air flow direction in the reaction chamber is adjusted, the different air supply adjusting holes 86 are closed or part of the air supply adjusting holes 86 is closed by the second closed plate 88, so that the air flow direction and the air volume entering the reaction chamber are changed, the air ionization process is more uniform, and the plasma treatment effect of the flexible circuit board surface is improved. The locking adjusting assembly 87 comprises a plurality of locking holes 871 uniformly and spaced apart in the horizontal direction arranged on the air supply adjusting plate 85 and a locking adjusting groove 872 arranged in the vertical direction on the second closed plate 88, the locking holes 871 and the locking adjusting groove 872 are locked and connected based on the locking bolt, the second closed plate 88 is locked and fixed on the air supply adjusting plate 85 by the locking adjusting assembly 87, and the position of the second closed plate 88 in the vertical direction can be adjusted to adjust the size of the closed air supply adjusting hole 86.
[0026] Reference Figure 1 , specifically, the guide sliding assembly 4 comprises a plurality of guide sliding shafts 41 fixedly connected to the lower base 1 in the vertical direction and a guide sliding sleeve 42 fixedly connected to the closed cover 5 and matched with the guide sliding shafts 41, the lifting cylinder 43 fixedly connected to the upper base 2 drives the closed cover 5 to move in the vertical direction, and the closed cover 5 slides along the direction of the guide sliding shafts 41 driven by the lifting cylinder 43 to improve the stability of the sliding process.
[0027] The use process is briefly described as follows: the air flow direction in the reaction chamber is adjusted by closing different air exhaust holes 73 by the first closed plate 74, and the air flow direction and the air volume entering the reaction chamber are changed by closing different air supply adjusting holes 86 or part of the air supply adjusting holes 86 by the second closed plate 88, so that the air ionization process is more uniform, and the plasma treatment effect of the flexible circuit board surface is improved.
[0028] This embodiment is only an explanation of the utility model, and is not a limitation of the utility model, and those skilled in the art can make creative contributions to the modification of the embodiment according to the needs after reading the specification, but as long as it is within the scope of the claims of the utility model, it is protected by the patent law.
Claims
1. A flexible wiring board plasma surface treatment pump gas conditioning device comprising a lower base (1) and an upper base (2); characterized by, The lower base (1) is fixedly connected with a lower pole plate (3), the upper base (2) is slidably connected with a closed cover (5) for abutting against the lower base (1) based on a guide sliding assembly (4), a reaction chamber is formed between the closed cover (5) and the lower base (1), the top of the closed cover (5) is fixedly connected with an upper pole plate (6) matched with the lower pole plate (3), and the two sides of the closed cover (5) are respectively fixedly connected with an air exhaust adjusting assembly (7) and an air supply adjusting assembly (8).
2. The plasma surface treatment and pumping air conditioning device for a flexible wiring board according to claim 1, wherein The air exhaust adjusting assembly (7) comprises an air exhaust pipe (71) fixedly connected to the closed cover (5) and an air exhaust plate (72) fixedly connected to the inner wall of the closed cover (5), a plurality of air exhaust holes (73) are uniformly arranged on the air exhaust plate (72), and a first closing plate (74) based on the air exhaust holes (73) is arranged between the air exhaust plate (72) and the inner wall of the closed cover (5) to change the air exhaust direction in the reaction chamber.
3. The plasma surface treatment and gas regulation apparatus for a flexible wiring board according to claim 2, wherein The air exhaust plate (72) comprises a connecting portion (721) abutting and tightly fixedly connected to the inner wall of the closed cover (5), and an air exhaust portion (722) fixedly connected to the connecting portion (721) and abutting the top surface of the closed cover (5), the air exhaust holes (73) are arranged on the air exhaust portion (722), and the first closing plate (74) is movably arranged between the air exhaust portion (722) and the closed cover (5).
4. The plasma surface treatment and gas regulation apparatus for a flexible wiring board according to Claim 1, wherein The air supply adjusting assembly (8) comprises an air supply pipe (81) fixedly connected to the closed cover (5) and an air supply plate (82) fixedly connected to the closed cover (5), an air supply groove (83) and an air supply port (84) communicated with the air supply pipe (81) are arranged on the air supply plate (82), an air supply adjusting plate (85) is tightly fixedly connected to the air supply plate (82), a plurality of air supply adjusting holes (86) of different sizes are uniformly arranged on the air supply adjusting plate (85), and a second closing plate (88) based on the air supply adjusting holes (86) is tightly connected to the air supply adjusting plate (85) based on a locking adjusting assembly (87) to adjust the air supply direction in the reaction chamber.
5. The plasma surface treatment and gas regulation apparatus for a flexible wiring board according to claim 4, wherein The locking adjusting assembly (87) comprises a plurality of locking holes (871) uniformly and spaced apart along the horizontal direction arranged on the air supply adjusting plate (85) and a locking adjusting groove (872) arranged along the vertical direction on the second closing plate (88), and the locking holes (871) and the locking adjusting groove (872) are tightly connected based on a locking bolt.
6. The plasma surface treatment and gas regulation apparatus for a flexible wiring board according to claim 1, wherein The guide sliding assembly (4) comprises a plurality of guide sliding shafts (41) fixedly connected to the lower base (1) along the vertical direction and a guide sliding sleeve (42) fixedly connected to the closed cover (5) and matched with the guide sliding shafts (41), and the upper base (2) is fixedly connected with a lifting cylinder (43) for driving the closed cover (5) to move along the vertical direction.
7. The plasma surface treatment and gas regulation apparatus for a flexible wiring board according to claim 1, wherein The bottom surface of the closure cover (5) is provided with a sealing groove (51), and the sealing groove (51) is provided with a sealing washer (52).