Silicon wafer soaking and flushing system
By using a multi-stage rinsing and water storage tank system, the problems of high water consumption and chemical residue in existing silicon wafer cleaning systems have been solved, achieving water conservation and improved silicon wafer yield.
Patent Information
- Application Number
- CN202423126638.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-17
- Publication Date
- 2025-11-28
- Estimated Expiration
- 2034-12-17
AI Technical Summary
Existing silicon wafer cleaning systems consume a lot of water, and chemical residues in the immersion water cause defects on the silicon wafer surface. The simple cleaning process also leads to a high defect rate.
A multi-stage rinsing and water storage system is adopted, including first and second rinsing mechanisms and a water storage tank. Through multi-stage rinsing and water recycling, chemical residues are avoided, silicon wafer yield is improved, and water resources are saved.
Multi-stage rinsing and water recycling reduce water consumption, improve silicon wafer yield, avoid defects caused by chemical residues, and enhance cleaning effectiveness.
Smart Images
Figure CN223612378U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to photovoltaic and semiconductor technical field, concretely is a kind of silicon wafer soaking and washing system. BACKGROUND
[0002] Silicon wafer cleaning is an important link in semiconductor device production, aims at removing the pollution impurities on the surface of silicon wafer, to prevent device failure.
[0003] The existing silicon wafer cleaning system, flushing water and soaking water all use new water of pure water pipeline, resulting in large water resource consumption, and cleaning process only has flushing and soaking two steps due to space limitation, and subsequent will enter drying procedure, but since soaking water still contains a small amount of chemicals, it will cause the surface of silicon wafer to appear a little point or even sheet-shaped defect in subsequent process.
[0004] Therefore, a silicon wafer soaking and washing system is needed. UTILITY MODEL CONTENT
[0005] In view of the problems in the prior art, the utility model solves the problem by the following technical structure.
[0006] To achieve the above object, the utility model adopts the following technical scheme:
[0007] A silicon wafer soaking and washing system, comprising: a first drain tank, a first water storage tank, a second drain tank, a second water storage tank, a waste water pipe, a pure water pipe, a first flushing mechanism and a second flushing mechanism, the silicon wafer passes through the first drain tank, the first water storage tank and the second drain tank in sequence;
[0008] The first drain tank is used for collecting flushing water from the first flushing mechanism, and the flushing water in the first drain tank is discharged to the waste water pipe through the first pipeline;
[0009] The first water storage tank is used for soaking the silicon wafer after being flushed by the first flushing mechanism;
[0010] The second flushing mechanism is used for re-flushing the silicon wafer after soaking;
[0011] The second drain tank is used for collecting flushing water from the second flushing mechanism, and the flushing water in the second drain tank is discharged to the second water storage tank through the second pipeline;
[0012] The second water storage tank supplies water to the first water storage tank through the third pipeline; and the second water storage tank supplies water to the first flushing mechanism through the fourth pipeline;
[0013] The pure water pipe is used for supplying water to the second flushing mechanism.
[0014] Further features are,
[0015] The first drainage groove is arranged below the first rinsing mechanism.
[0016] The first rinsing mechanism comprises two first rinsing water knives, which rinse the silicon wafer from above and below respectively.
[0017] The second drainage groove is arranged below the second rinsing mechanism.
[0018] The second rinsing mechanism comprises two second rinsing water knives, which rinse the silicon wafer from above and below respectively.
[0019] The third rinsing water knife is arranged above the first water storage groove and rinses the silicon wafer from above.
[0020] The second water storage groove supplies water to the third rinsing water knife through the fifth pipeline.
[0021] The second water storage groove is provided with overflow ports, and the fifth pipeline in communication with the waste water pipe is arranged at the overflow ports.
[0022] The overflow ports are arranged in two, and the two overflow ports are in communication with the waste water pipe through two fifth pipelines.
[0023] The two overflow ports are different in horizontal height.
[0024] The above structure of the utility model can achieve the following beneficial effects:
[0025] During rinsing, the silicon wafer is rinsed by the first rinsing mechanism, then is soaked in the first water storage groove, and then is rinsed by the second rinsing mechanism to wash away the residual soaking water on the silicon wafer, so that a small amount of chemicals contained in the soaking water is prevented from adhering to the silicon wafer, the yield of the silicon wafer is improved, and the rinsing water sprayed by the second rinsing mechanism is collected in the second drainage groove, is discharged into the second water storage groove through the second pipeline, and is collected through the second water storage groove. BRIEF DESCRIPTION OF DRAWINGS
[0026] Figure 1 The figure is a structural schematic diagram of the utility model.
