Adjustable bubbling structure and wafer cleaning device

By introducing a flow regulation mechanism into the wafer cleaning device, the problem that the existing bubble tube structure cannot regulate the gas flow rate is solved, achieving flexible gas flow control, reducing costs and resource waste, and improving production efficiency.

CN223612370UActive Publication Date: 2025-11-28ULTRON SEMICON (SHANGHAI) CO LTD
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Patent Information

Application Number
CN202422971834.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-03
Publication Date
2025-11-28
Estimated Expiration
2034-12-03

AI Technical Summary

Technical Problem

In existing wafer cleaning equipment, the bubble tube structure cannot control the gas flow, resulting in uneven gas flow rate, high resource waste, high cost, and the cleaning effect is gradually failing to meet the needs of development.

Method used

By adding a flow regulating mechanism to the bubbling tube structure, the gas flow rate in the bubbling area can be adjusted, enabling flexible control of the gas flow rate, reducing costs, minimizing resource waste, and improving production efficiency.

Benefits of technology

It enables flexible adjustment of gas flow rate, reduces production costs, minimizes ineffective waste of gas and cleaning agents, shortens process time, and improves production efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides an adjustable bubbling structure and a wafer cleaning device, the adjustable bubbling structure comprises a main pipe and a bubbling pipe, the bubbling pipe comprises a bubbling pipe section and a connecting pipe section, the front end, the middle end and the rear end of the bubbling pipe section are communicated with the main pipe through the connecting pipe section, and the bubbling pipe section is provided with bubbling holes; and the flow adjusting mechanism is used for adjusting the gas flow by extruding and communicating the front end of the bubbling pipe section with the connecting pipe section of the main pipe and communicating the middle end of the bubbling pipe section with the connecting pipe section of the main pipe. The bubbling effect of the bubbling area of the bubbling pipe is adjusted by increasing and decreasing the flow adjusting mechanism on the basis of an existing bubbling pipe structure, additional design of the bubbling pipe structure is not needed, cost is reduced, invalid loss of gas and cleaning agents is reduced, process time is shortened, and production efficiency is improved.
Need to check novelty before this filing date? Find Prior Art

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer cleaning technical field especially, relates to an adjustable bubble structure and wafer cleaning device. BACKGROUND

[0002] Because the processing process of wafer is very high to cleanliness requirement, all media contacting with wafer can cause pollution to silicon wafer, and the good and bad of wafer cleaning have serious influence on device performance, so almost every processing needs to remove contamination, the main cleaning method is wet cleaning at present, with the development of industry, the requirement of wafer cleaning is higher and higher, and the cleaning effect of current gradually cannot satisfy the demand of development. Figures 1-3 As shown in the prior art cleaning process, the existing technology is through the bubble pipe of wafer cleaning groove bottom, and the bubble pipe has bubble hole, and the gas is introduced into the bubble pipe, and the gas is sprayed from the bubble hole to make the cleaning agent in the groove appear boiling water column rolling and flushing wafer. Figure 1 As shown in the bubble pipe structure, the bubble hole of bubble pipe is fixed, the bubble pipe is divided into two paths by a main pipe after entering the gas and entering the bubble area existing in the bubble hole, if the bubble area is divided into A area, B area and C area three areas, the gas reaches C area by pipe way A / B area, under certain pressure, A area on the whole pipe releases pressure first, then the gas that cannot release due to inertia directly releases C area, when A and C area cannot release, B area slowly releases, that is, we see the phenomenon that the bubbles in the groove are large at both ends and small in the middle. UTILITY MODEL CONTENT

[0003] Based on the above content, the utility model provides an adjustable bubble structure and wafer cleaning device, aims at solving some problems existing in the bubble pipe structure in the prior art.

[0004] An adjustable bubble structure comprises:

[0005] A main pipe;

[0006] A bubble pipe, the bubble pipe comprises a bubble pipe section and a connecting pipe section, the front end, the middle end and the rear end of the bubble pipe section are communicated with the main pipe through the connecting pipe section, and the bubble pipe section is provided with a bubble hole;

[0007] A flow regulating mechanism is used for regulating the gas flow by extruding the connecting pipe section communicating the front end of the bubble pipe section and the main pipe and the connecting pipe section communicating the middle end of the bubble pipe section and the main pipe.

[0008] Further, the bubble pipe has two bubble pipe sections;

[0009] The rear end of the first bubble tube section is communicated with the main pipe through a first connecting pipe section, and the front end of the first bubble tube section is communicated with the first connecting pipe section through a second connecting pipe section;

[0010] The rear end of the second bubble tube section is communicated with the main pipe through a third connecting pipe section, and the front end of the second bubble tube section is communicated with the third connecting pipe section through a fourth connecting pipe section;

[0011] The fifth connecting pipe section has one end communicated with the main pipe and the other end communicated with the middle end of the first bubble tube section and the middle end of the second bubble tube section respectively.

[0012] Further, the flow regulating mechanism comprises:

[0013] The mounting seat is provided with through holes extending along the first direction for the second connecting pipe section, the fourth connecting pipe section and the fifth connecting pipe section to pass through respectively;

[0014] The mounting seat is further provided with threaded holes corresponding to the through holes one by one in up and down directions;

[0015] The threaded holes are for screws to be screwed into, and the gas flow of the corresponding one of the second connecting pipe section, the fourth connecting pipe section and the fifth connecting pipe section is adjusted by the depth of the screws.

[0016] Further, the bubble holes of the bubble tube section are of single-layer structure.

[0017] Further, the two bubble tube sections are straight sections.

[0018] Further, the bubble holes on the bubble tube section are arranged at equal intervals along the length direction.

[0019] Further, the first connecting pipe section and the first bubble tube section are integrally formed, and the second connecting pipe section and the first bubble tube section are integrally formed;

[0020] The third connecting pipe section and the second bubble tube section are integrally formed, and the fourth connecting pipe section and the second bubble tube section are integrally formed.

[0021] Further, the threaded holes corresponding to the through holes are arranged in a row.

[0022] A wafer cleaning device comprises:

[0023] The adjustable bubble structure is used before use.

[0024] A tank body is provided with a liquid inlet pipe at the bottom for providing a cleaning agent for wafer cleaning to the tank body;

[0025] A wafer bracket is arranged above the liquid inlet pipe for supporting a wafer;

[0026] The bubble tube of the adjustable bubble structure is arranged at the bottom of the tank body, and the external gas enters the bubble tube from the main pipe of the adjustable bubble structure.

[0027] The beneficial technical effects of the present application are as follows: the flow adjusting mechanism is added to the existing bubble tube structure to adjust the bubble effect of the bubble area of the bubble tube, the bubble tube structure does not need to be designed additionally, the cost is reduced, the invalid loss of the gas and the cleaning agent is reduced, the process time is shortened, and the production efficiency is improved. BRIEF DESCRIPTION OF DRAWINGS

[0028] Figures 1-2 Figure 1 is a schematic diagram of the bubble tube structure in the prior art;

[0029] Figure 3 Figure 2 is a schematic diagram of the bubble hole of the bubble tube structure in the prior art, which is large at both ends and small in the middle;

[0030] Figures 4-5 Figure 3 is a structural schematic diagram of the adjustable bubble structure of the present application;

[0031] Figure 6 Figure 4 is a structural schematic diagram of the flow adjusting mechanism of the adjustable bubble structure of the present application;

[0032] Wherein:

[0033] 1-main pipe; 2-bubble tube; 21-bubble tube section; 22-bubble hole; 23-first connecting pipe section; 24-second connecting pipe section; 25-third connecting pipe section; 26-fourth connecting pipe section; 27-fifth connecting pipe section;

[0034] 3-flow adjusting mechanism; 31-mounting seat; 32-perforation; 33-thread hole; 34-screw;

[0035] 4-tank body; 5-wafer. DETAILED DESCRIPTION

[0036] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0037] It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict.

[0038] The present application will be further described below with reference to the drawings and specific embodiments, but the present application is not limited by the present application.

[0039] Referring to Figures 4-6 The utility model provides a adjustable bubble structure, including:

[0040] Main pipe (1);

[0041] Bubble pipe (2), bubble pipe includes bubble pipe section (21) and connecting pipe section, and the front end, the middle end and the rear end of bubble pipe section (21) are all communicated with main pipe (1) through connecting pipe section (21), and bubble pipe section (21) is equipped with bubble hole (22);

[0042] Flow regulating mechanism (3) is used for carrying out gas flow regulation by extruding the connecting pipe section of the front end of bubble pipe section (21) and main pipe (1) and the connecting pipe section of the middle end of bubble pipe section (21) and main pipe (1).

[0043] The greater the extrusion pressure of connecting pipe is, the smaller the cross-sectional area of connecting pipe is, and the smaller the gas flow is, and the smaller the extrusion pressure is, the greater the cross-sectional area of connecting pipe is, and the greater the gas flow is.