[0027] In the figure, 1 is a first drainage groove, 2 is a first water storage groove, 3 is a second drainage groove, 4 is a second water storage groove, 5 is a waste water pipe, 6 is a first rinsing water knife, 7 is a second rinsing water knife, 8 is a third rinsing water knife, and 9 is an overflow port. DETAILED DESCRIPTION
[0028] In order to make the person skilled in the art better understand the technical scheme of the present application, the technical scheme in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by the person skilled in the art without creative labor should belong to the protection scope of the present application.
[0029] It should be noted that the terms "comprising" and "having" and any variations thereof in the specification and claims of the present application and the above drawings are intended to cover non-exclusive inclusion, for example, a process, method, device, product or equipment containing a series of steps or units does not have to be limited to the clearly listed steps or units, but can include other steps or units that are not clearly listed or inherent to these processes, methods, products or equipment.
[0030] The following will be described in detail in combination with the accompanying drawings Figure 1 The present application will be further described in detail.
[0031] Reference Figure 1 As shown in the accompanying drawings, a silicon wafer soaking and rinsing system comprises a first drain tank 1, a first water storage tank 2, a second drain tank 3, a second water storage tank 4, a waste water pipe 5, a pure water pipe, a first rinsing mechanism and a second rinsing mechanism. The silicon wafer passes through the first drain tank 1, the first water storage tank 2 and the second drain tank 3 in sequence. The first drain tank 1 is used for collecting rinsing water from the first rinsing mechanism, and the rinsing water in the first drain tank 1 is discharged to the waste water pipe 5 through a first pipeline. The first water storage tank 2 is used for soaking the silicon wafer rinsed by the first rinsing mechanism. The second rinsing mechanism is used for rinsing the soaked silicon wafer. The second drain tank 3 is used for collecting rinsing water from the second rinsing mechanism, and the rinsing water in the second drain tank 3 is discharged to the second water storage tank 4 through a second pipeline. The second water storage tank 4 supplies water to the first water storage tank 2 through a third pipeline. The second water storage tank 4 supplies water to the first rinsing mechanism through a fourth pipeline. The pure water pipe is used for supplying water to the second rinsing mechanism.
[0032] Based on the above structure, the silicon wafer is washed by the first washing mechanism, then is soaked in the first water storage tank 2, and then is washed by the second washing mechanism to wash away the residual soaking water on the silicon wafer, so as to avoid the adhesion of a small amount of chemicals contained in the soaking water on the silicon wafer, improve the yield of the silicon wafer, and collect the washing water sprayed by the second washing mechanism in the second drainage tank 3, and then discharge the washing water to the second water storage tank 4 through the second pipeline, and then collect the washing water through the second water storage tank 4. Since the washing water after washing the silicon wafer by the second washing mechanism is relatively clean, the water collected in the second water storage tank 4 is supplied to the first washing mechanism and the second water storage tank 2 through the pump of the second water storage tank 4, so as to realize the repeated use of the washing water. Only the second washing mechanism uses pure water supplied by a pure water pipe to save water resources.
[0033] As shown in Figure 1 , in order to collect the washing water of the first washing mechanism, the first drainage tank 1 is arranged below the first washing mechanism, and the first washing mechanism includes two first washing water knives 6, which wash the silicon wafer from above and below respectively to wash the two sides of the silicon wafer respectively.
[0034] As shown in Figure 1 , in order to collect the washing water of the second washing mechanism, the second drainage tank 3 is arranged below the second washing mechanism, and the second washing mechanism includes two second washing water knives 7, which wash the silicon wafer from above and below respectively to wash the two sides of the silicon wafer respectively.
[0035] As shown in Figure 1 , the upper side of the first water storage tank 2 is provided with a third washing water knife 8, which washes the silicon wafer from above. When the silicon wafer enters the first water storage tank 2 for soaking, the third washing water knife 8 washes the top surface at the same time, accelerates the liquid circulation of the surface layer of the first water storage tank 2, and the second water storage tank 4 supplies water to the third washing water knife 8 through the fifth pipeline to supply water to the third washing water knife 8 for further water recycling, and the overflow water of the first water storage tank 2 is discharged through the waste water pipe 5.
[0036] As shown in Figure 1 , the second water storage tank 4 is provided with overflow ports 9, and the overflow ports 9 are arranged in two, and the two overflow ports 9 are communicated with the waste water pipe 5 through two fifth pipelines. If the water level in the second water storage tank 4 is too high, the water is discharged through the two overflow ports, and the two overflow ports 9 are different in horizontal height, so as to cope with different water levels and different drainage efficiencies. When the water level is high, the two overflow ports 9 discharge water at the same time, and the drainage efficiency is high, and vice versa.
[0037] The utility model discloses a working principle: after the silicon wafer is washed by first washing mechanism, is placed in first water storage tank 2 and is soaked, then is washed by second washing mechanism, and the residual soaking water on the silicon wafer is washed, avoids the little chemical contained in the soaking water and adheres on the silicon wafer, improves the silicon wafer yield, and the washing water that second washing mechanism sprays is collected in second drain tank 3, and is arranged to second water storage tank 4 through second pipeline, and is collected through second water storage tank 4, because the washing water after the silicon wafer is washed by second washing mechanism is relatively clean, therefore the water collected in second water storage tank 4 is supplied to first washing mechanism and second water storage tank 2 through the pump of second water storage tank 4, realizes the repeated use of washing water, only the pure water of second washing mechanism is supplied with pure water pipe, saves water resource.
[0038] The above is only the preferred embodiment of the application, and the utility model is not limited to the above examples. It can be understood that other improvements and changes directly derived or thought of by those skilled in the art without departing from the spirit and concept of the utility model should be considered to be included in the protection scope of the utility model.
Claims
1. A silicon wafer immersion rinse system characterized by, The utility model relates to a silicon wafer cleaning device, including: a first drain groove (1), a first water storage groove (2), a second drain groove (3), a second water storage groove (4), a waste water pipe (5), a pure water pipe, a first flushing mechanism and a second flushing mechanism, and the silicon wafer passes through the first drain groove (1), the first water storage groove (2) and the second drain groove (3) in sequence; the first drain groove (1) is used for collecting flushing water from the first flushing mechanism, and the flushing water in the first drain groove (1) is discharged to the waste water pipe (5) through a first pipeline; the first water storage groove (2) is used for soaking the silicon wafer after being flushed by the first flushing mechanism; the second flushing mechanism is used for rinsing the soaked silicon wafer; the second drain groove (3) is used for collecting flushing water from the second flushing mechanism, and the flushing water in the second drain groove (3) is discharged to the second water storage groove (4) through a second pipeline; the second water storage groove (4) supplies water to the first water storage groove (2) through a third pipeline; and the second water storage groove (4) supplies water to the first flushing mechanism through a fourth pipeline; the pure water pipe is used for supplying water to the second flushing mechanism.
2. The silicon wafer immersion rinse system of claim 1, wherein: The first drain groove (1) is arranged below the first flushing mechanism.
3. A silicon wafer immersion rinse system as claimed in claim 2, wherein: The first flushing mechanism includes two first flushing water knives (6), and the two first flushing water knives (6) flush the silicon wafer from above and below, respectively.
4. The silicon wafer immersion rinse system of claim 1, wherein: The second drain groove (3) is arranged below the second flushing mechanism.
5. A silicon wafer immersion rinse system as claimed in claim 4, wherein: The second flushing mechanism includes two second flushing water knives (7), and the two second flushing water knives (7) flush the silicon wafer from above and below, respectively.
6. The silicon wafer immersion rinse system of claim 1, wherein: A third flushing water knife (8) is arranged above the first water storage groove (2), and the third flushing water knife (8) flushes the silicon wafer from above.
7. A silicon wafer immersion rinse system as claimed in claim 6, wherein: The second water storage groove (4) supplies water to the third flushing water knife (8) through a fifth pipeline.
8. The silicon wafer immersion rinse system of claim 1, wherein: An overflow port (9) is arranged on the second water storage groove (4), and a fifth pipeline in communication with the waste water pipe (5) is arranged at the overflow port (9).
9. A silicon wafer immersion rinse system as claimed in claim 8, wherein: The overflow port (9) is provided with two overflow ports (9), and the two overflow ports (9) are in communication with the waste water pipe (5) through two fifth pipelines, respectively.
10. The silicon wafer immersion rinse system of claim 8, wherein: The two overflow ports (9) are different in horizontal height.