[0044] By increasing flow regulating mechanism on the basis of the existing bubble pipe structure, the bubble effect of bubble area of bubble pipe is adjusted, without extra bubble pipe structure design, cost is reduced, invalid loss of gas and cleaning agent is reduced, process time is shortened, and production efficiency is improved.

[0045] Further, bubble pipe (2) has two bubble pipe sections (21);

[0046] The rear end of first bubble pipe section (21) is communicated with main pipe (1) through first connecting pipe section (23), and the front end of first bubble pipe section (21) is communicated with first connecting pipe section (23) through second connecting pipe section (24);

[0047] The rear end of second bubble pipe section (21) is communicated with main pipe (1) through third connecting pipe section (25), and the front end of second bubble pipe section (21) is communicated with third connecting pipe section (25) through fourth connecting pipe section (26);

[0048] First bubble pipe section (21) and second bubble pipe section (21) are equipped with fifth connecting pipe section (27), and one end of fifth connecting pipe section (27) is communicated with main pipe (1), and the other end is communicated with the middle end of first bubble pipe section (21) and the middle end of second bubble pipe section (21) respectively.

[0049] The two bubble tube sections (21) are arranged in parallel. The two bubble tube sections (21) are each divided into an A region, a B region and a C region, the A region is close to the rear end of the bubble tube section (21), the C region is close to the front end of the bubble tube section (21), and the B region covers the middle end of the bubble tube section (21). The fifth connecting tube section (27) is arranged in parallel with the two bubble tube sections (21).

[0050] The second connecting tube section (24) is communicated with the front end of the first bubble tube section (21) at one end and communicated with the first connecting tube section (23) at the other end. The connection between the second connecting tube section (24) and the first connecting tube section (23) is close to the lower end of the main pipe (1). The lower end of the main pipe (1) is connected to the bubble tube.

[0051] The fourth connecting tube section (26) is communicated with the front end of the second bubble tube section (21) at one end and communicated with the third connecting tube section (25) at the other end. The connection between the fourth connecting tube section (26) and the third connecting tube section (25) is close to the lower end of the main pipe (1).

[0052] After the external gas such as CO2 enters the main pipe, it is divided into three paths, one path enters the first connecting tube section (23), one path enters the third connecting tube section (25), and one path enters the fifth connecting tube section (27). The first connecting tube section (23) is further divided into one path for the second connecting tube section (24), and the third connecting tube section (25) is further divided into one path for the fourth connecting tube section (26). The gas enters the rear end of the first bubble tube section (21) through the first connecting tube section (23) and enters the front end of the first bubble tube section (21) through the second connecting tube section (24). The gas enters the rear end of the second bubble tube section (21) through the third connecting tube section (25) and enters the front end of the second bubble tube section (21) through the fourth connecting tube section (26). After the gas passes through the fifth connecting tube section (27), it is divided into two paths to enter the middle end of the first bubble tube section (21) and the second bubble tube section (21) respectively. By adjusting the gas flow of the second connecting tube section (24), the fourth connecting tube section (26) and the fifth connecting tube section (27), the bubbling conditions of the A, B and C front, middle and rear regions can be adjusted, and the problem of large front and rear and small middle can be solved.

[0053] Further, the flow regulating mechanism (3) comprises:

[0054] The mounting seat (31) is provided with a through hole (32) extending in the first direction for the second connecting tube section, the fourth connecting tube section and the fifth connecting tube section to pass through respectively;

[0055] The mounting seat is further provided with a threaded hole (33) corresponding to each through hole (32) one by one in up and down directions;

[0056] The threaded hole (33) is screwed into the screw (34), and the gas flow of the corresponding one of the second connecting pipe section (24), the fourth connecting pipe section (26) and the fifth connecting pipe section (27) is adjusted by the depth of the screw (34) screwed into.

[0057] The deeper the depth of the screw (34) screwed into, the smaller the pipe flow area in the connecting pipe section, and the size of the gas flow in the pipe flow area in the bubbling pipe section B region and C region is indirectly controlled by the change of the pipe flow area.

[0058] Further, the bubbling hole of the bubbling pipe section (21) is a single-layer structure.

[0059] When the bubbling pipe section (21) is arranged at the bottom of the wafer cleaning tank, the bubbling hole is upwardly directed to the wafer to be cleaned.

[0060] Further, both the two bubbling pipe sections (21) are straight sections.

[0061] Further, the bubbling holes on the bubbling pipe section (21) are arranged at equal intervals along the length direction.

[0062] Further, the first connecting pipe section (23) and the first bubbling pipe section (21) are integrally formed, and the second connecting pipe section (24) and the first bubbling pipe section (21) are integrally formed.

[0063] The third connecting pipe section (25) and the second bubbling pipe section (21) are integrally formed, and the fourth connecting pipe section (26) and the second bubbling pipe section (21) are integrally formed.

[0064] The integral formation reduces the connecting members, is simple to prepare, saves the manufacturing cost, and improves the production efficiency.

[0065] Further, the threaded holes (33) corresponding to the perforations (32) are arranged in a row.

[0066] The threaded holes (33) are arranged in a row, which improves the design convenience and regularity of the flow adjusting mechanism (3).

[0067] The utility model provides a kind of wafer cleaning device, comprising:

[0068] Use the adjustable bubbling structure before described;

[0069] Tank, tank bottom is equipped with inlet pipe, and inlet pipe is used to provide cleaning agent for wafer cleaning to tank;

[0070] Inlet pipe top is equipped with wafer bracket, and wafer bracket is used to support wafer;

[0071] The bubbling pipe of adjustable bubbling structure is arranged at the bottom of tank, and external gas enters the bubbling pipe from the main pipe of adjustable bubbling structure.

[0072] The above merely describes preferred embodiments of the present application, and is not intended to limit the implementation and protection scope of the present application. For those skilled in the art, it should be understood that any equivalent substitutions and obvious changes made according to the content of the present application and drawings should be included in the protection scope of the present application.

Claims

1. An adjustable bubble structure, characterized by, The adjustable bubble structure comprises: a main pipe; a bubble pipe, which comprises bubble pipe segments and connecting pipe segments, the front end, middle end and rear end of the bubble pipe segments are communicated with the main pipe through the connecting pipe segments, and the bubble pipe segments are provided with bubble holes; a flow adjusting mechanism for adjusting the gas flow by extruding the connecting pipe segments between the front end of the bubble pipe segments and the main pipe and the connecting pipe segments between the middle end of the bubble pipe segments and the main pipe.

2. An adjustable bubble structure as claimed in claim 1, wherein The bubble pipe has two bubble pipe segments; the rear end of the first bubble pipe segment is communicated with the main pipe through a first connecting pipe segment, and the front end of the first bubble pipe segment is communicated with the first connecting pipe segment through a second connecting pipe segment; the rear end of the second bubble pipe segment is communicated with the main pipe through a third connecting pipe segment, and the front end of the second bubble pipe segment is communicated with the third connecting pipe segment through a fourth connecting pipe segment; a fifth connecting pipe segment is arranged between the first bubble pipe segment and the second bubble pipe segment, one end of the fifth connecting pipe segment is communicated with the main pipe, and the other end is communicated with the middle end of the first bubble pipe segment and the middle end of the second bubble pipe segment respectively.

3. An adjustable bubble structure as claimed in claim 2, wherein The flow adjusting mechanism comprises: a mounting seat, which is provided with through holes extending in a first direction for the second connecting pipe segment, the fourth connecting pipe segment and the fifth connecting pipe segment to pass through respectively; the mounting seat is further provided with threaded holes corresponding to the through holes one by one in up and down directions; the threaded holes are screwed with screws, and the gas flow of the corresponding one of the second connecting pipe segment, the fourth connecting pipe segment and the fifth connecting pipe segment is adjusted by the depth of the screwing.

4. An adjustable bubble structure as claimed in claim 1, wherein, The bubble holes of the bubble pipe segments are single-layer structures.

5. An adjustable bubble structure as claimed in claim 2, wherein, The two bubble pipe segments are straight segments.

6. An adjustable bubble structure as claimed in claim 2, wherein, The bubble holes on the bubble pipe segments are arranged at equal intervals along the length direction.

7. An adjustable bubble structure as claimed in claim 2, wherein, The first connecting pipe segment and the first bubble pipe segment are integrally formed, and the second connecting pipe segment and the first bubble pipe segment are integrally formed; the third connecting pipe segment and the second bubble pipe segment are integrally formed, and the fourth connecting pipe segment and the second bubble pipe segment are integrally formed.

8. An adjustable bubble structure as claimed in claim 3, wherein, The threaded holes corresponding to the through holes are arranged in a row.

9. A wafer cleaning apparatus, characterized by comprising: The adjustable bubble structure comprises: an adjustable bubble structure according to any one of claims 1-8; a tank, which is provided at the bottom with a liquid inlet pipe for providing a wafer cleaning agent to the tank; a wafer bracket is arranged above the liquid inlet pipe, and the wafer bracket is used for supporting a wafer; the bubble pipe of the adjustable bubble structure is arranged at the bottom of the tank, and external gas enters the bubble pipe from the main pipe of the adjustable bubble structure.